CN214448072U - High-precision glue position semiconductor die - Google Patents
High-precision glue position semiconductor die Download PDFInfo
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- CN214448072U CN214448072U CN202022809439.2U CN202022809439U CN214448072U CN 214448072 U CN214448072 U CN 214448072U CN 202022809439 U CN202022809439 U CN 202022809439U CN 214448072 U CN214448072 U CN 214448072U
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Abstract
The utility model discloses a high-precision glue position semiconductor die, in particular to the technical field of semiconductors, which comprises an upper die, wherein the bottom of the upper die is provided with a lower die, a plurality of upper die frames are arranged in the upper die, a plurality of lower die frames are arranged in the lower die, the upper die frames are arranged opposite to the lower die frames, a mounting plate is arranged in the upper die frames, an insert is fixedly arranged on one side of the mounting plate, an insert block is fixedly connected with the other side of the mounting plate, a slot is arranged in the inner part of the upper die frames relative to the position of the insert block, the insert block is matched with the slot in structure, and a locking mechanism is arranged in the upper die frames; the number of the locking mechanisms is two, and the two locking mechanisms are arranged oppositely. The utility model has the advantages of simple and reasonable design, be convenient for change the mold insert of different grade type, easy operation has improved the application scope of mould, has reduced manufacturing cost.
Description
Technical Field
The utility model relates to the field of semiconductor technology, more specifically say, the utility model relates to a position semiconductor mould is glued to high accuracy.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and in the field of semiconductor packaging, injection molding is a mature process technology, and a mold mainly comprises an upper mold and a lower mold. The injection molding process mainly comprises three steps, namely, firstly, placing a semiconductor chip into a lower mold cavity, then, closing an upper mold, then, heating and melting the mold and packaging plastic, then, injecting the heated and melted plastic into the mold cavity, wrapping the semiconductor chip, and finally, after the plastic is cooled and immobilized, combining the semiconductor chip with the semiconductor chip to form protection on the semiconductor chip.
In some molds, inserts are usually installed, and different inserts can be used when different semiconductors are packaged, but the operation of installing the inserts of the existing mold is complex, and different inserts are inconvenient to replace, so that the application range of the mold is greatly reduced, and the production cost is improved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above-mentioned defect of prior art, the embodiment of the utility model provides a position semiconductor mould is glued to high accuracy is convenient for change the mold insert of different grade type through having set up locking mechanism, and easy operation has improved the application scope of mould, has reduced manufacturing cost to solve the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-precision glue position semiconductor die comprises an upper die, wherein a lower die is arranged at the bottom of the upper die, a plurality of upper die frames are arranged inside the upper die, a plurality of lower die frames are arranged inside the lower die, the upper die frames and the lower die frames are arranged oppositely, a mounting plate is arranged inside the upper die frames, an insert is fixedly arranged on one side of the mounting plate, an insert block is fixedly connected to the other side of the mounting plate, a slot is formed in the position, opposite to the insert block, inside the upper die frames, the structure of the insert block is matched with that of the slot, and a locking mechanism is arranged inside the upper die frames;
locking mechanism's quantity sets up to two sets ofly, and two sets of locking mechanism set up relatively, locking mechanism includes solid fixed cylinder, gu fixed cylinder installs the inside at last mold frame, gu fixed cylinder's inside is provided with the spring, the one end fixedly connected with fixed block of spring, the inner wall fixed connection of fixed block and solid fixed cylinder, the one end fixedly connected with of spring removes the disc, remove one side fixedly connected with check lock lever of disc, the check lock lever runs through to gu fixed cylinder outside, the locking groove has been seted up to the position department of the relative check lock lever of outer wall of inserted block, the check lock lever is phase-matched with the structure in locking groove.
In a preferred embodiment, the semiconductor mounting seat is mounted inside the lower mold frame, and the upper mold and the lower mold are both made of stainless steel.
In a preferred embodiment, the inner wall of the lower mold is provided with a main glue groove, the inner wall of the lower mold is provided with a plurality of branch glue grooves, and the branch glue grooves are all communicated with the main glue groove.
In a preferred embodiment, one end of the branch glue groove is communicated with the inside of the lower mold frame, and one end of the main glue groove penetrates to the outer side of the lower mold.
In a preferred embodiment, the four corners of the upper mold are fixedly connected with positioning rods, the four corners of the lower mold are provided with positioning grooves, and the positioning rods are matched with the positioning grooves in structure.
In a preferred embodiment, a stable sleeve is fixedly arranged at the joint of the fixed cylinder and the locking rod, the end of the locking rod is provided with a semi-sphere structure, and the cross-sectional shape of the locking groove is provided with a semi-circle.
In a preferred embodiment, the outer wall of the moving disk is mounted with a plurality of balls which are in contact with the inner wall of the fixed cylinder.
The utility model discloses a technological effect and advantage:
1. the locking mechanism is arranged, the insert block connected to one side of the mounting plate is inserted into the slot formed in the upper die frame, the locking rod is extruded, the spring is stressed and compressed, when the locking rod corresponds to the locking slot, the spring releases elastic potential energy, the locking rod is pushed into the locking slot, the insert block is clamped with the slot, the insert is mounted in the upper die frame, when the insert needs to be replaced, the mounting plate is pulled out, other types of inserts are replaced, the operation is simple, different types of inserts are convenient to replace, the application range of the die is improved, and the production cost is reduced;
2. through having set up the stabilizing sleeve, can play spacing and stable effect to the check lock lever, be favorable to locking mechanism more stable when locking, through having set up the ball, be favorable to reducing friction, and make locking mechanism more stable when locking, set up to the hemispheroid through the end with the check lock lever, be favorable to carrying out the joint with check lock lever and locking groove, also be favorable to check lock lever and locking groove to unpack apart, through having set up locating lever and constant head tank, insert in the constant head tank in order to make the locating lever, make the last mould dock with the bed die, the effect of direction can be played on the one hand in the setting of constant head tank and locating lever, on the other hand plays the effect of location, the compound die precision of mould and bed die is gone up in the improvement, it is higher to make product production precision.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic view of the upper mold frame structure of the present invention.
Fig. 3 is a schematic structural diagram of the locking mechanism of the present invention.
Fig. 4 is a schematic structural diagram of a position a in fig. 3 according to the present invention.
The reference signs are: 1. an upper die; 2. a lower die; 3. putting a mold frame; 4. a lower mold frame; 5. mounting a plate; 6. an insert; 7. inserting a block; 8. a slot; 9. a fixed cylinder; 10. a spring; 11. a fixed block; 12. moving the disc; 13. a locking lever; 14. a locking groove; 15. a semiconductor mount; 16. a main glue tank; 17. a supporting rubber groove; 18. positioning a rod; 19. positioning a groove; 20. a stabilizing sleeve; 21. and a ball.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The high-precision glue position semiconductor die shown in the attached figures 1-4 comprises an upper die 1, wherein a lower die 2 is arranged at the bottom of the upper die 1, a plurality of upper die frames 3 are arranged inside the upper die 1, a plurality of lower die frames 4 are arranged inside the lower die 2, the upper die frames 3 are arranged opposite to the lower die frames 4, a mounting plate 5 is arranged inside the upper die frames 3, an insert 6 is fixedly arranged on one side of the mounting plate 5, an insert block 7 is fixedly connected to the other side of the mounting plate 5, a slot 8 is formed in the position, opposite to the insert block 7, inside the upper die frame 3, the insert block 7 is matched with the slot 8 in structure, and a locking mechanism is arranged inside the upper die frame 3;
locking mechanism's quantity sets up to two sets of, two sets of locking mechanism sets up relatively, locking mechanism includes solid fixed cylinder 9, gu fixed cylinder 9 installs in the inside of last framed 3, gu fixed cylinder 9's inside is provided with spring 10, spring 10's one end fixedly connected with fixed block 11, the inner wall fixed connection of fixed block 11 and solid fixed cylinder 9, spring 10's one end fixedly connected with removes disc 12, remove one side fixedly connected with check lock lever 13 of disc 12, check lock lever 13 runs through to gu fixed cylinder 9 outside, locking groove 14 has been seted up to the relative check lock lever 13's of outer wall position department of inserted block 7, check lock lever 13 and locking groove 14's structure phase-match.
As shown in fig. 1, a semiconductor mounting base 15 is mounted inside the lower mold frame 4, the upper mold 1 and the lower mold 2 are both made of stainless steel, and the semiconductor mounting base 15 is provided for mounting a semiconductor.
As shown in fig. 1, a main glue groove 16 is formed on the inner wall of the lower mold 2, a plurality of branch glue grooves 17 are formed on the inner wall of the lower mold 2, and the plurality of branch glue grooves 17 are all communicated with the main glue groove 16, so that the packaging plastic of the main glue groove 16 flows into each branch glue groove 17.
As shown in fig. 1, one end of the branch glue groove 17 communicates with the inside of the lower mold frame 4, one end of the main glue groove 16 penetrates the outside of the lower mold 2, and in order to pour the packaging plastic from one end of the main glue groove 16, the packaging plastic flows into the lower mold frame 4 from each branch glue groove 17, thereby packaging the semiconductor.
As shown in figure 1, go up the equal fixedly connected with locating lever 18 in four edges of mould 1, constant head tank 19 has all been seted up in four edges of bed die 2, locating lever 18 and constant head tank 19's structure phase-match, in order to make locating lever 18 insert constant head tank 19, make and go up mould 1 and bed die 2 and dock, the effect of direction can be played on the one hand in setting up of constant head tank 19 and locating lever 18, on the other hand plays the effect of location, the compound die precision of mould 1 and bed die 2 is gone up in the improvement, make product production precision higher.
As shown in fig. 1, the fixed stable cover 20 that is provided with in junction of a fixed cylinder 9 and a check lock 13, the tip of check lock 13 sets up to the hemisphere structure, the cross sectional shape of locking groove 14 sets up to semi-circle, a plurality of balls 21 are installed to the outer wall of removal disc 12, ball 21 contacts with the inner wall of a fixed cylinder 9, stable cover 20 sets up in order to play spacing and stable effect to check lock 13, it is more stable when locking to be favorable to locking mechanism, ball 21 is provided with and is favorable to reducing friction, and make locking mechanism more stable when locking, set up the end of check lock 13 into the hemisphere, be favorable to carrying out the joint with check lock 13 and locking groove 14, also be favorable to check lock 13 and locking groove 14 to unpack apart.
The utility model discloses the theory of operation: the semiconductor is arranged on a semiconductor mounting seat 15 in a lower die frame 4, an upper die 1 and a lower die 2 are matched through a positioning rod 18 and a positioning groove 19, the lower die frame 4 is infused with packaging plastic through a main rubber groove 16 and a branch rubber groove 17, a locking mechanism is arranged, an insert block 7 connected with one side of a mounting plate 5 is inserted into a slot 8 formed in the upper die frame 3, a locking rod 13 is extruded, a spring 10 is compressed under stress, when the locking rod 13 corresponds to the locking slot 14, the spring 10 releases elastic potential energy, the locking rod 13 is pushed into the locking slot 14, the insert block 7 is clamped with the slot 8, the insert 6 is arranged in the upper die frame 3, when the insert 6 needs to be replaced, the mounting plate 5 is pulled out, other types of inserts 6 are replaced, a stabilizing sleeve 20 is arranged to play a role in limiting and stabilizing for the locking rod 13, and the locking mechanism is more stable in locking, the ball 21 is arranged to reduce friction, so that the locking mechanism is more stable when locked, the end of the locking rod 13 is arranged to be a hemisphere, the locking rod 13 and the locking groove 14 are clamped, and the locking rod 13 and the locking groove 14 are also detached.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The utility model provides a position semiconductor die is glued to high accuracy, includes mould (1), its characterized in that: the bottom of the upper die (1) is provided with a lower die (2), a plurality of upper die frames (3) are arranged inside the upper die (1), a plurality of lower die frames (4) are arranged inside the lower die (2), the upper die frames (3) are arranged opposite to the lower die frames (4), a mounting plate (5) is arranged inside the upper die frames (3), an insert (6) is fixedly arranged on one side of the mounting plate (5), an insert block (7) is fixedly connected to the other side of the mounting plate (5), a slot (8) is formed in the position, opposite to the insert block (7), inside the upper die frames (3), the insert block (7) is matched with the slot (8) in structure, and a locking mechanism is arranged inside the upper die frames (3);
locking mechanism's quantity sets up to two sets of, and two sets of locking mechanism set up relatively, locking mechanism includes solid fixed cylinder (9), gu fixed cylinder (9) are installed in the inside of last framed (3), gu fixed cylinder's (9) inside is provided with spring (10), one end fixedly connected with fixed block (11) of spring (10), the inner wall fixed connection of fixed block (11) and gu fixed cylinder (9), the one end fixedly connected with of spring (10) removes disc (12), one side fixedly connected with check lock lever (13) of removing disc (12), check lock lever (13) run through to gu fixed cylinder (9) outside, locking groove (14) have been seted up to the relative check lock lever (13) of outer wall department of inserted block (7), check lock lever (13) and the structure phase-match in locking groove (14).
2. The high-precision glue site semiconductor die according to claim 1, wherein: the semiconductor mounting seat (15) is mounted inside the lower die frame (4), and the upper die (1) and the lower die (2) are both made of stainless steel.
3. The high-precision glue site semiconductor die according to claim 1, wherein: the inner wall of the lower die (2) is provided with a main glue groove (16), the inner wall of the lower die (2) is provided with a plurality of glue grooves (17), and the glue grooves (17) are communicated with the main glue groove (16).
4. A high precision glue site semiconductor die as claimed in claim 3, wherein: one end of the rubber supporting groove (17) is communicated with the interior of the lower die frame (4), and one end of the main rubber groove (16) penetrates through the outer side of the lower die (2).
5. The high-precision glue site semiconductor die according to claim 1, wherein: the equal fixedly connected with locating lever (18) in four edges of going up mould (1), constant head tank (19) have all been seted up in four edges of bed die (2), the structure phase-match of locating lever (18) and constant head tank (19).
6. The high-precision glue site semiconductor die according to claim 1, wherein: the fixing device is characterized in that a stable sleeve (20) is fixedly arranged at the joint of the fixing barrel (9) and the locking rod (13), the end part of the locking rod (13) is of a hemispheroid structure, and the cross section of the locking groove (14) is semicircular.
7. The high-precision glue site semiconductor die according to claim 1, wherein: a plurality of balls (21) are mounted on the outer wall of the movable disc (12), and the balls (21) are in contact with the inner wall of the fixed cylinder (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022809439.2U CN214448072U (en) | 2020-11-27 | 2020-11-27 | High-precision glue position semiconductor die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022809439.2U CN214448072U (en) | 2020-11-27 | 2020-11-27 | High-precision glue position semiconductor die |
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| Publication Number | Publication Date |
|---|---|
| CN214448072U true CN214448072U (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022809439.2U Active CN214448072U (en) | 2020-11-27 | 2020-11-27 | High-precision glue position semiconductor die |
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| CN (1) | CN214448072U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114348116A (en) * | 2021-12-31 | 2022-04-15 | 重庆特斯联智慧科技股份有限公司 | Chassis device of logistics robot |
-
2020
- 2020-11-27 CN CN202022809439.2U patent/CN214448072U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114348116A (en) * | 2021-12-31 | 2022-04-15 | 重庆特斯联智慧科技股份有限公司 | Chassis device of logistics robot |
| CN114348116B (en) * | 2021-12-31 | 2024-04-09 | 重庆特斯联智慧科技股份有限公司 | Chassis device of logistics robot |
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