CN210429787U - Heat dissipation assembly, frequency converter and air conditioning unit - Google Patents
Heat dissipation assembly, frequency converter and air conditioning unit Download PDFInfo
- Publication number
- CN210429787U CN210429787U CN201921227917.XU CN201921227917U CN210429787U CN 210429787 U CN210429787 U CN 210429787U CN 201921227917 U CN201921227917 U CN 201921227917U CN 210429787 U CN210429787 U CN 210429787U
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- thermoelectric generation
- heat dissipation
- heat
- integrated circuit
- generation piece
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- 238000004378 air conditioning Methods 0.000 title claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 title claims description 29
- 238000001816 cooling Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010248 power generation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000005678 Seebeck effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a radiator unit, converter and air conditioning unit, wherein, radiator unit includes: the hot end of the thermoelectric generation piece is arranged corresponding to the heating source of the integrated circuit; the cooling part, the cooling part corresponds the cold junction that sets up at the thermoelectric generation piece, and the cooling part is used for cooling down the cold junction of thermoelectric generation piece. The utility model discloses a radiator unit, converter and air conditioning unit have solved the poor problem that just has the potential safety hazard of integrated circuit radiating effect of converter among the prior art effectively.
Description
Technical Field
The utility model relates to a heat radiating equipment's technical field particularly, relates to a radiator unit, converter and air conditioning unit.
Background
In the prior art, in the process of using or developing a frequency converter, an IPM Module (intelligent power Module) is often protected from over-temperature. In the actual use or research and development process, the condition of frequency reduction work can appear when the temperature of the IPM module reaches 90-95 ℃, and the working capacity of the unit under severe working conditions is greatly influenced. The traditional radiating structure uses an aluminum radiating fin, so that the radiating capacity is poor and the radiating fin is easily influenced by the surrounding environment. And because the temperature of the refrigerant is difficult to control, condensation is easy to occur in the refrigerant heat dissipation, and potential safety hazards exist.
In summary, the integrated circuit of the frequency converter in the prior art has poor heat dissipation effect and potential safety hazard.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an in provide a radiator unit, converter and air conditioning unit to the integrated circuit radiating effect of converter is poor and there is the problem of potential safety hazard among the solution prior art.
In order to achieve the above object, the utility model provides a heat radiation component for dispel the heat to integrated circuit, include: the hot end of the thermoelectric generation piece is arranged corresponding to the heating source of the integrated circuit; the cooling part, the cooling part corresponds the cold junction that sets up at the thermoelectric generation piece, and the cooling part is used for cooling down the cold junction of thermoelectric generation piece.
Further, the heat dissipation member includes: the cooling fin is connected to the cold junction of thermoelectric generation piece.
Further, the heat dissipation member includes: and the direct current fan is connected with the two poles of the temperature difference power generation sheet through a lead, and the temperature difference power generation sheet supplies power to the direct current fan.
Further, the heat dissipation member includes: the cooling fin is connected to the cold end of the thermoelectric generation fin; the direct current fan is connected with the two poles of the temperature difference power generation piece through the conducting wire, the temperature difference power generation piece supplies power to the direct current fan, and the direct current fan and the radiating fins are arranged correspondingly.
Furthermore, the hot junction of thermoelectric generation piece and the source that generates heat of integrated circuit support to be connected, and the junction coating between the hot junction of thermoelectric generation piece and the source that generates heat of integrated circuit has heat conduction silica gel.
Furthermore, the integrated circuit is a circuit board of the frequency converter, and a heating source of the integrated circuit is an intelligent power module.
According to another aspect of the utility model, a converter is provided, including foretell radiator unit.
According to another aspect of the present invention, an air conditioning unit is provided, which includes the above heat dissipation assembly.
The utility model discloses utilize the thermoelectric generation technique, the hot junction as the thermoelectric generation piece with the integrated circuit source that generates heat of converter, the integrated circuit source that generates heat (IPM module) of converter normal during operation cooling surface temperature can reach 80 ~ 90 degrees centigrade, the thermoelectric generation piece can lead to and utilize the difference in temperature directly to absorb the heat to the hot junction, the cold junction of thermoelectric generation piece passes through the radiating part and cools down always, in order further to pull open the difference in temperature and make the difference in temperature exist always, keep the radiating efficiency, make the temperature of integrated circuit source that generates heat (IPM module) keep in normal range always like this. The utility model discloses a structure is compared in traditional radiator volume littleer, and the radiating efficiency is higher, does not have the potential safety hazard moreover.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following drawings and specific examples, which should not be construed as limiting the invention.
Referring to fig. 1, according to an embodiment of the present invention, a heat dissipation assembly is provided for dissipating heat of an integrated circuit, especially for an IPM module of a frequency converter, the heat dissipation assembly includes a thermoelectric generation piece 10 and a heat dissipation component, a hot end 11 of the thermoelectric generation piece 10 is disposed corresponding to a heat source 30 of the integrated circuit; the heat dissipation part is correspondingly arranged at the cold end 12 of the thermoelectric generation piece 10, and the heat dissipation part is used for cooling the cold end 12 of the thermoelectric generation piece 10.
The utility model discloses utilize the thermoelectric generation technique, the hot junction as the thermoelectric generation piece with the integrated circuit source that generates heat of converter, the integrated circuit source that generates heat (IPM module) of converter normal during operation cooling surface temperature can reach 80 ~ 90 degrees centigrade, the thermoelectric generation piece can lead to and utilize the difference in temperature directly to absorb the heat to the hot junction, the cold junction of thermoelectric generation piece passes through the radiating part and cools down always, in order further to pull open the difference in temperature and make the difference in temperature exist always, keep the radiating efficiency, make the temperature of integrated circuit source that generates heat (IPM module) keep in normal range always like this. The utility model discloses a structure is compared in traditional radiator volume littleer, and the radiating efficiency is higher, does not have the potential safety hazard moreover.
It should be noted that the thermoelectric generation chip is not applied to the heat dissipation field of the integrated circuit in the prior art. And the thermoelectric power generation piece is high in cost, and more technical problems are involved in the field of heat dissipation applied to integrated circuits. Therefore, the utility model provides a radiator unit has outstanding substantive characteristics.
In order to further improve radiating component's heat dispersion, improve its whole radiating efficiency, the utility model discloses further preferably, radiating component includes fin 21, and fin 21 connects at cold junction 12 of thermoelectric generation piece 10. An aluminum radiating fin is added at the cold end 12 of the thermoelectric generation piece, so that the radiating area is enlarged, and the temperature difference between the two ends of the thermoelectric generation piece is further increased.
The basic principle of thermoelectric power generation is the seebeck effect of thermoelectric materials: when two metal conductors (or semiconductors) having different free electron densities (or carrier densities) in a temperature difference environment are in contact with each other, electrons on a contact surface diffuse from a high concentration to a low concentration, and the diffusion rate of the electrons is proportional to the temperature difference of the contact region. Therefore, as long as the temperature difference between the two contacting conductors is maintained, electrons can be continuously diffused, and a stable voltage can be formed between the other two terminals of the two conductors.
Based on foretell thermoelectric generation principle, the utility model discloses further preferably, the heat dissipation part includes direct current fan 22, and direct current fan 22 passes through the wire to be connected with the two poles of the earth of thermoelectric generation piece 10, and the power supply is given to direct current fan 22 to thermoelectric generation piece 10. The heat of a heating source (IPM module) of the integrated circuit is converted into electric energy to drive the direct current fan to dissipate heat. When the IPM module works, the temperature difference of at least 30 ℃ can be formed at two ends of the thermoelectric generation piece, the potential difference is formed at two ends of the generation piece, the direct current fan is supplied with power, the direct current fan continuously cools the cold end of the thermoelectric generation piece, the IPM module is continuously cooled through energy conversion, the whole heat dissipation efficiency is improved, and an external power supply is not needed.
In the embodiment, the integrated circuit is a circuit board of the inverter, and the heat generating source 30 of the integrated circuit is an intelligent power module (IPM module). The heat dissipation part simultaneously includes fin 21 and direct current fan 22, and fin 21 is connected at the cold junction 12 of thermoelectric generation piece 10, and direct current fan 22 passes through the wire to be connected with the two poles of the earth of thermoelectric generation piece 10, and direct current fan 22 power supply is given to thermoelectric generation piece 10, and direct current fan 22 corresponds the setting with fin 21.
The main technical problem when the thermoelectric generation piece is used is that the hot junction of the thermoelectric generation piece and the heat-generating surface of the IPM module are not high in heat conduction efficiency, and aiming at the problem, the embodiment is further improved, the hot junction 11 of the thermoelectric generation piece 10 is connected with the heat-generating source 30 of the integrated circuit in a propping manner, and the joint between the hot junction 11 of the thermoelectric generation piece 10 and the heat-generating source 30 of the integrated circuit is coated with heat-conducting silica gel 40.
The utility model also provides a converter, including the radiator unit of above-mentioned embodiment.
The utility model also provides an air conditioning unit, including the radiator unit of above-mentioned embodiment.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular is intended to include the plural unless the context clearly dictates otherwise, and it should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of features, steps, operations, devices, components, and/or combinations thereof.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
Of course, the above is a preferred embodiment of the present invention. It should be noted that, for a person skilled in the art, several modifications and decorations can be made without departing from the basic principle of the present invention, and these modifications and decorations are also considered to be within the scope of the present invention.
Claims (8)
1. A heat dissipation assembly for dissipating heat from an integrated circuit, comprising:
the thermoelectric generation piece (10), the hot junction (11) of the thermoelectric generation piece (10) is arranged corresponding to the heating source (30) of the integrated circuit;
the heat dissipation part is correspondingly arranged at the cold ends (12) of the thermoelectric generation pieces (10), and the heat dissipation part is used for cooling the cold ends (12) of the thermoelectric generation pieces (10).
2. The heat dissipation assembly of claim 1, wherein the heat dissipation component comprises:
the cooling fin (21), cooling fin (21) are connected in cold junction (12) of thermoelectric generation piece (10).
3. The heat dissipation assembly of claim 1, wherein the heat dissipation component comprises:
the direct current fan (22), direct current fan (22) pass through the wire with the two poles of the earth of thermoelectric generation piece (10) are connected, thermoelectric generation piece (10) give direct current fan (22) power supply.
4. The heat dissipation assembly of claim 1, wherein the heat dissipation component comprises:
the cooling fin (21), the cooling fin (21) is connected to the cold end (12) of the thermoelectric generation fin (10);
direct current fan (22), direct current fan (22) pass through the wire with the two poles of the earth of thermoelectric generation piece (10) are connected, thermoelectric generation piece (10) give direct current fan (22) power supply, direct current fan (22) with fin (21) correspond the setting.
5. The heat dissipation assembly of claim 1, wherein the hot end (11) of the thermoelectric generation sheet (10) is connected to the heat source (30) of the integrated circuit in a propping manner, and a joint between the hot end (11) of the thermoelectric generation sheet (10) and the heat source (30) of the integrated circuit is coated with a heat-conducting silica gel (40).
6. The heat sink assembly according to claim 1, wherein the integrated circuit is a circuit board of a frequency converter and the heat generating source (30) of the integrated circuit is a smart power module.
7. A frequency converter, characterized in that it comprises a heat sink assembly according to any one of claims 1 to 6.
8. An air conditioning assembly comprising a heat sink assembly as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921227917.XU CN210429787U (en) | 2019-07-31 | 2019-07-31 | Heat dissipation assembly, frequency converter and air conditioning unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921227917.XU CN210429787U (en) | 2019-07-31 | 2019-07-31 | Heat dissipation assembly, frequency converter and air conditioning unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210429787U true CN210429787U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921227917.XU Expired - Fee Related CN210429787U (en) | 2019-07-31 | 2019-07-31 | Heat dissipation assembly, frequency converter and air conditioning unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210429787U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566451A (en) * | 2020-11-13 | 2021-03-26 | 珠海格力电器股份有限公司 | Heat abstractor and contain its electrical equipment |
-
2019
- 2019-07-31 CN CN201921227917.XU patent/CN210429787U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566451A (en) * | 2020-11-13 | 2021-03-26 | 珠海格力电器股份有限公司 | Heat abstractor and contain its electrical equipment |
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200428 |