CN216620347U

CN216620347U - TEC semiconductor refrigeration piece integrated with multiple groups of reaction tables

Info

Publication number: CN216620347U
Application number: CN202123402420.7U
Authority: CN
Inventors: 石保华
Original assignee: Guanleng Technology Shenzhen Co ltd
Current assignee: Guanleng Technology Shenzhen Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-05-27
Anticipated expiration: 2031-12-31

Abstract

The utility model relates to a TEC semiconductor refrigeration sheet integrating a plurality of groups of reaction tables, which comprises a reaction table, wherein an operation groove is arranged at the top of the reaction table, a heat conducting plate is arranged at the bottom of the operation groove, an installation groove is arranged at the bottom of the heat conducting plate, a refrigeration sheet body is arranged in the installation groove, the refrigeration sheet body comprises ceramic panels which are symmetrically arranged, heat conducting sheets are symmetrically arranged at the inner sides of the ceramic panels, semiconductor elements are arranged between the heat conducting sheets, sealing elements are arranged at the outer sides of the semiconductor elements, a lead is arranged at one side of the refrigeration sheet body, a heat radiating piece is arranged at the lower side of the refrigeration sheet body, a wire groove is arranged at one side of the installation groove, a fixed plate is arranged below the reaction table, a heat radiating groove is arranged between the fixed plate and the reaction table, ventilation openings are symmetrically arranged at two sides of the reaction table, the structure is simple, the design is reasonable, can guarantee the leakproofness of refrigeration piece, can guarantee the heat dissipation simultaneously, avoid refrigeration piece high temperature to damage.

Description

TEC semiconductor refrigeration piece integrated with multiple groups of reaction tables

Technical Field

The utility model relates to a TEC semiconductor refrigerating sheet integrated with a plurality of groups of reaction tables, and belongs to the technical field of semiconductor refrigerating sheets.

Background

A semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump, its advantage is not having sliding part, apply to some space and is limited, the reliability is required to be high, the occasion without refrigerant pollution, utilize Peltier effect of the semiconductor material, when the direct current passes through the galvanic couple that two kinds of different semiconductor materials are connected in series, can absorb the heat and emit the heat separately at both ends of the galvanic couple, can realize the purpose of refrigerating, it is a refrigeration technology producing negative thermal resistance, it features there is no moving part, the reliability is higher too, the existing refrigerating plate hot junction dispels the heat slowly, produce the high temperature easily, cause the damage of refrigerating plate.

Disclosure of Invention

The technical problem to be solved by the utility model is to overcome the existing defects, and provide a TEC semiconductor refrigeration piece integrating multiple groups of reaction tables, wherein the heat conducting plate is arranged, so that the refrigeration effect of the refrigeration piece on an operation groove can be ensured, the using effect of the refrigeration piece is improved, the sealing element is arranged, the structure of the refrigeration piece can be sealed, the sealing effect is ensured, meanwhile, the normal heat transfer of the refrigeration piece is not influenced, the refrigeration and heat dissipation effects are realized, and the heat generated by the refrigeration piece can be quickly dissipated by arranging the heat dissipation piece, so that the refrigeration piece is prevented from being damaged due to high temperature, meanwhile, the heat dissipation groove is arranged, the heat dissipation piece can be conveniently dissipated, the heat dissipation effect on the refrigeration piece is improved, and the problems in the background technology can be effectively solved.

In order to solve the technical problems, the utility model provides the following technical scheme:

the utility model provides a TEC semiconductor refrigeration piece of integrated multiunit reaction platform, includes the reaction platform, the reaction platform top is provided with the operation groove, the heat-conducting plate is installed to operation tank bottom, the heat-conducting plate bottom is provided with the mounting groove, be provided with the refrigeration piece body in the mounting groove, the ceramic panel that the refrigeration piece body set up including the symmetry, the inboard symmetry of ceramic panel is provided with the conducting strip, be provided with semiconductor element between the conducting strip, the semiconductor element outside is provided with the sealing member, refrigeration piece body one side is provided with the lead wire, refrigeration piece body downside is provided with the radiating piece, mounting groove one side is provided with the wire casing, the reaction platform below is provided with the fixed plate, just be provided with the radiating groove between fixed plate and the reaction platform, reaction platform bilateral symmetry is provided with the vent.

Furthermore, the ceramic panel edge is provided with the extension limit, just extend the limit and set up in the relative one side of ceramic panel, it has sealed glue to fill between the ceramic panel.

Furthermore, a through groove is formed between the wire groove and the mounting groove, the lead wire penetrates through the through groove, and a protective pipe is arranged on the outer side of the lead wire.

Further, the heat dissipation part is arranged in the heat dissipation groove and comprises a heat dissipation plate, and heat dissipation fins are arranged on the heat dissipation plate.

Further, a dustproof net is installed in the vent, and a heat dissipation fan is installed on the vent on one side.

Further, the length of the ventilation opening at the air inlet end is the same as that of the mounting groove, and the ventilation opening at the air outlet end is connected with the heat dissipation fan through a pipeline.

The utility model has the beneficial effects that:

1. by arranging the heat conducting plate, the refrigerating effect of the refrigerating sheet on the operation groove can be ensured, and the using effect of the refrigerating sheet is improved;

2. by arranging the sealing element, the structure of the refrigerating sheet can be sealed, the sealing effect is ensured, and meanwhile, the normal heat transfer, the refrigerating and radiating effects of the refrigerating sheet are not influenced;

3. through setting up the radiating piece, can carry out the effluvium fast to the heat that the refrigeration piece produced to avoid refrigeration piece high temperature to cause destruction, the radiating groove can conveniently dispel the heat to the radiating piece simultaneously, thereby improves the radiating effect to the refrigeration piece.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model.

Fig. 1 is a structural diagram of a TEC semiconductor chilling plate reaction table integrated with multiple reaction tables according to the present invention.

Fig. 2 is a sectional view of a TEC semiconductor chilling plate reaction plate integrated with a plurality of reaction plates according to the present invention.

Fig. 3 is a structural diagram of a TEC semiconductor chilling plate body integrating a plurality of reaction stages according to the present invention.

Fig. 4 is a structural diagram of a heat sink of a TEC semiconductor chilling plate integrated with multiple groups of reaction stations according to the present invention.

Reference numbers in the figures: 1. a reaction platform; 2. an operation slot; 3. a heat conducting plate; 4. mounting grooves; 5. a refrigeration sheet body; 6. a ceramic panel; 7. a heat conductive sheet; 8. a semiconductor element; 9. a seal member; 10. a lead wire; 11. a heat sink; 12. a wire slot; 13. a fixing plate; 14. a heat sink; 15. a vent; 16. an extension edge; 17. sealing glue; 18. a through groove; 19. a heat dissipation plate; 20. a heat dissipating fin; 21. a heat radiation fan.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

As shown in FIGS. 1-4, a TEC semiconductor refrigeration piece integrating multiple groups of reaction tables comprises a reaction table 1, wherein an operation groove 2 is arranged at the top of the reaction table 1, a heat conducting plate 3 is arranged at the bottom of the operation groove 2, so that the refrigeration effect of the refrigeration piece on the operation groove 2 can be ensured, the use effect of the refrigeration piece can be improved, an installation groove 4 is arranged at the bottom of the heat conducting plate 3, a refrigeration piece body 5 is arranged in the installation groove 4, the refrigeration piece body 5 comprises symmetrically arranged ceramic panels 6, the refrigeration piece is protected under the condition of ensuring heat conduction, heat conducting plates 7 are symmetrically arranged at the inner sides of the ceramic panels 6, semiconductor elements 8 are arranged between the heat conducting plates 7, sealing parts 9 are arranged at the outer sides of the semiconductor elements 8, the refrigeration piece structure can be sealed, the sealing effect can be ensured, and the normal heat transfer of the refrigeration piece can not be influenced, refrigeration and radiating effect, 5 one sides of refrigeration piece body are provided with

lead wire

10, 5 downside of refrigeration piece body is provided with radiating piece 11, can carry out effluvium fast to the heat that the refrigeration piece produced to avoid refrigeration piece high temperature to cause destruction, 4 one sides of mounting groove are provided with

wire casing

12, 1 below of reaction platform is provided with fixed plate 13, just be provided with radiating groove 14 between fixed plate 13 and the reaction platform 1, can conveniently dispel the heat to radiating piece 11, thereby improve the radiating effect to the refrigeration piece, 1 bilateral symmetry of reaction platform is provided with vent 15.

As shown in fig. 1, a through groove 18 is arranged between the wire groove 12 and the mounting groove 4, the lead wire 10 passes through the through groove 18, and a protective tube is arranged outside the lead wire 10 to protect the lead wire 10, so as to prevent the lead wire 10 from being broken.

As shown in fig. 2, install the dust screen in the vent 15, one side install radiator fan 21 on the vent 15, the vent 15 length of air inlet end is the same with the length of mounting groove 4, and the vent 15 of air outlet end is connected with radiator fan 21 through the pipeline, thereby can accelerate the circulation of air and accelerate 11 heat of radiating piece to volatilize.

As shown in fig. 3, the edge of the ceramic panel 6 is provided with an extending edge 16, the extending edge 16 is arranged at the opposite side of the ceramic panel 6, and a sealant 17 is filled between the ceramic panels 6.

As shown in fig. 4, the heat sink 11 is disposed in the heat sink 14, the heat sink 11 includes a heat dissipation plate 19, and the heat dissipation plate 19 is provided with heat dissipation fins 20.

The working principle of the utility model is as follows: install refrigeration piece body 5 in mounting groove 4 during the installation, place lead wire 10 in wire casing 12, after the installation is accomplished, paste the cooling piece back at the refrigeration piece through heat conduction glue with radiating piece 11, and set up radiating fin 20's length direction along 15 directions of vent, then install fixed plate 13, during the use, the refrigeration piece circular telegram, cool down heat-conducting plate 3, open radiator fan 21 simultaneously and dispel the heat fast in to radiating groove 14, thereby avoid keeping warm and cause the refrigeration piece to damage.

The above embodiments are preferred embodiments of the present invention, and those skilled in the art can make variations and modifications to the above embodiments, therefore, the present invention is not limited to the above embodiments, and any obvious improvements, substitutions or modifications made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims

1. The utility model provides an integrated TEC semiconductor refrigeration piece of multiunit reaction platform, includes reaction platform (1), its characterized in that: the reaction table is characterized in that an operation groove (2) is arranged at the top of the reaction table (1), a heat conducting plate (3) is installed at the bottom of the operation groove (2), a mounting groove (4) is formed in the bottom of the heat conducting plate (3), a refrigerating sheet body (5) is arranged in the mounting groove (4), the refrigerating sheet body (5) comprises ceramic panels (6) which are symmetrically arranged, heat conducting sheets (7) are symmetrically arranged on the inner sides of the ceramic panels (6), semiconductor elements (8) are arranged between the heat conducting sheets (7), sealing elements (9) are arranged on the outer sides of the semiconductor elements (8), a lead (10) is arranged on one side of the refrigerating sheet body (5), a radiating piece (11) is arranged on the lower side of the refrigerating sheet body (5), a wire groove (12) is formed in one side of the mounting groove (4), a fixing plate (13) is arranged below the reaction table (1), and a radiating groove (14) is formed between the fixing plate (13) and the reaction table (1), the reaction table (1) is symmetrically provided with ventilation openings (15) at two sides.

2. The TEC semiconductor refrigeration piece integrating multiple groups of reaction tables according to claim 1, wherein: the ceramic panel (6) edge is provided with extends limit (16), just extend limit (16) and set up in ceramic panel (6) relative one side, it has sealed glue (17) to fill between ceramic panel (6).

3. The TEC semiconductor refrigeration piece integrating multiple groups of reaction tables according to claim 1, wherein: a through groove (18) is formed between the wire groove (12) and the mounting groove (4), the lead (10) penetrates through the through groove (18), and a protective pipe is arranged on the outer side of the lead (10).

4. The TEC semiconductor refrigeration piece integrating multiple groups of reaction tables according to claim 1, wherein: the heat dissipation piece (11) is arranged in the heat dissipation groove (14), the heat dissipation piece (11) comprises a heat dissipation plate (19), and heat dissipation fins (20) are arranged on the heat dissipation plate (19).

5. The TEC semiconductor refrigeration piece integrating multiple groups of reaction tables according to claim 1, wherein: install the dust screen in vent (15), one side install radiator fan (21) on vent (15).

6. The TEC semiconductor refrigeration piece integrating multiple groups of reaction tables according to claim 5, wherein: the length of the ventilation opening (15) at the air inlet end is the same as that of the mounting groove (4), and the ventilation opening (15) at the air outlet end is connected with a heat dissipation fan (21) through a pipeline.