CN219040477U

CN219040477U - TO-LL packaging lead frame and packaging structure

Info

Publication number: CN219040477U
Application number: CN202223595571.3U
Authority: CN
Inventors: 陈育锋; 李明芬; 梁志忠; 李尚哲; 吕娟娟
Original assignee: Anhui Jixin Microelectronics Technology Co ltd
Current assignee: Anhui Jixin Microelectronics Technology Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-05-16
Anticipated expiration: 2032-12-30

Abstract

The utility model discloses a TO-LL packaging lead frame and a packaging structure, and belongs TO the field of chip packaging. The device comprises a base island and a lead frame, wherein the base islands adjacent to the lead frame are connected to the lead frame through first connecting ribs, and two adjacent base islands are connected with each other through second connecting ribs along the extending direction perpendicular to the source pins. The utility model provides a TO-LL packaging lead frame, which is characterized in that a second connecting rib is arranged between two adjacent base islands and a first connecting rib is arranged between the base islands and the lead frame, and the first connecting rib and the second connecting rib are arranged, so that the first connecting rib and the second connecting rib can provide a yielding space of a die pressurizing ejector rod TO replace a pressing groove in the existing design, thereby not occupying the area of the base islands additionally. The utility model also provides a TO-LL packaging structure which can effectively increase the packaging area of the plastic package body, improve the utilization rate of the area of the base island and package a MOSFET power chip with larger volume.

Description

TO-LL packaging lead frame and packaging structure

Technical Field

The utility model relates TO the field of chip packaging, in particular TO a TO-LL packaging lead frame and a packaging structure.

Background

A conventional TO-LL package version (as shown in fig. 1 and 2, the conventional TO-LL package has an elongated crimp 41 on both sides of the long side). The TO-LL packaging process comprises wafer dicing, chip mounting and bonding, plastic package surface treatment printing, rib cutting and separation, electrical property testing, packaging and warehousing. The long side of the traditional TO-LL package body is provided with an appearance structure of a long pressing groove, and the affected working procedures comprise working procedures and links such as chip installation, chip plastic package, function application and the like.

The design purpose of the outer structure of the long side of the TO-LL package body with the long strip-shaped pressing grooves 41 is TO prevent the thermosetting plastic package material from penetrating between the metal base island under the semiconductor MOSFET power chip and the bottom layer of the plastic package body mold cavity in the metal mold due TO the fact that the thermosetting plastic package material is in a liquid fluid state in the metal mold under the high temperature (175 ℃) and the high pressure injection (more than or equal TO 1000 psi) pressure in the plastic package process of the semiconductor MOSFET power chip.

As shown in fig. 2, a schematic diagram of a prior art TO-LL package lead frame is shown. The metal islands are symmetrically arranged, two adjacent islands are connected through a connecting structure at the position of the drain electrode pin, and the position close to the frame is fixedly connected with the frame through the connecting structure at the position of the drain electrode pin. At this time, one side of the whole base island is suspended.

In order TO prevent the metal base island under the semiconductor MOSFET power chip from being permeated by the thermosetting plastic package material, the long side two sides of the traditional TO-LL package body are provided with long-shaped pressing grooves 41 for designing pressing ejector rods at the long side two long-shaped grooves of the plastic package body in the metal plastic package die, and the pressing ejector rods of the metal die are utilized TO press the metal base island under the chip, so that the metal base island under the chip and the bottom layer of the plastic package body die cavity in the metal die can be tightly adhered, and the thermosetting plastic package material is prevented from being permeated into the overflow outside the metal base island between the metal base island under the chip and the bottom layer of the plastic package body die cavity in the metal die due TO high temperature and high pressure.

Because the metal base island below the chip in the metal lead frame needs TO reserve the area required by the pressurizing ejector rod of the plastic package mould, the area which can bear the semiconductor MOSFET power chip and is remained by the metal base island below the semiconductor chip is greatly reduced, and the area of the large semiconductor MOSFET power chip, the large-capacity semiconductor MOSFET power chip and the installation of the large-capacity semiconductor MOSFET power chip are directly hindered, so that the traditional TO-LL packaging body cannot be applied TO terminal products which need higher power or higher capacity.

Disclosure of Invention

The utility model provides a TO-LL packaging lead frame, which can solve the problem that the traditional TO-LL packaging lead frame needs TO occupy part of the land area TO realize pressurization.

The utility model also provides a TO-LL packaging structure which can effectively improve the utilization area of the base island and realize the packaging of the MOSFET power chip with larger volume.

A TO-LL packaging lead frame comprises base islands and a lead frame, wherein the base islands adjacent TO the lead frame are connected TO the lead frame through first connecting ribs, and two adjacent base islands are connected with each other through second connecting ribs along the extending direction perpendicular TO source pins.

More preferably, the second connecting ribs are a plurality of, the first connecting ribs and the second connecting ribs are in one-to-one correspondence, and the plurality of second connecting ribs are arranged side by side along the extending direction of the source pins.

The TO-LL packaging structure comprising the lead frame comprises a plastic package body, wherein the plastic package body completely covers the base island.

The utility model provides a TO-LL packaging lead frame, which is characterized in that a second connecting rib is arranged between two adjacent base islands and a first connecting rib is arranged between the base islands and the lead frame, and the first connecting rib and the second connecting rib are arranged, so that the first connecting rib and the second connecting rib can provide a yielding space of a die pressurizing ejector rod TO replace a pressing groove in the existing design, thereby not occupying the area of the base islands additionally.

The utility model also provides a TO-LL packaging structure which can effectively increase the packaging area of the plastic package body, improve the utilization rate of the area of the base island and package a MOSFET power chip with larger volume.

Drawings

FIG. 1 is a schematic diagram of a TO-LL package structure in the prior art;

FIG. 2 is a schematic diagram of a TO-LL package lead frame (partial package) according TO the prior art;

FIG. 3 is a schematic diagram of a TO-LL package lead frame (partially packaged) according TO the present utility model;

fig. 4 is a schematic diagram of a TO-LL package leadframe according TO the present utility model.

Reference numerals illustrate:

10 frames; 20 basal islands; a 21 drain pin; 22 source pins; 23 gate pins; 30 first connecting ribs; 31 second connecting ribs; 40, plastic packaging; 41 pressing grooves.

Detailed Description

One embodiment of the present utility model will be described in detail below with reference to the attached drawings, but it should be understood that the scope of the present utility model is not limited by the embodiment.

Embodiment one:

as shown in fig. 3 and fig. 4, the TO-LL package lead frame provided in the embodiment of the present utility model includes a base island 20 and a lead frame 10, and in the case of the view angle of fig. 3, the positions of the upper and lower sides of the lead frame 10 corresponding TO the base island 20 are respectively provided with a source pin 22 and a gate pin 23; the islands 20 are symmetrically arranged in pairs, drain electrode pins 21 of two adjacent islands 20 are connected with each other, and the islands 20 close to the frame 10 are connected to the lead frame 10 through first connecting ribs 30 to form a support; the two adjacent islands 20 are connected with each other along the direction (transverse direction) perpendicular to the extending direction of the source pins 22 by the second connecting ribs 31, and the second connecting ribs 31 form a connecting structure between the adjacent islands 20 for supporting the islands 20.

The existence of the first connecting rib 30 and the second connecting rib 31 (or the second connecting rib 31 and the second connecting rib 31) can provide a pressing space for the mold pressing ejector rod during plastic packaging, and the first connecting rib 30 and the second connecting rib 31 do not occupy the area of the base island 20 because the first connecting rib 30 and the second connecting rib 31 extend outside the base island 20, so that the effective utilization area of the base island 20 can be effectively enlarged, and the base island 20 can prevent a MOSFET power chip with larger volume.

Embodiment two:

on the basis of the first embodiment, as shown in fig. 4, the number of the second connecting ribs 31 is several, in this embodiment, two second connecting ribs 31 are taken as an example, the number, the positions and the arrangement modes of the first connecting ribs 30 and the second connecting ribs 31 are uniformly corresponding to one another, and the two second connecting ribs 31 and the two first connecting ribs 30 are arranged side by side along the extending direction of the source pins 22. The first connecting ribs 30 and the second connecting ribs 31 which are arranged side by side can provide larger pressurizing space for the mold pressurizing ejector rod during injection molding, and the distribution of the first connecting ribs 30 and the second connecting ribs 31 at different positions can improve the stability of the injection molding time base island 20.

Embodiment III:

a TO-LL package structure comprising the lead frame comprises a plastic package body 40, wherein the plastic package body 40 completely covers a base island 20. As shown in fig. 4, since the land 20 does not need to reserve the space of the pressing groove 41, the use area of the land 20 can be increased, so that the land 20 can package a larger-sized MOSFET power chip, and the power of the packaged chip can be effectively increased without changing the original lead frame base structure.

The foregoing disclosure is merely illustrative of some embodiments of the utility model, but the embodiments are not limited thereto and variations within the scope of the utility model will be apparent to those skilled in the art.

Claims

1. The TO-LL packaging lead frame comprises base islands and a lead frame, and is characterized in that the base islands adjacent TO the lead frame are connected TO the lead frame through first connecting ribs, and the two adjacent base islands are connected through second connecting ribs along the extending direction perpendicular TO source pins.

2. The TO-LL package lead frame according TO claim 1, wherein the number of second connecting ribs is a plurality, the first connecting ribs are in one-TO-one correspondence with the second connecting ribs, and the plurality of second connecting ribs are arranged side by side along the extending direction of the source pins.

3. A package structure comprising the TO-LL package lead frame according TO claim 1 or 2, comprising a plastic package body that completely covers the submount.