CN206802775U - An efficient heat dissipation LED module - Google Patents

Abstract

The utility model discloses a high-efficient radiating LED module, including base plate and first radiator, the base plate sets up in first radiator top, and base plate and first radiator fixed connection, the base plate upper surface is provided with the LED chip, the inside semiconductor refrigeration piece that is provided with of first radiator, semiconductor refrigeration piece upper end is the cold junction, be provided with the through-hole that is located LED chip both sides on the base plate, the cold junction of semiconductor refrigeration piece is provided with the arch, semiconductor refrigeration piece top is protruding to insert in the through-hole of base plate upper end, the first radiator outside is provided with the fin, and fin and first radiator fixed connection, first radiator below is provided with the base, the base top is provided with sealed piece, sealed piece and base fixed connection. The utility model has the advantages that: structural design is reasonable, not only is convenient for install, and has the efficient radiating effect, is fit for generally using widely.

Description

An efficient heat dissipation LED module

technical field

The utility model belongs to the technical field of LED modules, in particular to an LED module with efficient heat dissipation.

Background technique

The chips of electronic products are highly integrated, with more and more functional requirements, and smaller and smaller volumes. The current components are rapidly developing in the direction of miniaturization, high function, and high efficiency. In the process of operation, a large number of Heat, the heat must be discharged in time to ensure that the components can work with the highest efficiency below the normal operating temperature, LED in the case of poor heat dissipation will cause light decay, and will reduce the life of the LED.

The heat dissipation effect of the LED module in the prior art is poor, and the temperature of the LED module is usually maintained at a relatively high temperature, thus affecting the normal operation of the LED module.

Utility model content

The purpose of this utility model is to provide an efficient heat dissipation LED module to solve the problems raised in the above-mentioned background technology.

In order to achieve the above purpose, the utility model provides the following technical solutions: an efficient heat dissipation LED module, including a substrate and a first heat sink, the substrate is arranged above the first heat sink, and the substrate is fixedly connected to the first heat sink , the upper surface of the substrate is provided with an LED chip, the inside of the first heat sink is provided with a semiconductor cooling element, the upper end of the semiconductor cooling element is a cold end, and the substrate is provided with through holes on both sides of the LED chip, so The cold end of the semiconductor cooling element is provided with a protrusion, and the top protrusion of the semiconductor cooling element is inserted into the through hole at the upper end of the substrate, and the outer side of the first radiator is provided with a cooling fin, and the cooling fin is fixedly connected to the first radiator , a base is provided under the first radiator, a sealing block is provided above the base, the sealing block is fixedly connected to the base, and the sealing block is embedded under the first radiator, and the semiconductor refrigeration element is worn under the Through the base, the bottom of the base is provided with a groove, and the heating end below the semiconductor refrigeration element is provided with a second radiator, the second radiator is installed in the groove, and the second radiator and the semiconductor The refrigeration unit is fixedly connected.

Preferably, the semiconductor cooling element is hollow inside, and a small opening is provided on one side of the semiconductor cooling element, and the bottom of the LED chip is connected in series through a wire passing through the small opening.

Preferably, heat dissipation holes are provided at the left and right ends of the first heat sink, and the heat dissipation holes at both ends are correspondingly arranged.

Preferably, the cooling fins are aluminum alloy cooling fins, and the cooling fins are evenly distributed on the outside of the first radiator.

Preferably, the through holes are C-shaped, V-shaped or groove-shaped, and the openings are oppositely arranged.

Preferably, the LED chips are uniformly distributed on the substrate.

The technical effects and advantages of the utility model: the efficient heat dissipation LED module can dissipate the temperature of the first radiator through the design of the heat sink, and use air for cooling, which can quickly reduce the temperature of the first radiator. The design of the heat dissipation holes, because the interior of the first heat sink is hollow, the design of the heat dissipation holes at both ends can well reduce the temperature inside the first heat sink, and on the other hand, it facilitates the opening and closing between the first heat sink and the base , the cold end of the semiconductor cooling element cools the LED chip, and the hot end of the semiconductor cooling element is arranged outside the base, which does not affect the working temperature of the LED chip. The high-efficiency heat dissipation LED module has a reasonable structural design, is not only easy to install, but also has a high-efficiency heat dissipation effect, and is suitable for popularization and use.

Description of drawings

Fig. 1 is the internal structure schematic diagram of the present utility model;

Fig. 2 is the front view of the utility model;

Fig. 3 is a left view of the utility model.

In the figure: 1 base, 2 sealing block, 3 first heat sink, 4 semiconductor cooling element, 5 substrate, 6 LED chip, 7 groove, 8 small opening, 9 second heat sink, 10 wire, 11 heat sink, 12 Vents.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

The utility model provides a high-efficiency heat dissipation LED module as shown in Figure 1-3, including a substrate 5 and a first radiator 3, the substrate 5 is arranged above the first radiator 3, and the substrate 5 and the first radiator A heat sink 3 is fixedly connected, and the upper surface of the substrate 5 is provided with LED chips 6, and the LED chips 6 are evenly distributed on the substrate 5. The inside of the first heat sink 3 is provided with a semiconductor cooling element 4, and the semiconductor refrigeration The upper end of the component 4 is a cold end, and the substrate 5 is provided with through holes located on both sides of the LED chip 6. The through holes are C-shaped, V-shaped or groove-shaped, and the openings are oppositely arranged. The semiconductor cooling component 4 The cold end is provided with a protrusion, and the protrusion at the top of the semiconductor cooling element 4 is inserted into the through hole at the upper end of the base plate 5 .

Further, the semiconductor cooling element 4 is hollow inside, and a small opening 8 is provided on one side of the semiconductor cooling element 4, and the bottom of the LED chip 6 is connected in series through a wire 10 passing through the small opening 8, and the outer side of the first heat sink 3 is provided with a Heat sink 11, and heat sink 11 is fixedly connected with first heat sink 3, and described heat sink 11 is aluminum alloy heat sink, and described heat sink 11 is evenly distributed on the outside of first heat sink 3, and described first heat sink 3 Heat dissipation holes 12 are arranged at the left and right ends of the body, and the heat dissipation holes 12 at both ends are correspondingly arranged.

Further, a base 1 is provided below the first radiator 3, a sealing block 2 is provided above the base 1, the sealing block 2 is fixedly connected to the base 1, and the sealing block 2 is embedded in the first radiator 3 Below, the semiconductor cooling element 4 passes through the base 1, the bottom of the base 1 is provided with a groove 7, and the heating end below the semiconductor cooling element 4 is provided with a second radiator 9, and the second The radiator 9 is installed in the groove 7 , and the second radiator 9 is fixedly connected with the semiconductor cooling element 4 .

Finally, it should be noted that: the above is only a preferred embodiment of the utility model, and is not intended to limit the utility model, although the utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art , it can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model, All should be included within the protection scope of the present utility model.

Claims (6)

1. An LED module with efficient heat dissipation, comprising a substrate (5) and a first radiator (3), characterized in that: the substrate (5) is arranged above the first radiator (3), and the substrate (5) ) is fixedly connected to the first heat sink (3), the upper surface of the substrate (5) is provided with LED chips (6), and the inside of the first heat sink (3) is provided with a semiconductor cooling element (4). The upper end of the cooling element (4) is a cold end, the substrate (5) is provided with through holes located on both sides of the LED chip (6), the cold end of the semiconductor cooling element (4) is provided with a protrusion, and the semiconductor cooling element (4) is provided with a protrusion. The top protrusion of the cooling element (4) is inserted into the through hole on the upper end of the base plate (5), and the heat sink (11) is provided on the outside of the first heat sink (3), and the heat sink (11) is connected with the first heat sink (3) ) is fixedly connected, a base (1) is provided under the first radiator (3), a sealing block (2) is provided above the base (1), and the sealing block (2) and the base (1 ) are fixedly connected, and the sealing block (2) is embedded under the first heat sink (3), and the semiconductor cooling element (4) passes through the base (1), and the bottom of the base (1) is provided with a groove ( 7), the heating end below the semiconductor cooling element (4) is provided with a second radiator (9), the second radiator (9) is installed in the groove (7), and the second radiator ( 9) It is fixedly connected with the semiconductor refrigeration unit (4). 2. An efficient heat dissipation LED module according to claim 1, characterized in that: the semiconductor cooling element (4) is hollow inside, and a small opening (8) is provided on one side of the semiconductor cooling element (4), so The bottom of the LED chip (6) is connected in series through the wire (10) passing through the small opening (8). 3. An LED module with efficient heat dissipation according to claim 1, characterized in that: the left and right ends of the first heat sink (3) are provided with heat dissipation holes (12), and the heat dissipation holes (12) at both ends ) corresponding to the setting. 4. The efficient heat dissipation LED module according to claim 1, characterized in that: the heat sink (11) is an aluminum alloy heat sink, and the heat sink (11) is evenly distributed on the first heat sink ( 3) Outside. 5 . The LED module with high heat dissipation according to claim 1 , wherein the through holes are C-shaped, V-shaped or groove-shaped, and the openings are opposite to each other. 6 . 6. The LED module with efficient heat dissipation according to claim 1, characterized in that: the LED chips (6) are evenly distributed on the substrate (5).