CN114077125A - DMD packaging structure compresses tightly radiator unit and projection ray apparatus - Google Patents
DMD packaging structure compresses tightly radiator unit and projection ray apparatus Download PDFInfo
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- CN114077125A CN114077125A CN202110883126.8A CN202110883126A CN114077125A CN 114077125 A CN114077125 A CN 114077125A CN 202110883126 A CN202110883126 A CN 202110883126A CN 114077125 A CN114077125 A CN 114077125A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 238000003825 pressing Methods 0.000 claims abstract description 130
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 230000006835 compression Effects 0.000 claims abstract description 18
- 238000007906 compression Methods 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims abstract description 9
- 230000009471 action Effects 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 239000002470 thermal conductor Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
- G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a compression heat dissipation assembly of a DMD packaging structure and a projection optical machine, wherein the compression heat dissipation assembly is used for mounting the DMD packaging structure and a circuit board on a base body; the pressing heat dissipation assembly comprises a radiator and an elastic pressing piece, wherein a groove is formed in one surface of the radiator facing the DMD packaging structure and used for accommodating the elastic pressing piece and the circuit board; the middle part of the elastic pressing piece is an arched pressing part, two sides of the pressing part are respectively provided with a limiting groove, so that the elastic pressing piece is I-shaped, and the limiting grooves are used for being matched with guide posts arranged on the base body; in the installation state, the radiator is fixedly connected to the base body so as to generate pressure on the elastic pressing piece; the elastic pressing piece deforms along the specific direction defined by the matching of the limiting groove and the guide column under the action of pressure, so that the circuit board is pressed on the DMD packaging structure through the pressing part, and the DMD packaging structure is pressed on the base body. The invention has simple structure and good pressing effect.
Description
Technical Field
The invention relates to the technical field of DMD installation, in particular to a compression heat dissipation assembly of a DMD packaging structure and a projection optical machine.
Background
A Digital Light Processing (DLP) projection display system is one of the projection display systems that are currently in the mainstream.
The DLP projector reflects light according to an externally input signal through a Digital Micromirror Device (DMD), and for the DMD which is a commonly used LGA (Land Grid Array) packaging technology in the market at present, a printed circuit board needs to be tightly pressed and attached to a contact corresponding to a DMD packaging structure during installation. At present, a DMD pressing assembly with simple structure and good pressing effect is urgently needed to be provided.
Disclosure of Invention
Based on the above situation, a main object of the present invention is to provide a pressing heat dissipation assembly and a projector with a DMD package structure, which are convenient for manufacturing and processing and can provide an excellent pressing effect.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, the invention provides a compression heat dissipation assembly of a DMD package structure, for mounting the DMD package structure and a circuit board on a substrate; the pressing heat dissipation assembly comprises a heat radiator and an elastic pressing piece, and the heat radiator, the elastic pressing piece, the circuit board and the DMD packaging structure are sequentially arranged in an installation state;
a groove is formed in one surface, facing the DMD packaging structure, of the radiator, the groove is used for containing the elastic pressing piece and the circuit board, and the groove depth of the groove is smaller than the sum of the height of the elastic pressing piece in an uncompressed state and the height of the circuit board;
the middle part of the elastic pressing piece is an arched pressing part, two sides of the pressing part are respectively provided with a limiting groove, so that the elastic pressing piece is I-shaped, the pressing part is closer to the circuit board relative to the bottom of the elastic pressing piece, and the limiting grooves are used for being matched with guide posts arranged on the base body;
in the installation state, the radiator is fixedly connected to the base body so as to generate pressure on the elastic pressing piece; the elastic pressing piece deforms along a specific direction defined by the matching of the limiting groove and the guide post under the action of the pressure, so that the circuit board is pressed on the DMD packaging structure by the pressing part, and the DMD packaging structure is pressed on the base body.
Preferably, both sides of the pressing portion of the elastic pressing member include a connecting portion and a bottom plane portion, the bottom plane portion is in contact with the groove bottom surface of the groove, and the connecting portion is used for connecting the pressing portion with the bottom plane portion.
Preferably, the limiting groove is a notch, the notch includes a start end, the start end is located in the pressing portion, and the notch extends from the pressing portion to the tail end of the bottom plane portion through the connecting portion.
Preferably, the limiting groove is a kidney-shaped hole.
Preferably, the groove has a first set of groove walls and a second set of groove walls;
the first groove wall group comprises two first groove walls which are fixedly connected with the base body, and the two first groove walls are arranged at intervals;
the second groove wall group comprises two second groove walls, the two second groove walls are respectively positioned between the two first groove walls, and the two first groove walls and the two second groove walls are alternately connected end to end;
the distance between the wall top of the first groove wall and the groove bottom of the groove is a first wall height, the distance between the wall top of the second groove wall and the groove bottom of the groove is a second wall height, and the first wall height is larger than the second wall height.
Preferably, the inner wall of each second groove wall is step-shaped and comprises a first-stage step and a second-stage step, one surface, perpendicular to the groove bottom, of each step is a kick surface, and the distance between the kick surfaces of the two first-stage steps is smaller than the distance between the kick surfaces of the two second-stage steps.
Preferably, compress tightly radiator unit still includes the gluing limit layer in advance, the gluing limit layer in advance sets up on the tank bottom surface of recess, be used for right the elasticity compresses tightly the piece spacing in advance.
Preferably, the compressing heat dissipation assembly further includes a heat conduction member, and in an installation state, the heat conduction member is disposed on a side of the first slot wall group facing the substrate, and the heat conduction member can directly or indirectly contact with a heat dissipation surface of the DMD package structure.
Preferably, the compressing heat dissipation assembly further includes a heat conduction pad layer, the heat conduction pad layer includes a first portion and a second portion, in a mounted state, the first portion is in direct contact with the heat dissipation surface of the DMD package structure, and the second portion is in direct contact with the heat conduction member, so as to conduct heat from the DMD package structure to the heat conduction member.
Preferably, the radiator is provided with at least two through holes, the heat conducting piece is provided with a through hole at a position corresponding to the through hole of the radiator, the through hole and the through hole are opposite to the threaded hole on the base body in the mounting state, and the bolt sequentially penetrates through the through hole on the radiator, the through hole on the heat conducting piece and the threaded hole on the base body so as to fixedly connect the radiator and the heat conducting piece on the base body.
In a second aspect, the invention further provides a projection optical machine, which includes a DMD package structure, a circuit board, a substrate, and a compression heat dissipation assembly of the DMD package structure as described above; the locating grooves are formed in two side edges of the DMD packaging structure respectively, two guide columns which are perpendicular to the base body and extend outwards are arranged on the shell of the base body, and the guide columns are matched with the locating grooves to achieve locating of the DMD packaging structure.
Preferably, at least a partial area of the surface of the DMD package structure has a contact, and the pressing portion of the elastic pressing member corresponds to the position of the area where the contact is located.
Preferably, two openings are formed at corresponding positions of the circuit board, and the two guide posts penetrate through the two openings.
The invention provides a compression heat radiation component of a DMD packaging structure, which utilizes a radiator as one of compression structural elements of the DMD packaging structure, wherein one surface of the radiator is provided with a groove for accommodating an arched elastic compression piece and a circuit board and the depth of the groove is controlled to be smaller than the sum of the height of the elastic compression piece under the non-stressed state and the height of the circuit board. The invention has simple structure, convenient manufacture and good compression effect, and improves the production efficiency and the projection effect of the projection optical machine.
Other advantages of the present invention will be described in the detailed description, and those skilled in the art will understand the technical features and technical solutions presented in the description.
Drawings
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the figure:
fig. 1 is a schematic structural diagram illustrating an installation state of a preferred embodiment of a compression heat dissipation assembly provided in the present invention;
FIG. 2 is an exploded view of a preferred embodiment of a compression heat sink assembly provided by the present invention in an installed state;
fig. 3 is a schematic perspective view of a preferred embodiment of the elastic pressing member provided in the present invention;
FIG. 4 is a side view of a preferred embodiment of the resilient hold down member provided by the present invention;
fig. 5 is a schematic perspective view of a preferred embodiment of a heat sink provided by the present invention;
fig. 6 is a front view of a preferred embodiment of the heat sink provided by the present invention.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in order to avoid obscuring the nature of the present invention, well-known methods, procedures, and components have not been described in detail.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
In a first aspect, referring to fig. 1 and 2, the present invention provides a pressing heat sink assembly of a DMD package structure, for mounting the DMD package structure 400 and a circuit board 300 on a substrate 700; the pressing heat dissipation assembly comprises a heat radiator 100 and an elastic pressing piece 200, and in an installation state, the heat radiator 100, the elastic pressing piece 200, the circuit board 300 and the DMD packaging structure 400 are sequentially arranged;
a groove 110 is formed in a surface of the heat sink 100 facing the DMD package structure 400, the groove 110 is used for accommodating the elastic pressing member 200 and the circuit board 300, and a groove depth of the groove 110 is smaller than a sum of a height of the elastic pressing member 200 in an unstressed state and a height of the circuit board 300;
with reference to fig. 3 and 4, the middle of the elastic pressing member 200 is an arched pressing portion 210, and two sides of the pressing portion 210 are respectively provided with a limiting groove 220, so that the elastic pressing member 200 is shaped like an i, the pressing portion 210 is closer to the circuit board 300 relative to the bottom of the elastic pressing member 200, and the limiting groove 210 is used for matching with a guiding column 710 arranged on the base 700;
in the mounted state, the heat sink 100 is fixedly connected to the base 700 to generate a pressure on the elastic pressing member 200; the pressing force causes the elastic pressing member 200 to deform along a specific direction defined by the engagement of the limiting groove 220 and the guiding post 710, so that the pressing portion 210 presses the circuit board 300 onto the DMD package structure 400, and the DMD package structure 400 is pressed onto the substrate 700.
According to the compressing and heat dissipating assembly of the DMD packaging structure, the heat radiator 100 is used as one of compressing structural elements of the DMD packaging structure 400, the heat radiator 100 can also participate in compressing the DMD packaging structure 400 while radiating heat generated in the normal working process of the DMD packaging structure 400, the function reuse of the heat radiator 100 is realized, and the structure of the compressing and heat dissipating assembly is simplified.
The surface of the heat sink 100 facing the DMD package structure 400 is provided with a groove 110 to accommodate the bowed elastic pressing member 200 and the circuit board 300, and the depth of the groove 110 is controlled to be smaller than the sum of the height of the elastic pressing member 200 in an uncompressed state and the height of the circuit board 300, so that when the heat sink 100 is mounted on the base body 700, since a part (for example, a groove wall part) of the surface of the base body 700 usually contacts with the surface of the base body 100 directly at the surface of the heat sink 100 facing the DMD package structure 400, the distance between the heat sink 100 and the base body 700 is equal to the depth of the groove 110, the elastic pressing member 200 naturally receives pressure from the heat sink 100, the pressure forces the elastic pressing member 200 to deform, and the pressing part in the middle of the elastic pressing member 200 generates sufficient pressure on the circuit board 300, so that the circuit board 300 is pressed on the DMD package structure 400. Moreover, more elastic deformation space can be provided for the elastic pressing piece 200 by arranging the groove 110, the depth of the groove 110 is selected to be different specific values according to different models, so that the elastic pressing piece 200 can generate appropriate deformation according to the actual model requirements (the pressure provided by the elastic pressing piece 200 is within an allowable interval range, which is not too large to crush the DMD package structure 400, and is not too small to cause the contact of the circuit board 300 and the DMD package structure 400 to be tightly attached), and conversely, if the groove 110 is not arranged on the heat sink 100, the deformation of the elastic pressing piece 200, which is caused by the pressure, is not easy to control, and the appropriate deformation of the elastic pressing piece 200 cannot be ensured.
The elastic pressing member 200 is designed to be i-shaped, which includes both i-shaped and simple deformation of i-shaped, for example, left end points of upper and lower long sides of the i-shaped are respectively connected and right end points thereof are respectively connected (forming an inverted-rectangular shape), or only left end points of upper and lower long sides of the i-shaped are connected, or only right end points of upper and lower long sides of the i-shaped are connected. In this way, the middle of the elastic pressing member 200 forms the arched pressing portion 210, which is particularly suitable for the DMD package 400 in which the contact 410 is designed in the middle of one end surface of the DMD package 400. After the elastic pressing piece 200 is pressed, the arched pressing part 210 is opposite to the contact 410 in the middle of one end face of the DMD package structure 400, the arched pressing part 210 tightly presses the circuit board 300, and the circuit board 300 tightly presses the contact 410 of the DMD package structure 400, so that the contact between the circuit board 300 and the DMD package structure 400 is good, and the display effect and the display stability are improved.
The two sides of the pressing part 210 of the elastic pressing part 200 are provided with the limiting grooves 220, the two limiting grooves 220 can be matched with two guide posts 710 arranged on the base body and used for positioning the DMD packaging structure, and the guide posts 710 are inserted into the limiting grooves 220, so that when the elastic pressing part 200 is pressed and deformed, the elastic pressing part can only deform along a specific direction limited by the matching of the limiting grooves 220 and the guide posts 710, but cannot displace in other directions, and the limit of the elastic pressing part 200 is realized by the matching of the existing structure on the base body 700 and the specific shape structure of the elastic pressing part 200 through the function multiplexing of the guide posts 710 arranged on the base body 700, so that the contact 410 part of the DMD packaging structure 400 can still be pressed after the elastic pressing part deforms. The compressing and radiating assembly provided by the invention has the advantages of simple structure, convenience in manufacturing and good compressing effect.
Preferably, referring to fig. 3 and 4, both sides of the pressing portion 210 of the elastic pressing member 200 include a connection portion 230 and a bottom plane portion 240, the bottom plane portion 240 contacts with the groove bottom surface of the groove 110, and the connection portion 230 is used to connect the pressing portion 210 with the bottom plane portion 240.
The elastic pressing piece 200 can be manufactured by adopting various existing processes, and through the arrangement, the elastic pressing piece 200 is provided with the bottom plane part 240 which is in contact with the bottom surface of the groove and is connected with the middle part of the middle. In contrast, if the elastic pressing member 200 is not provided with the bottom flat portion 240, the deformation may be large during the punching process and is not easy to process.
Preferably, the limiting groove 220 is a gap, the gap includes a starting end 221, the starting end 221 is located at the compressing portion 210, and the gap extends from the compressing portion 210 to the end of the bottom plane portion 240 through the connecting portion 230. Alternatively, the limiting groove 220 is preferably a kidney-shaped hole (not shown).
The limiting groove 220 has a certain length, so that sufficient deformation space is provided for the elastic pressing piece 220, and the opening and the waist-shaped hole are convenient for providing sufficient deformation space for the elastic pressing piece.
Those skilled in the art can further understand that, the size and the initial position of the opening both have a certain influence on the pressure that can be provided by the elastic pressing member 200 after being pressed and deformed, and as for the initial position, the initial end of the opening is located at the pressing portion 210, so that the opening extends from the pressing portion 210 to the end of the bottom planar portion 240 through the connecting portion 230, which is convenient for the elastic pressing member 200 to provide a proper pressure after being pressed and deformed, and not only can the circuit board 300 be tightly attached to the contact of the DMD package structure 400, but also the DMD package structure 400 is not damaged by pressing.
Preferably, referring to fig. 5 and 6, the groove 110 has a first set of groove walls 111 and a second set of groove walls 112;
the first groove wall group 111 comprises two first groove walls fixedly connected with the substrate, and the two first groove walls are arranged at intervals;
the second slot wall group 112 comprises two second slot walls, the two second slot walls are respectively positioned between the two first slot walls, and the two first slot walls and the two second slot walls are alternately connected end to end;
the distance between the wall top of the first groove wall and the groove bottom 113 is a first wall height, the distance between the wall top of the second groove wall and the groove bottom 113 is a second wall height, and the first wall height is larger than the second wall height.
Through the above arrangement, both first groove walls of the first groove wall group 111 can directly contact with the base 700 for the fixed connection of the heat sink 100 and the base 700, and the second groove wall group 112 has a wall height lower than that of the first groove wall group 111, so that after the compression heat dissipation assembly is mounted on the base 700, the extending end of the circuit board 300 can extend out from the space between the second groove wall 112 and the base 700 to be connected with other working elements of the electronic device (such as a projection optical engine) where the base 700 is located, thereby realizing the normal operation of the electronic device. The wall height of the two second groove walls is smaller than that of the first groove wall group 111, so that the extending end of the circuit board can extend out from the space between any one second groove wall and the base body 700 according to actual use requirements, and the applicability is strong.
Preferably, the inner wall of each second groove wall is step-shaped and comprises a first step and a second step, one surface of each step, which is perpendicular to the groove bottom, is a kick surface, and the distance H1 between the kick surfaces of the two first steps is smaller than the distance H2 between the kick surfaces of the two second steps.
As suggested above, the pressing portion 210 of the resilient pressing member 200 desirably can correspond to the contact location 410 on the DMD package structure 400, which requires that the pressing portion 210 of the resilient pressing member 200 be accurately positioned. Through set up two-stage step in recess 110, can reduce the locating surface effectively for elasticity compresses tightly piece 200 only need for two-stage steps and two first cell walls limit for local bottom surface pinpoint can, the prepositioning of the elasticity of being convenient for compresses tightly piece 200 is accurate.
It will be appreciated by those skilled in the art that a slope transitioning from the second groove wall to the bottom of the groove may be used instead of the two-step, and the purpose of effectively reducing the locating surface may also be achieved.
Preferably, referring to fig. 2, the compressing heat dissipation assembly further includes an adhesive pre-limiting layer 800, and the adhesive pre-limiting layer 800 is disposed on the bottom surface of the groove and is used for pre-limiting the elastic compressing member 200.
Apply on the suitable position of groove tank bottom face through double faced adhesive tape or other gluing agents, make gluing limit layer 800 in advance, elasticity compresses tightly the bottom plane portion of piece 200 and is glued on this gluing limit layer 800 in advance, can compress tightly piece 200 spacing in advance to elasticity for elasticity compresses tightly piece 200 when the installation, and its portion 210 that compresses tightly is corresponding with DMD packaging structure 400's contact 410 position always. In the process of mounting the pre-limited elastic pressing member 200 on the base 700 along with the heat sink 100, the guiding post 710 on the base 700 first passes through the limiting groove 220 of the elastic pressing member 200, and then the first groove wall group 111 of the heat sink 100 is closer to the base 700, thereby starting to apply pressure to the elastic pressing member 200, in the process of the guiding post 710 passing through the limiting groove 220, the elastic pressing member 200 will not change position due to the adhesion effect of the adhesive pre-limiting layer 800, and after the elastic pressing member 200 is deformed by pressure, the adhesive effect of the adhesive pre-limiting layer 800 on the bottom plane portion 240 of the elastic pressing member 200 is not enough to resist the pressure applied to the elastic pressing member 200, the adhesive pre-limiting layer 800 is damaged, the elastic pressing member 200 is deformed by normal pressure, and at this time, due to the cooperation between the guiding post 710 on the base 700 and the limiting grooves 220 on both sides of the pressing portion 210 of the elastic pressing member 200, the elastic pressing member 200 can only deform in a specific direction, and the pressing portion 210 of the elastic pressing member 200 still corresponds to the position of the contact 410 of the DMD package structure 400.
Preferably, referring to fig. 2, the pressing heat dissipation assembly further includes a heat conduction member 500, in a mounted state, the heat conduction member 500 is disposed on a side of the first groove wall group 111 facing the base 700, and the heat conduction member 500 can directly or indirectly contact the heat dissipation surface 420 of the DMD package structure 400.
Through the setting of heat-conducting piece 500, can conduct the heat that produces in the normal course of working of DMD packaging structure 400 on radiator 100, then be going to the external world with heat conduction through radiator 100, prevent that DMD packaging structure 400 is overheated, lead to the projection effect to receive the influence. The heat-conducting member 500 is disposed on the side of the first groove wall group 111 facing the base 700, so that the heat sink 100 and the heat-conducting member 500 are fixed to the base 700 together.
Preferably, referring to fig. 2, the compressing and heat dissipating assembly further includes a heat conducting pad layer 600, and the heat conducting pad layer 600 includes a first portion and a second portion, in the mounted state, the first portion is in direct contact with the heat dissipating surface 420 of the DMD package structure 400, and the second portion is in direct contact with the heat conducting element 500, so as to conduct heat from the DMD package structure 400 to the heat conducting element 500.
For example, in a case where the DMD package structure 400 uses two side surfaces 420 at two sides of the end surface where the contact 410 is located as heat dissipation surfaces, the heat conduction pad layer 600 is disposed, the heat conduction pad layer 600 may be disposed around the two heat dissipation surfaces of the DMD package structure, and a portion directly contacting the DMD package structure is a first portion of the heat conduction pad layer (the heat conduction pad layer 600 and the heat dissipation surface 420 of the DMD package structure are shown in the figure for clarity, and there is a gap between the heat conduction pad layer 600 and the heat dissipation surface 420 of the DMD package structure, it can be understood by those skilled in the art that, in practical applications, there is no gap between the heat conduction pad layer and the heat dissipation surface 420 of the DMD package structure), the first portion firstly transfers heat from the DMD package structure 400 to a second portion of the heat conduction pad layer 600, because the second portion of the thermal pad layer 600 is in direct contact with the thermal conductor 500, heat 400 from the DMD package is conducted to the thermal conductor 500.
In the above case, the heat conductive member 500 may be formed to have the hollow portion 510 and the frame forming the hollow portion 510, the frame including two lateral side frames 530 and two longitudinal side frames 520, wherein the two lateral side frames 530 are in contact with the second portion of the heat conductive pad layer 600, and the two longitudinal side frames 520 are in contact with the first groove wall group 111 of the heat sink 100; thus, the heat generated by the DMD package structure 400 passes through the first portion of the thermal pad layer 600, the second portion of the thermal pad layer 600, the two lateral side frames 530 of the thermal conductive member 500, and the two longitudinal side frames 520 of the thermal conductive member 500 to reach the first groove wall group 111 of the heat sink 100, and is conducted to the outside.
Further, the lateral side frame 530 may further have a local gap 531 formed thereon, where the local gap 531 includes a start end and a tail end, and the start end is closer to the hollow portion 510 than the tail end.
Through the setting of local breach 531, can improve the plane degree of heat-conducting member 500, the contact of the radiator 100 of being convenient for and heat-conducting member 500 is level and smooth, strengthens heat transfer effect of heat-conducting member 500.
Preferably, referring to fig. 6, at least two through holes 120 are formed in the heat sink 100, the heat conducting member 500 is formed with a through hole 540 at a position corresponding to the through hole 120 of the heat sink 100, in an installation state, the through hole 120 and the through hole 540 are both opposite to a threaded hole 720 formed in the base 700, the bolt 900 sequentially passes through the through hole 120 of the heat sink 100, the through hole 540 of the heat conducting member 500 and the threaded hole 720 of the base 700 to fixedly connect the heat sink 100 and the heat conducting member 500 to the base 700, and a lower surface of a bolt head of the bolt 900 directly contacts with a surface of the heat sink 100.
By the above arrangement, the heat sink 100, the heat-conducting member 500, and the base 700 can be fixedly coupled with ease. By directly contacting the lower surface of the bolt head of the bolt 900 with the surface of the heat sink 100, sufficient pressure can be provided to the heat sink 100, so that the elastic pressing member 200 can reach a desired deformation amount, which is enough to tightly press the circuit board 300 against the DMD package structure.
Further, three through holes 120 are formed in the heat sink 100, correspondingly, three through holes 540 are formed in the heat conducting member 500, three threaded holes 720 are formed in the base 700, the heat sink 100, the heat conducting member 500 and the base 700 are fixedly connected by three bolts 900, and the connecting lines of the three bolts 900 form a triangle, so that the heat sink 100 can provide enough pressure for the elastic pressing member 200 through three-point locking, and the circuit board 300 cannot be in close contact with the contact of the DMD packaged by the LGA.
It will be understood by those skilled in the art that, in the case where the heat-conducting member 500 is not provided, the heat sink and the base are directly fixedly connected by the screw thread by forming the through hole 120 and the screw hole 720 on the base in the manner as described above, and the lower surface of the bolt head of the bolt 900 is in direct contact with the surface of the heat sink 100.
In a second aspect, referring to fig. 1 and 2, the invention provides a projection optical machine, including a DMD package structure 400, a circuit board 300, a base 700, and a compression heat dissipation assembly of the DMD package structure 400 as described above; locating grooves are respectively formed in two side edges of the DMD package structure 400, two guide columns 710 which are perpendicular to the base body 700 and extend outwards are arranged on the shell of the base body 700, and the guide columns 710 are matched with the locating grooves to locate the DMD package structure 400.
Preferably, at least a partial area of the surface of the DMD package structure 400 is provided with a contact 410, and the pressing portion 210 of the elastic pressing member 200 corresponds to a position of the area where the contact 410 is located.
Preferably, two openings 310 are formed at corresponding portions of the circuit board 300, and the two guide posts 710 pass through the two openings 310.
Through the above arrangement, the guide post 710 may pass through the circuit board 300 and then be inserted into the limiting groove 220 of the elastic pressing member 200, and cooperate with the limiting groove 220 to limit the elastic pressing member 200.
It will be appreciated by those skilled in the art that the above-described preferred embodiments may be freely combined, superimposed, without conflict.
It will be understood that the embodiments described above are illustrative only and not restrictive, and that various obvious and equivalent modifications and substitutions for details described herein may be made by those skilled in the art without departing from the basic principles of the invention.
Claims (13)
1. A compressing and heat-dissipating component of a DMD packaging structure is used for mounting the DMD packaging structure and a circuit board on a base body; the pressing heat dissipation assembly comprises a heat radiator and an elastic pressing piece, and the heat radiator, the elastic pressing piece, the circuit board and the DMD packaging structure are sequentially arranged in an installation state;
it is characterized in that the preparation method is characterized in that,
a groove is formed in one surface, facing the DMD packaging structure, of the radiator, the groove is used for containing the elastic pressing piece and the circuit board, and the groove depth of the groove is smaller than the sum of the height of the elastic pressing piece in an uncompressed state and the height of the circuit board;
the middle part of the elastic pressing piece is an arched pressing part, two sides of the pressing part are respectively provided with a limiting groove, so that the elastic pressing piece is I-shaped, the pressing part is closer to the circuit board relative to the bottom of the elastic pressing piece, and the limiting grooves are used for being matched with guide posts arranged on the base body;
in the installation state, the radiator is fixedly connected to the base body so as to generate pressure on the elastic pressing piece; the elastic pressing piece deforms along a specific direction defined by the matching of the limiting groove and the guide post under the action of the pressure, so that the circuit board is pressed on the DMD packaging structure by the pressing part, and the DMD packaging structure is pressed on the base body.
2. The hold-down heat dissipation assembly of claim 1, wherein each of the two sides of the hold-down portion of the elastic hold-down member includes a connecting portion and a bottom planar portion, the bottom planar portion contacts with the bottom surface of the groove, and the connecting portion is used for connecting the hold-down portion and the bottom planar portion.
3. The hold-down heat dissipation assembly of claim 2, wherein said retaining groove is a notch, said notch including a start end, said start end being located at said hold-down portion, said notch extending from said hold-down portion through said connecting portion to an end of said bottom planar portion.
4. The hold down heat dissipation assembly of claim 2, wherein the retaining groove is a kidney-shaped hole.
5. The compression heat sink assembly of any one of claims 1-4, wherein the recess has a first set of channel walls and a second set of channel walls;
the first groove wall group comprises two first groove walls which are fixedly connected with the base body, and the two first groove walls are arranged at intervals;
the second groove wall group comprises two second groove walls, the two second groove walls are respectively positioned between the two first groove walls, and the two first groove walls and the two second groove walls are alternately connected end to end;
the distance between the wall top of the first groove wall and the groove bottom of the groove is a first wall height, the distance between the wall top of the second groove wall and the groove bottom of the groove is a second wall height, and the first wall height is larger than the second wall height.
6. The hold-down heat sink assembly of claim 5, wherein the inner wall of each of said second channel walls is stepped, including a first step and a second step, wherein the surface of said step perpendicular to said channel bottom is a step, and wherein the distance between the step surfaces of the first step is less than the distance between the step surfaces of the second step.
7. The hold-down heatsink assembly of any one of claims 1-6, further comprising an adhesive pre-limiting layer disposed on a slot bottom surface of the groove for pre-limiting the elastic hold-down member.
8. The compression heat sink assembly of claim 5, further comprising a thermal conductor disposed on a side of the first set of channel walls facing the substrate in an installed state, the thermal conductor being capable of directly or indirectly contacting a heat-dissipating surface of the DMD package.
9. The compression heat sink assembly of claim 8, further comprising a thermally conductive pad layer, the thermally conductive pad layer comprising a first portion and a second portion, the first portion being in direct contact with the heat sink surface of the DMD package structure in the mounted state, the second portion being in direct contact with the thermally conductive element to conduct heat from the DMD package structure to the thermally conductive element.
10. The hold-down heat sink assembly as claimed in claim 7, wherein the heat sink has at least two through holes, the heat conducting member has through holes at positions corresponding to the through holes of the heat sink, the through holes and the through holes are opposite to the threaded holes of the base, and the bolts are inserted through the through holes of the heat sink, the through holes of the heat conducting member and the threaded holes of the base in order to fixedly connect the heat sink and the heat conducting member to the base.
11. A projection optical machine, comprising a DMD package, a circuit board, a substrate, and a compression heat sink assembly of the DMD package of any one of claims 1 to 10; the locating grooves are formed in two side edges of the DMD packaging structure respectively, two guide columns which are perpendicular to the base body and extend outwards are arranged on the shell of the base body, and the guide columns are matched with the locating grooves to achieve locating of the DMD packaging structure.
12. The optical projection engine of claim 11, wherein at least a portion of the surface of the DMD package structure has a contact, and the pressing portion of the elastic pressing member corresponds to a position of the contact.
13. The optical projection engine of claim 11, wherein two openings are defined in corresponding portions of the circuit board, and the two guide posts pass through the two openings.
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| CN202110883126.8A CN114077125B (en) | 2021-08-02 | 2021-08-02 | Compressing and radiating assembly of DMD packaging structure and projection optical machine |
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| CN114077125B CN114077125B (en) | 2024-04-19 |
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| CN114077125B (en) | 2024-04-19 |
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