CN213401163U

CN213401163U - Radiating fin component for chip packaging

Info

Publication number: CN213401163U
Application number: CN202022374027.0U
Authority: CN
Inventors: 陈学彬
Original assignee: Shenzhen Huaqiang Zhilian Technology Co ltd
Current assignee: Shenzhen Huaqiang Zhilian Technology Co ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-06-08
Anticipated expiration: 2030-10-22

Abstract

The utility model belongs to the field of chip packaging, in particular to a radiating fin component for chip packaging, which aims at the problem of poor stability and accuracy of a chip placed on a circuit carrier plate before the chip is packaged, the scheme is provided, the radiating fin component comprises a radiating plate, two fixing sleeves which are symmetrically distributed are fixed at the bottom of the radiating plate, a guide frame is fixed above the fixing sleeves of the radiating plate, a clamping sleeve is fixed between the guide frame and the fixing sleeves of the radiating plate, a clamping rod penetrates through the inside of the clamping sleeve in a sliding manner, and a clamping plate is fixed at one end of the clamping rod, which is close to the center of the radiating plate; the utility model discloses in with the compressing tightly pole of chip extrusion both sides, increase the distance between two clamp plates, after the chip got into completely, reset through the clamp plate, press from both sides the both sides face of chip tightly, compress tightly the elastic action of pole through the extrusion spring simultaneously and handle that resets, compress tightly the top of chip to guarantee the stability and the accuracy of chip when the encapsulation.

Description

Radiating fin component for chip packaging

Technical Field

The utility model relates to a chip package technical field especially relates to a fin assembly for chip package.

Background

Generally, when a chip is operated, a large amount of heat energy is generated, and if the heat energy cannot be dissipated and is continuously accumulated in the chip, the temperature of the chip is continuously increased, so that the chip may be overheated to cause performance degradation or shortened service life, and even permanent damage; in order to prevent the chip from overheating and causing temporary or permanent failure, a heat sink is usually configured to lower the operating temperature of the chip so that the chip can operate normally.

In the manufacturing process of a chip package with a heat sink, the heat sink is usually disposed on a circuit carrier, a chip is located between the heat sink and the circuit carrier, and then the heat sink and the circuit carrier are placed together in a mold, and then a molten encapsulant is injected into the mold, so that the encapsulant covers the circuit carrier, the chip and a portion of the heat sink, and then the encapsulant is cooled and solidified to form a package layer.

Therefore, a heat sink assembly for chip packaging is needed to solve the problem of poor stability and accuracy of placing a chip on a circuit carrier before the chip is packaged.

SUMMERY OF THE UTILITY MODEL

The utility model provides a fin assembly for chip package has solved the chip and has capsulated the stability of placing on the circuit support plate of chip before the chip and the relatively poor problem of accuracy.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a fin subassembly for chip encapsulation, includes the heating panel, the bottom of heating panel is fixed with two fixed covers that are the symmetric distribution, the top that the heating panel is located fixed cover is fixed with the guide frame, the heating panel is located and is fixed with the clamping sleeve between guide frame and the fixed cover, the inside slip of clamping sleeve runs through there is the clamping bar, the clamping bar is close to the one end of heating panel center department and is fixed with the clamp plate, the other end of clamping bar is fixed with the movable block, fixed cover with all wear to be equipped with the slide bar in the guide frame, the movable block is with adjacent it has the connecting rod to articulate between the slide bar, the inside sliding connection of fixed cover has the pressing block fixed with the slide bar, press the pressing block with be fixed with between the fixed cover and press the spring, be provided with in the guide frame and compress.

Preferably, the compressing assembly comprises a compressing rod which is slidably penetrated through the side wall of the guide frame, one end of the compressing rod, which is positioned in the guide frame, is fixed with an extrusion block, an extrusion spring is fixed between the extrusion block and the guide frame, the top end of the sliding rod, which is positioned at the top, is fixed with a convex block, and the bottom end of the compressing rod is fixed with two bulges which are respectively matched with the convex block.

Preferably, the end part of the pressing rod is provided with a chamfer, and a conical block is fixed at the chamfer of the pressing rod.

Preferably, the clamping plates and the inner side surfaces of the adjacent fixed sleeves are located on the same vertical plane, the distance between the two guide frames is greater than the distance between the two clamping plates, and chamfers are formed at the top ends of the clamping plates.

Preferably, the cross section of the lug is semicircular, the cross section of the bulge is an arc surface, and the two bulges are in contact with the outer surface of the lug.

Preferably, the size of the pressing block is matched with that of the fixed sleeve, and a plurality of heat dissipation holes which are uniformly distributed are formed in the center of the heat dissipation plate.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses in with the compressing tightly pole of chip extrusion both sides, the drive compresses tightly the pole and removes in the guide frame, thereby increase the distance between two clamp plates, slide bar and connecting rod that the symmetry set up, make the clamp plate more stable of motion in the grip housing, thereby it places to be convenient for the chip to get into to form between fixed cover and the cassette, after the chip gets into completely, the clamp plate resets this moment, press from both sides the face of chip and press from both sides tightly, the elastic action that the pole passed through extrusion spring simultaneously compresses tightly the top of chip and compresses tightly, thereby guarantee stability and the accuracy of chip when the encapsulation.

2. The utility model discloses well pressing rod chamfer and the setting of toper piece, the chip of being convenient for directly extrudees the pressing rod from two toper pieces and can get into between circuit support plate and the heating panel and accomplish the tight installation of clamp.

Drawings

Fig. 1 is a schematic main sectional structure diagram of a heat sink assembly for chip packaging according to the present invention;

FIG. 2 is an enlarged view of area A of FIG. 1;

fig. 3 is a schematic front view of a heat sink assembly for chip packaging according to the present invention.

In the figure: 1. a heat dissipation plate; 2. fixing a sleeve; 3. a guide frame; 4. a clamping sleeve; 5. a clamping lever; 6. a clamping plate; 7. a moving block; 8. a slide bar; 9. a connecting rod; 10. a pressing block; 11. a pressing spring; 12. a compression assembly; 121. a hold down bar; 122. extruding the block; 123. a compression spring; 124. a bump; 125. a protrusion; 13. a conical block; 14. and (4) heat dissipation holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a heat sink assembly for chip packaging comprises a heat sink 1, wherein two fixing sleeves 2 are fixed at the bottom of the heat sink 1 and are symmetrically distributed, and specifically, a U-shaped clamping seat is fixed on a circuit carrier plate, so that the two fixing sleeves 2 can be used for clamping the heat sink 1 and the circuit carrier plate and supporting subsequent placement of a chip; a guide frame 3 is fixed on the heat dissipation plate 1 above the fixed sleeve 2, a clamping sleeve 4 is fixed on the heat dissipation plate 1 between the guide frame 3 and the fixed sleeve 2, a clamping rod 5 penetrates through the clamping sleeve 4 in a sliding manner, a clamping plate 6 is fixed at one end of the clamping rod 5 close to the center of the heat dissipation plate 1, a moving block 7 is fixed at the other end of the clamping rod 5, sliding rods 8 penetrate through the fixed sleeve 2 and the guide frame 3, a connecting rod 9 is hinged between the moving block 7 and the adjacent sliding rod 8, a pressing block 10 fixed with the sliding rod 8 is connected inside the fixed sleeve 2 in a sliding manner, a pressing spring 11 is fixed between the pressing block 10 and the fixed sleeve 2, a pressing component 12 matched with the sliding rod 8 is arranged in the guide frame 3, specifically, after the heat dissipation plate 1 and the circuit carrier plate are installed, a chip needs to be placed between the circuit carrier plate and the heat, thereby encapsulate the processing to the chip, the chip passes through and gets into between the guide frame 3 at heating panel 1 top, compress tightly subassembly 12 on the extrusion guide frame 3, slide bar 8 downstream in the drive guide frame 3, effect through connecting rod 9, drive clamp bar 5 and remove in clamp sleeve 4, thereby increase the distance between two clamp plates 6, slide bar 8 and the connecting rod 9 that the symmetry set up, make clamp plate 6 more stable of motion in clamp sleeve 4, thereby it places to be convenient for the chip to get into to form between fixed cover 2 and the cassette, after the chip gets into completely, compress tightly subassembly 12 and reset, at this moment, clamp plate 6 resets, press from both sides tightly the face of chip, compress tightly subassembly 12 simultaneously and compress tightly the top of chip, thereby guarantee stability and the accuracy of chip when the encapsulation.

The pressing component 12 comprises a pressing rod 121 which is slidably penetrated through the side wall of the guide frame 3, one end of the pressing rod 121 in the guide frame 3 is fixed with a pressing block 122, a pressing spring 123 is fixed between the pressing block 122 and the guide frame 3, the top end of the sliding rod 8 at the top is fixed with a bump 124, the bottom end of the pressing rod 121 is fixed with two protrusions 125 which are respectively matched with the bump 124, specifically, a chip is placed between the circuit carrier plate and the heat dissipation plate 1, the chip presses the pressing rod 121 at two sides to drive the pressing rod 121 to move in the guide frame 3, the bump 124 is pressed through the movement of the protrusion 125, so that the sliding rod 8 moves downwards in the guide frame 3, the two clamping plates 6 are driven to move outwards through the action of the connecting rod 9, when the chip completely enters between the two fixed sleeves 2, the pressing rod 121 is reset through the elastic action of the pressing spring 123, the top end of the chip is compressed, so that the stability and the accuracy of the chip in packaging are ensured.

The tip of holding down rod 121 has been seted up the chamfer, and the chamfer department of holding down rod 121 is fixed with conical block 13, and is concrete, the setting of holding down rod 121 chamfer and conical block 13, and the chip of being convenient for is directly extrudeed holding down rod 121 from two conical block 13 departments and can is got into and accomplish between circuit support plate and the heating panel 1 and press from both sides tight installation.

The clamping plate 6 and the inner side surface of the adjacent fixing sleeve 2 are positioned on the same vertical plane, and particularly, when the chip completely enters between the circuit carrier plate and the heat dissipation plate 1, the chip is positioned at the center of the heat dissipation plate 1 for concentrated heat dissipation, so that the sufficient heat dissipation effect of the heat dissipation plate 1 during subsequent packaging is ensured; the distance between the two guide frames 3 is greater than the distance between the two clamping plates 6, and chamfers are arranged at the top ends of the clamping plates 6, so that chips can better enter the space between the circuit carrier plate and the heat dissipation plate 1.

The section of the protrusion 124 is semicircular, the section of the protrusion 125 is an arc surface, the two protrusions 125 contact with the outer surface of the protrusion 124, and specifically, the protrusion 124 and the arc surface of the protrusion 125 are arranged so that the protrusion 125 and the protrusion 124 can extrude, and the sliding rod 8 can move downwards in the guide frame 3.

According to the size of pressing piece 10 and the size looks adaptation of fixed cover 2, a plurality of louvres 14 that are evenly distributed have been seted up to the center department of heating panel 1, and is concrete, according to the setting of pressing piece 10 size, has guaranteed to press the stability of pressing piece 10 motion in fixed cover 2 to the stability of clamp plate 6 motion in clamping sleeve 4 has further been improved.

The working principle is as follows: after the heat dissipation plate 1 and the circuit carrier plate are inserted and installed, a chip is required to be placed between the circuit carrier plate and the heat dissipation plate 1 to place the chip, so that the chip is packaged, the chip enters the heat dissipation plate 1 through the guide frame 3 at the top of the heat dissipation plate, the chip extrudes the pressing rods 121 at two sides to drive the pressing rods 121 to move in the guide frame 3, the bumps 124 are extruded through the movement of the protrusions 125, so that the sliding rods 8 move downwards in the guide frame 3 to drive the clamping rods 5 to move in the clamping sleeve 4, so that the distance between the two clamping plates 6 is increased, the sliding rods 8 and the connecting rods 9 are symmetrically arranged to enable the clamping plates 6 to move more stably in the clamping sleeve 4, so that the chip can conveniently enter the fixed sleeve 2 and the clamping seat to be placed, when the chip completely enters the heat dissipation plate 6, the clamping plates 6 reset to clamp two side faces of the chip, and the pressing rods 121 reset through the elastic action of, the top end of the chip is compressed, so that the stability and accuracy of the chip during packaging are ensured.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a fin subassembly for chip package, includes heating panel (1), its characterized in that, the bottom of heating panel (1) is fixed with two fixed covers (2) that are the symmetric distribution, the top that heating panel (1) is located fixed cover (2) is fixed with guide frame (3), heating panel (1) is located and is fixed with clamping sleeve (4) between guide frame (3) and fixed cover (2), the inside slip of clamping sleeve (4) is worn to penetrate has clamping bar (5), clamping bar (5) are close to the one end of heating panel (1) center department and are fixed with clamp plate (6), the other end of clamping bar (5) is fixed with movable block (7), fixed cover (2) with all wear to be equipped with slide bar (8) in guide frame (3), movable block (7) and adjacent it has connecting rod (9) to articulate between slide bar (8), the inside sliding connection of fixed cover (2) has the pressing block (10) fixed with slide bar (8), pressing block (10) with be fixed with between fixed cover (2) and press spring (11), be provided with in guide frame (3) and slide bar (8) matched with compress tightly subassembly (12).

2. The heat sink assembly for chip packaging according to claim 1, wherein the pressing assembly (12) comprises a pressing rod (121) slidably penetrating through the side wall of the guide frame (3), a pressing block (122) is fixed at one end of the pressing rod (121) located in the guide frame (3), a pressing spring (123) is fixed between the pressing block (122) and the guide frame (3), a bump (124) is fixed at the top end of the sliding rod (8) located at the top, and two protrusions (125) respectively matched with the bumps (124) are fixed at the bottom end of the pressing rod (121).

3. The heat sink assembly for chip packaging according to claim 2, wherein the end of the hold-down bar (121) is chamfered, and a tapered block (13) is fixed at the chamfered position of the hold-down bar (121).

4. A heat sink assembly for chip packaging according to claim 1, wherein the clamping plates (6) and the inner side of the adjacent fixing sleeve (2) are located on the same vertical plane, the distance between two guiding frames (3) is greater than the distance between two clamping plates (6), and the top ends of the clamping plates (6) are chamfered.

5. A heat sink assembly for chip packaging according to claim 2, wherein the cross section of the bump (124) is semicircular, the cross section of the protrusion (125) is an arc, and two protrusions (125) are in contact with the outer surface of the bump (124).

6. The heat sink assembly for chip packaging as claimed in claim 1, wherein the size of the pressing block (10) is adapted to the size of the fixing sleeve (2), and a plurality of heat dissipation holes (14) are formed at the center of the heat dissipation plate (1) and are uniformly distributed.