CN214672588U - Gallium nitride-based power switch device - Google Patents
Gallium nitride-based power switch device Download PDFInfo
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- CN214672588U CN214672588U CN202120737485.8U CN202120737485U CN214672588U CN 214672588 U CN214672588 U CN 214672588U CN 202120737485 U CN202120737485 U CN 202120737485U CN 214672588 U CN214672588 U CN 214672588U
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- gallium nitride
- heat dissipation
- mounting groove
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- based power
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Abstract
The utility model discloses a gallium nitride-based power switch device, which comprises a base, wherein two mounting holes are arranged on the base, a mounting groove is arranged on the surface of the base, a laying groove extending to the edge of the base is arranged on one side of the mounting groove, heat dissipation ports are arranged on both sides of the base, a communication port communicated with the mounting groove is arranged on the inner surface of each heat dissipation port, a gallium nitride chip is arranged in the mounting groove, a first heat dissipation part is arranged on the inner surface of the mounting groove, a plurality of pins are arranged on the gallium nitride chip, connecting wires are connected on the pins, an encapsulation plate encapsulated in the mounting groove is covered on the surface of the gallium nitride chip, thus the gallium nitride chip can be positioned and encapsulated, and when the whole device is used, the four sides of the gallium nitride chip can be simultaneously dissipated, the device has better heat dissipation effect and integral detachability, the maintenance and the replacement are convenient, and the actual use requirement is better met.
Description
Technical Field
The utility model relates to a power switch technical field specifically is a gallium nitride based power switch device.
Background
The power switch tube is a triode which can bear larger current, has smaller leakage current and better saturation conduction and cut-off characteristics under certain conditions, and is used as the triode of the power switch, the triode can bear larger current frequently, so that much heat can be generated, and the triode can be burned out in serious cases.
And the structure of a grant notice No. CN 210073821U's a gallium nitride base power switch, it is through base plate, L shape metal frame, first heat conduction pole, fin, second heat conduction pole and radiating block, can directly conduct the heat that produces from the gallium nitride chip on L shape metal frame, first heat conduction pole and the second heat conduction pole, and final heat can be respectively followed fin and radiating block two and shed, can directly effectually dispel the heat to the gallium nitride chip through this device, and the radiating efficiency is higher.
Although the above patent can achieve a certain heat dissipation effect, the overall detachability is weak, and the overall dispersibility needs to be improved, so we provide a gallium nitride-based power switch device.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a to prior art not enough, the utility model provides a gallium nitride base power switch device has solved the above-mentioned problem that proposes.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a gallium nitride-based power switch device comprises a base, wherein two mounting holes are formed in the base, a mounting groove is formed in the surface of the base, and a distribution groove extending to the edge of the base is formed in one side of the mounting groove;
the two sides of the base are both provided with heat dissipation ports, and the inner surfaces of the heat dissipation ports are provided with communication ports communicated with the mounting grooves;
the packaging structure comprises a mounting groove, a gallium nitride chip, a first heat dissipation part, a second heat dissipation part and a packaging board, wherein the mounting groove is internally provided with the gallium nitride chip, the inner surface of the mounting groove is provided with the first heat dissipation part, the gallium nitride chip is provided with a plurality of pins, the pins are connected with connecting wires, the surface of the gallium nitride chip is covered with the packaging board packaged in the mounting groove in a sealing manner, and the packaging board is provided with the second heat dissipation part;
the heat dissipation opening is internally provided with a detachable heat dissipation plate which is communicated with the closed communication opening.
Preferably, the first heat dissipation part includes a notch formed in an inner surface of the mounting groove, and the first heat dissipation fin is fitted to the inner surface of the notch.
Preferably, the four corners of the inner surface of the mounting groove are provided with fixing holes, the four corners of the gallium nitride chip are provided with positioning holes corresponding to the fixing holes, and the packaging plate is provided with fixing bolts penetrating through the positioning holes and connected in the fixing holes.
Preferably, fixing seats are fixed on two sides of the surface of the gallium nitride chip, and a touch rod used for touching the fixing seats is fixed on the inner surface of the packaging plate.
Preferably, the second heat dissipation part is a second heat dissipation fin embedded in the package plate.
Preferably, a pin slot for clamping the pin is arranged in the arrangement slot.
Preferably, two connecting holes are formed in the inner end wall of the heat dissipation opening, and a connecting bolt used for being connected into the connecting holes is arranged on the heat dissipation plate.
(III) advantageous effects
The utility model provides a gallium nitride based power switch device. The method has the following beneficial effects: can fix a position the encapsulation to the gallium nitride chip, and make whole when using, can make the four sides of gallium nitride chip dispel the heat simultaneously, have better radiating effect, and holistic detachability makes it conveniently maintain and change, and then makes its better satisfied in-service use needs.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the base with the gallium nitride chip removed according to the present invention;
fig. 3 is a schematic front view of the present invention;
fig. 4 is a schematic structural diagram of the package board of the present invention.
In the figure: 1. a base; 2. mounting holes; 3. mounting grooves; 31. a notch; 4. arranging grooves; 5. a lead groove; 6. a first heat radiation fin; 7. a heat dissipation port; 8. a communication port; 9. connecting holes; 10. a fixing hole; 11. a gallium nitride chip; 12. a fixed seat; 13. a pin; 14. a connecting wire; 15. a heat dissipation plate; 16. a package board; 17. a fixing bolt; 18. a second heat radiation fin; 19. a touch bar; 20. a connecting bolt; 21. and (7) positioning the holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a gallium nitride-based power switch device comprises a base 1, wherein two mounting holes 2 are formed in the base 1, the mounting holes 2 are used for mounting the base 1 through bolts, a mounting groove 3 is formed in the surface of the base 1, a distribution groove 4 extending to the edge of the base 1 is formed in one side of the mounting groove 3, and the distribution groove 4 extends to the lower edge of the base 1;
both sides of the base 1 are provided with heat dissipation ports 7, and the inner surfaces of the heat dissipation ports 7 are provided with communication ports 8 communicated with the mounting groove 3;
the installation groove 3 is internally provided with a gallium nitride chip 11 matched with the groove cavity of the installation groove, the inner surface of the installation groove 3 is provided with a first heat dissipation part, the first heat dissipation part comprises a notch 31 arranged on the inner surface of the installation groove 3, the inner surface of the notch 31 is embedded with a first heat dissipation fin 6, the notch 31 is arranged to ensure that a gap exists between the gallium nitride chip 11 and the first heat dissipation fin 6, further, the heat dissipation performance is better, a plurality of pins 13 are arranged on the gallium nitride chip 11, a pin groove 5 for clamping the pins 13 is arranged in the arrangement groove 4, the pins 13 are connected with connecting wires 14, the surface of the gallium nitride chip 11 is sealed and covered with an encapsulation plate 16 encapsulated in the installation groove 3, the encapsulation plate 16 protects the gallium nitride chip 11, the packaging plate 16 is provided with a second heat dissipation part which is a second heat dissipation fin 18 embedded in the packaging plate 16, so that the gallium nitride chip 11 can be better dissipated through the second heat dissipation fin 18;
install removable and with the heating panel 15 that seals intercommunication mouth 8 in the thermovent 7, seted up two connecting holes 9 on the inner end wall of thermovent 7, be provided with on the heating panel 15 and be arranged in connecting hole 9 connecting bolt 20, make heating panel 15 removable, make its convenient maintenance.
In order to facilitate positioning and fixing, fixing holes 10 are formed in four corners of the inner surface of the mounting groove 3, positioning holes 21 corresponding to the fixing holes 10 are formed in four corners of the gallium nitride chip 11, and fixing bolts 17 penetrating through the positioning holes 21 and connected into the fixing holes 10 are arranged on the packaging plate 16 through bolts, so that the packaging plate 16 can abut against the gallium nitride chip 11 and fix the gallium nitride chip 11.
In order to better fix the position, the two sides of the surface of the gallium nitride chip 11 are both fixed with the fixing bases 12, the inner surface of the packaging plate 16 is fixed with the contact rods 19 which are used for abutting against the fixing bases 12, the fixing bases 12 are provided with abutting ports, which is convenient for the contact rods 19 to position and abut against, so that a gap exists between the packaging plate 16 and the gallium nitride chip 11, and further the heat dissipation cavity of the packaging plate is wider, and the packaging plate can better dissipate heat.
When the installation is carried out, firstly, the gallium nitride chip 11 can be placed in the installation groove 3, the pin of the gallium nitride chip 11 is placed in the pin groove 5, so that the connection wire 14 can be conveniently connected, and further, when the packaging plate 16 is covered, the touch rod 19 is firstly touched in the touch opening of the fixed seat 12, so that the positioning is convenient, and further, the fixed bolt 17 can conveniently penetrate through the positioning hole 21, so that the fixed bolt is connected in the fixed hole 10 of the installation groove 31, and the installation and the fixation are convenient;
the notch 31 enables a heat dissipation cavity to exist between the gallium nitride chip 11 and the first heat dissipation fin 6, and the setting of the abutting rod 19 enables a gap heat dissipation cavity to exist between the gallium nitride chip and the second heat dissipation fin 18, so that a better heat dissipation effect can be achieved;
the heat dissipation plate 15 arranged in the heat dissipation port 7 can achieve the further heat dissipation effect;
thereby can fix a position the encapsulation to the gallium nitride chip, and make whole when using, can make the four sides of gallium nitride chip dispel the heat simultaneously, have better radiating effect, and holistic detachability makes it conveniently maintain and change, and then makes its better satisfied in-service use needs.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a gallium nitride based power switch device, includes base (1), two mounting holes (2), its characterized in that have been seted up on base (1): the surface of the base (1) is provided with a mounting groove (3), and one side of the mounting groove (3) is provided with a distribution groove (4) extending to the edge of the base (1);
both sides of the base (1) are provided with heat dissipation ports (7), and the inner surfaces of the heat dissipation ports (7) are provided with communication ports (8) communicated with the mounting groove (3);
a gallium nitride chip (11) is arranged in the mounting groove (3), a first heat dissipation part is arranged on the inner surface of the mounting groove (3), a plurality of pins (13) are arranged on the gallium nitride chip (11), connecting wires (14) are connected to the pins (13), a packaging plate (16) packaged in the mounting groove (3) is covered on the surface of the gallium nitride chip (11), and a second heat dissipation part is arranged on the packaging plate (16);
a detachable heat dissipation plate (15) which is connected with the closed communication opening (8) is arranged in the heat dissipation opening (7).
2. A gallium nitride based power switching device according to claim 1, wherein: the first heat dissipation part comprises a notch (31) formed in the inner surface of the mounting groove (3), and a first heat dissipation fin (6) is embedded in the inner surface of the notch (31).
3. A gallium nitride based power switching device according to claim 1, wherein: the mounting structure is characterized in that fixing holes (10) are formed in four corners of the inner surface of the mounting groove (3), positioning holes (21) corresponding to the fixing holes (10) are formed in four corners of the gallium nitride chip (11), and fixing bolts (17) penetrating through the positioning holes (21) and connected into the fixing holes (10) are arranged on the packaging plate (16) through bolts.
4. A gallium nitride based power switching device according to claim 1, wherein: fixing seats (12) are fixed on two sides of the surface of the gallium nitride chip (11), and contact rods (19) used for abutting against the fixing seats (12) are fixed on the inner surface of the packaging plate (16).
5. A gallium nitride based power switching device according to claim 1, wherein: the second heat dissipation part is a second heat dissipation fin (18) embedded on the packaging plate (16).
6. A gallium nitride based power switching device according to claim 1, wherein: and a pin groove (5) for clamping a pin (13) is formed in the arrangement groove (4).
7. A gallium nitride based power switching device according to claim 1, wherein: two connecting holes (9) are formed in the inner end wall of the heat dissipation opening (7), and a connecting bolt (20) used for being connected into the connecting holes (9) is arranged on the heat dissipation plate (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120737485.8U CN214672588U (en) | 2021-04-12 | 2021-04-12 | Gallium nitride-based power switch device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120737485.8U CN214672588U (en) | 2021-04-12 | 2021-04-12 | Gallium nitride-based power switch device |
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| Publication Number | Publication Date |
|---|---|
| CN214672588U true CN214672588U (en) | 2021-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120737485.8U Active CN214672588U (en) | 2021-04-12 | 2021-04-12 | Gallium nitride-based power switch device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566476A (en) * | 2022-02-11 | 2022-05-31 | 广东汇芯半导体有限公司 | Heat radiator |
| CN115881649A (en) * | 2023-02-22 | 2023-03-31 | 广东气派科技有限公司 | Packaging structure and method for improving plastic packaging thermal stress of high-power GaN chip |
-
2021
- 2021-04-12 CN CN202120737485.8U patent/CN214672588U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566476A (en) * | 2022-02-11 | 2022-05-31 | 广东汇芯半导体有限公司 | Heat radiator |
| CN115881649A (en) * | 2023-02-22 | 2023-03-31 | 广东气派科技有限公司 | Packaging structure and method for improving plastic packaging thermal stress of high-power GaN chip |
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