CN211128380U - Heat radiation structure of mainboard and power device - Google Patents
Heat radiation structure of mainboard and power device Download PDFInfo
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- CN211128380U CN211128380U CN201921955894.4U CN201921955894U CN211128380U CN 211128380 U CN211128380 U CN 211128380U CN 201921955894 U CN201921955894 U CN 201921955894U CN 211128380 U CN211128380 U CN 211128380U
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Abstract
The utility model discloses what realize is a mainboard and power device's heat radiation structure, this structure includes shell, mainboard and power device, the mainboard all sets up inside the shell with power device, power device includes patch element, patch element still is provided with heat-conducting component with the mainboard junction, heat-conducting component supports with the shell and holds. Through setting up the power device into the form of paster element, conveniently paste the power device on the mainboard, guarantee paster element and mainboard connection's stability, the setting of paster element also makes things convenient for the inside thermal effluvium of power device simultaneously, set up through heat-conducting component and support with the shell and hold, make things convenient for on quick the deriving of heat on paster element and the mainboard to the shell, and then realize mainboard and power device's good heat dissipation function, replaced traditional needs fix radiator fan with the screw and then realize the inside radiating condition of equipment.
Description
Technical Field
The utility model belongs to the technical field of the power device heat dissipation, in particular to mainboard and power device's heat radiation structure.
Background
The heat radiator is a device or an instrument which transfers heat generated by a machine or other appliances in the working process in time so as to avoid influencing the normal work of the machine or other appliances. Common radiators can be divided into various types such as air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and the like according to the heat dissipation mode.
High temperatures are a rival of integrated circuits. The high temperature can not only cause the unstable operation of the system and shorten the service life, but also possibly burn some parts. The heat that results in the high temperature does not come from outside the device but inside the device, or inside the integrated circuit. The radiator is used for absorbing the heat and then radiating the heat into the case or out of the case, so that the temperature of the power component is ensured to be normal. According to the way of taking away heat from the heat sink, the heat sink of the computer can be divided into active heat dissipation and passive heat dissipation.
In a chinese patent with the publication number "CN 206921041U," entitled "three-dimensional heat sink for motherboard for computer," a three-dimensional heat sink for motherboard for computer is disclosed, which belongs to the technical field of computer hardware. Including the hardware mainboard main part, three-dimensional fin and heat dissipation fan, characterized by passes through fixing bolt and fan fixed base connection in both sides about the hardware mainboard main part, be fixed with the heat dissipation fan in the horizontal position of fan fixed base, be equipped with fan power plug on the heat dissipation fan, the inboard right-hand member of the heat dissipation fan of fixing in the horizontal position is equipped with the connection fixed branch body, be equipped with the slot pedestal on the connection fixed branch body, the heat dissipation fan bottom both sides in vertical position are equipped with the combination and insert the body, the heat dissipation fan in vertical position inserts the body through the combination of downside and is connected fixedly with the slot pedestal, hardware mainboard main part right side is equipped with CPU. The utility model discloses simple structure, convenient to use, when carrying out the three-dimensional heat dissipation of computer motherboard hardware equipment and act on, safe high efficiency, stable in structure, scientific effective, radiating effect ideal are favorable to the timely heat dissipation of mainboard and hardware equipment.
In the above patents, although the heat dissipation function of the main board is realized by the arrangement of the heat dissipation fan, the overall size of the equipment is increased by the mode, dust is increased after the heat dissipation fan is used for a period of time, and the dust has a large influence on the performance of power devices such as the main board and the like; the quality of each bolt fastening and the insulating property of elements need to be controlled in the assembling process, the labor intensity is high, the assembling is complex, the requirement on manpower resource quality is high, the production efficiency is low, the production cost can be indirectly increased, and the product consistency is poor.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a heat dissipation structure for a motherboard and a power device, which has good heat dissipation effect, high product consistency, good insulation property, good anti-seismic function and good waterproof performance.
Another object of the present invention is to provide a heat dissipation structure for a motherboard and a power device, which has the advantages of stable structure, good sealing performance, low production cost, easy installation and use, and wider application range.
In order to achieve the above object, the technical solution of the present invention is as follows.
The utility model discloses what realize is a mainboard and power device's heat radiation structure, this structure includes shell, mainboard and power device, the mainboard all sets up inside the shell with power device, a serial communication port, power device includes patch element, patch element still is provided with heat-conducting component with the mainboard junction, heat-conducting component supports with the shell and holds. Through setting up the power device into the form of paster element, conveniently paste the power device on the mainboard, guarantee paster element and mainboard connection's stability, the setting of paster element also makes things convenient for the inside thermal effluvium of power device simultaneously, through heat-conducting component's setting and support with the shell and hold, make things convenient for on the quick derivation of heat on paster element and the mainboard to the shell, and then realize mainboard and power device's good heat dissipation function.
Further, the heat conduction assembly is wrapped at the joint of the patch element and the main board. The heat conduction subassembly cladding is in patch element and mainboard junction, realizes abundant and comprehensive absorption with the heat on mainboard and the patch element, furtherly, heat conduction subassembly is including heat conduction silica gel, the heat conduction silica gel embedment is in patch element and mainboard junction, just heat conduction silica gel supports with the shell and holds. The heat absorption and the conduction of mainboard and paster element heat are conveniently realized through setting up of heat conduction silica gel, and the support of heat conduction silica gel and shell is held, makes things convenient for heat conduction silica gel to transfer the heat to the shell on, and then realizes the inside mainboard of equipment and the thermal transmission and the dissipation of paster element.
Further, the patch element is produced by adopting an SMT production process. When the SMT production process is adopted for production, the patch elements are automatically produced by a machine, so that the consistency of products is good, and the production efficiency is high.
Further, the side of mainboard inwards caves in and forms the joint groove, be provided with the location platform on the shell, joint groove and location platform adaptation. The matching and the clamping of the clamping groove and the positioning table realize the positioning connection of the mainboard and the shell, and ensure the stability of the mainboard in the internal installation of the shell; simultaneously, the design in joint groove has also increased the surface area of mainboard, has increased the heat radiating area of mainboard promptly, makes the radiating effect of mainboard better.
Furthermore, the clamping groove and the positioning table are both arranged to be more than one, and the clamping groove and the positioning table are the same in number and opposite in position.
Furthermore, the patch element comprises a PFC switch MOS tube, a fly-wheel diode, a power supply inversion switch MOS tube and a DC converter switch MOS tube. Through setting up multiple MOS pipe equipower device into the paster component, make things convenient for the heat dissipation of the inside power device of equipment, guaranteed the good performance of equipment.
To sum up, the utility model discloses what realize is a mainboard and power device's heat radiation structure, and this structure includes shell, mainboard and power device, the mainboard all sets up inside the shell with power device, its characterized in that, power device includes the paster element, the paster element still is provided with heat-conducting component with the mainboard junction, heat-conducting component supports with the shell and holds. Through setting up power device into the form of paster component, make things convenient for the inside thermal effluvium of power device, through heat-conducting component's setting and support with the shell and hold, make things convenient for on paster component and the quick derivation of the heat on the mainboard to the shell, and then realize mainboard and power device's good heat dissipation function.
Drawings
Fig. 1 is a structural diagram of a power device of a heat dissipation structure of a motherboard and a power device of the present invention before improvement.
Fig. 2 is a structural diagram of the heat conducting assembly of the heat dissipating structure of the main board and the power device of the present invention before improvement.
Fig. 3 is a structural diagram of the power device with an improved heat dissipation structure for the motherboard and the power device.
Fig. 4 is a structural diagram of the heat conducting assembly of the heat dissipating structure of the main board and the power device according to the present invention after improvement.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-4, what the utility model realized is a mainboard and power device's heat radiation structure, this structure includes shell 1, mainboard 2 and power device 3, mainboard 2 all sets up inside shell 1 with power device 3, its characterized in that, power device 3 includes chip component 31, chip component 31 still is provided with heat-conducting component 4 with mainboard 2 junction, heat-conducting component 4 supports with shell 1 and holds. Through setting up power device 3 into the form of chip component 31, conveniently paste power device 3 on the mainboard, guarantee the stability that chip component 31 and mainboard 2 are connected, the setting of chip component 31 also makes things convenient for the inside thermal effluvium of power device simultaneously, set up through heat-conducting component 4 and support with shell 1 and hold, make things convenient for quick the deriving to shell 1 of the heat on chip component 31 and the mainboard 2, and then realize mainboard 2 and power device 3's good heat dissipation function, replaced traditional needs to fix radiator fan with screw 5 and then realize the inside radiating condition of equipment.
In this embodiment, the heat conducting assembly 4 is wrapped at the connection between the patch element 31 and the motherboard 2. The heat conducting component 4 is coated at the joint of the patch element 31 and the mainboard 2, so that the heat on the mainboard 2 and the patch element 31 can be fully and comprehensively absorbed,
in this embodiment, the heat conducting assembly 4 includes the heat conducting silica gel 41, the heat conducting silica gel 41 is embedded and sealed at the connection between the patch element 31 and the motherboard 2, and the heat conducting silica gel 41 is supported and held by the housing 1. The heat absorption and conduction of mainboard 2 and patch element 31 are conveniently realized through setting up of heat conduction silica gel 41, and the support of heat conduction silica gel 41 and shell 1 is held, makes things convenient for heat conduction silica gel 41 to transmit the heat to shell 1 on, and then realizes the inside mainboard 2 of equipment and the thermal transmission and the dissipation of patch element 31.
In the present embodiment, the patch element 31 is produced by an SMT production process. When the SMT production process is adopted for production, the patch elements 31 are automatically produced by a machine, so that the consistency of products is good, and the production efficiency is high.
In this embodiment, the side of mainboard 2 is inwards sunken to form joint groove 21, be provided with location platform 11 on the shell 1, joint groove 21 and location platform 11 adaptation. The matching and clamping of the clamping groove 21 and the positioning table 11 realize the positioning connection of the mainboard 2 and the shell 1, and ensure the stability of the installation of the mainboard 2 in the shell 1; meanwhile, the design of the clamping groove 21 also increases the surface area of the mainboard 2, namely, the heat dissipation area of the mainboard 2 is increased, so that the heat dissipation effect of the mainboard 2 is better.
In this embodiment, the number of the clamping grooves 21 and the number of the positioning tables 11 are more than one, and the clamping grooves 21 and the positioning tables 11 are the same in number and opposite in position.
In this embodiment, the patch element 31 includes a PFC switching MOS 311, a freewheeling diode 312, a power inverting switching MOS 313, and a DC converter switching MOS 314. Through setting up power device 3 such as multiple MOS pipe into paster component 31, make things convenient for the heat dissipation of the inside power device 3 of equipment, guaranteed the good performance of equipment.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. The utility model provides a mainboard and power device's heat radiation structure, this structure includes shell, mainboard and power device all set up inside the shell, its characterized in that, power device includes the paster component, paster component and mainboard junction still are provided with heat-conducting component, heat-conducting component supports with the shell and holds.
2. A heat dissipating structure for a motherboard and a power device as claimed in claim 1, wherein the heat conducting component is coated on the connection between the chip component and the motherboard.
3. The heat dissipating structure of claim 2, wherein the heat conducting assembly comprises a heat conducting silicone, the heat conducting silicone is encapsulated at a connection between the patch element and the motherboard, and the heat conducting silicone abuts against the housing.
4. A heat dissipating structure for a motherboard and a power device as recited in claim 1 wherein said chip component is produced by SMT production process.
5. A heat dissipating structure for a motherboard and a power device as claimed in claim 1, wherein the side edge of the motherboard is recessed inward to form a clip groove, the housing is provided with a positioning platform, and the clip groove is adapted to the positioning platform.
6. A heat dissipation structure for a motherboard and a power device as recited in claim 5, wherein the number of the clip grooves and the positioning platforms are the same and the positions of the clip grooves and the positioning platforms are opposite.
7. The heat dissipation structure for a motherboard and a power device as recited in claim 4, wherein the chip component comprises a PFC switch MOS transistor, a freewheeling diode, a power inverting switch MOS transistor, and a DC converter switch MOS transistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921955894.4U CN211128380U (en) | 2019-11-13 | 2019-11-13 | Heat radiation structure of mainboard and power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921955894.4U CN211128380U (en) | 2019-11-13 | 2019-11-13 | Heat radiation structure of mainboard and power device |
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| CN211128380U true CN211128380U (en) | 2020-07-28 |
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| CN201921955894.4U Active CN211128380U (en) | 2019-11-13 | 2019-11-13 | Heat radiation structure of mainboard and power device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114076171A (en) * | 2020-08-20 | 2022-02-22 | 北京小米移动软件有限公司 | Mainboard and terminal equipment |
| CN114449729A (en) * | 2020-11-06 | 2022-05-06 | 中移物联网有限公司 | Mainboard protection structure and assembling method thereof |
-
2019
- 2019-11-13 CN CN201921955894.4U patent/CN211128380U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114076171A (en) * | 2020-08-20 | 2022-02-22 | 北京小米移动软件有限公司 | Mainboard and terminal equipment |
| CN114449729A (en) * | 2020-11-06 | 2022-05-06 | 中移物联网有限公司 | Mainboard protection structure and assembling method thereof |
| CN114449729B (en) * | 2020-11-06 | 2023-11-10 | 中移物联网有限公司 | Main board protection structure and assembly method thereof |
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