CN212648228U

CN212648228U - Integrated circuit heat dissipation device

Info

Publication number: CN212648228U
Application number: CN202021407351.1U
Authority: CN
Inventors: 李宝; 耿凯昌; 李光奎
Original assignee: Jiangsu Weibang Electronic Co ltd
Current assignee: Jiangsu Weibang Electronic Co ltd
Priority date: 2020-07-17
Filing date: 2020-07-17
Publication date: 2021-03-02
Anticipated expiration: 2030-07-17

Abstract

The utility model discloses an integrated circuit heat abstractor in integrated circuit heat dissipation equipment field, including the mounting panel, fixed mounting has the heat conduction aluminium pig in the mounting panel, and the both sides that the mounting panel bottom is located the heat conduction aluminium pig all are provided with the cassette, and the joint has the integrated circuit body between two cassettes, and two cassette bottoms all are provided with the cardboard, and equal sliding connection has the limiting plate in two cassettes, and the equal fixed mounting in two limiting plate bottoms has the return pole, and two return pole bottoms all pass cassette fixed mounting on the cardboard, and the equal fixed mounting in two cassette tops has the connecting block, and equal fixed mounting has the slider on two connecting blocks, the beneficial effects of the utility model are that: this equipment utilizes the mode of joint, is convenient for install the dismantlement fast between this equipment and integrated circuit body, further improves the convenience of using, simultaneously because cassette and cardboard are all adjustable for this equipment can be installed with between polytype integrated circuit body, has further improved the suitability.

Description

Integrated circuit heat dissipation device

Technical Field

The utility model relates to an integrated circuit heat dissipation equipment field specifically is an integrated circuit heat abstractor.

Background

An integrated circuit is a miniature electronic device, and is often applied to some electronic devices, because the integrated circuit generates temperature when working, and the damage of the integrated circuit is easily influenced when the temperature is too high, a heat dissipation device for the integrated circuit is needed.

The existing integrated circuit heat dissipation device has a single structure, can only provide a heat dissipation effect, and often adopts a bolt fixing installation mode, so that the installation between the heat dissipation device and the integrated circuit is troublesome, and the heat dissipation device can only be installed between the integrated circuit boards of the adaptation, and has low applicability, therefore the utility model provides an integrated circuit heat dissipation device.

SUMMERY OF THE UTILITY MODEL

The utility model provides an integrated circuit heat abstractor for solve above-mentioned problem.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model relates to an integrated circuit heat dissipation device, which comprises a mounting plate, wherein a heat-conducting aluminum block is fixedly arranged in the mounting plate, the bottom of the mounting plate is positioned at two sides of the heat-conducting aluminum block and is provided with two clamping seats, an integrated circuit body is clamped between the two clamping seats, the bottom of the two clamping seats is provided with a clamping plate, the two clamping seats are internally provided with a limiting plate in a sliding way, the bottom of the two limiting plate is fixedly provided with a return rod, the bottom of the two return rod passes through the clamping seats and is fixedly arranged on the clamping plates, the top of the two clamping seats is fixedly provided with a connecting block, the two connecting blocks are fixedly provided with a sliding block, the sliding grooves are arranged in the mounting plate corresponding to the two sliding blocks, the sliding blocks are connected in the sliding grooves in a sliding way, one side of the two sliding blocks, which is far away from, be provided with the heating panel on the mounting panel, heating panel fixed mounting is on the heat conduction aluminium piece, the equal fixed mounting in both sides of heating panel has a plurality of mount pads, and is a plurality of equal fixed mounting has the support column on the mount pad, and is a plurality of other fixed mounting is equallyd divide on two fixing bases, two fixed mounting has radiator fan between the fixing base.

As a further aspect of the present invention: a plurality of the mount pad is the well style of calligraphy and distributes in the outside of heating panel, and it is even to distribute to make a plurality of support columns atress through the well style of calligraphy, and overall structure is more firm.

As a further aspect of the present invention: a plurality of radiating fins are fixedly mounted on the radiating plate, radiating area is increased through the radiating fins, and radiating effect is further improved.

As a further aspect of the present invention: radiator fan bottom fixed mounting has the protective cover, improves radiator fan's dustproof ability through the protective cover, avoids personnel's finger to touch carelessly simultaneously and causes danger, further improves the security.

As a further aspect of the present invention: the clamping seat and the clamping plate are arranged in an L shape, and the clamping seat and the clamping plate can clamp integrated circuits with different lengths and thicknesses in an uncertain mode through the L shape, so that the overall applicability is further improved.

As a further aspect of the present invention: the bottom of the heat-conducting aluminum block penetrates through the mounting plate to be abutted to the top of the integrated circuit body, and the heat-conducting aluminum block is attached to the surface of the integrated circuit body, so that the heat-conducting aluminum block is favorable for absorbing heat on the integrated circuit body.

Compared with the prior art, the beneficial effects of the utility model are that:

1. in the utility model, two clamping seats are respectively pulled towards the directions far away from each other, and then the two clamping seats are clamped on the two sides of the integrated circuit body, two clamping seats are loosened, two clamping springs return to drive two sliding blocks to approach each other, two sliding blocks drive two connecting blocks to approach each other, two connecting blocks drive two clamping seats to approach each other to form clamping fixation on the integrated circuit body, when the thickness of the integrated circuit body is larger than that of the clamping seats, two clamping plates are pulled downwards to be positioned at the bottom of the integrated circuit body, two clamping plates are loosened, two return springs return to drive two limiting plates to ascend in the clamping seats, two limiting plates drive two return rods to ascend, two return rods drive two clamping plates to ascend, the bottom of the integrated circuit body is limited and fixed, the equipment utilizes the clamping mode to facilitate the quick installation and disassembly between the equipment and the integrated circuit body, the convenience of use is further improved, and simultaneously, because the cassette and the cardboard are all adjustable, the equipment can be installed with various integrated circuit bodies, and the applicability is further improved.

2. The utility model discloses in, when integrated circuit body during operation produced the temperature, adsorb the heat on the integrated circuit body through the heat conduction aluminium pig, on transferring the heat to the heating panel again, utilize a plurality of fin to dispel the heat, radiator fan rotates simultaneously and bloies, dispels the heat to the fin, realizes dispelling the heat fast.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a cross-sectional view of the present invention;

fig. 3 is a schematic structural diagram of a in fig. 2 according to the present invention.

In the figure: 1. mounting a plate; 2. a heat conductive aluminum block; 3. an integrated circuit body; 4. clamping a plate; 5. connecting blocks; 6. a clamping spring; 7. a chute; 8. a mounting seat; 9. a support pillar; 10. a fixed seat; 11. a heat radiation fan; 12. a slider; 13. a protective cover; 14. a heat sink; 15. a heat dissipation plate; 16. a card holder; 17. a return lever; 18. a return spring; 19. and a limiting plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example (b): as shown in FIGS. 1-3, an integrated circuit heat dissipation device comprises a mounting plate 1, a heat-conducting aluminum block 2 is fixedly installed in the mounting plate 1, clamping seats 16 are respectively arranged at two sides of the heat-conducting aluminum block 2 at the bottom of the mounting plate 1, an integrated circuit body 3 is clamped between the two clamping seats 16, clamping plates 4 are respectively arranged at the bottoms of the two clamping seats 16, limiting plates 19 are respectively and slidably connected in the two clamping seats 16, return rods 17 are respectively and fixedly installed at the bottoms of the two limiting plates 19, the bottoms of the two return rods 17 are respectively and fixedly installed on the clamping plates 4 through the clamping seats 16, connecting blocks 5 are respectively and fixedly installed at the tops of the two clamping seats 16, sliders 12 are respectively and fixedly installed on the two connecting blocks 5, sliding grooves 7 are respectively arranged at positions corresponding to the two sliders 12 in the mounting plate 1, the sliders 12 are slidably connected in the sliding grooves 7, clamping springs 6 are respectively and fixedly installed at the sides of the two, be provided with heating panel 15 on the mounting panel 1, heating panel 15 fixed mounting is on heat conduction aluminium piece 2, and the equal fixed mounting in both sides of heating panel 15 has a plurality of mount pads 8, and equal fixed mounting has support column 9 on a plurality of mount pads 8, and a plurality of support columns 9 are equallyd divide and are do not fixed mounting on two fixing bases 10, and fixed mounting has radiator fan 11 between two fixing bases 10.

A plurality of mount pads 8 are the distribution of # -shaped in the outside of heating panel 15, and it is even to distribute to make a plurality of support columns 9 atress through # -shaped, and overall structure is more firm.

The plurality of heat radiating fins 14 are fixedly attached to the heat radiating plate 15, and the heat radiating area is increased by the plurality of heat radiating fins 14, thereby further improving the heat radiating effect.

Radiator fan 11 bottom fixed mounting has protective cover 13, improves radiator fan 11's dustproof ability through protective cover 13, avoids personnel's finger to touch carelessly simultaneously and causes danger, further improves the security.

The cassette 16 is L-shaped with the clamping plate 4, and the cassette 16 and the clamping plate 4 can clamp integrated circuits with different lengths and thicknesses through the L-shaped arrangement, so that the overall applicability is further improved.

The bottom of the heat-conducting aluminum block 2 penetrates through the mounting plate 1 to be abutted to the top of the integrated circuit body 3, and the heat-conducting aluminum block 2 is attached to the surface of the integrated circuit body 3, so that the heat-conducting aluminum block 2 is favorable for absorbing heat on the integrated circuit body 3.

Specifically, when the utility model is used, two clamping seats 16 are respectively pulled towards the direction away from each other, then the two clamping seats 16 are clamped on the two sides of the integrated circuit body 3, the two clamping seats 16 are loosened, the two clamping springs 6 return to drive the two sliders 12 to approach each other, the two sliders 12 drive the two connecting blocks 5 to approach each other, the two connecting blocks 5 drive the two clamping seats 16 to approach each other to clamp and fix the integrated circuit body 3, when the thickness of the integrated circuit body 3 is larger than that of the clamping seats 16, the two clamping plates 4 are pulled downwards to enable the two clamping plates 4 to be positioned at the bottom of the integrated circuit body 3, the two clamping plates 4 are loosened, the two return springs 18 return to drive the two limiting plates 19 to ascend in the clamping seats 16, the two limiting plates 19 drive the two return rods 17 to ascend, the two return rods 17 drive the two clamping plates 4 to limit and fix the bottom of the integrated circuit, the equipment is convenient to rapidly install and detach the equipment and the integrated circuit bodies 3 in a clamping mode, the use convenience is further improved, and meanwhile, the clamping seat 16 and the clamping plate 4 can be adjusted, so that the equipment can be installed between various types of integrated circuit bodies 3, and the applicability is further improved;

when integrated circuit body 3 during operation produced the temperature, adsorb the heat on the integrated circuit body 3 through heat conduction aluminium pig 2, on transferring the heat to heating panel 15 again, utilize a plurality of fin 14 to dispel the heat, radiator fan 11 rotates simultaneously and bloies, dispels the heat to fin 14, realizes dispelling the heat fast.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The integrated circuit heat dissipation device is characterized by comprising a mounting plate (1), wherein a heat-conducting aluminum block (2) is fixedly mounted in the mounting plate (1), clamping seats (16) are respectively arranged at two sides of the bottom of the mounting plate (1) which are positioned on the heat-conducting aluminum block (2), an integrated circuit body (3) is clamped between the two clamping seats (16), clamping plates (4) are respectively arranged at the bottoms of the two clamping seats (16), limiting plates (19) are respectively and slidably connected in the two clamping seats (16), return rods (17) are respectively and fixedly mounted at the bottoms of the two limiting plates (19), the bottoms of the two return rods (17) penetrate through the clamping seats (16) and are fixedly mounted on the clamping plates (4), connecting blocks (5) are respectively and fixedly mounted at the tops of the two clamping seats (16), sliders (12) are respectively and fixedly mounted on the two connecting blocks (5), sliding grooves (7) are respectively arranged in the mounting plate (1) corresponding to the, just slider (12) sliding connection is in spout (7), two slider (12) keep away from the equal fixed mounting in one side each other and have clamping spring (6), two clamping spring (6) keep away from each other the equal fixed mounting in one side each other in two spout (7) on the lateral wall of keeping away from each other, be provided with heating panel (15) on mounting panel (1), heating panel (15) fixed mounting is on heat conduction aluminium piece (2), the equal fixed mounting in both sides of heating panel (15) has a plurality of mount pads (8), and is a plurality of equal fixed mounting has support column (9) on mount pad (8), and is a plurality of support column (9) are equallyd divide and are do not fixed mounting on two fixing bases (10), two fixed mounting has radiator fan (11) between fixing base (10).

2. The heat sink for integrated circuits according to claim 1, wherein the plurality of mounting seats (8) are arranged in a matrix on the outside of the heat sink (15).

3. The heat sink for integrated circuits according to claim 1, wherein a plurality of heat sinks (14) are fixedly mounted on the heat sink (15).

4. The heat sink device as claimed in claim 1, wherein a protective cover (13) is fixedly mounted on the bottom of the heat dissipating fan (11).

5. The heat sink for integrated circuits according to claim 1, wherein the card holder (16) and the card board (4) are disposed in an L-shape.

6. The heat sink for integrated circuits according to claim 1, wherein the bottom of the thermally conductive aluminum block (2) is inserted through the mounting board (1) and abuts against the top of the integrated circuit body (3).