CN214257020U - Graphene heat dissipation device for electronic device - Google Patents
Graphene heat dissipation device for electronic device Download PDFInfo
- Publication number
- CN214257020U CN214257020U CN202120400531.5U CN202120400531U CN214257020U CN 214257020 U CN214257020 U CN 214257020U CN 202120400531 U CN202120400531 U CN 202120400531U CN 214257020 U CN214257020 U CN 214257020U
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- heat dissipation
- heat
- graphene
- electronic device
- fins
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 113
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 238000010030 laminating Methods 0.000 claims description 14
- 229910002804 graphite Inorganic materials 0.000 claims description 10
- 239000010439 graphite Substances 0.000 claims description 10
- -1 graphite alkene Chemical class 0.000 claims description 10
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 230000003139 buffering effect Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 3
- 239000010410 layer Substances 0.000 description 9
- 238000009434 installation Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a graphene heat dissipation device for an electronic device, which comprises a metal heat conduction plate and a heat dissipation mechanism, wherein a plurality of heat conduction contact blocks are arranged at the top of the metal heat conduction plate, and the heat dissipation mechanism is arranged at the bottom of the metal heat conduction plate; the heat dissipation mechanism comprises a graphene heat dissipation sheet, a plurality of heat dissipation connecting fins and a plurality of attaching support sheets, the heat dissipation connecting fins are transversely arranged at the top of the graphene heat dissipation sheet at equal intervals, the attaching support sheets are longitudinally arranged at the top of the graphene heat dissipation sheet at equal intervals and are inserted at the bottoms of the heat dissipation connecting fins, and the heights of the attaching support sheets are all lower than the heights of the heat dissipation connecting fins; and a plurality of fence heat dissipation cavities are formed by the plurality of heat dissipation connecting fins and the plurality of attaching support sheets in a crossed manner. The utility model discloses wholly assemble fixed convenient and stable, application scope is wider to can improve the radiating efficiency well.
Description
Technical Field
The utility model relates to an electronic equipment heat dissipation technical field especially relates to a graphite alkene heat abstractor for electronic device.
Background
At present, in the prior art, graphene has excellent optical, electrical, mechanical, thermal and other properties, and thus has been widely used in the fields of electronic product equipment and the like. Electronic product commonly used in life, for example, computer, many corresponding parts all can constantly produce the heat in the use, if do not have good heat dissipation means, inside a large amount of heats remain the computer, cause the computer temperature to rise, often can lead to the emergence of card pause phenomenon, and long-time high temperature also can influence the life of computer.
Therefore, a heat dissipation patch is often used for dissipating heat of a computer, for example, a graphene heat dissipation patch of an electronic device with the application number of CN201921189162.9 is used in the prior art, the graphene heat dissipation patch sequentially comprises a graphene heat dissipation layer, a metal heat conduction layer and a positioning adhesive layer from outside to inside, the graphene heat dissipation layer covers the outer surface of the metal heat conduction layer, and the positioning adhesive layer is adhered to the inner surface of the metal heat conduction layer, so that the overall heat dissipation efficiency is improved. But in the installation, because whole all is in the plane installation, thereby it influences concatenation efficiency to take place easily to sideslip, and the contact is too inseparable simultaneously, to the limited and comparatively inseparable electronic equipment of electrical part arrangement in space such as cell-phone, influences holistic ventilation cooling efficiency easily.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that, overcome prior art not enough, provide a graphite alkene heat abstractor for electronic device, it is whole to assemble fixed convenient and stable, and application scope is wider to can improve the radiating efficiency well.
In order to solve the technical problem, the technical scheme of the utility model is that:
a graphene heat dissipation device for an electronic device comprises a metal heat conduction plate and a heat dissipation mechanism, wherein a plurality of heat conduction contact blocks are arranged at the top of the metal heat conduction plate, and the heat dissipation mechanism is arranged at the bottom of the metal heat conduction plate; the heat dissipation mechanism comprises a graphene heat dissipation sheet, a plurality of heat dissipation connecting fins and a plurality of attaching support sheets, the heat dissipation connecting fins are transversely arranged at the top of the graphene heat dissipation sheet at equal intervals, the attaching support sheets are longitudinally arranged at the top of the graphene heat dissipation sheet at equal intervals and are inserted at the bottoms of the heat dissipation connecting fins, and the heights of the attaching support sheets are all lower than the heights of the heat dissipation connecting fins; a plurality of fence heat dissipation cavities are formed by the plurality of heat dissipation connecting fins and the plurality of attaching support sheets in a crossed manner; the bottom of the metal heat conducting plate is provided with a plurality of clamping positioning grooves matched with the heat dissipation connecting fins, the heat dissipation connecting fins are clamped in the corresponding clamping positioning grooves, the bottom of the metal heat conducting plate is also provided with a plurality of concave insertion grooves matched with the laminating supporting sheets, and the laminating supporting sheets are clamped in the corresponding concave insertion grooves.
Further, a heat dissipation glue layer is filled in the fence heat dissipation cavity.
Furthermore, the top of the heat dissipation connecting fin is bonded with a buffering heat conducting pad, and a heat conducting adhesive layer is filled in the clamping positioning groove.
Furthermore, a silica gel heat conducting pad is arranged in the concave insertion groove.
Furthermore, the both ends of laminating backing sheet all integrated into one piece have fixed connector, it has the connecting sleeve to peg graft on the fixed connector, the spiro union has clamping screw in the connecting sleeve.
Further, connecting sleeve's bottom integrated into one piece has spacing platform, the top integrated into one piece that presss from both sides tight screw rod has T shape joint piece.
Further, the heat dissipation connecting fins and the graphene radiating fins are integrally formed.
By adopting the technical scheme, the utility model discloses following beneficial effect has:
1. the utility model discloses the design has a plurality of heat dissipation connecting fin and laminating backing sheet on graphite alkene heat dissipation sheet to through the cooperation joint with the metal heat-conducting plate, can be convenient for carry out the joint to the metal heat-conducting plate and fix, thereby the overall structure's of being convenient for installation is fixed, improves stability from this. Through the design that laminating backing sheet and heat dissipation connecting fin height are different to leave certain space between making metal heat-conducting plate and the graphite alkene fin, thereby be convenient for ventilate, further improve heat conduction efficiency, especially also can leave the heat dissipation guide rail in inseparable space, and then make things convenient for the graphite alkene fin to dispel the heat to the outside.
2. The fence heat dissipation cavity formed among the graphene heat dissipation fins, the heat dissipation connecting fins and the attaching support sheet is filled with the heat dissipation glue layer, so that the overall heat dissipation efficiency is further improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the heat dissipation mechanism of the present invention;
FIG. 3 is a schematic structural diagram of the metal heat-conducting plate of the present invention;
fig. 4 is a side sectional view of the heat dissipating mechanism of the present invention;
fig. 5 is a schematic side view of the metal heat-conducting plate of the present invention;
fig. 6 is a schematic front view of the metal heat-conducting plate of the present invention;
wherein, 1, a metal heat conducting plate; 2. a heat conductive contact block; 3. a heat dissipation mechanism; 4. a connecting sleeve; 5. clamping the screw rod; 11. clamping the positioning groove; 12. a concave plug groove; 30. a graphene heat sink; 31. heat dissipation connecting fins; 32. attaching a support sheet; 40. a limiting table; 50, a T-shaped clamping block; 110. a heat-conducting adhesive layer; 120. a silica gel heat conducting pad; 300. a fence heat dissipation cavity; 301. a heat dissipation adhesive layer; 310. a buffer heat-conducting pad; 320. and fixing the connector.
Detailed Description
In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is provided in connection with the accompanying drawings.
As shown in fig. 1 to 6, in this embodiment, a graphene heat dissipation device for an electronic device is composed of a metal heat conduction plate 1 and a heat dissipation mechanism 3, wherein the top of the metal heat conduction plate 1 is provided with a plurality of heat conduction contact blocks 2, specifically, in this embodiment, the heat conduction contact blocks 2 are uniformly distributed in three rows and five columns for 15, the top of the metal heat conduction plate 1 is provided with 15 nesting holes, and the 15 heat conduction contact blocks 2 are bonded in the corresponding nesting holes, so that the design can improve the heat conduction area and the heat dissipation effect. Heat dissipation mechanism 3 is installed in 1 bottom of metal heat-conducting plate, heat dissipation mechanism 3 specifically is by graphite alkene fin 30, a plurality of heat dissipation connection fin 31 and a plurality of laminating backing sheet 32 are constituteed, the quantity of heat dissipation connection fin 31 is 5 in this embodiment, 5 heat dissipation connection fin 31 are equidistant transversal arrangement in graphite alkene fin 30 top, the quantity of laminating backing sheet 32 also is 5, 5 laminating backing sheet 32 are equidistant longitudinal arrangement in graphite alkene fin 30 top and plug-in 5 heat dissipation connection fin 31 bottoms, all laminating backing sheet 32 highly all are less than heat dissipation connection fin 31's height. A plurality of fence heat dissipation cavities 300 are formed between the plurality of heat dissipation connecting fins 31 and the plurality of attaching support sheets 32 in a crossed manner, in this embodiment, 16 fence heat dissipation cavities 300 are just formed between 5 heat dissipation connecting fins 31 and 5 attaching support sheets 32, and the existence of the fence heat dissipation cavities 300 can be more beneficial to heat conduction of the metal heat conducting plate 1 and heat dissipation of the graphene heat dissipation sheet 30. In this embodiment, 5 clamping positioning grooves 11 adapted to the heat dissipation connecting fins 31 are formed in the bottom of the metal heat conducting plate 1, the 5 heat dissipation connecting fins 31 are clamped in the corresponding clamping positioning grooves 11, 5 concave insertion grooves 12 adapted to the laminating supporting sheets 32 are further formed in the bottom of the metal heat conducting plate 1, and the 5 laminating supporting sheets 32 are clamped in the corresponding concave insertion grooves 12. Through a plurality of heat dissipation connection fins 31 and the laminating backing sheet 32 on the graphite alkene fin 30 in this embodiment, with metal heat-conducting plate 1 cooperation joint, can be convenient for carry out the joint to metal heat-conducting plate 1 fixed to overall structure's the installation of being convenient for is fixed, improves holistic stability from this. In addition, through the design that the heights of the attaching support sheet 32 and the heat dissipation connecting fins 31 are different, a certain space is reserved between the metal heat conduction plate 1 and the graphene heat dissipation sheet 30, ventilation is facilitated, heat conduction efficiency can be further improved, especially, complete heat dissipation guide rails can be reserved in a compact space, the heat can be dissipated outwards through the heat dissipation connecting fins 31 and the attaching support sheet 32, heat dissipation of the graphene heat dissipation sheet 30 to the outside is facilitated, and heat dissipation efficiency is greatly improved.
In order to further improve the heat dissipation efficiency, the heat dissipation cavity 300 of the fence in this embodiment is filled with a heat dissipation glue layer 301.
In order to improve the heat conduction efficiency between the metal heat conduction plate 1 and the graphene heat dissipation sheet 30, the top of the heat dissipation connecting fin 31 in this embodiment is bonded with a buffer heat conduction pad 310, the clamping positioning groove 11 is filled with a heat conduction glue layer 110, and the concave insertion groove 12 is provided with a silica gel heat conduction pad 120.
In order to facilitate installation and fixation, the two ends of the attaching support sheet 32 in the embodiment are integrally formed with the fixed connector 320, the fixed connector 320 is inserted with the connecting sleeve 4, the internal thread of the connecting sleeve 4 is connected with the clamping screw 5, and the clamping screw 5 can move up and down through rotation control.
In order to make the installation more stable when fixed, the bottom integrated into one piece of connecting sleeve 4 in this embodiment has spacing platform 40, and the top integrated into one piece of clamping screw 5 has T shape joint piece 50.
In order to improve the heat conduction efficiency and the overall matching stability, the heat dissipation connecting fin 31 and the graphene heat dissipation sheet 30 in the present embodiment are integrally formed by press molding.
The above-mentioned embodiments further explain in detail the technical problems, technical solutions and advantages solved by the present invention, and it should be understood that the above only is a specific embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. The utility model provides a graphite alkene heat abstractor for electronic device which characterized in that: the heat dissipation device comprises a metal heat conduction plate (1) and a heat dissipation mechanism (3), wherein a plurality of heat conduction contact blocks (2) are arranged at the top of the metal heat conduction plate (1), and the heat dissipation mechanism (3) is arranged at the bottom of the metal heat conduction plate (1);
the heat dissipation mechanism (3) comprises a graphene heat dissipation fin (30), a plurality of heat dissipation connecting fins (31) and a plurality of attaching support sheets (32), the heat dissipation connecting fins (31) are transversely arranged at the top of the graphene heat dissipation fin (30) at equal intervals, the attaching support sheets (32) are longitudinally arranged at the top of the graphene heat dissipation fin (30) at equal intervals and are inserted into the bottoms of the heat dissipation connecting fins (31), and the heights of the attaching support sheets (32) are lower than those of the heat dissipation connecting fins (31); a plurality of heat dissipation connecting fins (31) and a plurality of attaching support sheets (32) are crossed to form a plurality of fence heat dissipation cavities (300);
the heat radiation connecting fin structure is characterized in that a plurality of clamping positioning grooves (11) matched with heat radiation connecting fins (31) are formed in the bottom of the metal heat conducting plate (1), the heat radiation connecting fins (31) are clamped in the corresponding clamping positioning grooves (11), a plurality of concave insertion grooves (12) matched with the laminating supporting sheet (32) are formed in the bottom of the metal heat conducting plate (1), and the laminating supporting sheet (32) is clamped in the corresponding concave insertion grooves (12).
2. The graphene heat dissipation device for an electronic device according to claim 1, wherein: and a heat dissipation glue layer (301) is filled in the fence heat dissipation cavity (300).
3. The graphene heat dissipation device for an electronic device according to claim 1, wherein: the top of the heat dissipation connecting fin (31) is bonded with a buffering heat conducting pad (310), and a heat conducting glue layer (110) is filled in the clamping positioning groove (11).
4. The graphene heat dissipation device for an electronic device according to claim 1, wherein: and a silica gel heat conducting pad (120) is arranged in the concave insertion groove (12).
5. The graphene heat dissipation device for an electronic device according to claim 1, wherein: the two ends of the attaching support sheet (32) are integrally formed with fixed connectors (320), the fixed connectors (320) are connected with connecting sleeves (4) in an inserting mode, and clamping screws (5) are screwed in the connecting sleeves (4).
6. The graphene heat dissipation device for an electronic device according to claim 5, wherein: the bottom integrated into one piece of connecting sleeve (4) has spacing platform (40), the top integrated into one piece that presss from both sides tight screw rod (5) has T shape joint piece (50).
7. The graphene heat dissipation device for an electronic device according to claim 1, wherein: the heat dissipation connecting fins (31) and the graphene radiating fins (30) are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120400531.5U CN214257020U (en) | 2021-02-23 | 2021-02-23 | Graphene heat dissipation device for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120400531.5U CN214257020U (en) | 2021-02-23 | 2021-02-23 | Graphene heat dissipation device for electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214257020U true CN214257020U (en) | 2021-09-21 |
Family
ID=77727084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120400531.5U Active CN214257020U (en) | 2021-02-23 | 2021-02-23 | Graphene heat dissipation device for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214257020U (en) |
-
2021
- 2021-02-23 CN CN202120400531.5U patent/CN214257020U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240311 Address after: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Dragon totem Technology (Hefei) Co.,Ltd. Country or region after: China Address before: 213000 No. 26 Mingxin Middle Road, Hutang Town, Wujin District, Changzhou City, Jiangsu Province Patentee before: CHANGZHOU VOCATIONAL INSTITUTE OF MECHATRONIC TECHNOLOGY Country or region before: China |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240327 Address after: No. 662 Yue'ai East Street, Xishangbi Village, Development Zone, Congtai District, Handan City, Hebei Province, 056000 Patentee after: Wang Kun Country or region after: China Address before: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee before: Dragon totem Technology (Hefei) Co.,Ltd. Country or region before: China |
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| TR01 | Transfer of patent right |