CN206802775U - A kind of LED module of high efficiency and heat radiation - Google Patents

A kind of LED module of high efficiency and heat radiation Download PDF

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Publication number
CN206802775U
CN206802775U CN201720298433.9U CN201720298433U CN206802775U CN 206802775 U CN206802775 U CN 206802775U CN 201720298433 U CN201720298433 U CN 201720298433U CN 206802775 U CN206802775 U CN 206802775U
Authority
CN
China
Prior art keywords
radiator
semiconductor refrigerating
refrigerating part
substrate
pedestal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201720298433.9U
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Chinese (zh)
Inventor
蓝思军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Ming Pu Electronic Technology Co Ltd
Original Assignee
Guangzhou Ming Pu Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Ming Pu Electronic Technology Co Ltd filed Critical Guangzhou Ming Pu Electronic Technology Co Ltd
Priority to CN201720298433.9U priority Critical patent/CN206802775U/en
Application granted granted Critical
Publication of CN206802775U publication Critical patent/CN206802775U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of LED module of high efficiency and heat radiation, including substrate and the first radiator, the substrate is arranged on above the first radiator, and substrate is fixedly connected with the first radiator, the upper surface of base plate is provided with LED chip, first radiator is internally provided with semiconductor refrigerating part, the semiconductor refrigerating part upper end is cold end, the through hole positioned at LED chip both sides is provided with the substrate, the cold end of the semiconductor refrigerating part is provided with projection, in the through hole of the semiconductor refrigerating part top bump insertion substrate upper end, fin is provided with the outside of first radiator, and fin is fixedly connected with the first radiator, pedestal is provided with below first radiator, sealing block is provided with above the pedestal, the sealing block is fixedly connected with pedestal.The beneficial effects of the utility model are:It is reasonable in design, it is not only convenient for installing, and there is efficient radiating effect, it is adapted to popularity to use.

Description

A kind of LED module of high efficiency and heat radiation
Technical field
The utility model belongs to LED module technical field, and in particular to a kind of LED module of high efficiency and heat radiation.
Background technology
The chip height of electronic product is integrated, and functional requirement is more and more, and volume is less and less, and present component is able to Quickly develop to miniaturization, high function, high efficiency direction, and during operation, substantial amounts of heat can be produced, these heats Must timely it discharge, to ensure that component can be worked below normal operating temperature with peak efficiency, LED is radiating not Light decay phenomenon can be caused in the case of good, and LED life-span can be reduced.
LED module radiating effect of the prior art is poor, and the temperature of LED module generally remains in higher temperature, because This influences the normal work of LED module.
Utility model content
The purpose of this utility model is to provide a kind of LED module of high efficiency and heat radiation, to solve to carry in above-mentioned background technology The problem of going out.
To achieve the above object, the utility model provides following technical scheme:A kind of LED module of high efficiency and heat radiation, including Substrate and the first radiator, the substrate is arranged on above the first radiator, and substrate is fixedly connected with the first radiator, described Upper surface of base plate is provided with LED chip, and first radiator is internally provided with semiconductor refrigerating part, the semiconductor refrigerating part Upper end is cold end, and the through hole positioned at LED chip both sides is provided with the substrate, and the cold end of the semiconductor refrigerating part is provided with Projection, the semiconductor refrigerating part top bump are inserted in the through hole of substrate upper end, are provided with the outside of first radiator scattered Backing, and fin is fixedly connected with the first radiator, and pedestal is provided with below first radiator, is set above the pedestal Sealing block is equipped with, the sealing block is fixedly connected with pedestal, and sealing block is embedded in below the first radiator, the semiconductor refrigerating Pedestal is passed through below part, the base bottom setting is fluted, and the heating end below the semiconductor refrigerating part is provided with second Radiator, second radiator is arranged in groove, and the second radiator is fixedly connected with semiconductor refrigerating part.
Preferably, the semiconductor refrigerating part inner hollow, and semiconductor refrigerating part side is provided with osculum, the LED Chip bottom is connected by the wire through osculum.
Preferably, the left and right ends of first radiator are provided with heat emission hole, and the heat emission hole at both ends is correspondingly arranged.
Preferably, the fin is aluminum alloy heat sink, and the fin is evenly distributed on the outside of the first radiator.
Preferably, the through hole is C-shaped, V-arrangement or groove profile, and the opposition that is open is set.
Preferably, the LED chip is uniformly distributed on substrate.
Technique effect of the present utility model and advantage:The LED module of the high efficiency and heat radiation, can by the design of fin First radiator temperature is distributed, cooled down using air, the temperature of the first radiator can be rapidly reduced, pass through The design of heat emission hole, due to the first radiator inner hollow, by the design of both ends heat emission hole, can be good at, which reduces by first, dissipates Temperature inside hot device, the folding being on the other hand easy between the first radiator and pedestal, the cold end of semiconductor refrigerating part is to LED Chip is freezed, and the hot junction of semiconductor refrigerating part is arranged on the outside of pedestal, does not influence the operating temperature of LED chip.This is efficient The LED module of radiating, it is reasonable in design, it is not only convenient for installing, and there is efficient radiating effect, suitable popularity makes With.
Brief description of the drawings
Fig. 1 is internal structure schematic diagram of the present utility model;
Fig. 2 is front view of the present utility model;
Fig. 3 is left view of the present utility model.
In figure:1 pedestal, 2 sealing blocks, 3 first radiators, 4 semiconductor refrigerating parts, 5 substrates, 6 LED chips, 7 grooves, 8 Osculum, 9 second radiators, 10 wires, 11 fin, 12 heat emission holes.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made The every other embodiment obtained, belong to the scope of the utility model protection.
The utility model provides a kind of LED module of high efficiency and heat radiation as Figure 1-3, including substrate 5 and first dissipates Hot device 3, the substrate 5 is arranged on the top of the first radiator 3, and substrate 5 is fixedly connected with the first radiator 3, on the substrate 5 Surface is provided with LED chip 6, and the LED chip 6 is uniformly distributed on the substrate 5, and first radiator 3 is internally provided with half Conductor cooling piece 4, the upper end of semiconductor refrigerating part 4 are cold end, are provided with the substrate 5 positioned at the logical of the both sides of LED chip 6 Hole, the through hole is C-shaped, V-arrangement or groove profile, and the opposition that is open is set, and the cold end of the semiconductor refrigerating part 4 is provided with projection, In the through hole of the top bump of semiconductor refrigerating part 4 insertion substrate 5 upper end.
Further, the inner hollow of semiconductor refrigerating part 4, and the side of semiconductor refrigerating part 4 is provided with osculum 8, it is described The bottom of LED chip 6 is connected by the wire 10 through osculum 8, and the outside of the first radiator 3 is provided with fin 11, And fin 11 is fixedly connected with the first radiator 3, the fin 11 is aluminum alloy heat sink, and the fin 11 uniformly divides For cloth on the outside of the first radiator 3, the left and right ends of first radiator 3 are provided with heat emission hole 12, and the heat emission hole 12 at both ends It is correspondingly arranged.
Further, the lower section of the first radiator 3 is provided with pedestal 1, and the top of pedestal 1 is provided with sealing block 2, described Sealing block 2 is fixedly connected with pedestal 1, and sealing block 2 is embedded in the lower section of the first radiator 3, and the lower section of semiconductor refrigerating part 4 passes through Pedestal 1, the bottom of pedestal 1 set fluted 7, and the heating end of the lower section of semiconductor refrigerating part 4 is provided with the second radiator 9, second radiator 9 is arranged in groove 7, and the second radiator 9 is fixedly connected with semiconductor refrigerating part 4.
Finally it should be noted that:Preferred embodiment of the present utility model is the foregoing is only, is not limited to this Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic Progress equivalent substitution, all within the spirit and principles of the utility model, any modification, equivalent substitution and improvements made etc., It should be included within the scope of protection of the utility model.

Claims (6)

1. a kind of LED module of high efficiency and heat radiation, including substrate(5)With the first radiator(3), it is characterised in that:The substrate(5) It is arranged on the first radiator(3)Top, and substrate(5)With the first radiator(3)It is fixedly connected, the substrate(5)Upper surface is set It is equipped with LED chip(6), first radiator(3)It is internally provided with semiconductor refrigerating part(4), the semiconductor refrigerating part(4) Upper end is cold end, the substrate(5)On be provided with positioned at LED chip(6)The through hole of both sides, the semiconductor refrigerating part(4)'s Cold end is provided with projection, the semiconductor refrigerating part(4)Top bump inserts substrate(5)In the through hole of upper end, described first dissipates Hot device(3)Outside is provided with fin(11), and fin(11)With the first radiator(3)It is fixedly connected, first radiating Device(3)Lower section is provided with pedestal(1), the pedestal(1)Top is provided with sealing block(2), the sealing block(2)With pedestal(1) It is fixedly connected, and sealing block(2)Embedded first radiator(3)Lower section, the semiconductor refrigerating part(4)Lower section passes through pedestal(1), The pedestal(1)Bottom sets fluted(7), the semiconductor refrigerating part(4)The heating end of lower section is provided with the second radiator (9), second radiator(9)Installed in groove(7)It is interior, and the second radiator(9)With semiconductor refrigerating part(4)It is fixed to connect Connect.
A kind of 2. LED module of high efficiency and heat radiation according to claim 1, it is characterised in that:The semiconductor refrigerating part(4) Inner hollow, and semiconductor refrigerating part(4)Side is provided with osculum(8), the LED chip(6)Bottom is by through osculum(8) Wire(10)Connected.
A kind of 3. LED module of high efficiency and heat radiation according to claim 1, it is characterised in that:First radiator(3)'s Left and right ends are provided with heat emission hole(12), and the heat emission hole at both ends(12)It is correspondingly arranged.
A kind of 4. LED module of high efficiency and heat radiation according to claim 1, it is characterised in that:The fin(11)For aluminium Alloy heat-sink piece, the fin(11)It is evenly distributed on the first radiator(3)Outside.
A kind of 5. LED module of high efficiency and heat radiation according to claim 1, it is characterised in that:The through hole be C-shaped, V-arrangement or Groove profile, and the opposition that is open is set.
A kind of 6. LED module of high efficiency and heat radiation according to claim 1, it is characterised in that:The LED chip(6)In base Plate(5)On be uniformly distributed.
CN201720298433.9U 2017-03-25 2017-03-25 A kind of LED module of high efficiency and heat radiation Expired - Fee Related CN206802775U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720298433.9U CN206802775U (en) 2017-03-25 2017-03-25 A kind of LED module of high efficiency and heat radiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720298433.9U CN206802775U (en) 2017-03-25 2017-03-25 A kind of LED module of high efficiency and heat radiation

Publications (1)

Publication Number Publication Date
CN206802775U true CN206802775U (en) 2017-12-26

Family

ID=60731032

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720298433.9U Expired - Fee Related CN206802775U (en) 2017-03-25 2017-03-25 A kind of LED module of high efficiency and heat radiation

Country Status (1)

Country Link
CN (1) CN206802775U (en)

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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20171226

Termination date: 20200325