CN213660416U

CN213660416U - MOS tube capable of efficiently radiating

Info

Publication number: CN213660416U
Application number: CN202022948491.6U
Authority: CN
Inventors: 王晓莉
Original assignee: Xi'an Yansheng Electronic Technology Co ltd
Current assignee: Xi'an Yansheng Electronic Technology Co ltd
Priority date: 2020-12-08
Filing date: 2020-12-08
Publication date: 2021-07-09
Anticipated expiration: 2030-12-08

Abstract

The utility model discloses a can high-efficient radiating MOS pipe, including the packaging body, the fixed surface of packaging body bottom is connected with the pin, the equal fixedly connected with cooling tube in top of the positive surface of pin and back of the body surface, the first radiating fin of surface hoop fixedly connected with of cooling tube outer lane, the front side and the rear side on packaging body left side surface all transversely run through the radiator window, the horizontal fixedly connected with second radiating fin in one side that two radiator window are corresponding. The utility model discloses a set up the cooling tube, first radiating fin, the radiating block, second radiating fin, heat dissipation window, place the recess, the guide piece, positioning groove, the cooperation of louvre and isolation dictyosome is used, improved the heat radiating area of MOS pipe, the radiating efficiency of MOS pipe is higher like this, has solved the in-process of MOS pipe using, because of heat radiating area is less, causes a large amount of heats of accumulating on the MOS pipe easily to lead to the MOS pipe problem that high temperature damaged appears.

Description

MOS tube capable of efficiently radiating

Technical Field

The utility model relates to a MOS manages technical field, specifically is a can high-efficient radiating MOS pipe.

Background

The MOS tube is a metal-oxide-semiconductor field effect transistor or a metal-insulator-semiconductor, the source and drain of the MOS tube can be exchanged, the source and drain are both N-type regions formed in a P-type back gate, in most cases, the two regions are the same, even if the two ends are exchanged, the performance of the device cannot be influenced, the device is considered to be symmetrical, the heat dissipation area of the existing MOS tube is small in the using process, a large amount of heat is easy to accumulate on the MOS tube, the problem that the MOS tube is damaged at high temperature is caused, and great economic loss is brought to a user.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a can high-efficient radiating MOS pipe possesses the big advantage of heat radiating area, has solved the in-process of MOS pipe using, because of heat radiating area is less, causes a large amount of heats of accumulating on the MOS pipe easily to lead to the MOS pipe problem that high temperature damaged to appear.

In order to achieve the above object, the utility model provides a following technical scheme: a MOS tube capable of dissipating heat efficiently comprises a packaging body, wherein pins are fixedly connected to the surface of the bottom of the packaging body, heat dissipation tubes are fixedly connected to the tops of the front surface and the back surface of each pin, first heat dissipation fins are fixedly connected to the circumferential surface of the outer ring of each heat dissipation tube, heat dissipation windows transversely penetrate through the front side and the back side of the left side surface of the packaging body, second heat dissipation fins are fixedly connected to the corresponding sides of the two heat dissipation windows transversely, a placement groove is formed in the surface of the top of the packaging body, heat dissipation holes are formed in the outer ring of the bottom of the inner cavity of the placement groove, an isolation net body is fixedly connected to the inner cavity of each heat dissipation hole, a positioning groove is formed in the center of the bottom of the inner cavity of the placement groove, a heat dissipation block is fixedly connected to the center of the bottom of the inner cavity of the positioning groove, the top of, the bottom fixedly connected with guide piece on radiating block outer lane surface, positioning groove is run through and the encapsulation is internal to the bottom of guide piece.

Preferably, the top of the pin has a transverse length greater than that of the bottom of the pin, and the top of the pin extends to the inner cavity of the package body.

Preferably, one side of each of the two second heat dissipation fins extends into the package body, and the longitudinal length of the heat dissipation window is greater than that of the second heat dissipation fin.

Preferably, the isolation net body is located at the top of the inner cavity of the heat dissipation hole, and one side, away from the heat dissipation block, of the guide piece is in contact with the inner wall of the positioning groove.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a set up the cooling tube, first radiating fin, the radiating block, second radiating fin, heat radiation window, place the recess, the guide piece, positioning groove, the cooperation of louvre and isolation dictyosome is used, the heat radiating area of MOS pipe has been improved, the radiating efficiency of MOS pipe is higher like this, the in-process of having solved the MOS pipe and using, because of heat radiating area is less, cause a large amount of heats of accumulating on the MOS pipe easily, thereby lead to MOS pipe the problem that high temperature damaged to appear, be worth promoting.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a left side view of the package structure of the present invention;

fig. 3 is a top view of the package structure of the present invention.

In the figure: the heat dissipation structure comprises a packaging body 1, a heat dissipation pipe 2, pins 3, first heat dissipation fins 4, hanging holes 5, heat dissipation blocks 6, second heat dissipation fins 7, heat dissipation windows 8, placement grooves 9, guide pieces 10, positioning grooves 11, heat dissipation holes 12 and an isolation mesh body 13.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a MOS transistor capable of dissipating heat with high efficiency includes a package 1, a pin 3 fixedly connected to a surface of a bottom of the package 1, a lateral length of a top of the pin 3 being greater than a lateral length of the bottom, a top of the pin 3 extending to an inner cavity of the package 1, a heat dissipating tube 2 fixedly connected to a top of a front surface and a top of a back surface of the pin 3, a first heat dissipating fin 4 fixedly connected to a surface of an outer ring of the heat dissipating tube 2 in a circumferential direction, heat dissipating windows 8 transversely penetrating through a front side and a back side of a left side surface of the package 1, second heat dissipating fins 7 fixedly connected to sides corresponding to the two heat dissipating windows 8, a side corresponding to the two second heat dissipating fins 7 extending into the package 1, a longitudinal length of the heat dissipating window 8 being greater than a longitudinal length of the second heat dissipating fin 7, a placement groove 9 formed on a surface of the top of the package, the inner cavity of the heat dissipation hole 12 is fixedly connected with an isolation net body 13, the center of the bottom of the inner cavity of the placement groove 9 is provided with a positioning groove 11, the center of the bottom of the inner cavity of the positioning groove 11 is fixedly connected with a heat dissipation block 6, the top of the heat dissipation block 6 extends to the top of the packaging body 1, the center of the top of the front surface of the heat dissipation block 6 is provided with a hanging hole 5 in a penetrating way, the bottom of the outer ring surface of the heat dissipation block 6 is fixedly connected with a guide sheet 10, the bottom of the guide sheet 10 penetrates through the positioning groove 11 and extends into the packaging body 1, the heat dissipation area of the MOS tube is improved by the matching use of the heat dissipation tube 2, the first heat dissipation fin 4, the heat dissipation block 6, the second heat dissipation fin 7, the heat dissipation window 8, the placement groove 9, the guide sheet 10, the positioning groove 11, the heat dissipation hole 12 and the isolation net body, cause a large amount of heats of accumulating on the MOS pipe easily to lead to the MOS pipe problem that high temperature damaged appears, be worth promoting, keep apart the dictyosome 13 and be located the top of 12 inner chambers of louvre, one side that radiating block 6 was kept away from to guide piece 10 contacts with positioning groove 11's inner wall.

When the MOS tube is used, the radiating area of the MOS tube is increased by the matching use of the radiating tube 2, the first radiating fin 4, the radiating block 6, the second radiating fin 7, the radiating window 8, the placing groove 9, the guide piece 10, the positioning groove 11, the radiating hole 12 and the isolation net body 13, so that the radiating efficiency of the MOS tube is higher, and the problem that the MOS tube is damaged at high temperature due to the fact that a large amount of heat is accumulated on the MOS tube easily because the radiating area is smaller in the using process of the MOS tube is solved; the radiating area of the pins 3 is increased through the matching of the radiating pipe 2 and the first radiating fins 4; through the cooperation of second radiating fin 7 and guide piece 10, can lead out the heat in the packaging body 1, heat volatilization in the packaging body 1 has been made things convenient for through the cooperation of louvre 12 and isolation dictyosome 13.

All parts used in the application document are standard parts and can be purchased from the market, and the specific connection mode of all parts adopts conventional means such as bolts, rivets, welding and the like mature in the prior art, and detailed description is not given here.

In summary, the following steps: this can high-efficient radiating MOS pipe, through setting up cooling tube 2, first radiating fin 4, radiating block 6, second radiating fin 7, heat dissipation window 8, place recess 9, guide piece 10, positioning groove 11, louvre 12 and isolation dictyosome 13's cooperation use, solved the in-process that the MOS pipe was using, because of heat radiating area is less, cause a large amount of heats of accumulating on the MOS pipe easily to lead to the MOS pipe problem that high temperature damaged to appear.

In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a can high-efficient radiating MOS pipe, includes packaging body (1), its characterized in that: the surface of the bottom of the packaging body (1) is fixedly connected with a pin (3), the tops of the front surface and the back surface of the pin (3) are fixedly connected with a radiating pipe (2), the surface ring of the outer ring of the radiating pipe (2) is fixedly connected with a first radiating fin (4), the front side and the rear side of the left side surface of the packaging body (1) transversely penetrate through radiating windows (8), one side corresponding to the two radiating windows (8) is transversely and fixedly connected with a second radiating fin (7), the surface of the top of the packaging body (1) is provided with a placing groove (9), the outer ring of the inner cavity bottom of the placing groove (9) is provided with a radiating hole (12), the inner cavity of the radiating hole (12) is fixedly connected with an isolating net body (13), the center of the inner cavity bottom of the placing groove (9) is provided with a positioning groove (11), and the center of the inner cavity bottom of the positioning, the top of radiating block (6) extends to the top of packaging body (1), the center department at radiating block (6) positive surface top runs through and has seted up hanging hole (5), the bottom fixedly connected with guide piece (10) on radiating block (6) outer lane surface, the bottom of guide piece (10) runs through positioning groove (11) and extends to in packaging body (1).

2. The MOS tube capable of dissipating heat with high efficiency as claimed in claim 1, wherein: the transverse length of the top of the pin (3) is larger than that of the bottom of the pin, and the top of the pin (3) extends to the inner cavity of the packaging body (1).

3. The MOS tube capable of dissipating heat with high efficiency as claimed in claim 1, wherein: one side corresponding to the two second heat dissipation fins (7) extends into the packaging body (1), and the longitudinal length of the heat dissipation window (8) is larger than that of the second heat dissipation fins (7).

4. The MOS tube capable of dissipating heat with high efficiency as claimed in claim 1, wherein: the isolation net body (13) is located at the top of the inner cavity of the heat dissipation hole (12), and one side, far away from the heat dissipation block (6), of the guide piece (10) is in contact with the inner wall of the positioning groove (11).