CN214542195U - Discrete semiconductor device with heat dissipation performance - Google Patents
Discrete semiconductor device with heat dissipation performance Download PDFInfo
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- CN214542195U CN214542195U CN202120452081.4U CN202120452081U CN214542195U CN 214542195 U CN214542195 U CN 214542195U CN 202120452081 U CN202120452081 U CN 202120452081U CN 214542195 U CN214542195 U CN 214542195U
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- packaging body
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Abstract
The utility model discloses a discrete semiconductor device with thermal diffusivity, including the plastic packaging body, the top fixed mounting of the plastic packaging body has the protection to fill up, the top fixed mounting that the protection was filled up has the apron, two have been seted up to the left and right sides symmetry of apron put the thing groove, two put a lateral symmetry fixed mounting that the thing groove is close to each other and have two handles, the left and right sides symmetry fixed mounting that the protection was filled up the bottom outer wall has two dead levers, two a lateral symmetry that the dead lever was kept away from each other has seted up two first arc draw-in grooves. This semiconductor discrete device with thermal diffusivity is favorable to the installation of N type fin through the N type draw-in groove that sets up, and the effective heat dissipation of discrete device of being convenient for through the N type fin cooperation radiating fin that sets up is favorable to the bellied dress that clamps of rectangle through the rectangle draw-in groove that sets up, and the heat-conducting plate cooperation cooling tube through setting up is favorable to further heat dissipation, makes the radiating effect promote greatly.
Description
Technical Field
The utility model relates to a semiconductor equipment and accessory technical field, in particular to discrete semiconductor device with thermal diffusivity.
Background
With the continuous development of society and the continuous improvement of the scientific and technical level, electronic products are developed rapidly, and in order to make the functions of the electronic products more complete, the internal structures of the electronic products are more and more complex, and in the electronic products, semiconductor discrete devices are one of important parts.
The semiconductor discrete device belongs to the semiconductor category, is an intermediate product between the electronic complete machine industry and the upstream raw material industry, covers a semiconductor II, a triode, a thyristor and other discrete devices, and has application fields covering multiple aspects of consumer electronics, computer and peripheral markets, network communication, electronic special equipment and instruments, automotive electronics, LED display screens, electronic lighting and the like.
The existing semiconductor discrete device can generate larger heat when in use, and in order to timely dissipate the heat, a heat dissipation plate is usually arranged on the bottom surface of the plastic package body, so that the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a discrete semiconductor device with heat dissipation, which can effectively solve the problems of the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a semiconductor discrete device with heat dissipation performance comprises a plastic packaging body, wherein a protective pad is fixedly installed at the top of the plastic packaging body, a cover plate is fixedly installed at the top of the protective pad, two object placing grooves are symmetrically formed in the left side and the right side of the cover plate, two handles are symmetrically and fixedly installed on one side, close to each other, of the two object placing grooves, two fixing rods are symmetrically and fixedly installed on the left side and the right side of the outer wall of the bottom of the protective pad, two first arc-shaped clamping grooves are symmetrically formed in one side, far away from each other, of the two fixing rods, two inserting holes are symmetrically formed in the left side and the right side of the top of the plastic packaging body, two hollow columns are symmetrically and fixedly installed on one side, far away from each other, of the two hollow columns, and two reset springs are symmetrically and fixedly connected to one end, far away from each other, of the two hollow columns, one end of each of the two return springs, which is close to each other, is symmetrically and fixedly connected with two sliding blocks, one side of each of the two sliding blocks, which is close to each other, is symmetrically and fixedly connected with two arc-shaped clamping rods, the bottom of the plastic packaging body is provided with an N-shaped clamping groove, an inner cavity of the N-shaped clamping groove is clamped with an N-shaped radiating fin, the outer wall of the front surface and the outer walls of the left side and the right side of the N-shaped radiating fin are both fixedly provided with radiating fins, the outer wall of the back surface of the N-shaped radiating fin is fixedly provided with rectangular bulges, two arc-shaped bulges are symmetrically arranged on one side of the bottom of the N-shaped radiating fin close to each other, a rectangular clamping groove is arranged on the front surface of the plastic packaging body, two second arc draw-in grooves have been seted up to the inner wall symmetry of the plastics packaging body left and right sides, the symmetrical fixed mounting in the left and right sides of the inside of plastics packaging body has two heat-conducting plates, two the two rows of cooling tubes of a symmetrical fixedly connected with in one side that the heat-conducting plate kept away from each other.
Preferably, the outer wall of the fixing rod is tightly attached to the inner wall of the inserting hole.
Preferably, the inner wall of the N-shaped radiating fin is tightly attached to the outer wall of the plastic packaging body.
Preferably, the inner wall of the first arc-shaped clamping groove is tightly attached to the arc surface of the arc-shaped clamping rod.
Preferably, the outer wall of the rectangular protrusion is tightly attached to the inner wall of the rectangular clamping groove.
Preferably, the outer wall of the arc-shaped protrusion is tightly attached to the inner wall of the second arc-shaped clamping groove.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, the fixed of the hollow post of being convenient for through the fixed slot that sets up, the hollow post reset spring's of being convenient for through setting up is fixed, the installation that is favorable to the dead lever through the first arc draw-in groove of arc kelly cooperation that sets up is fixed, the N type draw-in groove that is favorable to N type fin's installation through setting up, the effective heat dissipation of discrete device of being convenient for through the N type fin cooperation radiating fin that sets up, be favorable to the bellied clamping of rectangle through the rectangle draw-in groove that sets up, heat-conducting plate cooperation cooling tube through setting is favorable to further heat dissipation, make the radiating effect promote greatly.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a cross-sectional view of an N-shaped fin of the present invention;
fig. 3 is a perspective view of the heat pipe of the present invention.
In the figure: 1. a plastic package; 2. an N-type heat sink; 3. a heat dissipating fin; 4. a protective pad; 5. fixing grooves; 6. a hollow column; 7. a return spring; 8. a slider; 9. an arc-shaped clamping rod; 10. fixing the rod; 11. a first arc-shaped clamping groove; 12. a cover plate; 13. a storage groove; 14. a handle; 15. an N-type card slot; 16. a rectangular clamping groove; 17. a rectangular protrusion; 18. a second arc-shaped clamping groove; 19. an arc-shaped bulge; 20. a heat conducting plate; 21. a radiating pipe; 22. and (6) installing a jack.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
As shown in fig. 1-3, a discrete semiconductor device with heat dissipation comprises a plastic package 1, a protective pad 4 is fixedly mounted on the top of the plastic package 1, a cover plate 12 is fixedly mounted on the top of the protective pad 4, two object placing grooves 13 are symmetrically formed on the left and right sides of the cover plate 12, two handles 14 are symmetrically and fixedly mounted on the side, close to each other, of the two object placing grooves 13, two fixing rods 10 are symmetrically and fixedly mounted on the left and right sides of the outer wall of the bottom of the protective pad 4, the outer walls of the fixing rods 10 are tightly attached to the inner wall of an insertion hole 22, two first arc-shaped clamping grooves 11 are symmetrically formed on the side, far away from each other, of the two fixing rods 10, the inner wall of each first arc-shaped clamping groove 11 is tightly attached to the arc-shaped surface of an arc-shaped clamping rod 9, two insertion holes 22 are symmetrically formed on the left and right sides of the top of the plastic package 1, two fixing grooves 5 are symmetrically formed on the left and right sides of the top of the plastic package 1, the fixing of the hollow columns 6 is facilitated through the arranged fixing grooves 5, two hollow columns 6 are symmetrically and fixedly arranged on one sides, far away from each other, of the two fixing grooves 5, the fixing of the reset springs 7 is facilitated through the arranged hollow columns 6, two reset springs 7 are symmetrically and fixedly connected to one ends, far away from each other, of the two hollow columns 6, two sliders 8 are symmetrically and fixedly connected to one ends, close to each other, of the two reset springs 7, two arc-shaped clamping rods 9 are symmetrically and fixedly connected to one sides, close to each other, of the two sliders 8, the installation and fixing of the fixing rods 10 are facilitated through the arranged arc-shaped clamping rods 9 matched with the first arc-shaped clamping grooves 11, the bottom of the plastic packaging body 1 is provided with the N-shaped clamping grooves 15, the installation of the N-shaped radiating fins 2 is facilitated through the arranged N-shaped clamping grooves 15, the inner cavities of the N-shaped clamping grooves 15 are clamped with the N-shaped radiating fins 2, and the inner walls of the N-shaped radiating fins 2 are tightly attached to the outer walls of the plastic packaging body 1, the N-type radiating fin 2 is matched with the radiating fins 3 to facilitate the effective radiation of discrete devices, the radiating fins 3 are fixedly arranged on the outer wall of the front surface and the outer walls of the left side and the right side of the N-type radiating fin 2, the rectangular bulge 17 is fixedly arranged on the outer wall of the back surface of the N-type radiating fin 2, the outer wall of the rectangular bulge 17 is tightly attached to the inner wall of the rectangular clamping groove 16, two arc bulges 19 are symmetrically arranged on one side of the bottom of the N-type radiating fin 2 close to each other, the outer wall of each arc bulge 19 is tightly attached to the inner wall of the second arc clamping groove 18, the rectangular clamping groove 16 is arranged on the front surface of the plastic packaging body 1, the rectangular bulge 17 is favorably clamped through the arranged rectangular clamping groove 16, the two second arc clamping grooves 18 are symmetrically arranged on the inner walls of the left side and the right side of the plastic packaging body 1, two heat-conducting plates 20 are symmetrically and fixedly arranged on the left side and the right side of the plastic packaging body 1, and the one side of the two heat-conducting plates 20 is symmetrically and fixedly connected with two rows of radiating tubes 21, the heat conducting plate 20 is arranged to be matched with the radiating pipe 21 to facilitate further heat radiation, so that the heat radiating effect is greatly improved.
It should be noted that, the utility model relates to a discrete semiconductor device with thermal diffusivity, during the use, inject N type fin 2 ann into in N type draw-in groove 15, the heat of plastic packaging body 1 carries out effectual giving off through N type fin 2's effect, promote N type fin 2's heat dispersion simultaneously by a wide margin under radiating fin 3's effect, a part of heat of plastic packaging body 1 is conducted on cooling tube 21 through heat-conducting plate 20, carry out thermal giving off through cooling tube 21, aim at dead lever 10 and ann insert fixedly hole 22, restoring force effect through reset spring 7 promotes slider 8, make arc kelly 9 and dead lever 10 clamp fixedly.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A semiconductor discrete device having heat dissipation properties, comprising a plastic package (1), characterized in that: the protective pad (4) is fixedly arranged at the top of the plastic packaging body (1), the cover plate (12) is fixedly arranged at the top of the protective pad (4), two object placing grooves (13) are symmetrically formed in the left side and the right side of the cover plate (12), two handles (14) are symmetrically and fixedly arranged on one side, close to each other, of the object placing grooves (13), two fixing rods (10) are symmetrically and fixedly arranged on the left side and the right side of the outer wall of the bottom of the protective pad (4), two first arc-shaped clamping grooves (11) are symmetrically formed in one side, far away from each other, of the two fixing rods (10), two inserting holes (22) are symmetrically formed in the left side and the right side of the top of the plastic packaging body (1), two fixing grooves (5) are symmetrically formed in the left side and the right side of the top of the plastic packaging body (1), and two hollow columns (6) are symmetrically and fixedly arranged on one side, far away from each fixing groove (5), two reset springs (7) are symmetrically and fixedly connected at one end, far away from each other, of each hollow column (6), two sliders (8) are symmetrically and fixedly connected at one end, close to each other, of each reset spring (7), two arc-shaped clamping rods (9) are symmetrically and fixedly connected at one side, close to each other, of each slider (8), an N-shaped clamping groove (15) is formed in the bottom of the plastic packaging body (1), an N-shaped radiating fin (2) is clamped in an inner cavity of the N-shaped clamping groove (15), radiating fins (3) are fixedly arranged on the outer wall of the front face and the outer walls of the left side and the right side of the N-shaped radiating fin (2), a rectangular protrusion (17) is fixedly arranged on the outer wall of the back face of the N-shaped radiating fin (2), two arc-shaped protrusions (19) are symmetrically arranged on one side, close to each other, of the bottom of the N-shaped radiating fin (2), and a rectangular clamping groove (16) is formed in the front face of the plastic packaging body (1), two second arc draw-in grooves (18) have been seted up to the inner wall symmetry of the plastics packaging body (1) left and right sides, the symmetrical fixed mounting in the left and right sides of the inside of plastics packaging body (1) has two heat-conducting plates (20), two heat-conducting plates (20) the two rows of cooling tubes (21) of a symmetrical fixedly connected with in one side of keeping away from each other.
2. The semiconductor discrete device with heat dissipation performance according to claim 1, wherein: the outer wall of the fixed rod (10) is tightly attached to the inner wall of the installation hole (22).
3. The semiconductor discrete device with heat dissipation performance according to claim 1, wherein: the inner wall of the N-shaped radiating fin (2) is tightly attached to the outer wall of the plastic packaging body (1).
4. The semiconductor discrete device with heat dissipation performance according to claim 1, wherein: the inner wall of the first arc-shaped clamping groove (11) is tightly attached to the arc surface of the arc-shaped clamping rod (9).
5. The semiconductor discrete device with heat dissipation performance according to claim 1, wherein: the outer wall of the rectangular protrusion (17) is tightly attached to the inner wall of the rectangular clamping groove (16).
6. The semiconductor discrete device with heat dissipation performance according to claim 1, wherein: the outer wall of the arc-shaped bulge (19) is tightly attached to the inner wall of the second arc-shaped clamping groove (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120452081.4U CN214542195U (en) | 2021-03-02 | 2021-03-02 | Discrete semiconductor device with heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120452081.4U CN214542195U (en) | 2021-03-02 | 2021-03-02 | Discrete semiconductor device with heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214542195U true CN214542195U (en) | 2021-10-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120452081.4U Active CN214542195U (en) | 2021-03-02 | 2021-03-02 | Discrete semiconductor device with heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214542195U (en) |
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2021
- 2021-03-02 CN CN202120452081.4U patent/CN214542195U/en active Active
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