CN214852017U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
- Publication number
- CN214852017U CN214852017U CN202121434406.2U CN202121434406U CN214852017U CN 214852017 U CN214852017 U CN 214852017U CN 202121434406 U CN202121434406 U CN 202121434406U CN 214852017 U CN214852017 U CN 214852017U
- Authority
- CN
- China
- Prior art keywords
- mounting
- circuit board
- bar
- multilayer printed
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims description 29
- 238000009434 installation Methods 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 241001122767 Theaceae Species 0.000 abstract description 2
- 239000000110 cooling liquid Substances 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000011120 plywood Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a multilayer printed circuit board, which comprises an upper plate and a lower plate, wherein the two sides of the upper plate and the lower plate are fixedly connected through a mounting bar, the mounting bar is symmetrically provided with mounting holes, the inner cavity of the mounting hole is provided with a mounting rod, radiating fins are evenly arranged between the upper plate and the lower plate, the inner cavity of the lower plate is provided with a radiating channel, the mounting hole on the mounting bar is aligned to the position of the mounting hole when mounting, a loop bar is inserted into the mounting hole and the mounting fixing hole, and then the loop bar is inserted into the loop bar and pressed downwards to fix the circuit board, the tea mounting is more convenient, the circuit board is not damaged, the practicability is increased, a circulating water pump is used to be connected with the radiating channel, when in use, cooling liquid can circularly flow in the radiating channel, thereby the radiating capacity of the circuit board is improved, and the normal operation of the circuit board is ensured, other radiators are not needed, and the service life of the radiator is prolonged.
Description
Technical Field
The utility model relates to a multilayer printed circuit board belongs to printed circuit board technical field.
Background
The printed circuit board is an important electronic component, is a support body of the electronic component, is a carrier for electrical connection of the electronic component, is called a printed circuit board because the printed circuit board is manufactured by adopting electronic printing; printed circuit board maintenance is a new-type repair industry, and industrial equipment's degree of automation is higher and higher, so the quantity of the printed circuit board of each trade is also more and more, but current printed circuit board fixes through the bolt when the installation, and the installation is inconvenient, still causes the damage of circuit board easily, and the circuit board can produce a large amount of heats when operating condition moreover, can make the easy high temperature of circuit board and lead to the damage.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multilayer printed circuit board, the fixed orifices position of the installation of the mounting hole alignment on the mounting bar when the installation, insert the fixed orifices position of mounting hole and installation with the loop bar in, can fix the circuit board after inserting the inserted bar downwards to the loop bar again, it is all more convenient that installation tea is interrupted, and can not cause the damage to the circuit board, increase its practicality, use circulating water pump and heat dissipation channel to be connected, when using, can let the coolant liquid circulate in heat dissipation channel, thereby improve the heat-sinking capability of circuit board, guarantee that it can normal operating, need not reuse other radiators, improve its life, in order to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a multilayer printed wiring board, includes top plate, lower plywood, top plate, lower plywood both sides are through mounting bar fixed connection, the mounting hole has been seted up to the symmetry on the mounting bar, the mounting hole inner chamber is equipped with the installation pole, evenly be equipped with the fin between top plate and the lower plywood, heat dissipation channel has been seted up to lower plywood inner chamber.
Furthermore, the height of the mounting bar is higher than the distance between the upper layer plate and the lower layer plate, and chip grooves are uniformly formed in the upper layer plate.
Further, the installation rod comprises a loop bar and an inserted bar, the bottom of the loop bar penetrates through the installation hole, and the bottom end of the inserted bar is inserted into the inner cavity of the loop bar.
Furthermore, the two sides of the bottom of the loop bar are provided with movable blocks, the movable blocks are arranged in an inclined mode, and a chamfer is arranged on one side, located in the loop bar, of each movable block.
Furthermore, elastic pieces are arranged on two sides of the loop bar, the inner surface of each elastic piece is in surface contact with the corresponding inserted bar, and fixing protrusions are fixedly arranged on the outer sides of the elastic pieces and located in the mounting holes.
Further, the heat dissipation channel is S-shaped, through holes are evenly formed between the heat dissipation channels, the cooling fins are arranged in parallel with the mounting bars, the bottom ends of the cooling fins stretch into the heat dissipation channels, the connectors are formed in one ends of the mounting bars, and the connectors are connected with the heat dissipation channels in a penetrating mode.
The utility model has the advantages that:
1. by arranging the mounting bar, when the mounting bar is mounted, the mounting hole on the mounting bar is aligned to the mounting position, so that the mounting bar can be inserted into the mounting hole, and can be fixed after being pressed, the mounting is more convenient, the circuit board cannot be damaged, and the bottom of the circuit board has a certain space, so that the heat dissipation is convenient;
2. through setting up heat dissipation channel, the installation back can use circulating water pump to be connected with heat dissipation channel, when using, can let the coolant liquid at heat dissipation channel inner loop flow to improve the heat-sinking capability of circuit board, guarantee that it can normal operating, need not reuse other radiators, increase its practicality.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic view of the overall structure of a multilayer printed wiring board according to the present invention;
fig. 2 is a schematic cross-sectional view of a multilayer printed wiring board according to the present invention;
FIG. 3 is a schematic view of a mounting bar structure of a multilayer printed circuit board according to the present invention;
fig. 4 is a top view of a lower board of a multilayer printed wiring board according to the present invention;
reference numbers in the figures: 1. an upper plate; 2. a lower layer plate; 3. mounting a bar; 4. mounting holes; 5. mounting a rod; 6. a heat sink; 7. a heat dissipation channel; 8. a loop bar; 9. inserting a rod; 10. a movable block; 11. an elastic sheet; 12. a fixed protrusion; 13. a connecting port; 14. and a through hole.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance
Referring to fig. 1-4, the present invention provides a technical solution: a multilayer printed circuit board comprises an upper board 1 and a lower board 2, wherein the two sides of the upper board 1 and the lower board 2 are fixedly connected through mounting bars 3, mounting holes 4 are symmetrically formed in the mounting bars 3, mounting rods 5 are arranged in the inner cavities of the mounting holes 4, when the multilayer printed circuit board is mounted, the mounting holes 4 in the mounting bars 3 are aligned to the mounting positions, the mounting rods 5 can be inserted into the mounting holes 4 and can be fixed after being pressed, the multilayer printed circuit board is more convenient to mount, the circuit board is not damaged, a certain space is formed at the bottom of the circuit board, heat dissipation is facilitated, heat dissipation fins 6 are uniformly arranged between the upper board 1 and the lower board 2, heat dissipation channels 7 are formed in the inner cavity of the lower board 2, after the multilayer printed circuit board is mounted, a circulating water pump can be connected with the heat dissipation channels 7, when the multilayer printed circuit board is used, cooling liquid can flow in the heat dissipation channels 7 in a circulating mode, and therefore the heat dissipation capacity of the circuit board is improved, the normal operation of the radiator is ensured, other radiators are not needed, and the practicability is improved.
Specifically, as shown in fig. 1 and 2, the height of the mounting bar 3 is greater than the distance between the upper board 1 and the lower board 2, and the upper board 1 is uniformly provided with chip grooves, so that the bottom of the circuit board has a certain space, which is helpful for heat dissipation.
Specifically, as shown in fig. 3, the mounting rod 5 includes a sleeve rod 8 and an insertion rod 9, the bottom of the sleeve rod 8 penetrates through the mounting hole 4, the bottom end of the insertion rod 9 is inserted into the inner cavity of the sleeve rod 8, two sides of the bottom of the sleeve rod 8 are provided with movable blocks 10, the movable blocks 10 are arranged obliquely, and one side of the movable blocks 10, which is located in the sleeve rod 8, is provided with a chamfer, during mounting, the sleeve rod 8 is firstly inserted into the mounting hole 4, the bottom of the sleeve rod is inserted into the mounting fixed hole, then the insertion rod 9 is inserted into the sleeve rod 8, the movable blocks 10 can be extruded outwards, so that the movable blocks 10 move to the bottom of the mounting fixed hole, thereby fixing the circuit board, the two sides of the sleeve rod 8 are provided with elastic sheets 11, the inner surfaces of the elastic sheets 11 are in surface contact with the insertion rod 9, the outer sides of the elastic sheets 11 are fixedly provided with fixed protrusions 12, and the fixed protrusions 12 are located in the mounting hole 4, when the insertion rod 9 is inserted, the elastic piece 11 is also supported to the outside so that the fixing protrusion 12 is brought into close contact with the inner surface of the mounting hole 4, thereby increasing the mounting stability.
Specifically, as shown in fig. 4, the heat dissipation channel 7 is in an S-shaped configuration, and the through holes 14 are uniformly formed between the heat dissipation channels 7, the heat dissipation fins 6 are arranged in parallel with the mounting bar 3, and the bottom end of each heat dissipation fin extends into the heat dissipation channel 7, the connector 13 is formed at one end of the mounting bar 3, and the connector 13 is connected with the heat dissipation channel 7 in a penetrating manner, so that the heat dissipation capability of the circuit board is effectively improved, and the service life of the circuit board is prolonged.
The utility model discloses the theory of operation: when the installation with the position of mounting hole 4 alignment installation on the mounting bar 3, can insert in mounting hole 4 installation pole 5, can fix it after pressing down, it is more convenient to install, and can not cause the damage to the circuit board, use circulating water pump to be connected with heat dissipation channel 7, when using, can let the coolant liquid at heat dissipation channel 7 inner loop flow to improve the heat-sinking capability of circuit board, guarantee that it can normal operating, need not reuse other radiators, increase its practicality.
The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.
Claims (6)
1. A multilayer printed wiring board comprising an upper board (1) and a lower board (2), characterized in that: mounting bar (3) fixed connection is passed through to upper plate (1), lower floor plate (2) both sides, mounting hole (4) have been seted up to the symmetry on mounting bar (3), mounting hole (4) inner chamber is equipped with installation pole (5), evenly be equipped with fin (6) between upper plate (1) and lower floor plate (2), heat dissipation channel (7) have been seted up to lower floor plate (2) inner chamber.
2. A multilayer printed wiring board according to claim 1, wherein: the height of the mounting bar (3) is higher than the distance between the upper plate (1) and the lower plate (2), and chip grooves are uniformly formed in the upper plate (1).
3. A multilayer printed wiring board according to claim 2, wherein: the mounting rod (5) comprises a sleeve rod (8) and an inserted rod (9), the bottom of the sleeve rod (8) penetrates through the mounting hole (4), and the bottom end of the inserted rod (9) is inserted into the inner cavity of the sleeve rod (8).
4. A multilayer printed wiring board according to claim 3, wherein: the movable block (10) is arranged on two sides of the bottom of the loop bar (8), the movable block (10) is arranged in an inclined mode, and a chamfer is arranged on one side, located in the loop bar (8), of the movable block (10).
5. The multilayer printed wiring board of claim 4, wherein: elastic pieces (11) are arranged on two sides of the loop bar (8), the inner surfaces of the elastic pieces (11) are in contact with the toilet surface of the inserted bar (9), fixing protrusions (12) are fixedly arranged on the outer sides of the elastic pieces (11), and the fixing protrusions (12) are located in the mounting holes (4).
6. The multilayer printed wiring board of claim 5, wherein: radiating channel (7) are the S-shaped setting, and evenly seted up through-hole (14) between radiating channel (7), fin (6) and mounting bar (3) parallel arrangement, and the bottom all stretches into in radiating channel (7), connector (13) have been seted up to mounting bar (3) one end, and connector (13) and radiating channel (7) through connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121434406.2U CN214852017U (en) | 2021-06-25 | 2021-06-25 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121434406.2U CN214852017U (en) | 2021-06-25 | 2021-06-25 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214852017U true CN214852017U (en) | 2021-11-23 |
Family
ID=78810228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121434406.2U Expired - Fee Related CN214852017U (en) | 2021-06-25 | 2021-06-25 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214852017U (en) |
-
2021
- 2021-06-25 CN CN202121434406.2U patent/CN214852017U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214852017U (en) | Multilayer printed circuit board | |
| US20150086829A1 (en) | Battery module having thermally conductive holding frame | |
| CN217470648U (en) | Radiator and electrical equipment | |
| CN217283921U (en) | Liquid cooling device and case | |
| CN215601713U (en) | Heat conduction type metal substrate | |
| CN214672409U (en) | Rapid heat dissipation relay | |
| CN213818695U (en) | PCBA heat radiation component | |
| CN213213952U (en) | PCB assembly with good heat dissipation performance | |
| CN210610093U (en) | High-efficient heat dissipation type PCB circuit board | |
| CN112530889A (en) | Powerful chip radiator | |
| CN211210022U (en) | Heat dissipation circuit board and electrical equipment | |
| CN216357845U (en) | Aluminum-based circuit board with ultrahigh heat conduction | |
| CN211063854U (en) | Semiconductor mainboard | |
| CN219019110U (en) | Circuit board | |
| CN215500280U (en) | Smart television circuit board with self-heat dissipation function | |
| CN218830758U (en) | Heat dissipation type circuit board | |
| CN212324619U (en) | Heat dissipation box | |
| CN217822758U (en) | Power module | |
| CN216649842U (en) | Television mainboard integrated by multiple modules | |
| CN209861264U (en) | Double-sided PCB aluminum substrate | |
| CN218351415U (en) | High-efficiency etching tank | |
| CN209879438U (en) | Radiator with rapid heat dissipation | |
| CN212081183U (en) | Radiator integrated with substrate | |
| CN218125201U (en) | Ceramic radiator | |
| CN216352178U (en) | Cladding heat conduction type heat dissipation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211123 |