CN217881477U - Miniature heat dissipation device for computer chip - Google Patents

Abstract

The utility model discloses a miniature heat abstractor for computer chip relates to the computer system field, including frame and chip body, the bottom of frame both sides is provided with rubber column groove, the rubber column inslot is connected with and is annular rubber post, the one end that the frame was provided with rubber post both sides is provided with the contact pin guide slot, the frame is connected with the picture peg on one side of two sets of contact pin guide slots, be connected with on the picture peg with rubber post complex contact pin. The utility model discloses insert the contact pin and make rubber column extrusion chip in the rubber column, the rubber column extrusion of both sides presss from both sides tight chip to fix the frame on the chip, improved heat abstractor's installation rate greatly, two sets of extrusion rubber columns that can be even with the contact pin of frame aequilate have guaranteed that the rubber column can apply even pressure to the chip, in firm connection chip, guarantee can not cause the damage to the chip, and the simple structure of device, use cost is lower.

Description

Miniature heat dissipation device for computer chip

Technical Field

The utility model relates to a computer system field specifically is a miniature heat abstractor for computer chip.

Background

The computer system integrated chip is a core component on a computer, and the computer system integrated chip needs to use a miniature heat dissipation device in the using process.

The micro radiator of the existing computer system integrated chip mostly adopts a fan to radiate the chip in an air cooling mode, the air cooling fan occupies a large space, air circulation is not easily generated efficiently in a narrow and closed space, and the radiating performance is not greatly improved under the condition of occupying a large amount of space.

The existing micro radiator for the computer chip has the disadvantages of poor radiating effect, troublesome installation, large volume, difficulty in installation on a circuit board where the chip is located, need of an external power supply for radiating the chip, poor practicability, high use cost and low radiating efficiency.

Disclosure of Invention

Based on this, the utility model aims at providing a miniature heat abstractor for computer chip to the volume that solves current miniature heat abstractor for computer chip is great, is difficult to install the technical problem on the circuit board at chip place.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a miniature heat abstractor for computer chip, includes frame and chip body, the bottom of frame both sides is provided with the rubber column groove, the rubber column inslot is connected with and is annular rubber column, the one end that the frame was provided with rubber column both sides is provided with the contact pin guide slot, the frame is connected with the picture peg in two sets of contact pin guide slots one side, be connected with on the picture peg with rubber column complex contact pin.

Through adopting above-mentioned technical scheme, make the rubber column extrusion chip in inserting the rubber column with the contact pin, the rubber column extrusion of both sides presss from both sides tight chip to fix the frame on the chip, heat abstractor's installation rate has been improved greatly, two sets of extrusion rubber columns that can be even with the equal wide contact pin of frame, guaranteed that the rubber column can exert even pressure to the chip, when firm connection chip, the assurance can not cause the damage to the chip, and the simple structure of device, use cost is lower.

The utility model discloses further set up to, the inside of frame is provided with phase transition heat conduction material layer, the inner wall connection of frame has the fin spliced pole, evenly be connected with the multiunit fin on the fin spliced pole.

By adopting the technical scheme, the phase change heat conduction material is changed from a solid state to a non-flowing liquid state after the temperature of the chip rises, the uneven microscopic surface of the chip is filled, so that the thermal resistance of a contact interface is reduced, the heat transfer efficiency is increased, the heat radiating fins which are uniformly inserted into the phase change heat conduction material layer are matched to lead heat out of the frame, and the heat radiating efficiency of the chip is greatly improved under the condition of not using an external power supply.

The utility model discloses further set up to, the intraformational phase change heat conduction material of phase change heat conduction material is changed the liquid state of non-flow into by solid-state after the chip temperature risees.

Through adopting above-mentioned technical scheme, the phase change heat conduction material cooperation fin in the phase change heat conduction material layer can improve the radiating efficiency to the chip body greatly.

The utility model discloses further set up to, the top of frame is connected with the cover plate through glue, it has the confession fin to pass the groove to open on the cover plate.

By adopting the technical scheme, the cover plate can protect the phase change heat conduction material layer in the frame.

The utility model discloses further set up to, insert behind the contact pin in the rubber column, the rubber column is with the lateral wall in close contact with of fixed chip body.

Through adopting above-mentioned technical scheme, through the tight chip body of the clamp that the rubber post that expands can be even, when guaranteeing stable fixed, can not harm the chip body.

The utility model discloses further set up as, the fin upwards extends the frame.

Through adopting above-mentioned technical scheme, the derivation chip body that makes the heat can be better.

The utility model discloses further set up to, the internal diameter of rubber column is less than the diameter of contact pin.

By adopting the technical scheme, the insertion pin can be inserted into the rubber column to expand and extrude the chip body.

To sum up, the utility model discloses mainly have following beneficial effect:

1. the utility model discloses a set up heat dissipation frame construction, add phase change heat conduction material in frame construction, phase change heat conduction material changes the liquid state of non-flow from solid state after the chip temperature risees, fills uneven chip microscopic surface to reduce contact interface thermal resistance, increase heat transfer efficiency, cooperate the fin of evenly inserting phase change heat conduction material layer to derive the heat from the frame, under the condition of not with the help of external power supply greatly improved the radiating efficiency to the chip;

2. the utility model discloses a set up hollow heat conduction rubber post in the both sides bottom of frame, opposite side at the frame sets up the picture peg and connects two sets of contact pins, insert the contact pin and make rubber post extrusion chip in the rubber post, the rubber post extrusion of both sides presss from both sides tight chip, thereby fix the frame on the chip, heat abstractor's installation rate has been improved greatly, two sets of extrusion rubber posts that can be even with the contact pin of frame aequilate, guaranteed that the rubber post can exert even pressure to the chip, when firm connection chip, guarantee can not cause the damage to the chip, and the simple structure of device, use cost is lower.

Drawings

FIG. 1 is a front view of the present invention;

fig. 2 is an enlarged view of a in fig. 1 of the present invention;

fig. 3 is a side view of the present invention;

fig. 4 is an enlarged view of B in fig. 2 according to the present invention;

fig. 5 is a top view of the present invention;

fig. 6 is a top view of the contact pin of the present invention.

In the figure: 1. a frame; 2. a chip body; 3. a cover sheet; 4. a fin connecting post; 5. a heat sink; 6. a phase change heat conductive material layer; 7. a rubber column groove; 8. a rubber column; 9. inserting a pin guide groove; 10. inserting plates; 11. and (6) inserting pins.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

The following describes an embodiment of the present invention according to its overall structure.

A miniature heat sink for a computer chip, as shown in FIGS. 1-6, comprises a frame 1 and a chip body 2, wherein a phase change heat conducting material layer 6 is arranged inside the frame 1, the inner wall of the frame 1 is connected with a heat sink connecting column 4, a plurality of groups of heat sinks 5 are uniformly connected on the heat sink connecting column 4, the heat sinks 5 extend upwards out of the frame 1, the phase change heat conducting material in the phase change heat conducting material layer 6 is changed into a non-flowing liquid from a solid state after the chip body 2 works, the micro surface of the chip body 2 with unevenness is filled to reduce the thermal resistance of a contact interface and increase the heat transfer efficiency, the heat is led out of the frame 1 by matching with the heat sinks 5 uniformly inserted into the phase change heat conducting material layer 6, very big improvement under the condition with the help of external power source not to chip body 2 radiating efficiency, the bottom at frame 1 both sides is provided with rubber column groove 7, rubber column groove 7 in-connection has and is annular rubber column 8, the one end that frame 1 was provided with rubber column 8 both sides is provided with contact pin guide slot 9, frame 1 is connected with picture peg 10 in two sets of contact pin guide slot 9 one sides, be connected with on the picture peg 10 with 8 complex contact pins 11 of rubber column, contact pin 11 receives contact pin guide slot 9 direction entering rubber column 8 inside, because the internal diameter of rubber column 8 is less than the diameter of contact pin 11, extrude chip body 2's lateral wall after the inflation of rubber column 8, chip body 2's lateral wall is extruded simultaneously to the rubber column 8 of frame 1 both sides bottom, press from both sides tightly chip body 2.

Referring to fig. 1, the phase change heat conductive material in the phase change heat conductive material layer 6 is changed from a solid state to a non-flowing liquid state after the temperature of the chip is raised, and the phase change heat conductive material in the phase change heat conductive material layer 6 is matched with the heat sink 5 to greatly improve the heat dissipation efficiency of the chip body 2.

Referring to fig. 2, the inner diameter of the rubber column 8 is smaller than the diameter of the pin 11, so as to ensure that the pin 11 can expand to squeeze the chip body 2 after being inserted into the rubber column 8, the frame 1 can clamp and fix the side wall of the chip body 2 through the rubber column 8 with the pin 11 inserted into the bottom ends of the two sides, and the chip body 2 can be uniformly clamped through the expanded rubber column 8, thereby ensuring stable fixation without damaging the chip body 2.

Referring to fig. 1 and 5, the top end of the frame 1 is connected with a cover plate 3 through glue, the cover plate 3 is provided with a slot for a heat sink 5 to pass through, and the cover plate 3 can protect the phase change heat conduction material layer 6 in the frame 1.

The utility model discloses a theory of operation does: the frame 1 under the normal temperature is placed above the chip body 2, the pins 11 on the plug board 10 are aligned to the pin guide grooves 9 on two sides of the frame 1, the pins 11 are inserted, the pins 11 are guided by the pin guide grooves 9 to enter the inside of the rubber columns 8, because the inner diameters of the rubber columns 8 are smaller than the diameters of the pins 11, the side walls of the chip body 2 are extruded after the rubber columns 8 expand, the rubber columns 8 at the bottoms of two sides of the frame 1 simultaneously extrude the side walls of the chip body 2, the chip body 2 is clamped, the frame 1 is ensured to be stably connected with the chip body, the purpose of quickly connecting a heat dissipation device is achieved, the phase change heat conduction material in the phase change heat conduction material layer 6 generates phase change after the chip body 2 works, the phase change heat conduction material is changed into non-flowing liquid, the micro surface of the chip body 2 with uneven filling is used for reducing the thermal resistance of a contact interface, the heat transfer efficiency is increased, the heat dissipation efficiency of the frame 1 is greatly improved by matching with the heat dissipation fins 5 which are uniformly inserted into the phase change heat conduction material layer 6 without the aid of an external power supply.

While embodiments of the invention have been illustrated and described, it is not intended to limit the invention to the exact construction and operation illustrated and described, and that various other features, structures, materials, or characteristics may be substituted for those illustrated and described without departing from the spirit and scope of the invention.

Claims (7)

1. A miniature heat abstractor for computer chip, includes frame (1) and chip body (2), its characterized in that: the bottom of frame (1) both sides is provided with rubber column groove (7), rubber column groove (7) in-connection has and is annular rubber column (8), the one end that frame (1) was provided with rubber column (8) both sides is provided with contact pin guide slot (9), frame (1) is connected with picture peg (10) in two sets of contact pin guide slot (9) one side, be connected with on picture peg (10) with rubber column (8) complex contact pin (11).

2. The micro heat sink device for a computer chip as recited in claim 1, wherein: the phase-change heat conduction structure is characterized in that a phase-change heat conduction material layer (6) is arranged inside the frame (1), the inner wall of the frame (1) is connected with a cooling fin connecting column (4), and a plurality of groups of cooling fins (5) are uniformly connected to the cooling fin connecting column (4).

3. The micro heat sink device for a computer chip as recited in claim 2, wherein: the phase change heat conduction material in the phase change heat conduction material layer (6) is changed from a solid state into a non-flowing liquid state after the temperature of the chip is raised.

4. The micro heat sink device for a computer chip as recited in claim 1, wherein: the top end of the frame (1) is connected with a cover plate (3) through glue, and the cover plate (3) is provided with a groove for the radiating fins (5) to pass through.

5. The micro heat sink device for a computer chip according to claim 1, wherein: after the inserting needle (11) is inserted into the rubber column (8), the rubber column (8) is in close contact with the side wall of the fixed chip body (2).

6. The micro heat sink device for a computer chip according to claim 2, wherein: the radiating fins (5) extend upwards out of the frame (1).

7. The micro heat sink device for a computer chip as recited in claim 1, wherein: the inner diameter of the rubber column (8) is smaller than the diameter of the inserting needle (11).

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