CN220306247U - High-heat-dissipation patch rectifier bridge - Google Patents
High-heat-dissipation patch rectifier bridge Download PDFInfo
- Publication number
- CN220306247U CN220306247U CN202321808199.1U CN202321808199U CN220306247U CN 220306247 U CN220306247 U CN 220306247U CN 202321808199 U CN202321808199 U CN 202321808199U CN 220306247 U CN220306247 U CN 220306247U
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- heat
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- packaging shell
- conducting
- conducting plate
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 39
- 230000005855 radiation Effects 0.000 claims abstract description 17
- 239000004519 grease Substances 0.000 claims abstract description 13
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 13
- 230000017525 heat dissipation Effects 0.000 claims description 48
- 238000005192 partition Methods 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000003044 adaptive effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- Rectifiers (AREA)
Abstract
The utility model relates to a patch rectifier bridge with high heat radiation, which comprises a packaging shell, wherein a heat radiation mechanism is arranged on the packaging shell and comprises a first heat-conducting plate arranged on the top surface and the bottom surface of an inner cavity of the packaging shell, a second heat-conducting plate is fixedly arranged on the outer side of the first heat-conducting plate, a heat radiation plate is fixedly arranged on one side of the second heat-conducting plate, which is far away from the first heat-conducting plate, a heat radiation groove is formed in the surface of one side of the heat radiation plate, two sides of the inner cavity of the packaging shell are respectively provided with a fixing plate, four diodes are fixedly arranged between the two fixing plates, two ends of each diode are respectively fixed with an anode pin and a cathode pin which extend out of the packaging shell, heat-conducting silicone grease is filled between each diode and the first heat-conducting plate, and the heat-conducting silicone grease covers the surface of each diode. According to the high-heat-radiation patch rectifier bridge, the first heat-conducting plate, the second heat-conducting plate and the heat-conducting silicone grease are arranged in the packaging shell, and the heat radiation plate is arranged on the outer surface of the packaging shell, so that the heat radiation performance of the rectifier bridge is greatly improved.
Description
Technical Field
The utility model relates to the technical field of rectifier bridges, in particular to a patch rectifier bridge with high heat dissipation.
Background
The rectifier bridge is formed by sealing the rectifier tube in a shell, and the rectifier bridge is divided into a full bridge and a half bridge; the full bridge is to seal four diodes of a bridge rectifier circuit which are connected together; the half bridge is a half-bridge that encloses the four diode bridge rectifiers together.
The inventors found in the course of implementing the present utility model that:
chinese patent CN211670191U discloses a patch rectifier bridge with high heat dissipation, which comprises a body, wherein the body is provided with a rectifier bridge and a plurality of conductive pins, the longitudinal section of each conductive pin is in a Z shape, the upper ends of the conductive pins extend into the body and are electrically connected with the rectifier bridge, and the conductive pins are in a shape of thin upper ends and thick lower ends. Therefore, the area of the contact between the lower end of the conductive pin and air is large, and compared with the prior pins, the conductive pin has the advantages of good heat dissipation effect and high heat dissipation efficiency. According to the utility model, the width of the lower end of the conductive pin is increased, so that the contact area between the lower end of the conductive pin and air is increased, the heat radiation capacity and the reliability of components are improved, and the overall temperature of a circuit is reduced;
the technical scheme of the utility model provides another implementation scheme aiming at the problems in the prior art.
Disclosure of Invention
In order to solve the problems in the prior art, the utility model provides a patch rectifier bridge with high heat dissipation, which has the advantage of good heat dissipation, and solves the problems that the heat dissipation of the traditional patch rectifier bridge is not good enough and the heat of the surface of the rectifier bridge is not easy to dissipate after long-term use.
The technical scheme of the utility model is as follows: the utility model provides a high heat dissipation's paster rectifier bridge, includes encapsulation shell, its characterized in that: a heat dissipation mechanism is arranged on the packaging shell,
the heat dissipation mechanism comprises a first heat conduction plate arranged on the top surface and the bottom surface of an inner cavity of the packaging shell, a second heat conduction plate penetrating through and extending to the outer surface of the packaging shell is fixedly arranged on the outer side of the first heat conduction plate, a heat dissipation plate is fixedly arranged on one side of the second heat conduction plate away from the first heat conduction plate, a heat dissipation groove is formed in the surface of one side of the heat dissipation plate away from the second heat conduction plate, fixing plates are arranged on two sides of the inner cavity of the packaging shell, four diodes are fixedly arranged between the two fixing plates, positive electrode pins and negative electrode pins extending to the outside of the packaging shell through the fixing plates are respectively fixed at two ends of each diode, heat conduction silicone grease is filled between each diode and the first heat conduction plate, and the heat conduction silicone grease covers the surface of each diode.
Preferably, the heat dissipation grooves are provided with a plurality of heat dissipation grooves, and the intervals between two adjacent heat dissipation grooves are equal.
The technical scheme is further improved as follows: the packaging shell is characterized in that supporting plates are fixedly arranged on two sides of the top surface and the bottom surface of the packaging shell, a partition plate is arranged at one end, far away from the packaging shell, of each supporting plate, and a gap with a distance not less than 1cm is reserved between each partition plate and each radiating plate.
Further, the width of the heat dissipation plate is smaller than that of the packaging shell, the heat dissipation plate is adaptive to the inner width of the support plates at the two sides, and the length of the heat dissipation plate is identical to that of the packaging shell.
Further, the width of the first heat conducting plate is larger than that of the second heat conducting plate, the first heat conducting plate is abutted against the fixing plates on the two sides, and the length of the first heat conducting plate is identical to that of the second heat conducting plate.
Further, the width of the first heat conducting plate is smaller than that of the heat radiating plate, and the length of the first heat conducting plate is the same as that of the heat radiating plate.
The beneficial effects are that: compared with the prior art, the technical scheme of the utility model is characterized in that: this high heat dissipation's paster rectifier bridge through being equipped with first heat-conducting plate, second heat-conducting plate and heat conduction silicone grease in the encapsulation shell, is equipped with the heating panel that is located the encapsulation shell surface on the second heat-conducting plate, offers the heat dissipation recess at the heating panel surface, can be through first heat-conducting plate, second heat-conducting plate and heat conduction silicone grease guide to the heating panel on the heat dissipation during the use, gives off the heat in the air through heating panel and heat dissipation recess, has improved the heat dissipation of rectifier bridge greatly, has solved current paster rectifier bridge heat dissipation and has not been good enough, the problem that the too high heat of rectifier bridge surface temperature is difficult for giving off after long-term use.
Drawings
Fig. 1 is an internal schematic view of the present utility model.
Fig. 2 is a schematic view of the appearance of the present utility model.
In the figure: 1. packaging the shell; 2. a first heat-conducting plate; 3. a second heat-conducting plate; 4. a heat dissipation plate; 5. a heat dissipation groove; 6. a fixing plate; 7. a diode; 8. a positive electrode pin; 9. a negative electrode pin; 10. heat conductive silicone grease; 11. a support plate; 12. and a partition plate.
Detailed Description
The technical scheme of the utility model will be clear with reference to the attached drawings; this example is fully described, but should not be construed as limiting the utility model.
It should be noted that: the width in the present utility model means the left-right direction, and the length means the front-rear direction.
The utility model is shown in fig. 1 and 2:
a patch rectifier bridge with high heat radiation comprises a packaging shell 1, a heat radiation mechanism is arranged on the packaging shell 1,
the heat dissipation mechanism comprises a first heat conduction plate 2 fixedly arranged on the top surface and the bottom surface of an inner cavity of a packaging shell 1, a second heat conduction plate 3 penetrating to the outer surface of the packaging shell 1 is fixedly arranged on the outer sides of the two first heat conduction plates 2, a heat dissipation plate 4 is fixedly arranged on one side surface of the second heat conduction plate 3 far away from the first heat conduction plate 2, the width of the heat dissipation plate 4 in the left-right direction is smaller than the width of the packaging shell 1, the length of the heat dissipation plate 4 in the front-back direction is the same as the length of the packaging shell 1, the width of the first heat conduction plate 2 in the left-right direction is larger than the width of the second heat conduction plate 3, the length of the first heat conduction plate 2 in the front-back direction is the same as the length of the second heat conduction plate 3, the width of the first heat conduction plate 2 is smaller than the width of the heat dissipation plate 4, the length of the first heat conduction plate 2 is the same as the length of the heat dissipation plate 4, the first heat conduction plate 2 and the second heat conduction plate 3 can have the largest contact area with the heat dissipation plate 4,
symmetrical supporting plates 11 are fixedly arranged on the upper side and the lower side of the packaging shell 1, a separation plate 12 is fixedly arranged at the outer end of the supporting plate 11 far away from the packaging shell 1, the distance between the separation plate 12 and the heat dissipation plate 4 is not less than 1cm, the surface of the heat dissipation plate 4 is prevented from being shielded to influence heat dissipation,
the surface of one side of the heat radiation plate 4 far away from the second heat conduction plate 3 is provided with a plurality of heat radiation grooves 5, the space between two adjacent heat radiation grooves 5 is equal, which is beneficial to increasing the heat radiation area,
the left side and the right side of the inner cavity of the packaging shell 1 are fixedly provided with fixing plates 6, four diodes 7 are fixedly arranged between the two fixing plates 6 at intervals, two ends of each diode 7 are respectively fixedly provided with an anode pin 8 and a cathode pin 9 which penetrate through the fixing plates to the outside of the packaging shell 1, heat conduction silicone grease 10 is filled between the two first heat conduction plates 2, and the heat conduction silicone grease 10 covers the surfaces of the diodes 7.
It should be noted that, in this embodiment, the first heat conductive plate 2 and the second heat conductive plate 3 are both made of an aluminum plate, and the heat dissipation plate 4 is made of a copper plate.
The working principle of the utility model is as follows:
the rectifier bridge is connected with other devices through the positive electrode pin 8 and the negative electrode pin 9, when the rectifier bridge works, the diode 7 can generate heat, the first heat conducting plate 2, the second heat conducting plate 3 and the heat conducting silicone grease 10 guide the heat generated by the diode 7 to the heat radiating plate 4, and the heat is dissipated to the air through the heat radiating plate 4 and the heat radiating grooves 5 on the heat radiating plate 4, so that the heat of the rectifier bridge is radiated.
Where not described in detail in this specification, techniques well known in the art.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (6)
1. The utility model provides a high heat dissipation's paster rectifier bridge, includes encapsulation shell, its characterized in that: the packaging shell is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises first heat-conducting plates arranged on the top surface and the bottom surface of the inner cavity of the packaging shell, second heat-conducting plates penetrating through and extending to the outer surface of the packaging shell are fixedly arranged on the outer sides of the first heat-conducting plates, a heat dissipation plate is fixedly arranged on one side of each second heat-conducting plate, a heat dissipation groove is formed in one side surface of each heat dissipation plate, which is far away from each second heat-conducting plate, of each packaging shell, fixing plates are respectively arranged on two sides of the inner cavity of the packaging shell, four diodes are fixedly arranged between the two fixing plates, positive pins and negative pins penetrating through the fixing plates and extending to the outer side of the packaging shell are respectively fixed at two ends of each diode, heat-conducting silicone grease is filled between each diode and each first heat-conducting plate, and the heat-conducting silicone grease covers the surfaces of the diodes.
2. A high thermal dissipation patch bridge as defined in claim 1, wherein: the heat dissipation grooves are arranged in a plurality, and the intervals between two adjacent heat dissipation grooves are equal.
3. A high heat dissipation patch bridge according to claim 1 or 2, wherein: the packaging shell is characterized in that supporting plates are fixedly arranged on two sides of the top surface and the bottom surface of the packaging shell, a partition plate is arranged at one end, far away from the packaging shell, of each supporting plate, and a gap with a distance not less than 1cm is reserved between each partition plate and each radiating plate.
4. A high thermal dissipation patch bridge as defined in claim 3, wherein: the width of the heat radiation plate is smaller than that of the packaging shell, the heat radiation plate is adaptive to the inner width of the support plates at the two sides, and the length of the heat radiation plate is identical to that of the packaging shell.
5. A high heat dissipation patch bridge as defined in claim 1, 2 or 4, wherein: the width of the first heat conducting plate is larger than that of the second heat conducting plate, the first heat conducting plate is abutted against the fixing plates on the two sides, and the length of the first heat conducting plate is identical to that of the second heat conducting plate.
6. The high thermal dissipation chip rectifier bridge of claim 5, wherein: the width of the first heat conducting plate is smaller than that of the heat radiating plate, and the length of the first heat conducting plate is the same as that of the heat radiating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321808199.1U CN220306247U (en) | 2023-07-11 | 2023-07-11 | High-heat-dissipation patch rectifier bridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321808199.1U CN220306247U (en) | 2023-07-11 | 2023-07-11 | High-heat-dissipation patch rectifier bridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220306247U true CN220306247U (en) | 2024-01-05 |
Family
ID=89376508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321808199.1U Active CN220306247U (en) | 2023-07-11 | 2023-07-11 | High-heat-dissipation patch rectifier bridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220306247U (en) |
-
2023
- 2023-07-11 CN CN202321808199.1U patent/CN220306247U/en active Active
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