CN216526410U - Optical communication module - Google Patents
Optical communication module Download PDFInfo
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- CN216526410U CN216526410U CN202123176768.9U CN202123176768U CN216526410U CN 216526410 U CN216526410 U CN 216526410U CN 202123176768 U CN202123176768 U CN 202123176768U CN 216526410 U CN216526410 U CN 216526410U
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- laser
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- communication module
- pressing plate
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Abstract
The utility model relates to the technical field of optical communication, in particular to an optical communication module which comprises a base, a circuit board and a laser, wherein the circuit board and the laser are arranged on the upper part of the base; the optical communication module further includes: a pressing plate for pressing and fixing the laser, a first M1.2 screw and a second M1.2 screw; a base side plate is arranged on one side of the base close to the laser; the pressing plate is arranged at the upper part of the laser, and one side of the pressing plate is connected with the side plate of the base; one end of the first M1.2 screw penetrates through the other side of the pressing plate and the circuit board in sequence to be in threaded connection with the base; one end of the second M1.2 screw penetrates through the circuit board to be in threaded connection with the base. This optical communication module adopts the less first M1.2 screw of diameter and second M1.2 screw cooperation clamp plate fixed circuit board and laser instrument, under the prerequisite that guarantees that circuit board and laser instrument have better joint strength, can satisfy the miniaturized requirement of optical communication module.
Description
Technical Field
The utility model relates to the technical field of optical communication, in particular to an optical communication module.
Background
At present, the space requirement of the optical communication module is smaller and smaller, and the volume of the laser used in the optical communication module is also smaller and smaller. The laser in the traditional optical communication module adopts a design of fixing a plurality of M2 screws, and the requirement of miniaturization of the module can not be met because the occupied space of the M2 screw fixing part is too large.
Accordingly, the prior art is yet to be improved and developed.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to provide an optical communication module, which solves the problem of a large volume of an existing optical communication module caused by fixing a laser with an M2 screw.
The technical scheme adopted by the utility model for solving the technical problems is as follows: an optical communication module is provided, which comprises a base, a circuit board arranged on the upper part of the base and a laser; the optical communication module further includes: the pressing plate is used for pressing and fixing the laser, and the first M1.2 screw and the second M1.2 screw are used for pressing and fixing the laser; a base side plate is arranged on one side of the base, which is close to the laser; the pressing plate is arranged at the upper part of the laser, and one side of the pressing plate is connected with the side plate of the base; one end of the first M1.2 screw penetrates through the other side of the pressing plate and the circuit board in sequence to be in threaded connection with the base; one end of the second M1.2 screw penetrates through the circuit board to be in threaded connection with the base.
Further preferred embodiments of the present invention are: the pressing plate is detachably connected with the base side plate.
Further preferred embodiments of the present invention are: at least one clamping slot hole is formed in the upper portion of the base side plate, and the clamping slot holes are arranged in rows at intervals; the clamping groove bulges with the number corresponding to that of the clamping groove holes are arranged on one side of the pressing plate; the direction of the clamping groove bulge entering or leaving the clamping groove hole is vertical to the direction of the pressing plate pressing the laser.
Further preferred embodiments of the present invention are: the optical communication module further comprises a first adhesive connecting layer arranged at the position of the clamping groove hole and used for connecting the fixed clamping groove hole and the clamping groove protrusion.
Further preferred embodiments of the present invention are: the pressing plate also comprises a pressing plate side plate vertically arranged on the other side of the pressing plate and a screw lug vertically arranged on the pressing plate side plate; the pressing plate side plate is attached to the side face of the laser; the screw lug is parallel to the pressure plate; and the screw lug is provided with a through hole matched with the first M1.2 screw.
Further preferred embodiments of the present invention are: the optical communication module further comprises a second dispensing connecting layer arranged at the dispensing hole and used for connecting the pressing plate side plate and the laser.
Further preferred embodiments of the present invention are: and a glue layer for buffering is arranged at the lower part of the laser.
Further preferred embodiments of the present invention are: the glue layer is a heat-conducting glue layer.
Further preferred embodiments of the present invention are: and the upper part of the base is provided with a heat dissipation groove for heat dissipation of the circuit board and the laser.
Further preferred embodiments of the present invention are: and the middle part of the pressing plate is provided with a heat dissipation hole for heat dissipation of the laser.
The laser has the advantages that the circuit board can be fixed on the base through the first M1.2 screw and the second M1.2 screw, and the laser can be fixed on the base through the cooperation of the first M1.2 screw and the pressing plate; this optical communication module adopts the less first M1.2 screw of diameter and second M1.2 screw cooperation clamp plate fixed circuit board and laser instrument, under the prerequisite that guarantees that circuit board and laser instrument have better joint strength, can satisfy the miniaturized requirement of optical communication module.
Drawings
The utility model will be further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a first schematic structural diagram of an optical communication module according to the present invention;
fig. 2 is an exploded view of an optical communication module of the present invention;
fig. 3 is a schematic structural diagram of an optical communication module according to the present invention.
Detailed Description
The present invention provides an optical communication module, and in order to make the objects, technical solutions, and effects of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Referring to fig. 1 to 3 together, the optical communication module according to the preferred embodiment of the present invention includes a base 1, a circuit board 2 disposed on the upper portion of the base 1, and a laser 3, and further includes: a pressing plate 4 for pressing and fixing the laser 3, a first M1.2 screw 51 and a second M1.2 screw 52; a base side plate 11 is arranged on one side of the base 1 close to the laser 3; the pressing plate 4 is arranged at the upper part of the laser 3, and one side of the pressing plate is connected with the base side plate 11; one end of the first M1.2 screw 51 sequentially penetrates through the other side of the pressing plate 4 and the circuit board 2 and is in threaded connection with the base 1; one end of the second M1.2 screw 52 is threaded through the circuit board 2 and into the base 1.
The circuit board 2 can be fixed on the base 1 through the first M1.2 screw 51 and the second M1.2 screw 52, and the laser 1 can be fixed on the base 1 through the cooperation of the first M1.2 screw 51 and the pressing plate 4; this optical communication module adopts the less first M1.2 screw 51 of diameter and second M1.2 screw 52 cooperation clamp plate 4 fixed circuit board 2 and laser instrument 3, under the prerequisite that guarantees that circuit board 2 and laser instrument 1 have better joint strength, can satisfy the miniaturized requirement of optical communication module.
Wherein, the M1.2 screw is a screw with a nominal diameter of 1.2 mm; the laser 3 is electrically connected with the circuit board through a high-density pin, and the laser 3 is a micro laser. The size of the optical module produced by adopting the structure of the optical communication module can reach 25.1mm multiplied by 15.7mm multiplied by 6.9mm, and the miniaturization effect of the product is better.
Referring to fig. 1 and 2, the pressing plate 4 is detachably connected to the base side plate 11. Wherein, set up clamp plate 4 to be connected with base curb plate 11 is detachable, when carrying out the installation of laser instrument 3 and circuit board 2, can unpack clamp plate 4 apart earlier, make the installation of laser instrument 3 and circuit board 2 have sufficient space, can effectual reduction laser instrument 3 and circuit board 2's the installation degree of difficulty, reduction in production cost. In another embodiment, the pressing plate 4 may be directly fixed on the base side plate 11 and integrally formed with the base side plate 11, but the installation difficulty of the laser 3 and the circuit board 2 is higher than that of the pressing plate 4 which is detachable.
Referring to fig. 1 and 2, at least one slot hole 111 is formed in the upper portion of the base side plate 11, and the slot holes 111 are arranged in rows at intervals; the clamping groove bulges 41 with the number corresponding to that of the clamping groove holes 111 are arranged on one side of the pressing plate 4; the direction in which the pocket projection 41 enters or leaves the pocket hole 111 is perpendicular to the direction in which the pressing plate 4 presses the laser 3. Through the cooperation of draw-in groove hole 111 and draw-in groove arch 41, can realize the joint of base curb plate 11 and clamp plate 4, then through behind the first M1.2 screw 51 fixed clamp plate 4 other end, can fix clamp plate 4 and realize compressing tightly laser instrument 1. The reaction force of the laser 1 on the pressing plate 4 is perpendicular to the direction in which the card slot protrusion 41 enters or leaves the card slot hole 111, so that the card slot protrusion 41 can be attached to the side wall of the card slot hole 111, the friction force is increased, the card slot protrusion 41 can be prevented from sliding away from the card slot hole 111, and the stability of the optical communication module is improved. In this embodiment, there are two card slot holes 111, and there are two card slot protrusions 41; the two sets of card slot holes 111 and card slot protrusions 41 are arranged in the optical communication module, so that the stability of the optical communication module can be further improved.
The optical communication module further includes a first adhesive connecting layer (not shown) disposed at the slot hole 111 for connecting the fixed slot hole 111 and the slot protrusion 41. The first adhesive connecting layer is added, so that the position between the clamping groove hole 111 and the clamping groove protrusion 41 can be fixed, the clamping groove protrusion 41 is prevented from being separated from the clamping groove hole 111, and the stability of the mounting structure of the pressing plate 4 is improved.
Referring to fig. 2 and 3, the pressing plate 4 further includes a pressing plate side plate 42 vertically disposed at the other side of the pressing plate 4, and a screw ear 43 disposed perpendicular to the pressing plate side plate 42; the pressure plate side plate 42 is attached to the side surface of the laser 3; the screw lug 43 is parallel to the pressure plate 4; the screw ear 43 is provided with a through hole 431 for matching with the first M1.2 screw 51. The pressing plate side plate 42 can be used for increasing the contact area of the pressing plate 4 and the laser 3, and the fixing effect of the pressing plate 4 on the laser 3 is further improved. Wherein the through hole 431 is used for matching with the first M1.2 screw 51 to fix the pressure plate 4 on the base 1.
Referring to fig. 2 and 3, the pressing plate side plate 42 is provided with at least one dispensing hole 421, and the optical communication module further includes a second dispensing connection layer (not shown) disposed at the dispensing hole 421 and used for connecting the pressing plate side plate 42 and the laser 3. In this embodiment, the two dispensing holes 421 are provided, and the relative positions of the pressing plate 4 and the laser 3 can be fixed by providing the dispensing holes and the second dispensing connection layer for connecting the pressing plate side plate 42 and the laser 3, so as to further improve the stability of laser fixation.
Referring to fig. 1 and 2, a buffer glue layer 6 for reducing friction and collision between the laser 3 and the base 1 is disposed below the laser 3. Through increasing buffer glue layer 6, can effectual reduction laser instrument 3 and base 1 between friction and the collision, guarantee laser instrument 3's normal use, improve laser instrument 3's life.
Wherein, the buffer glue layer 6 is a heat-conducting glue layer. Set up to heat-conducting adhesive layer through with buffer adhesive layer 6, can be used for the heat dissipation of laser instrument 3 during operation, prevent that laser instrument 3 from generating heat in the use and leading to the high temperature, guarantee laser instrument 3's work efficiency.
Referring to fig. 1 and 2, a heat dissipation groove 12 for dissipating heat of the circuit board 2 and the laser 3 is formed on the upper portion of the base 1. In this embodiment, the heat dissipation slot 12 is a groove with an upward opening, and a plurality of ventilation openings 121 facilitating air circulation in the heat dissipation slot 12 are further formed on the slot wall of the heat dissipation slot 12. The heat dissipation groove 12 is added for heat dissipation of the laser 3 and the circuit board 2, so that normal operation of the laser 3 and the circuit board 2 is guaranteed.
Further, referring to fig. 1 and 2, a heat dissipation hole 44 for dissipating heat of the laser 3 is formed in the middle of the pressing plate 4. In this embodiment, the heat dissipation hole 44 is a square hole and is disposed in the middle of the pressing plate 4. The heat dissipation hole 44 is formed, so that the heat dissipation of the laser 3 can be realized, the weight of the pressing plate 4 can be reduced, and the production cost can be reduced.
It should be understood that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same, and those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some technical features; and all such modifications and alterations are intended to fall within the scope of the appended claims.
Claims (10)
1. An optical communication module, includes base, sets up circuit board and the laser instrument on base upper portion, its characterized in that, optical communication module still includes: the pressing plate is used for pressing and fixing the laser, and the first M1.2 screw and the second M1.2 screw are used for pressing and fixing the laser; a base side plate is arranged on one side of the base, which is close to the laser; the pressing plate is arranged at the upper part of the laser, and one side of the pressing plate is connected with the side plate of the base; one end of the first M1.2 screw penetrates through the other side of the pressing plate and the circuit board in sequence and then is in threaded connection with the base; one end of the second M1.2 screw penetrates through the circuit board to be in threaded connection with the base.
2. The optical communication module of claim 1, wherein the pressure plate is detachably connected to the base side plate.
3. The optical communication module of claim 2, wherein the base side plate has at least one slot hole formed in an upper portion thereof, and the slot holes are spaced in rows; the clamping groove bulges with the number corresponding to that of the clamping groove holes are arranged on one side of the pressing plate; the direction of the clamping groove bulge entering or leaving the clamping groove hole is vertical to the direction of the pressing plate pressing the laser.
4. The optical communication module of claim 3, further comprising a first adhesive connecting layer disposed at the slot opening for connecting the slot opening and the slot protrusion.
5. The optical communication module as claimed in any one of claims 1 to 4, wherein the pressing plate further comprises a pressing plate side plate vertically disposed at the other side of the pressing plate, and a screw ear disposed vertically to the pressing plate side plate; the pressing plate side plate is attached to the side face of the laser; the screw lug is parallel to the pressure plate; and the screw lug is provided with a through hole matched with the first M1.2 screw.
6. The optical communication module of claim 5, wherein the pressing plate side plate is provided with at least one dispensing hole, and the optical communication module further comprises a second dispensing connection layer arranged at the dispensing hole and used for connecting the pressing plate side plate and the laser.
7. The optical communication module as claimed in any one of claims 1 to 4, wherein the lower portion of the laser is provided with a glue layer for buffering.
8. The optical communication module of claim 7, wherein the adhesive layer is a thermal conductive adhesive layer.
9. The optical communication module of any one of claims 1-4, wherein the upper portion of the base is provided with a heat sink for dissipating heat from the circuit board and dissipating heat from the laser.
10. The optical communication module of claim 9, wherein a heat dissipation hole is formed in the middle of the pressing plate for dissipating heat of the laser.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123176768.9U CN216526410U (en) | 2021-12-16 | 2021-12-16 | Optical communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123176768.9U CN216526410U (en) | 2021-12-16 | 2021-12-16 | Optical communication module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216526410U true CN216526410U (en) | 2022-05-13 |
Family
ID=81499475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123176768.9U Active CN216526410U (en) | 2021-12-16 | 2021-12-16 | Optical communication module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216526410U (en) |
-
2021
- 2021-12-16 CN CN202123176768.9U patent/CN216526410U/en active Active
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| GR01 | Patent grant | ||
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Address after: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Patentee after: Ona Technology (Shenzhen) Group Co.,Ltd. Address before: 518000 No. 35, Cuijing Road, Pingshan New District, Shenzhen, Guangdong Patentee before: O-NET COMMUNICATIONS (SHENZHEN) Ltd. |