CN217563040U

CN217563040U - Metal-ceramic insulator packaging structure for semiconductor laser

Info

Publication number: CN217563040U
Application number: CN202221208623.4U
Authority: CN
Inventors: 胡新; 杨霞
Original assignee: Hefei Advanced Packaging Ceramics Co ltd
Current assignee: Hefei Advanced Packaging Ceramics Co ltd
Priority date: 2022-05-18
Filing date: 2022-05-18
Publication date: 2022-10-11
Anticipated expiration: 2032-05-18

Abstract

The utility model discloses a metal-ceramic insulator packaging structure for semiconductor laser, including metal bottom plate and the metal wall body of setting around its upper end, the embedding has run through ceramic insulator on the metal wall body lateral wall, ceramic insulator outside both ends all are provided with hem portion, both ends hem portion all are provided with the arc bullet piece on the opposite face, the last symmetry of hem portion is provided with the slide connection post, the slip cover of spliced pole outside is equipped with the anti-bending supporting shoe, the anti-bending supporting shoe lateral wall has laid the design arc groove, the metal lead wire upper and lower part all wears out and carries out the anti-bending support in the design arc groove that corresponds and arranges; both sides of the bottom end of the packaging cover plate are provided with heat conducting frames. The reverse elasticity of arc bullet piece can reduce the crooked volume of metal lead, and the arc bullet piece can push away prevents the supporting shoe that bends and reset, and the heat that the supporting shoe absorbed of preventing bending of metal lead contact can transmit for the heat conduction frame through the heat conduction rib, has avoided metal lead to can take place excessively bending because there is not the strong point when crooked.

Description

Metal-ceramic insulator packaging structure for semiconductor laser

Technical Field

The utility model belongs to the technical field of semiconductor laser's packaging structure, concretely relates to metal-ceramic insulator packaging structure for semiconductor laser.

Background

The semiconductor laser, also called laser diode, is a laser using semiconductor material as working material, the package shell structure adopted by the semiconductor laser is mainly composed of metal base plate, metal wall welded on the periphery of the metal base plate and package cover plate, and the optical coupling interface is welded in the opening on the single side metal wall body, and the optical coupling interface is correspondent to the placed semiconductor laser chip, the ceramic insulator is welded in the side opening of the metal wall body, the ceramic insulator is preset with needle-shaped open pore, the metal lead wire is connected with internal and external circuits by passing through the ceramic insulator from the needle-shaped open pore, the metal base plate, metal wall body and package cover plate in the above-mentioned package structure can make heat conduction and radiation to the heat produced by semiconductor laser chip.

For example, chinese patent No. CN201623361U discloses a metal-ceramic insulator package structure for a semiconductor laser, which includes a metal base plate, a metal wall welded around the metal base plate, an optical coupling interface welded in an opening of the metal wall, and ceramic insulators welded in openings of the metal wall at two sides of the optical coupling interface, wherein the ceramic insulator has a needle-shaped opening, a metal lead wire is welded in the needle-shaped opening and connected to an internal circuit and an external circuit, the ceramic insulator has a T-shaped structure, a thin end is welded in the opening of the metal wall, and a wide end is in contact with an outer side of the metal wall and is welded on the metal wall.

However, the above scheme has the following disadvantages: the metal lead in the above-mentioned patent document directly passes in the aciculiform opening on the ceramic insulator, and the heat that semiconductor laser chip during operation produced can indirectly transmit for the metal lead, and metal lead and ceramic insulator connecting portion do not set up anti-bending structure, and the metal lead after the heating is easy is buckled because there is not the strong point under the exogenic action, influences metal lead's performance.

To this end, we propose a metal-ceramic insulator package structure for a semiconductor laser to solve the above-mentioned problems in the background art.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a metal-ceramic insulator packaging structure for semiconductor laser to solve the problem that exists among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a metal-ceramic insulator packaging structure for a semiconductor laser comprises a metal base plate and a metal wall body arranged on the periphery of the upper end of the metal base plate, wherein a packaging cover plate is arranged at the top of the metal wall body, a ceramic insulator is embedded in and penetrates through the side wall of the metal wall body, both ends of the exterior of the ceramic insulator are respectively provided with a flanging part, the side wall of the ceramic insulator is provided with a needle-shaped opening, a metal lead wire penetrates through the needle-shaped opening, the opposite surfaces of the flanging parts at both ends are respectively provided with an arc-shaped elastic block, the flanging parts are symmetrically provided with connecting columns which penetrate through the arc-shaped elastic blocks in a sliding manner, anti-bending supporting blocks are sleeved on the outer sides of the connecting columns in a sliding manner, the outer sides of the anti-bending supporting blocks are of arc-shaped structures, the outer side walls of the anti-bending supporting blocks are provided with shaping arc grooves, and the upper and lower parts of the metal lead wires penetrate through the corresponding shaping arc grooves to be supported;

and heat conducting frames are arranged on two sides of the bottom end of the packaging cover plate and sleeved outside the folded edge part, and the heat conducting frames can absorb heat transferred by the ceramic insulator.

Preferably, the top end face of the arc-shaped elastic block is symmetrically provided with a movable hole, the connecting column penetrates through the movable hole in a sliding mode, a movable groove is formed in the bending-preventing supporting block, the top end of the connecting column is inserted into the movable groove in a sliding mode, and two sides of the top of the arc-shaped elastic block are provided with limiting conical blocks.

Preferably, the bending-prevention supporting block is located on the two sides of the movable groove, the ejecting block can be in contact with the limiting conical block, the metal lead can be driven to move outwards when being bent by external force, the ejecting block pushes the limiting conical block to cause the arc-shaped elastic block to generate elastic deformation, and the metal lead resets under the action of elastic restoring force of the arc-shaped elastic block after losing the external force.

Preferably, the side of the anti-bending support block close to the arc-shaped structure is embedded with a heat conducting rib, the free end of one side of the heat conducting rib is in contact with the heat conducting frame, and the heat conducting rib absorbs heat of the ceramic insulator and transmits the heat to the heat conducting frame.

Preferably, the radiating fins are arranged on the outer side wall of the heat conduction frame, the outer end faces of the edge folding portions are provided with heat insulation strips, the heat insulation strips are in contact connection with the inner ring face of the heat conduction frame, and a heat conduction silicone grease layer is arranged between the inner ring face of the heat conduction frame and the outer end face of the edge folding portion.

Compared with the prior art, the beneficial effects of the utility model are that: if the metal lead is bent by external force, the metal lead can drive the anti-bending supporting block to move through the shaping arc groove, the anti-bending supporting block elastically extrudes the arc elastic block through the matching of the limiting conical block and the jacking block, the bending amount of the metal lead can be reduced through the reverse elasticity of the arc elastic block, meanwhile, after the external force disappears, the arc elastic block can push the anti-bending supporting block to reset, the curvature of the metal lead can be limited through the setting of the shaping arc groove, the influence on the use performance of the metal lead caused by the excessive bending of the metal lead is effectively avoided, after the ceramic insulator absorbs the excessive heat generated in the packaging structure, the heat can be transmitted to the heat conducting frame through the heat conducting silicone layer, the heat absorbed by the anti-bending supporting block in contact with the metal lead can be transmitted to the heat conducting frame through the heat conducting rib, the heat gathered by the heat conducting frame is dissipated through the radiating fin, the heat absorbed by the metal lead is reduced, the accumulation of the excessive bending of the metal lead due to the absence of a supporting point during the bending is avoided, and the use performance of the metal lead is guaranteed.

Drawings

Fig. 1 is a schematic overall top view structure of the present invention;

FIG. 2 is a schematic front view of FIG. 1;

FIG. 3 is a schematic right-side view of FIG. 2;

FIG. 4 is a schematic cross-sectional view of FIG. 3;

FIG. 5 is a partial schematic view of the anti-buckling support block area of FIG. 3;

fig. 6 is the matching structure diagram of the arc-shaped spring block, the connecting column, the anti-bending supporting block and the heat conducting frame of the present invention.

In the figure: 1. a metal base plate; 2. a metal wall; 3. packaging the cover plate; 4. a ceramic insulator; 5. a hem part; 6. forming a hole in a needle shape; 7. a metal lead; 8. an arc-shaped elastic block; 9. connecting columns; 10. a bending-proof supporting block; 11. shaping the arc groove; 12. a heat conducting frame; 13. a movable hole; 14. A movable groove; 15. a limiting conical block; 16. a top block; 17. heat conducting ribs; 18. a heat sink; 19. a thermally insulating strip; 20. a thermally conductive silicone layer.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.

Referring to fig. 1-6, the present invention provides a technical solution:

the first embodiment is as follows:

a metal-ceramic insulator packaging structure for a semiconductor laser comprises a metal base plate 1 and a metal wall body 2 arranged on the periphery of the upper end of the metal base plate, a packaging cover plate 3 is arranged on the top of the metal wall body 2, a ceramic insulator 4 penetrates through the side wall of the metal wall body 2 in an embedded mode, bending parts 5 are arranged at two outer ends of the ceramic insulator 4, the outer side of the ceramic insulator 4 is of a concave structure, needle-shaped openings 6 are formed in the side wall of the ceramic insulator 4, metal leads 7 penetrate through the needle-shaped openings 6, arc-shaped elastic blocks 8 are arranged on opposite surfaces of the bending parts 5 at two ends, the arc-shaped elastic blocks 8 can deform elastically under the action of external force, connecting columns 9 penetrating through the arc-shaped elastic blocks 8 in a sliding mode are symmetrically arranged on the bending parts 5, anti-bending supporting blocks 10 are sleeved on the outer sides of the connecting columns 9 in a sliding mode, the anti-bending supporting blocks 10 can be made of nylon materials, the connecting columns 9 can limit sliding positions of the anti-bending supporting blocks 10, as shown in figures 5 and 6, arc-shaped structures are arranged on the outer sides of the anti-bending supporting blocks 10, and the outer sides of the anti-bending supporting arc grooves 11 are distributed with shaping arc-shaping grooves 11, the metal leads 7, and are convenient to prevent the metal leads 7 from being bent and damaged when the metal leads 7 are bent and matched with the metal leads 7;

both sides of the bottom end of the packaging cover plate 3 are bonded with heat conducting frames 12 or are fixed with the heat conducting frames 12 in a threaded manner, the heat conducting frames 12 are of U-shaped structures, the heat conducting frames 12 can be made of copper materials with good heat conducting performance, the heat conducting frames 12 are sleeved outside the edge folding portions 5, the heat conducting frames 12 can absorb heat transferred by the ceramic insulators 4, and then heat transfer of the ceramic insulators 4 to the metal lead wires 7 is reduced.

Example two:

further explaining the arc-shaped elastic block 8 and the anti-bending supporting block 10 on the basis of the first embodiment, the top end face of the arc-shaped elastic block 8 is symmetrically provided with movable holes 13, the connecting column 9 penetrates through the movable holes 13 in a sliding manner, the anti-bending supporting block 10 is provided with a movable groove 14, the top end of the connecting column 9 is inserted into the movable groove 14 in a sliding manner, the connecting column 9 slides in the movable groove 14 due to the arrangement, so that the anti-bending supporting block 10 can vertically move under the action of external force, and the two sides of the top of the arc-shaped elastic block 8 are provided with limiting conical blocks 15; all welded the kicking block 16 in 14 both sides of activity groove on the supporting shoe 10 of preventing bending, kicking block 16 can contact with spacing awl piece 15, the setting of kicking block 16 and spacing awl piece 15 is convenient for push away arc-shaped bullet piece 8 when preventing bending supporting shoe 10 and removing, metal lead 7 can drive when receiving external force and prevent bending supporting shoe 10 and move outward, kicking block 16 pushes away spacing awl piece 15 this moment and leads to arc-shaped bullet piece 8 to take place elastic deformation, metal lead 7 resets under the elasticity restoring force effect of arc-shaped bullet piece 8 after losing external force.

Example three:

further, on the basis of the first embodiment, the anti-bending support block 10 and the heat conduction frame 12 are further described, a heat conduction rib 17 is embedded in the anti-bending support block 10 close to the arc-shaped structure side, the heat conduction rib 17 is made of an aluminum material with a heat conductivity coefficient lower than that of the heat conduction frame 12, a free end of one side of the heat conduction rib 17 is in contact with the heat conduction frame 12, the heat conduction rib 17 can transfer the heat absorbed by the anti-bending support block 10 to the heat conduction frame 12, a heat dissipation fin 18 is arranged on the outer side wall of the heat conduction frame 12, the heat dissipation fin 18 is a heat dissipation aluminum fin and facilitates the dissipation of the heat absorbed by the heat conduction frame 12, heat insulation strips 19 are arranged on the outer end face of the edge folding portion 5, the heat insulation strips 19 are made of a heat-resistant rubber material, the heat insulation strips 19 are in contact with the inner ring face of the heat conduction frame 12, the heat conduction frame 12 is prevented from being in contact with the outer end face of the folding portion 5 due to the arrangement of the heat insulation strips 19, and a heat conduction silicone layer 20 is arranged between the inner ring face of the heat conduction frame 12 and the outer end face of the folding portion 5, the heat conduction frame 12, the heat conduction silicone layer can indirectly transfer the heat absorbed by the heat conduction insulator 4 to the heat conduction insulator.

The working principle is as follows: when the packaging structure of the semiconductor laser is installed, an operator fixes the heat conducting frame 12 on two sides of the bottom end of the packaging cover plate 3 in a bonding or screwing mode, so that the heat conducting frame 12 is positioned on the outer end face of the flange part 5, the heat insulating strip 19 at the outer end of the flange part 5 is contacted with the inner annular face of the heat conducting frame 12, and a heat conducting silicone layer 20 is injected into a gap between the flange part 5 and the inner annular face of the heat conducting frame 12;

in the daily use process, if the metal lead 7 is bent by external force, the metal lead 7 can drive the anti-bending supporting block 10 to move through the shaping arc groove 11, the anti-bending supporting block 10 elastically extrudes the arc elastic block 8 through the matching of the limiting conical block 15 and the top block 16, the reverse elasticity of the arc elastic block 8 can reduce the bending amount of the metal lead 7, meanwhile, after the external force disappears, the arc elastic block 8 can push the anti-bending supporting block 10 to reset, the curvature of the metal lead 7 can be limited through the shaping arc groove 11, the phenomenon that the metal lead 7 is excessively bent to influence the use performance of the metal lead 7 is effectively avoided, after the ceramic insulator 4 absorbs redundant heat generated inside the packaging structure, the heat is firstly transmitted to the heat conducting frame 12 through the heat conducting silicone layer 20, the heat absorbed by the anti-bending supporting block 10 in contact with the metal lead 7 can be transmitted to the heat conducting frame 12 through the heat conducting rib 17, the heat conducted by the heat conducting frame 12 is dissipated through the heat radiating fins 18, meanwhile, in order to reduce the influence of the packaging cover plate 3 on the heat conducting frame 12, the heat insulating cotton injected between the cover plate 3 and the heat conducting frame 7, the heat conducting block 7 is prevented from being excessively bent, and the heat conducting lead 7 is prevented from being accumulated when the heat conducting point is not accumulated, and the metal lead 7, and the heat conducting support point is prevented, and the metal lead 7 is prevented from being excessively bent, and the heat conducting block 7 is prevented from being accumulated, and the heat conducting block, and the heat conducting wire is prevented from being accumulated when the heat conducting wire is prevented from being accumulated.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a metal-ceramic insulator packaging structure for semiconductor laser, includes metal soleplate (1) and sets up metal wall body (2) all around its upper end, and metal wall body (2) top is provided with encapsulation apron (3), just ceramic insulator (4), its characterized in that have been run through in the embedding on metal wall body (2) lateral wall: the ceramic insulator is characterized in that both ends of the outside of the ceramic insulator (4) are provided with flanging parts (5), the side wall of the ceramic insulator (4) is provided with needle-shaped openings (6), metal leads (7) penetrate through the needle-shaped openings (6), the opposite surfaces of the flanging parts (5) at both ends are provided with arc-shaped elastic blocks (8), the flanging parts (5) are symmetrically provided with connecting columns (9) which penetrate through the arc-shaped elastic blocks (8) in a sliding manner, anti-bending supporting blocks (10) are sleeved on the outer sides of the connecting columns (9) in a sliding manner, the outer sides of the anti-bending supporting blocks (10) are of arc-shaped structures, shaping arc grooves (11) are distributed on the outer side walls of the anti-bending supporting blocks (10), and the upper and lower parts of the metal leads (7) penetrate through the corresponding shaping arc grooves (11) to be supported and arranged;

both sides of the bottom end of the packaging cover plate (3) are provided with heat conducting frames (12), the heat conducting frames (12) are sleeved on the outer side of the edge folding portion (5), and the heat conducting frames (12) can absorb heat transferred by the ceramic insulator (4).

2. The metal-ceramic insulator package structure for a semiconductor laser according to claim 1, wherein: the arc-shaped elastic block is characterized in that movable holes (13) are symmetrically formed in the top end face of the arc-shaped elastic block (8), the connecting column (9) penetrates through the movable holes (13) in a sliding mode, movable grooves (14) are formed in the bending-preventing supporting blocks (10), the top end of the connecting column (9) is inserted into the movable grooves (14) in a sliding mode, and limiting conical blocks (15) are arranged on the two sides of the top of the arc-shaped elastic block (8).

3. The metal-ceramic insulator package structure for a semiconductor laser according to claim 2, wherein: prevent that support block (10) go up to be located movable groove (14) both sides all are provided with kicking block (16), kicking block (16) can contact with spacing taper block (15), metal lead (7) can drive when receiving external force and prevent that bending support block (10) moves outward, and kicking block (16) top pushes away spacing taper block (15) this moment and leads to arc bullet piece (8) to take place elastic deformation, and metal lead (7) lose after the external force and reset under the elasticity restoring force effect of arc bullet piece (8).

4. The metal-ceramic insulator package structure for a semiconductor laser according to claim 1, wherein: the anti-bending support block (10) is internally provided with a heat conduction rib (17) close to the side of the arc-shaped structure in an embedded mode, the free end of one side of the heat conduction rib (17) is in contact with the heat conduction frame (12), and the heat conduction rib (17) absorbs heat of the ceramic insulator (4) and transmits the heat to the heat conduction frame (12).

5. The metal-ceramic insulator package structure for a semiconductor laser according to claim 1, wherein: the heat conducting frame is characterized in that radiating fins (18) are arranged on the outer side wall of the heat conducting frame (12), heat insulating strips (19) are arranged on the outer end face of the edge folding portion (5), the heat insulating strips (19) are in contact connection with the inner ring face of the heat conducting frame (12), and a heat conducting silicone grease layer (20) is arranged between the inner ring face of the heat conducting frame (12) and the outer end face of the edge folding portion (5).