CN221041111U

CN221041111U - MOS pipe packaging structure

Info

Publication number: CN221041111U
Application number: CN202322687076.3U
Authority: CN
Inventors: 吴修善; 邹骏发
Original assignee: Shijing Semiconductor Shenzhen Co ltd
Current assignee: Shijing Semiconductor Shenzhen Co ltd
Priority date: 2023-10-08
Filing date: 2023-10-08
Publication date: 2024-05-28
Anticipated expiration: 2033-10-08

Abstract

The utility model relates to the technical field of MOS tube packaging, in particular to a MOS tube packaging structure which comprises a fixed base, wherein one side of the fixed base is fixedly connected with a bottom packaging shell, two symmetrical side surfaces of the bottom packaging shell are respectively provided with a positioning groove, and the inner wall of each positioning groove is fixedly provided with a positioning plate through bolts. The utility model has the advantages that: through absorber plate, heat conduction pole, first heating panel, the fin, the heat-conducting plate, the chip, the pin, heat conduction sleeve, the heat conduction threaded rod, the second heating panel, the second fin, the installation cavity, the cooperation setting of radiating groove and intercommunication groove, can dispel the heat work to the inside of bottom encapsulation shell and top encapsulation shell simultaneously, can be at the inside heat dissipation to the external world of the inside bottom encapsulation shell of chip during operation quick with bottom encapsulation shell and top encapsulation shell, thereby avoid the inside higher condition of temperature of bottom encapsulation shell and top encapsulation shell, avoid the influence of temperature rise to the chip, guaranteed the life of MOS pipe.

Description

MOS pipe packaging structure

Technical Field

The utility model relates to the technical field of MOS (metal oxide semiconductor) tube packaging, in particular to a MOS tube packaging structure.

Background

The M0S transistor is a metal-oxide-semiconductor field effect transistor, or referred to as a metal-insulator-semiconductor field effect transistor. The source and drain of the MOS transistor are interchangeable, they are both N-type regions formed in P-type backgate, and in most cases, the two regions are identical, even though the two ends are interchangeable, without affecting the performance of the device, which is considered symmetrical. After the production, the MOS tube is packaged, the chip is placed on a substrate with a bearing function, the pins are led out, and then the chips are fixedly packaged into a whole so as to be protected and transported.

At present, a chip is generally packaged in a mounting frame formed by combining an upper frame and a lower frame, the upper frame and the lower frame are fixed together through a plurality of screws, so that a relatively airtight space is formed between the upper frame and the lower frame for avoiding the influence of external factors such as water vapor on the MOS tube chip, and the airtight space has poor heat dissipation.

Disclosure of utility model

The object of the present utility model is to solve at least one of the technical drawbacks.

Therefore, an object of the present utility model is to provide a MOS transistor packaging structure, which solves the problems mentioned in the background art, and overcomes the drawbacks of the prior art.

In order to achieve the above object, an embodiment of an aspect of the present utility model provides a MOS tube packaging structure, which comprises a fixing base, one side of the fixing base is fixedly connected with a bottom packaging shell, two symmetrical sides of the bottom packaging shell are respectively provided with a positioning groove, an inner wall of the positioning groove is fixedly provided with a positioning plate through a bolt, one side of the positioning plate is fixedly connected with a top packaging shell, one side of the top packaging shell is fixedly provided with a heat absorbing plate, one side of the heat absorbing plate is fixedly connected with a plurality of heat conducting rods, a plurality of top ends of the heat conducting rods are fixedly connected with a first heat dissipating plate, one side of the first heat dissipating plate, which is far away from the heat conducting rods, is fixedly connected with a heat conducting plate fixedly connected with the fixing base, one side of the heat conducting plates is fixedly provided with a chip, one side of the chip is fixedly provided with pins, one side of the heat conducting plate, one side of the heat conducting plates is far away from the chip is fixedly connected with two heat conducting sleeves, two inner walls of the heat conducting sleeves are respectively in threaded connection with a heat conducting rod, one ends of the two heat conducting rods are fixedly connected with a second heat dissipating plate, one side of the heat dissipating rods is fixedly connected with a plurality of heat dissipating plates, one side of the heat dissipating plates is fixedly connected with a plurality of heat dissipating plates, and one side of heat dissipating plates is fixedly connected with two heat dissipating plates.

By the above-mentioned scheme preferred, first seal groove has been seted up to the top side of bottom encapsulation shell, the inner wall fixedly connected with U-shaped sealing washer of first seal groove, the second seal groove has been seted up to the bottom side of top encapsulation shell, the inner wall fixedly connected with sealed pad of second seal groove.

By any of the above schemes, preferably, the heat conducting rod penetrates through the top packaging shell, the heat conducting rod is fixedly connected with the top packaging shell, the first heat radiating plate is fixedly installed on one side of the top packaging shell, and the heat conducting rod is connected with the top packaging shell.

By above-mentioned arbitrary scheme preferred, the pin is located the inside of U-shaped sealing washer, the pin is closely with the laminating of U-shaped sealing washer, the top side of pin is closely laminated with the bottom side of sealed pad, has carried out sealing work through U-shaped sealing washer and sealed pad to the junction of pin, bottom encapsulation shell and top encapsulation shell.

By any of the above schemes, it is preferable that the heat conducting sleeve penetrates through one side of the fixed base and extends to the inside of the installation cavity, and the heat conducting sleeve is fixedly connected with the fixed base.

By the above-mentioned scheme preferred, the shape of second heating panel and installation cavity is circular, the centre of a circle position of second heating panel and installation cavity corresponds, the diameter of second heating panel is less than the diameter of installation cavity for the inside of installation cavity can be gone into smoothly to the second heating panel.

By any of the above schemes, preferably, the heat dissipation grooves are communicated with the installation cavities, and the plurality of heat dissipation grooves are distributed in a circumferential array about the circle center of the installation cavities, and the communication grooves are communicated with the two installation cavities, so that gas can enter the inside of the installation cavities and circulate in the inside of the two installation cavities through the plurality of communication grooves.

Compared with the prior art, the utility model has the following advantages and beneficial effects:

1. Through absorber plate, heat conduction pole, first heating panel, fin, heat conduction board, chip, pin, heat conduction sleeve, heat conduction threaded rod, second heating panel, second fin, installation cavity, radiating groove and intercommunication groove's cooperation setting can be right simultaneously the inside of bottom encapsulation shell and top encapsulation shell carries out the heat dissipation work, can be in the inside heat dissipation to the external world of bottom encapsulation shell and top encapsulation shell that the during operation of chip for a long time is quick, thereby avoids the inside higher condition of temperature of bottom encapsulation shell and top encapsulation shell avoids the temperature to rise to the influence of chip, has guaranteed the life of MOS pipe.

2. The U-shaped sealing ring and the sealing gasket are used for sealing the joints of the pins, the bottom packaging shell and the top packaging shell, so that the sealing performance of the packaging structure is good while the heat dissipation performance is good, the influence of external factors on the chip is avoided, and the service life of the MOS tube is further guaranteed.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic cross-sectional view of the present utility model;

FIG. 3 is a schematic view of a first view structure of a bottom package and a connecting member thereof according to the present utility model;

FIG. 4 is a schematic view of a second view structure of the bottom package and the connecting members thereof according to the present utility model;

fig. 5 is a schematic structural view of the top package and the connection members thereof according to the present utility model.

In the figure: the heat-conducting device comprises a 1-fixed base, a 2-bottom packaging shell, a 3-positioning groove, a 4-positioning plate, a 5-top packaging shell, a 6-heat-absorbing plate, a 7-heat-conducting rod, an 8-first heat-radiating plate, 9-radiating fins, a 10-heat-conducting plate, an 11-chip, 12-pins, a 13-heat-conducting sleeve, a 14-heat-conducting threaded rod, a 15-second heat-radiating plate, a 16-second heat-radiating fin, a 17-mounting cavity, an 18-heat-radiating groove, a 19-communicating groove, a 20-U-shaped sealing ring and a 21-sealing gasket.

Detailed Description

The present utility model will be further described with reference to the accompanying drawings, but the scope of the present utility model is not limited to the following.

As shown in fig. 1 to 5, a MOS tube packaging structure comprises a fixing base 1, a bottom packaging shell 2 is fixedly connected to one side of the fixing base 1, positioning grooves 3 are formed in two symmetrical side surfaces of the bottom packaging shell 2, a positioning plate 4 is fixedly mounted on the inner wall of the positioning groove 3 through bolts, a top packaging shell 5 is fixedly connected to one side of the positioning plate 4, a heat absorbing plate 6 is fixedly mounted on one side of the top packaging shell 5, a plurality of heat conducting rods 7 are fixedly connected to one side of the heat absorbing plate 6, a first heat dissipating plate 8 is fixedly connected to the top ends of the plurality of heat conducting rods 7, a plurality of heat dissipating fins 9 are fixedly connected to one side of the first heat dissipating plate 8 away from the heat conducting rods 7, a heat conducting plate 10 fixedly connected to one side of the inside the bottom packaging shell 2, a chip 11 is fixedly mounted on one side of the heat conducting plate 10, pins 12 are fixedly mounted on one side of the chip 11, two heat conducting sleeves 13 are fixedly connected to one side, far away from the chip 11, of the heat conducting plate 10, heat conducting threaded rods 14 are fixedly connected to the inner walls of the two heat conducting sleeves 13, second radiating plates 15 are fixedly connected to one ends of the two heat conducting threaded rods 14, a plurality of second radiating fins 16 are fixedly connected to one sides of the two second radiating plates 15, two mounting cavities 17, a plurality of radiating grooves 18 and communicating grooves 19 are formed in the bottom side of the fixing base 1, when the second radiating plates 15 are connected, the heat conducting threaded rods 14 are in threaded connection with the heat conducting sleeves 13, the second radiating plates 15 are tightly attached to the inner walls of the mounting cavities 17, at the moment, the middle positions of the two adjacent second radiating fins 16 correspond to the positions of one radiating groove 18, so that air flow can pass through the two second radiating fins 16, radiating work is performed on the second radiating fins 16, when the chip 11 works to generate heat, the heat conducting plate 10 conducts heat to the heat conducting sleeve 13, the heat conducting threaded rod 14 conducts heat to the second heat radiating plate 15, the second heat radiating plate 15 is subjected to heat radiating work through the plurality of second heat radiating fins 16, the heat absorbing plate 6 absorbs heat and conducts heat to the first heat radiating plate 8 through the heat conducting rod 7, the first heat radiating plate 8 is subjected to heat radiating work through the heat radiating fins 9, and therefore heat in the bottom packaging shell 2 and the top packaging shell 5 can be conducted to the outside.

As an alternative technical scheme of the utility model, the top side of the bottom packaging shell 2 is provided with a first sealing groove, the inner wall of the first sealing groove is fixedly connected with a U-shaped sealing ring 20, the bottom side of the top packaging shell 5 is provided with a second sealing groove, the inner wall of the second sealing groove is fixedly connected with a sealing gasket 21, the sealing gasket 21 and the U-shaped sealing ring 20 are made of rubber, when a chip 11 is installed, the chip 11 is installed on a heat-conducting plate 10, pins 12 are clamped into the U-shaped sealing ring 20, at the moment, the U-shaped sealing ring 20 is tightly attached to the pins 12, then a positioning plate 4 is clamped with a positioning groove 3, the top side of the bottom packaging shell 2 is tightly attached to the bottom side of the top packaging shell 5, and the positioning plate 4 is fixed through screws, at the moment, the bottom side of the sealing gasket 21 is tightly attached to the top side of the pins 12, and at the joint of the pins 12, the bottom packaging shell 2 and the top packaging shell 5 are sealed, and at the moment, the chip 11 is packaged.

As an alternative solution of the present utility model, the heat conducting rod 7 penetrates through the top packaging shell 5, the heat conducting rod 7 is fixedly connected with the top packaging shell 5, the first heat dissipating plate 8 is fixedly installed on one side of the top packaging shell 5, and the heat conducting rod 7 is connected with the top packaging shell 5.

As an alternative technical scheme of the utility model, the pin 12 is positioned in the U-shaped sealing ring 20, the pin 12 is tightly attached to the U-shaped sealing ring 20, the top side of the pin 12 is tightly attached to the bottom side of the sealing gasket 21, and the joint of the pin 12, the bottom packaging shell 2 and the top packaging shell 5 is sealed through the U-shaped sealing ring 20 and the sealing gasket 21.

As an alternative solution of the present utility model, the heat conducting sleeve 13 penetrates one side of the fixed base 1 and extends to the inside of the installation cavity 17, and the heat conducting sleeve 13 is fixedly connected with the fixed base 1.

As an alternative solution of the present utility model, the shapes of the second heat dissipation plate 15 and the installation cavity 17 are all circular, the second heat dissipation plate 15 corresponds to the center position of the installation cavity 17, and the diameter of the second heat dissipation plate 15 is smaller than the diameter of the installation cavity 17, so that the second heat dissipation plate 15 can smoothly enter into the installation cavity 17.

As an alternative solution of the present utility model, the heat dissipation grooves 18 are communicated with the installation cavities 17, and the plurality of heat dissipation grooves 18 are distributed in a circumferential array about the center of the installation cavities 17, and the communication grooves 19 are communicated with the two installation cavities 17, so that the gas can enter the inside of the installation cavities 17 and circulate inside the two installation cavities 17 through the plurality of communication grooves 19.

An MOS tube packaging structure has the following working principle:

When the chip 11 works to generate heat, the heat conducting plate 10 conducts the heat to the heat conducting sleeve 13, and conducts the heat to the second heat radiating plate 15 through the heat conducting threaded rod 14, the second heat radiating plate 15 is subjected to heat radiating work through the plurality of second heat radiating fins 16, and at the moment, the heat absorbing plate 6 absorbs the heat and conducts the heat to the first heat radiating plate 8 through the heat conducting rod 7, and the first heat radiating plate 8 is subjected to heat radiating work through the heat radiating fins 9, so that the heat inside the bottom packaging shell 2 and the top packaging shell 5 can be conducted to the outside.

To sum up, this MOS pipe packaging structure, through absorber plate 6, heat conduction pole 7, first heating panel 8, fin 9, heat conduction board 10, chip 11, pin 12, heat conduction sleeve 13, heat conduction threaded rod 14, second heating panel 15, second fin 16, installation cavity 17, the cooperation setting of heat dissipation groove 18 and intercommunication groove 19, can dispel the heat work to the inside of bottom encapsulation shell 2 and top encapsulation shell 5 simultaneously, can be at the inside heat dissipation of chip 11 long-time during operation quick with bottom encapsulation shell 2 and top encapsulation shell 5 to the external world, thereby avoid the inside higher condition of temperature of bottom encapsulation shell 2 and top encapsulation shell 5, avoid the influence of temperature rise to chip 11, guaranteed MOS pipe's life, the junction through U-shaped sealing washer 20 and sealing washer 21 to pin 12, bottom encapsulation shell 2 and top encapsulation shell 5 has carried out sealing work, thereby make this packaging structure's leakproofness comparatively good simultaneously, avoided the influence of external factor to chip 11, thereby further guaranteed MOS pipe's life.

Claims

1. An MOS pipe packaging structure, its characterized in that: including unable adjustment base (1), one side fixedly connected with bottom encapsulation shell (2) of unable adjustment base (1), constant head tank (3) have all been seted up to two sides of bottom encapsulation shell (2) symmetry, the inside one side fixedly connected with locating plate (4) of constant head tank (3) through the bolt, one side fixedly connected with top encapsulation shell (5) of locating plate (4), one side fixedly connected with heat-absorbing plate (6) of top encapsulation shell (5), one side fixedly connected with a plurality of heat-conducting rod (7) of heat-absorbing plate (6), a plurality of heat-conducting rod (7) top fixedly connected with first heating panel (8), one side fixedly connected with a plurality of fin (9) of heat-conducting rod (7) are kept away from to first heating panel (8), one side fixedly connected with and unable adjustment base (1) inside heat-conducting plate (10) of heat-conducting plate (10), one side fixedly connected with chip (11) of heat-conducting plate (10), one side fixedly connected with pin (12) of chip (11), heat-conducting plate (10) is kept away from heat-conducting sleeve (13) two heat-conducting sleeve (13) of heat-conducting rod (13), one end of each heat conduction threaded rod (14) is fixedly connected with a second heat dissipation plate (15), one side of each second heat dissipation plate (15) is fixedly connected with a plurality of second heat dissipation fins (16), and two mounting cavities (17), a plurality of heat dissipation grooves (18) and communication grooves (19) are formed in the bottom side of the fixed base (1).

2. The MOS transistor package structure of claim 1, wherein: the top side of bottom encapsulation shell (2) has seted up first seal groove, the inner wall fixedly connected with U-shaped sealing washer (20) of first seal groove, the second seal groove has been seted up to the bottom side of top encapsulation shell (5), the inner wall fixedly connected with sealing washer (21) of second seal groove.

3. The MOS transistor package structure of claim 2, wherein: the heat conducting rod (7) penetrates through the top packaging shell (5), the heat conducting rod (7) is fixedly connected with the top packaging shell (5), and the first heat radiating plate (8) is fixedly installed on one side of the top packaging shell (5).

4. A MOS transistor package structure according to claim 3, wherein: the pin (12) is located inside the U-shaped sealing ring (20), the pin (12) is tightly attached to the U-shaped sealing ring (20), and the top side of the pin (12) is tightly attached to the bottom side of the sealing gasket (21).

5. The MOS transistor package structure of claim 4, wherein: the heat conduction sleeve (13) penetrates through one side of the fixed base (1) and extends to the inside of the installation cavity (17), and the heat conduction sleeve (13) is fixedly connected with the fixed base (1).

6. The MOS transistor package structure of claim 5, wherein: the shape of the second radiating plate (15) and the shape of the mounting cavity (17) are circular, the second radiating plate (15) corresponds to the circle center of the mounting cavity (17), and the diameter of the second radiating plate (15) is smaller than the diameter of the mounting cavity (17).

7. The MOS transistor package structure of claim 6, wherein: the heat dissipation grooves (18) are communicated with the mounting cavities (17), a plurality of heat dissipation grooves (18) are distributed in a circumferential array with respect to the circle centers of the mounting cavities (17), and the communication grooves (19) are communicated with the two mounting cavities (17).