KR100904683B1 - Cooler module - Google Patents

Cooler module Download PDF

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Publication number
KR100904683B1
KR100904683B1 KR1020080072874A KR20080072874A KR100904683B1 KR 100904683 B1 KR100904683 B1 KR 100904683B1 KR 1020080072874 A KR1020080072874 A KR 1020080072874A KR 20080072874 A KR20080072874 A KR 20080072874A KR 100904683 B1 KR100904683 B1 KR 100904683B1
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KR
South Korea
Prior art keywords
heat
base block
heat sink
cooler module
bottom opening
Prior art date
Application number
KR1020080072874A
Other languages
Korean (ko)
Inventor
정성호
Original Assignee
(주) 하이로
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주) 하이로 filed Critical (주) 하이로
Priority to KR1020080072874A priority Critical patent/KR100904683B1/en
Application granted granted Critical
Publication of KR100904683B1 publication Critical patent/KR100904683B1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials

Abstract

A cooler module is provided to simplify the assembling process through the combination by engagement. A base block(3) includes an upper wall(31) and a plurality of bottom-opened grooves(32). A guide unit fixes a protrusion formed in a heat sink. To fix a heat pipe(2), a plurality of clamping ribs include cut surfaces(331) of the longitudinal direction. The first extended-branch(21) of the heat pipe is rigidly fixed to a heat emitting pin of the heat sink. The second extended-branch(22) is inserted into the bottom-opened grooves. To transfer the heat to the heat sink from a heat source, a plane wall unit is directly contacted with the heat source.

Description

Cooler Module {COOLER MODULE}

The present invention relates to a cooler module for cooling an electronic chip. More specifically, the horizontal cooler module, the cooler module has a flat wall portion of the heat pipe that is exposed to the outside of the base block to be in direct contact with the heat source for rapid heat dissipation of the heat energy from the heat source to fit It is composed of joined members.

Heat pipes are widely used in cooler modules for cooling semiconductor chips and the like. In addition to the heat pipes, conventional cooler modules include a heat sink and a base block formed of a plurality of heat sink fins. The heat dissipation fin is made by extrusion molding of aluminum or copper. The heat tubes are sealed metal tubes filled with a working fluid. The base block is a block of aluminum or copper. Since the heat tubes and the base block of this type of cooler module are made of different materials, nickel plating technology is required to connect the heat tubes and the base block by tin-lead alloy soldering or thermal bonding. The manufacturing and assembly process of such cooler module is complicated, resulting in low production rate and high manufacturing cost. Soldering between the base block and the heat pipes reduces the heat transfer efficiency of the cooler module relatively. In addition, environmental pollution can occur during the soldering of the heat pipes to the base block.

In use, the base block (aluminum base block or copper base block) absorbs the heat energy from the electronic chip, transfers the absorbed heat energy to the heat pipe, and then transfers it to the heat sink for additional heat dissipation. It is placed in contact with the face. Since heat energy is indirectly transferred to the heat pipe and heat sink, the heat dissipation efficiency of this type of cooler module is low.

In order to solve the above problems, the heat sink, heat pipe, and base block are combined by fitting, not by soldering or thermal bonding, to simplify the assembly process and reduce environmental pollution. Direct contact with the heat source is to enhance the heat transfer efficiency and heat dissipation effect.

According to one aspect of the invention, the horizontal cooler module includes a plurality of heat sink fins, a plurality of heat pipes, and the base block. The constituent members of the cooler module have a perfect structure. Each of the heat tubes has a flat wall portion exposed to the outside of the base block for direct contact with the electronic chip to transfer heat energy directly from the electronic chip to the heat sink for rapid heat dissipation.

According to another aspect of the present invention, the coupling of the constituent members of the cooler module is increased by thermal expansion, thereby providing excellent thermal conductivity and excellent heat dissipation. Since the horizontal cooler module does not require tin-lead alloy soldering or nickel plating, the manufacturing method of the present invention does not cause any environmental pollution due to tin-lead alloy soldering or nickel plating. Therefore, the manufacturing method of the present invention is well suited to environmental protection as compared to the manufacturing method of the conventional cooler module.

According to yet another aspect of the present invention, the base block includes a plurality of bottom opening grooves each receiving the heat pipe, and a plurality of clamping ribs protruding from the bottom wall and extending along both walls of the bottom opening grooves. rib). After the heat pipes are inserted into the bottom open grooves of the base block, the clam flanges may be fixed in such a way that the heat pipes are held in engagement with the bottom open grooves, and may be laterally pressed to tighten the heat pipes.

The present invention is a flat wall portion formed in the heat pipe can directly and heat transfer heat energy to the heat sink can be quickly and effectively, the heat expansion is more efficient because the coupling force of the component is possible, the efficient heat transfer, by fitting the coupling of the component It is effective in simplifying the assembly process, lowering production costs, and reducing environmental pollution since there is no process such as soldering.

1 to 5, the horizontal cooler module of the present invention is shown to include a plurality of heat dissipation fins 1, a plurality of heat pipes 2, and a base block 3.

The heat dissipation fins 1 are stacked to form a heat sink 10. Each of the heat dissipation fins 1 includes a plurality of through grooves 11 that firmly receive the heat pipes 2, and notches 12 of a predetermined dimension corresponding to an upper portion of the base block 3 on a bottom surface thereof. It includes.

Both side ends of the upper wall 31 of the base block include a guide part 34 having a groove formed in a longitudinal direction so as to be firmly fixed to the heat sink 10, and the notch 12 has the guide part 34. And a jaw corresponding to the longitudinal groove of < RTI ID = 0.0 >

The heat tube 2 is an I-type or U-type closed tube filled with a working fluid, each heat tube having a first extension branch 21 at one end and a second extension branch 22 at the other end. And a flat wall portion 23 formed on the bottom surface of the second extension branch 22 (see FIG. 6). The flat wall portion 23 of the heat pipe 2 is exposed toward the outside of the bottom surface of the base block 3 to form a plane having the same height as the bottom surface of the bottom wall of the base block 3.

The base block 3 is a block made of metal (copper or aluminum), and includes a top wall 31 fixed to the bottom surface of the heat sink 10 and a plurality of bottom opening grooves for accommodating the heat pipe 2 ( 32 and a plurality of clamping ribs extending in the longitudinal direction along both sides facing each other in each of the bottom opening grooves 32 so that the heat pipe 2 is fixed to the bottom opening groove 32. (clamping rib) 33, and includes a plurality of heat pipe fixing jaw 321 formed in the longitudinal direction in order to more firmly fix the second extension branch 22 in the bottom opening grooves (32). .

The heat dissipation fin 1, the heat pipe 2, and the base block 3 are tightly fitted to each other. Due to the thermal expansion of the heat pipe 2, the members of the horizontal cooler module of the present invention are firmly coupled to each other. After installing the horizontal cooler module, the flat wall portion 23 of the second extension branch 22 of the heat pipe 2 is exposed in a flat shape toward the outside of the base block 3 and is in contact with a heat source such as an electronic chip. It is disposed as close as possible to radiate heat quickly by transferring heat energy from the electronic chip to the heat sink 10. Since heat energy is directly transferred from the electronic chip to the heat sink 10 by the heat pipes 2 for rapid heat dissipation, the present invention has a very high heat dissipation efficiency.

Since the members of the cooler module of the present invention are firmly fitted to each other, they are firmly fixed without vibration between the members, and the production cost is reduced because the manufacture of the cooler module is easy and fast. Since the flat wall portion 23 of the heat pipe 2 directly contacts the heat supply source, the horizontal structure cooler module can efficiently dissipate heat, so the horizontal structure cooler module of the present invention provides excellent thermal conductivity and performs excellent heat dissipation. do. Furthermore, according to the present invention, since the necessity of soldering of the tin-lead alloy is eliminated, environmental pollution due to the soldering of the tin-lead alloy is not caused in the manufacture of the cooler module. That is, this invention is invention which meets more environmental protection.

The clamping ribs 33 of the base block 3 are disposed on both sides of the respective bottom opening grooves 32, and each of the clamping ribs 33 is a longitudinal cutting surface representing a V-shaped cross section ( 331). By the cutting surface 331 in the longitudinal direction, the clamping rib 33 is capable of transverse compression. When the heat pipes 2 are fixed to the respective bottom opening grooves 32, the clamping ribs 33 are compressed in the transverse direction and clamped with the heat pipes 2. (See Figures 6-8)

The specimen of the horizontal cooler module is constructed in accordance with the features shown in Figs. 1-7, and the cooler module works smoothly to provide all the features described above.

Although described in detail for the purpose of specific implementation in the specific content for the practice of the invention, various modifications and improvements can be made without departing from the spirit and equivalents of the present invention. Therefore, the scope of the present invention should not be limitedly interpreted only by the claims.

1 is a plan perspective view of a horizontal structure cooler module according to the present invention.

Figure 2 is an exploded view of the heat pipe and the base block of the horizontal structure cooler module according to the present invention.

3 is a perspective view of a base block according to the present invention;

4 is an enlarged partial view of a base block according to the present invention;

5 is an exploded view of a horizontal structure cooler module according to the present invention.

Figure 6 is a bottom perspective view of a horizontal structure cooler module according to the present invention.

7 is a front view of a horizontal structure cooler module according to the present invention.
8 is a rear view of the horizontal structure cooler module according to the present invention.

[Description of Symbols for Main Parts of Drawing]

1: heat radiation fin 2: heat pipe

3: base block 10: heat sink

11: through groove 12: notch

21: first extension branch 22: second extension branch

23: flat wall portion 31: the upper wall

32: floor opening groove 33: clamping rib (clamping rib)

34: guide portion 321: heat pipe fixing jaw

331: cutting surface

Claims (6)

A heat sink 10 formed of a plurality of heat dissipation fins 1, a base block 3 attached to the heat sink, and a working fluid are filled, penetrates through the heat sink fins of the heat sink, and fits snugly to the base block 3; In the cooler module consisting of a plurality of heat pipes (2) which are closely coupled to each other, The heat sink 10 is formed at the bottom of the base block and a jaw for fixing, The base block 3 is a metal block, and has a plurality of upper walls 31 that fit perfectly to one side of the heat sink 10, and a plurality of bottom opening grooves 32 formed on the lower wall. It is formed in both sides end in the longitudinal direction, the guide portion 34 is formed to fit the jaw formed in the heat sink 10 is fixed, the bottom opening groove 32 is formed along both sides facing each other in each In order to tighten the heat pipe 2 to be fixed, a plurality of clamping ribs 33 having a longitudinal cutting surface 331 and having a V-shaped cross section and a heat pipe fixing jaw 321 are formed therein, The heat pipes 2 are fitted to the first extension branches 21 and the bottom opening grooves 32 of the base block 3 which are firmly fixed to each of the heat dissipation fins 1 of the heat sink 10. Each having a second extension branch 22 fitted therein, the second extension branch 22 being capable of being in direct contact with the heat source to transfer heat from the heat source to the heat sink 10 for heat dissipation; Cooler module characterized in that it comprises a flat wall portion (23) exposed to the outside of the 3) and maintain the same plane as the lower wall of the base block. The method of claim 1, The base block (3) is a cooler module, characterized in that made of copper or aluminum. delete delete delete delete
KR1020080072874A 2008-07-25 2008-07-25 Cooler module KR100904683B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080072874A KR100904683B1 (en) 2008-07-25 2008-07-25 Cooler module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080072874A KR100904683B1 (en) 2008-07-25 2008-07-25 Cooler module

Publications (1)

Publication Number Publication Date
KR100904683B1 true KR100904683B1 (en) 2009-06-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080072874A KR100904683B1 (en) 2008-07-25 2008-07-25 Cooler module

Country Status (1)

Country Link
KR (1) KR100904683B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869794A (en) * 2015-06-22 2015-08-26 东莞市澍华五金制品有限公司 Integrated heat-pipe heat dissipating device
CN114287871A (en) * 2022-03-09 2022-04-08 杭州康基医疗器械有限公司 Medical endoscope fluorescence cold light source camera system with high-efficient heat radiation structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060011329A1 (en) * 2004-07-16 2006-01-19 Jack Wang Heat pipe heat sink with holeless fin module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060011329A1 (en) * 2004-07-16 2006-01-19 Jack Wang Heat pipe heat sink with holeless fin module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104869794A (en) * 2015-06-22 2015-08-26 东莞市澍华五金制品有限公司 Integrated heat-pipe heat dissipating device
CN114287871A (en) * 2022-03-09 2022-04-08 杭州康基医疗器械有限公司 Medical endoscope fluorescence cold light source camera system with high-efficient heat radiation structure

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