CN219705876U

CN219705876U - Semiconductor packaging mould

Info

Publication number: CN219705876U
Application number: CN202223321507.6U
Authority: CN
Inventors: 冯红; 梁远驱; 黎扬文
Original assignee: Dongguan Xuanpin Mold Technology Co ltd
Current assignee: Dongguan Xuanpin Mold Technology Co ltd
Priority date: 2022-12-09
Filing date: 2022-12-09
Publication date: 2023-09-19
Anticipated expiration: 2032-12-09

Abstract

The utility model discloses a semiconductor packaging die which comprises a lower die, wherein an upper die is movably arranged at the top end of the lower die, four plastic packaging cavities are formed in the top end surface of the lower die, and a plurality of movable rods are movably arranged in the plastic packaging cavities. According to the utility model, through the cooperation of the movable rod and the compression spring, when the device is used, the connecting rod can be pushed by the elastic potential energy of the compression spring, so that the movable rod is pushed to move towards the inside of the plastic package cavity, and then when the device is used, a semiconductor to be packaged can be placed into the inside of the plastic package cavity, and then the movable rod can move towards the inside of the plastic package cavity to be attached to the surface of the semiconductor, so that the semiconductor is sealed through the plurality of movable rods, the device can be matched with semiconductors with different sizes for packaging through the plurality of movable rods, and after the semiconductor is placed into the device, the semiconductor can be attached to the surface of the bump through the arrangement of the bump, so that the semiconductor can be conveniently installed.

Description

Semiconductor packaging mould

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging die.

Background

Semiconductors refer to materials that have electrical conductivity between conductors and insulators at room temperature, and are typically packaged using a packaging mold during the manufacturing process.

Semiconductor packaging refers to the process of processing a wafer passing through a test to obtain independent chips according to the product model and functional requirements, and a packaging mold is a tool for placing a semiconductor into the mold for plastic packaging.

When the existing semiconductor packaging die is used, the existing semiconductor packaging die is difficult to adapt to semiconductors of different models and sizes; therefore, the existing requirements are not met, and a semiconductor packaging mold is proposed.

Disclosure of Invention

The utility model aims to provide a semiconductor packaging die, which solves the problems that the semiconductor packaging die provided in the background art is difficult to adapt to the use of semiconductors with different models and sizes when in use.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor packaging mould, includes the bed die, the top movable mounting of bed die has the mould, the top surface of bed die is equipped with four plastic envelope chambeies, the inside of plastic envelope chambeies is all movable mounting has a plurality of movable rods, the outside surface fixed mounting of bed die has a plurality of T type clamping pieces.

Preferably, the movable rod is movably clamped into the plastic package cavity, a plurality of spring grooves are formed in the inner surface of the plastic package cavity, compression springs are movably mounted in the spring grooves, connecting rods are movably mounted in the spring grooves, and the connecting rods are fixedly connected with the movable rod.

Preferably, the top surface fixed mounting of last mould has the plastic envelope pipe, the bottom surface of plastic envelope pipe is equipped with the runner, the inside one side surface that is close to the runner of plastic envelope intracavity is all fixed mounting has the lug, the runner all link up with the inside of plastic envelope intracavity and be connected.

Preferably, a melting cavity is formed in the plastic packaging pipe, and a compression bar is movably mounted in the melting cavity.

Preferably, a plurality of T-shaped grooves are formed in the surface, close to the outer side, of the bottom end of the upper die, and the T-shaped clamping blocks are movably clamped into the T-shaped grooves.

Preferably, the surfaces of the lower die and the upper die are provided with a plurality of assembly holes.

Preferably, the bottom end surface of the lower die is fixedly provided with a base.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, through the cooperation of the movable rod and the compression spring, when the device is used, the connecting rod can be pushed by the elastic potential energy of the compression spring, so that the movable rod is pushed to move towards the inside of the plastic package cavity, and then when the device is used, a semiconductor to be packaged can be placed into the inside of the plastic package cavity, and then the movable rod can move towards the inside of the plastic package cavity to be attached to the surface of the semiconductor, so that the semiconductor is sealed through a plurality of movable rods, and the device can be matched with semiconductors with different sizes through the plurality of movable rods for packaging;

2. the utility model can attach the semiconductor to the surface of the bump after the semiconductor is placed in the device by the arrangement of the bump, thereby facilitating the installation of the semiconductor. The flow channels are led into the four plastic package cavities, so that a plurality of semiconductors can be packaged at one time when the device is used, and the working efficiency of the device is improved. Through the cooperation in depression bar and melting the chamber, make the device accessible reciprocate the mode of depression bar, will melt the inside EMC epoxy plastic envelope material that melts of chamber and promote downwards to make its more convenient inside of inflow runner, and make it can be even to the inside inflow in four plastic envelope chambeies.

Drawings

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a top view, in cross-section, of the entirety of the present utility model;

FIG. 3 is a cross-sectional side view of the entirety of the present utility model;

fig. 4 is a schematic view showing a partial structure of the movable bar of the present utility model.

In the figure: 1. a base; 2. a lower die; 3. an upper die; 4. a fitting hole; 5. plastic packaging the tube; 6. a compression bar; 7. t-shaped clamping blocks; 8. a flow passage; 9. a plastic package cavity; 10. a bump; 11. a melting chamber; 12. a movable rod; 13. a spring groove; 14. a compression spring; 15. and a connecting rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1 to 4, an embodiment of the present utility model provides: the utility model provides a semiconductor packaging mould, includes bed die 2, and the top movable mounting of bed die 2 has mould 3, and the top surface of bed die 2 is equipped with four plastic envelope chambeies 9, and the inside of plastic envelope chambeies 9 is all movable mounting has a plurality of movable rods 12, and the outside surface fixed mounting of bed die 2 has a plurality of T type clamping piece 7.

Further, the movable rod 12 is movably clamped into the plastic package cavity 9, a plurality of spring grooves 13 are formed in the inner surface of the plastic package cavity 9, compression springs 14 are movably mounted in the spring grooves 13, connecting rods 15 are movably mounted in the spring grooves 13, and the connecting rods 15 are fixedly connected with the movable rod 12.

Through adopting above-mentioned technical scheme, through the cooperation of movable rod 12 and compression spring 14, make the device when using, accessible compression spring 14's elastic potential energy promotes connecting rod 15 to promote movable rod 12 and to the inside removal of plastic envelope chamber 9, and then make the device when using, can put into the inside of plastic envelope chamber 9 with the semiconductor that waits to encapsulate earlier, then movable rod 12 can move and laminate at the surface of semiconductor to the inside of plastic envelope chamber 9, thereby seal semiconductor through a plurality of movable rods 12, and then make the semiconductor of device accessible a plurality of movable rods 12 adaptation not unidimensional encapsulate.

Further, the top surface fixed mounting of last mould 3 has plastic envelope pipe 5, and the bottom surface of plastic envelope pipe 5 is equipped with runner 8, and the inside one side surface that is close to runner 8 of plastic envelope chamber 9 is all fixed mounting has lug 10, runner 8 all link up with the inside of plastic envelope chamber 9.

Through adopting above-mentioned technical scheme, through the setting of lug 10, make the device after putting into the semiconductor, can laminate the surface of semiconductor and lug 10 to make things convenient for the installation of semiconductor, import the inside of four plastic envelope chambeies 9 through runner 8, make the device when using, can once only encapsulate a plurality of semiconductors, improve the work efficiency of device.

Further, the inside of plastic envelope pipe 5 is equipped with melts chamber 11, melts the inside movable mounting in chamber 11 and has depression bar 6.

Through adopting above-mentioned technical scheme, through the cooperation of depression bar 6 and melting chamber 11, make the device accessible reciprocate the mode of depression bar 6, will melt the inside EMC epoxy plastic envelope material that melts of chamber 11 and promote downwards to make its more convenient inside of inflow runner 8, and make it can be even to the inside inflow of four plastic envelope chambeies 9.

Further, a plurality of T-shaped grooves are formed in the surface, close to the outer side, of the bottom end of the upper die 3, and the T-shaped clamping blocks 7 are movably clamped into the T-shaped grooves.

By adopting the technical scheme, the lower die 2 and the upper die 3 can be assembled stably through the T-shaped clamping block 7.

Further, the surfaces of the lower mold 2 and the upper mold 3 are each provided with a plurality of fitting holes 4.

Further, the bottom end surface of the lower die 2 is fixedly provided with a base 1.

Working principle: when the device is used, the device is placed at a designated position to check whether each part works normally, and the connecting rod 15 is pushed by the elastic potential energy of the compression spring 14 through the cooperation of the movable rod 12 and the compression spring 14, so that the movable rod 12 is pushed to move towards the inside of the plastic package cavity 9, and then the semiconductor to be packaged can be placed into the inside of the plastic package cavity 9 when the device is used, and then the movable rod 12 can move towards the inside of the plastic package cavity 9 to be attached to the surface of the semiconductor, so that the semiconductor is sealed through the movable rods 12, and the device can be packaged through the semiconductors with different sizes by adapting the movable rods 12.

By arranging the convex blocks 10, the device can attach the semiconductor to the surface of the convex blocks 10 after the semiconductor is placed in the device, so that the semiconductor is convenient to install. The flow channels 8 are led into the four plastic package cavities 9, so that a plurality of semiconductors can be packaged at one time when the device is used, and the working efficiency of the device is improved. Through the cooperation of depression bar 6 and melting chamber 11, make the device accessible reciprocate depression bar 6's mode, will melt the inside EMC epoxy plastic envelope material that melts of chamber 11 and promote downwards to make its more convenient inflow runner 8's inside, and make it can be even to the inside inflow of four plastic envelope chambeies 9.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. Semiconductor package mould, including bed die (2), its characterized in that: the upper die (3) is movably mounted at the top end of the lower die (2), four plastic sealing cavities (9) are formed in the top end surface of the lower die (2), a plurality of movable rods (12) are movably mounted in the plastic sealing cavities (9), and a plurality of T-shaped clamping blocks (7) are fixedly mounted on the outer side surface of the lower die (2);

the movable rod (12) is movably clamped into the plastic package cavity (9), a plurality of spring grooves (13) are formed in the inner surface of the plastic package cavity (9), compression springs (14) are movably mounted in the spring grooves (13), connecting rods (15) are movably mounted in the spring grooves (13), and the connecting rods (15) are fixedly connected with the movable rod (12).

2. The semiconductor package mold according to claim 1, wherein: the plastic packaging device is characterized in that a plastic packaging pipe (5) is fixedly arranged on the top surface of the upper die (3), a flow channel (8) is arranged on the bottom surface of the plastic packaging pipe (5), bumps (10) are fixedly arranged on the surface of one side, close to the flow channel (8), of the inner portion of the plastic packaging cavity (9), and the flow channel (8) is in through connection with the inner portion of the plastic packaging cavity (9).

3. A semiconductor package mold according to claim 2, wherein: the plastic package pipe is characterized in that a melting cavity (11) is formed in the plastic package pipe (5), a compression bar (6) is movably mounted in the melting cavity (11), and a plurality of EMC epoxy plastic packages are arranged in the melting cavity (11).

4. The semiconductor package mold according to claim 1, wherein: the surface of the bottom end of the upper die (3) close to the outer side is provided with a plurality of T-shaped grooves, and the T-shaped clamping blocks (7) are movably clamped into the T-shaped grooves.

5. The semiconductor package mold according to claim 1, wherein: the surfaces of the lower die (2) and the upper die (3) are provided with a plurality of assembly holes (4).

6. The semiconductor package mold according to claim 1, wherein: the bottom surface of the lower die (2) is fixedly provided with a base (1).