CN210837727U - Heat radiator suitable for circuit board - Google Patents
Heat radiator suitable for circuit board Download PDFInfo
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- CN210837727U CN210837727U CN201922136948.0U CN201922136948U CN210837727U CN 210837727 U CN210837727 U CN 210837727U CN 201922136948 U CN201922136948 U CN 201922136948U CN 210837727 U CN210837727 U CN 210837727U
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- stainless steel
- circuit board
- metal
- anchor clamps
- inner chamber
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Abstract
The utility model discloses a heat abstractor suitable for circuit board, including the first metal casing who sets up first inner chamber, set up the second metal anchor clamps in first inner chamber, a second stainless steel fixed subassembly for fixing the first MOS pipe on the circuit board at second metal anchor clamps top and be used for fixing the second stainless steel fixed subassembly in second metal anchor clamps bottom with the second MOS pipe on the circuit board, set up the second inner chamber that the U type led to the chamber and be used for placing magnetic ring on the circuit board on the second metal anchor clamps, the U type leads to the intracavity and is provided with the coolant liquid, the fixed subassembly of first stainless steel and second stainless steel set up respectively in the upper and lower both sides of second metal anchor clamps, the inner wall of second inner chamber is provided with the heat conduction silica gel with the magnetic ring contact. The utility model discloses, avoid the noise big problem, improve to magnetic ring, MOS pipe radiating effect.
Description
Technical Field
The utility model belongs to the technical field of switching power supply heat radiation structure, especially, relate to a heat abstractor who is suitable for circuit board.
Background
At present, a large amount of heat (MOS (metal oxide semiconductor) tubes, magnetic rings and other high-power energy conversion products such as a plurality of switch power supply products and new energy automobile charging products) can be generated when the products work, and in order to prevent the heat from causing temperature rise to affect the product components, the heat dissipation treatment needs to be carried out on the products. The traditional product processing method is to use a fan for heat dissipation, but has the problem of large noise, and also uses a metal shell for heat dissipation, but has poor heat dissipation effect on a magnetic ring and an MOS tube.
Therefore, the prior art is to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a heat abstractor who is suitable for circuit board to mention in solving the background art, avoid the big problem of noise, improve to magnetic ring, MOS pipe radiating effect.
The utility model discloses a heat abstractor suitable for circuit board, a serial communication port, including the first metal casing who sets up first inner chamber, set up the second metal anchor clamps in first inner chamber, a second stainless steel fixed subassembly that is used for fixing the first MOS pipe on the circuit board at second metal anchor clamps top and is used for fixing the second MOS pipe in the second metal anchor clamps bottom on the circuit board, set up the second inner chamber that the U type led to the chamber and is used for placing the magnetic ring on the circuit board on the second metal anchor clamps, the U type leads to the intracavity and is provided with the coolant liquid, the fixed subassembly of first stainless steel and second stainless steel set up respectively in the upper and lower both sides of second metal anchor clamps, the inner wall of second inner chamber is provided with the heat conduction silica gel with the magnetic ring contact.
Preferably, the first stainless steel fixing assembly includes an upper side fixed to a side of the second metal jig by a first screw.
Preferably, the second stainless steel fixing assembly is fixed to the lower side of the second metal jig by a second screw.
Preferably, a first convex part and a second convex part are arranged on the first metal shell, a first flow channel is formed in the first convex part, a second flow channel is formed in the second convex part, the first flow channel is connected with the input port of the U-shaped through cavity, and the second flow channel is connected with the output port of the U-shaped through cavity.
Preferably, the quantity of first screw is two, the quantity of first MOS pipe is two, the fixed subassembly of first stainless steel includes first stainless steel shell fragment, first bar portion and second stainless steel shell fragment, first stainless steel shell fragment is connected with second stainless steel shell fragment through first bar portion, the one end of first stainless steel shell fragment is fixed in the upside of second metal anchor clamps side through a first screw, the other end is contradicted to a first MOS pipe, the one end of second stainless steel shell fragment is fixed in the upside of second metal anchor clamps side through another first screw, the other end is contradicted to another first MOS pipe.
The utility model discloses be suitable for heat abstractor of circuit board sets up in U type logical intracavity through the coolant liquid, improves the ageing of heat conduction silicone grease, can not be because heat conduction silicone grease along with volatilizing inefficacy, improves the heat dissipation stability to the magnetic ring; based on the arrangement of the first stainless steel fixing component and the second stainless steel fixing component, the first MOS tube and the second MOS tube are attached to the second metal fixture as much as possible, and the heat dissipated by the first MOS tube and the second MOS tube is rapidly conducted through the second metal fixture.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view of an internal structure of a heat dissipation device suitable for a circuit board according to the present invention;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a cross-sectional view B-B of FIG. 1;
fig. 4 is a three-dimensional schematic diagram of the heat dissipation device suitable for the circuit board of the present invention.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It is noted that relative terms such as "first," "second," and the like may be used to describe various components, but these terms are not intended to limit the components. These terms are only used to distinguish one component from another component. For example, a first component could be termed a second component, and, similarly, a second component could be termed a first component, without departing from the scope of the present invention. The term "and/or" refers to a combination of any one or more of the associated items and the descriptive items.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, fig. 1 is a schematic view of an internal structure of a heat dissipation device suitable for a circuit board according to the present invention; FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1; FIG. 3 is a cross-sectional view B-B of FIG. 1; fig. 4 is a three-dimensional schematic diagram of the heat dissipation device suitable for the circuit board of the present invention.
The utility model discloses a heat abstractor suitable for circuit board, a serial communication port, including the first metal casing 10 of seting up first inner chamber 11, set up second metal anchor clamps 20 in first inner chamber 11, a second stainless steel fixed component 100 that is used for fixing first MOS pipe 2 on circuit board 8 at second metal anchor clamps 20 top with be used for on the circuit board second MOS pipe 21 fix in second metal anchor clamps 20 bottom, set up the U type on the second metal anchor clamps and lead to chamber 40 and be used for placing circuit board on magnetic ring 30's second inner chamber 21, the U type leads to the intracavity and is provided with the coolant liquid, first stainless steel fixed component 1 and second stainless steel fixed component 100 set up respectively in second metal anchor clamps 20's upper and lower both sides, the inner wall of second inner chamber is provided with the heat conduction silica gel 4 with the contact of magnetic ring 30. The heat dissipation device suitable for the circuit board is arranged in the U-shaped through cavity through the cooling liquid, so that the timeliness of the heat-conducting silicone grease is improved, the failure of the heat-conducting silicone grease along with volatilization is avoided, and the heat dissipation stability of a magnetic ring is improved; based on the arrangement of the first stainless steel fixing component and the second stainless steel fixing component, the first MOS tube and the second MOS tube are attached to the second metal fixture as much as possible, and the heat dissipated by the first MOS tube and the second MOS tube is rapidly conducted through the second metal fixture. The first metal shell comprises an aluminum shell; the second metal clip comprises an aluminum clip.
As shown in fig. 1, a first convex portion 52 and a second convex portion 51 are disposed on the first metal shell, the first convex portion is provided with a first flow channel 521, the second convex portion is provided with a second flow channel 511, the first flow channel 521 is connected to the U-shaped through cavity input port Z, and the second flow channel 511 is connected to the U-shaped through cavity output port Y; based on the above preferred embodiment, in practical application, the cooling liquid enters the U-shaped through cavity input port Z through the first flow channel 521, and then flows to the U-shaped through cavity output port Y in the U-shaped through cavity and flows out from the second flow channel 511; the cooling liquid flows and circulates, the heat dissipation effect on the heat-conducting silica gel is greatly improved, and volatilization of the heat-conducting silica gel is avoided.
Preferably, the first stainless steel fixing assembly 1 is fixed to the upper side of the second metal jig by a first screw 61. Preferably, the second stainless steel fixing assembly 100 is fixed to the lower side of the second metal jig by the second screw 6. As shown in fig. 3, preferably, the number of the first screws 61 is two, the number of the first MOS transistors 2 is two, the first stainless steel fixing component includes a first stainless steel spring plate 1000, a first bar 1001 and a second stainless steel spring plate 1002, the first stainless steel spring plate is connected with the second stainless steel spring plate through the first bar, one end of the first stainless steel spring plate is fixed on the upper side of the side surface of the second metal fixture through one first screw, the other end of the first stainless steel spring plate abuts against one first MOS transistor, one end of the second stainless steel spring plate is fixed on the upper side of the side surface of the second metal fixture through another first screw, and the other end of the second stainless steel spring plate abuts against another first MOS transistor. The first stainless steel fixing component is subjected to specific structure limitation in the preferred embodiment so as to be suitable for the situation that one side of the circuit board is provided with at least two MOS tubes; the applicability is improved. The first stainless steel elastic piece comprises a stainless steel structure with a curved section; the second stainless steel spring piece comprises a stainless steel structure with a curved section. It should be noted that the above embodiments are merely illustrative, and the number of the first screws, the number of the first MOS transistors, and the number of the second MOS transistors are not particularly limited.
The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings or the direct or indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (5)
1. The utility model provides a heat abstractor suitable for circuit board, a serial communication port, including the first metal casing of seting up first inner chamber, set up the second metal anchor clamps in first inner chamber, a first stainless steel fixed subassembly that is used for fixing first MOS pipe on the circuit board at second metal anchor clamps top and a second stainless steel fixed subassembly that is used for fixing second MOS pipe on the circuit board in second metal anchor clamps bottom, set up the second inner chamber that the U type led to the chamber and is used for placing magnetic ring on the circuit board on the second metal anchor clamps, the U type leads to the intracavity and is provided with the coolant liquid, first stainless steel fixed subassembly and second stainless steel fixed subassembly set up respectively in the upper and lower both sides of second metal anchor clamps, the inner wall of second inner chamber is provided with the heat conduction silica gel with the magnetic ring contact.
2. A heat dissipating device for a circuit board according to claim 1, wherein the first stainless steel fixing member is fixed to the upper side of the second metal jig by a first screw.
3. A heat sink for a circuit board according to claim 1, wherein the second stainless steel fixing member is fixed to the lower side of the second metal jig by a second screw.
4. The heat dissipating device for a circuit board as claimed in claim 1, wherein the first metal shell has a first protrusion and a second protrusion, the first protrusion defines a first channel, the second protrusion defines a second channel, the first channel is connected to the input port of the U-shaped cavity, and the second channel is connected to the output port of the U-shaped cavity.
5. The heat dissipating device for a printed circuit board as claimed in claim 2, wherein the number of the first screws is two, the number of the first MOS transistors is two, the first stainless steel fixing member includes a first stainless steel spring, a first bar and a second stainless steel spring, the first stainless steel spring is connected to the second stainless steel spring through the first bar, one end of the first stainless steel spring is fixed to the upper side of the second metal fixture through one first screw, the other end of the first stainless steel spring abuts against one first MOS transistor, one end of the second stainless steel spring is fixed to the upper side of the second metal fixture through another first screw, and the other end of the second stainless steel spring abuts against another first MOS transistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922136948.0U CN210837727U (en) | 2019-12-03 | 2019-12-03 | Heat radiator suitable for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922136948.0U CN210837727U (en) | 2019-12-03 | 2019-12-03 | Heat radiator suitable for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210837727U true CN210837727U (en) | 2020-06-23 |
Family
ID=71281498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922136948.0U Active CN210837727U (en) | 2019-12-03 | 2019-12-03 | Heat radiator suitable for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210837727U (en) |
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2019
- 2019-12-03 CN CN201922136948.0U patent/CN210837727U/en active Active
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