CN211063854U

CN211063854U - Semiconductor mainboard

Info

Publication number: CN211063854U
Application number: CN201922005224.2U
Authority: CN
Inventors: 洪朝满
Original assignee: Guizhou Xizhi Technology Co Ltd
Current assignee: Guizhou Xizhi Technology Co Ltd
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2020-07-21
Anticipated expiration: 2029-11-19

Abstract

The utility model discloses a semiconductor mainboard, including the mainboard body, the bottom of mainboard body is provided with a cooling plate, the cooling plate is fixed with a heat-conducting plate on the surface, the heat-conducting plate upper surface with the lower surface in close contact with of mainboard body, the inside a plurality of cooling chambeies that are provided with of cooling plate, the cooling intracavity is provided with the coolant liquid, the cooling intracavity is provided with the heat transfer board, the heat transfer board through the heat conduction pole with heat-conducting plate fixed connection, the utility model relates to a circuit board technical field. This semiconductor mainboard sets up the cooling plate through setting up the cooling plate bottom mainboard body, sets up the cooling chamber in the cooling plate, sets up coolant liquid and heat transfer board in the cooling chamber, and the heat-conducting plate conducts the heat of mainboard to heat transfer board and coolant liquid and carries out the heat transfer to the realization to the heat dissipation of mainboard, cooling, realize better radiating effect, further reduce the mainboard and the heating element's on the temperature, and then reduce system's temperature, avoid the high temperature to lead to circuit or electronic component to damage.

Description

Semiconductor mainboard

Technical Field

The utility model relates to a circuit board technical field specifically is a semiconductor mainboard.

Background

The main board, also called main board system board or mother board, is installed in the case and is one of the most basic and important components of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a key and board control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.

The mainboard can produce a large amount of heats at the during operation, if not dispel the heat in time, the mainboard high temperature can lead to circuit and electronic component impaired, and current mainboard heat dissipation function is relatively poor, can't better heat dissipation, needs to install the radiator in addition and dispels the heat to the mainboard to further reduce the temperature of mainboard and the heating element on it, and then reduce system temperature.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art, the utility model provides a semiconductor mainboard has solved current mainboard heat dissipation function relatively poor, unable better heat dissipation, and board high temperature can lead to the impaired problem of circuit and electronic component.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a semiconductor mainboard, includes the mainboard body, the bottom of mainboard body is provided with a cooling plate, be fixed with a heat-conducting plate on the cooling plate surface, the heat-conducting plate upper surface with the lower surface in close contact with of mainboard body, the inside a plurality of cooling chambers that are provided with of cooling plate, the cooling intracavity is provided with the coolant liquid, the cooling intracavity is provided with the heat transfer board, the heat transfer board through the heat conduction pole with heat-conducting plate fixed connection.

Further, the one end of cooling plate is provided with a movable groove, be fixed with a connecting rod on the terminal surface of cooling plate, the other end of connecting rod link up extremely the inner chamber of movable groove, the connecting rod is located the inside one end of movable groove is fixed with a radius and is greater than the limiting plate of connecting rod, the connecting rod surface cover is equipped with the spring, the one end fixed connection of spring is in on the limiting plate, the other end fixed connection of spring in the movable groove internal face is close to on the terminal surface of cooling plate.

The cooling plate with the relative one in activity groove is served and all be provided with a kelly on the outer end in activity groove, the top of kelly upwards extends and inwards buckles, the both ends of mainboard body all be provided with the card hole of kelly looks adaptation.

Be provided with feed liquor pipe and drain pipe on the lateral wall face of cooling plate, the feed liquor pipe link up to the inside of cooling plate with the one end intercommunication in cooling chamber, the drain pipe link up to the inside of cooling plate with the other end intercommunication in cooling chamber.

The number of the heat conducting rods is multiple, and the heat conducting rods are uniformly distributed on the lower surface of the heat conducting plate.

The other ends of the heat conducting rods are uniformly distributed in the cooling cavities.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) this semiconductor mainboard through set up the cooling plate bottom mainboard body, sets up the cooling chamber in the cooling plate, sets up coolant liquid and heat transfer board in the cooling chamber, and the heat-conducting plate carries out the heat transfer with the coolant liquid on with the heat transfer board of mainboard heat conduction to the heat transfer board to the realization is to the heat dissipation of mainboard, cooling, realizes better radiating effect, further reduces the mainboard and the heating element's on the mainboard temperature, and then reduces the system temperature, avoids the high temperature to lead to circuit or electronic component to damage.

(2) This semiconductor mainboard through can dismantling the cooling plate and mainboard body and be connected, in use can confirm whether need install the cooling plate according to specific service environment, can select to pull down the volume and the weight of cooling plate in order to reduce the mainboard under the good operational environment of heat dissipation, can adapt to different operational environment, and the practicality is strong.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a cross-sectional view of the cooling plate of the present invention viewed from above.

In the figure: 1-main board body, 2-cooling plate, 3-heat conducting plate, 4-cooling cavity, 5-cooling liquid, 6-heat exchanging plate, 7-heat conducting rod, 8-movable groove, 9-connecting rod, 10-spring, 11-limiting plate, 12-clamping rod, 13-clamping hole, 14-liquid inlet pipe and 15-liquid outlet pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a semiconductor mainboard, includes mainboard body 1, and the bottom of mainboard body 1 is provided with a cooling plate 2, and cooling plate 2 is fixed with a heat-conducting plate 3 on the surface, and 3 metal material that the heat conductivity is good of heat-conducting plate are made.

The upper surface of the heat conducting plate 3 is in close contact with the lower surface of the mainboard body 1, and can absorb a large amount of heat on the mainboard body 1. Inside a plurality of cooling chamber 4 that are provided with of cooling plate 2, be provided with coolant liquid 5 in the cooling chamber 4, be provided with heat transfer board 6 in the cooling chamber 4, heat transfer board 6 is made for the metal material that the heat conductivility is good, and heat transfer board 6 passes through heat conduction pole 7 and heat-conducting plate 3 fixed connection. The number of the heat conducting rods 7 is multiple, the heat conducting rods are uniformly distributed on the lower surface of the heat conducting plate 3, and the other ends of the heat conducting rods 7 are uniformly distributed in the cooling cavities 4.

All be provided with a heat transfer board 6 in every cooling chamber 4, all be provided with a plurality of heat conduction poles 7 on every heat transfer board 6, the metal material that 7 positions heat conductivities of heat conduction pole are good makes, and the other end of heat conduction pole 7 extends to the outside and the heat-conducting plate 3 fixed connection of cooling plate 2.

One end of cooling plate 2 is provided with a movable groove 8, is fixed with a connecting rod 9 on the terminal surface of cooling plate 2, and the other end of connecting rod 9 link up to the inner chamber of movable groove 8, and connecting rod 9 is located the inside one end of movable groove 8 and is fixed with the limiting plate 11 that a radius is greater than connecting rod 9, and connecting rod 9 surface cover is equipped with spring 10, and the one end fixed connection of spring 10 is on limiting plate 11, and the other end fixed connection of spring 10 is on the terminal surface that 8 internal faces of movable groove are close to cooling plate 2.

One of the cooling plate 2 opposite to the movable groove 8 is provided with a clamping rod 12 and the outer end of the movable groove 8 is provided with an inward bending clamping rod 12, the top end of the clamping rod 12 extends upwards, and the two ends of the main plate body 1 are provided with clamping holes 13 matched with the clamping rods 12.

When mainboard body 1 and cooling plate 2 are unpacked apart to needs, pulling movable groove 8 removes to the one end of keeping away from cooling plate 2, because spring 10 is located between limiting plate 11 and the 8 internal faces in movable groove, spring 10 receives the compression, movable groove 8 drives a kelly 12 motion this moment, break away from with mainboard body 1, thereby take off mainboard body 1 from cooling plate 2, when the dress, outwards pulling movable groove 8 equally, increase the distance between two kellies 12, block into the card hole 13 of mainboard body 1 one end with the kelly 12 card of the other end, put flat mainboard body 1, loosen movable groove 8, under the effect of elasticity, movable groove 8 resets and pastes tightly with cooling plate 2, kelly 12 card is blocked into in the card hole 13, on installing mainboard body 1 on cooling plate 2.

A liquid inlet pipe 14 and a liquid outlet pipe 15 are arranged on the side wall surface of the cooling plate 2, the liquid inlet pipe 14 penetrates through the inside of the cooling plate 2 and is communicated with one end of the cooling cavity 4, and the liquid outlet pipe 15 penetrates through the inside of the cooling plate 2 and is communicated with the other end of the cooling cavity 4. The cooling liquid 5 is continuously pumped into the cooling cavity 4 through an external pump, the cooling liquid 5 with the increased temperature flows out of the liquid outlet pipe 15, and is re-pumped into the cooling cavity 4 after being cooled, so that circulation is realized.

The during operation, mainboard body 1 work produces the heat, heat-conducting plate 3 absorbs the heat, conduct the heat to heat transfer board 6 through heat conduction pole 7 on, coolant liquid 5 is gone into from 14 pump pumps of feed liquor pipe to outside pump, coolant liquid 5 is full of cooling chamber 4,

heat transfer board

6 and 5 heat exchanges of coolant liquid, make surface temperature reduce, form the temperature difference with heat conduction pole 7 and heat-conducting plate 3, can continuously absorb the heat, continuously suck away the heat that mainboard body 1 produced, realize the heat dissipation, coolant liquid 5 that the temperature rose flows from drain pipe 15, pump again into cooling chamber 4 after the cooling in, realize the circulation.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor motherboard comprising a motherboard body (1), characterized in that: the bottom of mainboard body (1) is provided with a cooling plate (2), cooling plate (2) are fixed with a heat-conducting plate (3) on the surface, heat-conducting plate (3) upper surface with the lower surface in close contact with of mainboard body (1), cooling plate (2) inside is provided with a plurality of cooling chambers (4), be provided with coolant liquid (5) in cooling chamber (4), be provided with heat transfer board (6) in cooling chamber (4), heat transfer board (6) through heat conduction pole (7) with heat-conducting plate (3) fixed connection.

2. A semiconductor motherboard according to claim 1, characterized in that: the one end of cooling plate (2) is provided with a movable groove (8), be fixed with a connecting rod (9) on the terminal surface of cooling plate (2), the other end of connecting rod (9) link up extremely the inner chamber of movable groove (8), connecting rod (9) are located the inside one end of movable groove (8) is fixed with a radius and is greater than limiting plate (11) of connecting rod (9), connecting rod (9) surface cover is equipped with spring (10), the one end fixed connection of spring (10) is in on limiting plate (11), the other end fixed connection of spring (10) in movable groove (8) internal face is close to on the terminal surface of cooling plate (2).

3. A semiconductor motherboard according to claim 2, characterized in that: the cooling plate (2) on with the relative one end in activity groove (8) is served with all be provided with a kelly (12) on the outer end in activity groove (8), the top of kelly (12) upwards extends and inwards buckles, the both ends of mainboard body (1) all be provided with card hole (13) of kelly (12) looks adaptation.

4. A semiconductor motherboard according to claim 1, characterized in that: be provided with feed liquor pipe (14) and drain pipe (15) on the lateral wall face of cooling plate (2), feed liquor pipe (14) link up extremely the inside of cooling plate (2) with the one end intercommunication in cooling chamber (4), drain pipe (15) link up extremely the inside of cooling plate (2) with the other end intercommunication in cooling chamber (4).

5. A semiconductor motherboard according to claim 1, characterized in that: the number of the heat conducting rods (7) is multiple, and the heat conducting rods are uniformly distributed on the lower surface of the heat conducting plate (3).

6. A semiconductor motherboard according to claim 5, wherein: the other ends of the heat conducting rods (7) are uniformly distributed in the cooling cavities (4).