CN114077125B - Compressing and radiating assembly of DMD packaging structure and projection optical machine - Google Patents
Compressing and radiating assembly of DMD packaging structure and projection optical machine Download PDFInfo
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- CN114077125B CN114077125B CN202110883126.8A CN202110883126A CN114077125B CN 114077125 B CN114077125 B CN 114077125B CN 202110883126 A CN202110883126 A CN 202110883126A CN 114077125 B CN114077125 B CN 114077125B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 230000003287 optical effect Effects 0.000 title claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 117
- 238000009434 installation Methods 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 230000006835 compression Effects 0.000 claims description 22
- 238000007906 compression Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 5
- 238000005056 compaction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 9
- 230000008569 process Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
- G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a compressing and radiating assembly of a DMD packaging structure and a projection optical machine, wherein the compressing and radiating assembly is used for installing the DMD packaging structure and a circuit board on a substrate; the compressing and radiating assembly comprises a radiator and an elastic compressing piece, a groove is formed in one surface of the radiator, facing the DMD packaging structure, and the groove is used for accommodating the elastic compressing piece and the circuit board; the middle part of the elastic pressing piece is an arched pressing part, and limit grooves are respectively formed in two sides of the pressing part, so that the elastic pressing piece is I-shaped, and the limit grooves are used for being matched with guide posts arranged on the base body; in the installation state, the radiator is fixedly connected to the base body so as to generate pressure on the elastic pressing piece; the elastic pressing piece deforms along the specific direction defined by the limit groove and the guide post in a matched mode by pressure, so that the pressing part presses the circuit board on the DMD packaging structure, and the DMD packaging structure is pressed on the base body. The invention has simple structure and good compacting effect.
Description
Technical Field
The invention relates to the technical field of DMD (digital micromirror device) installation, in particular to a compressing and radiating assembly of a DMD packaging structure and a projection optical machine.
Background
Digital Light Processing (DLP) projection display mode is one of the currently mainstream projection display modes.
The DLP projector reflects light according to an externally input signal through a digital micromirror device (Digital Micromirror Devices, DMD), and for the DMD of the LGA (LAND GRID ARRAY ) packaging technology commonly used in the current market, a printed circuit board needs to be tightly pressed against a contact corresponding to the DMD packaging structure during installation. At present, a DMD compression assembly with a simple structure and a good compression effect is needed to be proposed.
Disclosure of Invention
Based on the above-mentioned current situation, the main objective of the present invention is to provide a compression heat dissipation assembly and a projection optical machine of a DMD package structure, which are convenient to process and manufacture and can bring excellent compression effect.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
In a first aspect, the present invention provides a compression heat dissipation assembly of a DMD package structure, for mounting the DMD package structure and a circuit board to a substrate; the compressing and radiating assembly comprises a radiator and an elastic compressing piece, and in the installation state, the radiator, the elastic compressing piece, the circuit board and the DMD packaging structure are sequentially arranged;
A groove is formed in one surface of the radiator, facing the DMD packaging structure, and is used for accommodating the elastic pressing piece and the circuit board, and the depth of the groove is smaller than the sum of the height of the elastic pressing piece and the height of the circuit board in the state of not being under pressure;
the middle part of the elastic pressing piece is an arched pressing part, and limit grooves are respectively formed in two sides of the pressing part, so that the elastic pressing piece is I-shaped, the pressing part is closer to the circuit board relative to the bottom of the elastic pressing piece, and the limit grooves are used for being matched with guide posts arranged on the base body;
in the installation state, the radiator is fixedly connected to the base body so as to generate pressure on the elastic pressing piece; the elastic pressing piece deforms along a specific direction defined by the limit groove and the guide post in a matched mode, so that the pressing part presses the circuit board on the DMD packaging structure, and the DMD packaging structure is pressed on the base body.
Preferably, both sides of the pressing part of the elastic pressing part comprise a connecting part and a bottom plane part, the bottom plane part is contacted with the bottom surface of the groove, and the connecting part is used for connecting the pressing part with the bottom plane part.
Preferably, the limit groove is a notch, the notch includes a start end, the start end is located at the pressing portion, and the notch extends from the pressing portion to the end of the bottom plane portion through the connecting portion.
Preferably, the limiting groove is a waist-shaped hole.
Preferably, the groove has a first groove wall set and a second groove wall set;
the first groove wall group comprises two first groove walls which are fixedly connected with the base body, and the two first groove walls are arranged at intervals;
the second groove wall group comprises two second groove walls, the two second groove walls are respectively positioned between the two first groove walls, and the two first groove walls and the two second groove walls are alternately connected end to end;
The distance between the wall top of the first groove wall and the groove bottom of the groove is a first wall height, the distance between the wall top of the second groove wall and the groove bottom of the groove is a second wall height, and the first wall height is larger than the second wall height.
Preferably, the inner wall of each second groove wall is in a step shape and comprises a first-stage step and a second-stage step, one surface of the step perpendicular to the groove bottom is a kicking surface, and the distance between the kicking surfaces of the two first-stage steps is smaller than the distance between the kicking surfaces of the two second-stage steps.
Preferably, the compressing and radiating assembly further comprises an adhesive pre-limiting layer, wherein the adhesive pre-limiting layer is arranged on the bottom surface of the groove and used for pre-limiting the elastic compressing piece.
Preferably, the heat dissipation component further comprises a heat conducting member, and in the installation state, the heat conducting member is disposed on one side of the first groove wall set facing the substrate, and the heat conducting member can directly or indirectly contact with the heat dissipation surface of the DMD packaging structure.
Preferably, the heat dissipation assembly further includes a heat conduction pad layer, and the heat conduction pad layer includes a first portion and a second portion, and in a mounted state, the first portion is in direct contact with the heat dissipation surface of the DMD package structure, and the second portion is in direct contact with the heat conduction member, so as to conduct heat from the DMD package structure to the heat conduction member.
Preferably, the radiator is provided with at least two through holes, the heat conducting piece is provided with perforations at positions corresponding to the through holes of the radiator, in the installation state, the through holes and the perforations are opposite to the threaded holes formed in the base body, and the bolts sequentially penetrate through the through holes in the radiator, the perforations in the heat conducting piece and the threaded holes in the base body to fixedly connect the radiator and the heat conducting piece to the base body.
In a second aspect, the present invention further provides a projection optical engine, including a DMD package structure, a circuit board, a substrate, and a compression heat dissipation assembly of the DMD package structure as described above; the two sides of the DMD packaging structure are respectively provided with a positioning groove, the shell of the matrix is provided with two guide posts which are perpendicular to the matrix and extend outwards, and the guide posts are matched with the positioning grooves to position the DMD packaging structure.
Preferably, at least part of the surface of the DMD packaging structure is provided with a contact, and the pressing part of the elastic pressing piece corresponds to the position of the contact.
Preferably, two openings are formed in corresponding positions of the circuit board, and the two guide posts penetrate through the two openings.
According to the compressing and radiating assembly of the DMD packaging structure, the radiator is used as one of compressing structural elements of the DMD packaging structure, the arched elastic compressing element and the circuit board are accommodated in the groove on one side of the radiator, the groove depth is controlled to be smaller than the sum of the height of the elastic compressing element and the height of the circuit board in an unpressurized state, so that when the radiator is mounted on a base body, the radiator generates pressure on the arched I-shaped elastic compressing element, the elastic compressing element is forced to deform, and the compressing part in the middle of the elastic compressing element generates enough and proper pressure on the circuit board, so that the circuit board is compressed on the DMD packaging structure, and contacts corresponding to the circuit board and the DMD packaging structure are in tight contact. The invention has simple structure, convenient manufacture and good compacting effect, and improves the production efficiency and the projection effect of the projection optical machine.
Other advantages of the present invention will be set forth in the description of specific technical features and solutions, by which those skilled in the art should understand the advantages that the technical features and solutions bring.
Drawings
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the figure:
FIG. 1 is a schematic view of a mounting state structure of a preferred embodiment of a heat dissipation assembly according to the present invention;
FIG. 2 is an exploded view of a preferred embodiment of a compact heat sink assembly according to the present invention;
FIG. 3 is a schematic perspective view of a preferred embodiment of an elastic pressing member according to the present invention;
FIG. 4 is a side view of a preferred embodiment of the resilient compression member provided by the present invention;
fig. 5 is a schematic perspective view of a preferred embodiment of a heat sink according to the present invention;
fig. 6 is a front view of a preferred embodiment of the heat sink provided by the present invention.
Detailed Description
The present invention is described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in order to avoid obscuring the present invention, and in order to avoid obscuring the present invention, well-known methods, procedures, flows, and components are not presented in detail.
Moreover, those of ordinary skill in the art will appreciate that the drawings are provided herein for illustrative purposes and that the drawings are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, it is the meaning of "including but not limited to".
In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, in the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
Referring to fig. 1 and 2, in a first aspect, the present invention provides a compression heat dissipation assembly of a DMD package structure for mounting a DMD package structure 400 and a circuit board 300 to a substrate 700; the compression heat dissipation assembly comprises a heat sink 100 and an elastic compression member 200, and in the installation state, the heat sink 100, the elastic compression member 200, the circuit board 300 and the DMD package structure 400 are sequentially arranged;
A groove 110 is formed on a surface of the heat spreader 100 facing the DMD package structure 400, the groove 110 is used for accommodating the elastic pressing member 200 and the circuit board 300, and a groove depth of the groove 110 is smaller than a sum of a height of the elastic pressing member 200 under an unpressurized state and a height of the circuit board 300;
Referring to fig. 3 and 4, the middle part of the elastic pressing member 200 is an arched pressing part 210, two sides of the pressing part 210 are respectively provided with a limiting groove 220, so that the elastic pressing member 200 presents an i-shape, the pressing part 210 is closer to the circuit board 300 than the bottom of the elastic pressing member 200, and the limiting grooves 210 are used for being matched with the guide posts 710 arranged on the base 700;
In the installed state, the heat sink 100 is fixedly coupled to the base 700 to generate pressure to the elastic pressing member 200; the pressure deforms the elastic pressing member 200 along a specific direction defined by the limit groove 220 and the guide post 710, so that the pressing portion 210 presses the circuit board 300 against the DMD package structure 400, and the DMD package structure 400 is pressed against the base 700.
According to the compressing and radiating assembly of the DMD packaging structure, the radiator 100 is used as one of compressing structure elements of the DMD packaging structure 400, and the radiator 100 can also participate in compressing the DMD packaging structure 400 while radiating heat generated in the normal working process of the DMD packaging structure 400, so that the function multiplexing of the radiator 100 is realized, and the structure of the compressing and radiating assembly is simplified.
The side of the heat sink 100 facing the DMD package structure 400 is provided with the groove 110 to accommodate the arched elastic pressing member 200 and the circuit board 300, and the depth of the groove 110 is controlled to be smaller than the sum of the height of the elastic pressing member 200 in the non-stressed state and the height of the circuit board 300, so that when the heat sink 100 is mounted on the substrate 700, since a part (such as a groove wall part) of the side of the heat sink 100 facing the DMD package structure 400 is generally in direct contact with the surface of the substrate 700, the distance between the heat sink 100 and the substrate 700 is equal to the depth of the groove 110, the elastic pressing member 200 naturally receives the pressure from the heat sink 100, the pressure forces the elastic pressing member 200 to deform, and the pressing part in the middle of the elastic pressing member 200 generates enough pressure on the circuit board 300, so that the circuit board 300 is pressed on the DMD package structure 400. In addition, by providing the groove 110 to provide more elastic deformation space for the elastic pressing member 200, the groove depth of the groove 110 is selected to be different specific values according to different models, so that the elastic pressing member 200 generates a moderate deformation according to the actual model (the pressure provided by the elastic pressing member 200 is ensured to be within the allowable range, the DMD packaging structure 400 is not damaged too much, and the contact points of the circuit board 300 and the DMD packaging structure 400 cannot be tightly attached because of not being too small), conversely, if the groove 110 is not provided on the heat sink 100, the deformation of the elastic pressing member 200 cannot be controlled easily, and the moderate deformation of the elastic pressing member 200 cannot be ensured.
The elastic pressing member 200 is designed to be of an i-like shape, which includes an i-shape and also includes a simple deformation of the i-shape, such as connecting left end points of upper and lower long sides of the i-shape respectively and right end points of the upper and lower long sides respectively (forming an inverted-y shape), or connecting left end points of only the upper and lower long sides of the i-shape, or connecting right end points of only the upper and lower long sides of the i-shape. In this way, the middle portion of the elastic pressing member 200 forms the arched pressing portion 210, which is particularly suitable for the DMD package structure 400 in which the contact 410 is designed in the middle of one end surface of the DMD package structure 400. After the elastic pressing piece 200 is pressed, the arched pressing part 210 is opposite to the contact 410 in the middle of one end face of the DMD packaging structure 400, the arched pressing part 210 tightly presses the circuit board 300, and the circuit board 300 tightly presses the contact 410 of the DMD packaging structure 400, so that good contact between the circuit board 300 and the contact of the DMD packaging structure 400 is ensured, and the display effect and the display stability are improved.
Limiting grooves 220 are formed in two sides of the compressing part 210 of the elastic compressing element 200, the two limiting grooves 220 can be matched with two guide posts 710 arranged on the base body and used for positioning the DMD packaging structure, and the guide posts 710 are inserted into the limiting grooves 220, so that when the elastic compressing element 200 is deformed under pressure, the elastic compressing element can only deform along a specific direction defined by the matching of the limiting grooves 220 and the guide posts 710, but cannot displace in other directions, and the existing structure on the base body 700 and the specific shape and structure of the elastic compressing element 200 are matched to realize limiting of the elastic compressing element 200, so that the contact 410 of the DMD packaging structure 400 can still be pressed after the elastic compressing element 200 is deformed. The compressing and radiating assembly provided by the invention has the advantages of simple structure, convenience in manufacturing and good compressing effect.
Preferably, referring to fig. 3 and 4, both sides of the pressing portion 210 of the elastic pressing member 200 include a connection portion 230 and a bottom plane portion 240, the bottom plane portion 240 is in contact with the bottom surface of the groove 110, and the connection portion 230 is used to connect the pressing portion 210 with the bottom plane portion 240.
The elastic pressing member 200 can be manufactured by adopting various existing processes, and by arranging the above, besides the pressing portion 210 with the arched middle portion, the elastic pressing member 200 has a bottom plane portion 240 contacting with the bottom surface of the groove, and the pressing portion 210 and the bottom plane portion 240 are connected by a connecting portion 230, so that the elastic pressing member 200 can be manufactured by adopting a stamping mode, and the manufacturing efficiency of the elastic pressing member 200 is improved. In contrast, if the elastic pressing member 200 is not provided with the bottom planar portion 240, it may be deformed greatly during the pressing process, and it is not easy to process.
Preferably, the limit groove 220 is a notch, the notch includes a start end 221, the start end 221 is located at the pressing portion 210, and the notch extends from the pressing portion 210 to the end of the bottom plane portion 240 through the connecting portion 230. Or preferably, the limiting groove 220 is a waist-shaped hole (not shown in the figure).
The limiting groove 220 has a certain length, so that sufficient deformation space is provided for the elastic pressing member 220, and the notch and the waist-shaped hole are convenient for providing sufficient deformation space for the elastic pressing member.
It will be further appreciated by those skilled in the art that the size of the opening and the starting position of the opening all have a certain influence on the pressure that can be provided after the elastic pressing member 200 is deformed by compression, and regarding the starting position, the starting end of the opening is located at the pressing portion 210, so that the opening extends from the pressing portion 210 to the end of the bottom plane portion 240 all the way through the connecting portion 230, so that the elastic pressing member 200 can provide moderate pressure after being deformed by compression, and not only can the circuit board 300 and the contact of the DMD packaging structure 400 be guaranteed to be tightly attached, but also the DMD packaging structure 400 is not damaged by compression.
Preferably, referring to fig. 5 and 6, the groove 110 has a first groove wall set 111 and a second groove wall set 112;
the first groove wall group 111 includes two first groove walls fixedly connected to the base body, and two first groove walls are disposed at intervals;
The second groove wall group 112 includes two second groove walls, the two second groove walls are respectively located between the two first groove walls, and the two first groove walls and the two second groove walls are alternately connected end to end;
the distance between the wall top of the first groove wall and the groove bottom 113 is a first wall height, the distance between the wall top of the second groove wall and the groove bottom 113 is a second wall height, and the first wall height is larger than the second wall height.
Through the arrangement, both the two first groove walls of the first groove wall set 111 can be directly contacted with the base 700 for fixedly connecting the radiator 100 with the base 700, and the second groove wall set 112 is lower than the first groove wall set 111 in wall height, so that after the heat dissipation component is mounted on the base 700, the extending end of the circuit board 300 can extend out of the space between the second groove wall 112 and the base 700 to be connected with other working elements of the electronic device (such as a projection optical machine) where the base 700 is located, and normal operation of the electronic device is realized. The wall heights of the two second groove walls are smaller than the wall height of the first groove wall group 111, so that the extending end of the circuit board can extend from any position between the second groove wall and the base 700 according to actual use requirements, and the applicability is strong.
Preferably, the inner wall of each second groove wall is in a step shape, and comprises a first-stage step and a second-stage step, one surface of the step perpendicular to the groove bottom is a kicking surface, and the distance H1 between the kicking surfaces of the two first-stage steps is smaller than the distance H2 between the kicking surfaces of the two second-stage steps.
As suggested above, the pressing portion 210 of the elastic pressing member 200 is desirably able to correspond to the contact point position 410 on the DMD package structure 400, which requires accurate positioning of the pressing portion 210 of the elastic pressing member 200. By arranging two steps in the groove 110, the positioning surface can be effectively reduced, so that the elastic pressing piece 200 only needs to be accurately positioned relative to the local bottom surface defined by the two second steps and the two first groove walls, and the elastic pressing piece 200 can be accurately positioned conveniently.
It will be appreciated by those skilled in the art that a slope that transitions from the second groove wall to the bottom surface of the groove may be used instead of a two-stage step, as well as achieving an effective reduction in the locating surface.
Preferably, referring to fig. 2, the compression heat dissipation assembly further includes an adhesive pre-limiting layer 800, where the adhesive pre-limiting layer 800 is disposed on a bottom surface of the groove, and is used for pre-limiting the elastic compression member 200.
The adhesive pre-limiting layer 800 is manufactured by applying double-sided adhesive or other adhesives on the appropriate positions of the bottom surfaces of the grooves, and the bottom plane parts of the elastic pressing members 200 are adhered to the adhesive pre-limiting layer 800, so that the elastic pressing members 200 can be pre-limited, and the pressing parts 210 of the elastic pressing members 200 always correspond to the positions of the contacts 410 of the DMD packaging structure 400 when the mounting process is started. In the process of mounting the pre-limited elastic pressing member 200 onto the base 700 along with the heat sink 100, the guide post 710 on the base 700 passes through the limiting groove 220 of the elastic pressing member 200, then the first groove wall set 111 of the heat sink 100 is closer to the base 700, so as to start to apply pressure to the elastic pressing member 200, in the process that the guide post 710 passes through the limiting groove 220, the elastic pressing member 200 cannot change in position due to the adhesion of the adhesive pre-limiting layer 800, after the elastic pressing member 200 is deformed under pressure, the adhesion of the adhesive pre-limiting layer 800 to the bottom plane portion 240 of the elastic pressing member 200 is insufficient to resist the pressure applied to the elastic pressing member 200, the elastic pressing member 200 is damaged, and at this time, the elastic pressing member 200 is deformed under normal pressure, and only in a specific direction due to the cooperation of the guide post 710 on the base 700 and the limiting groove 220 on both sides of the pressing portion 210 of the elastic pressing member 200, the pressing portion 210 of the elastic pressing member 200 still corresponds to the contact point 410 of the DMD package structure 400.
Preferably, referring to fig. 2, the heat dissipation assembly further includes a heat conducting member 500, in a mounted state, the heat conducting member 500 is disposed on a side of the first groove wall set 111 facing the base 700, and the heat conducting member 500 can directly or indirectly contact with the heat dissipation surface 420 of the DMD package structure 400.
Through the setting of heat conduction spare 500, can be with the heat conduction that DMD packaging structure 400 normal operating process produced to radiator 100 on, then go outside with the heat conduction through radiator 100, prevent that DMD packaging structure 400 from overheated, lead to projection effect to receive the influence. The heat conducting member 500 is disposed on the side of the first groove wall set 111 facing the base 700, so that the heat sink 100 and the heat conducting member 500 are fixed together to the base 700.
Preferably, referring to fig. 2, the heat dissipation assembly further includes a heat conductive pad layer 600, and the heat conductive pad layer 600 includes a first portion and a second portion, wherein in a mounted state, the first portion is in direct contact with the heat dissipation surface 420 of the DMD package structure 400, and the second portion is in direct contact with the heat conductive member 500, so as to conduct heat from the DMD package structure 400 to the heat conductive member 500.
For example, in the case of the DMD package structure 400 having the two sides 420 located at both sides of the end surface where the contacts 410 are located as the heat dissipation surfaces, the heat conduction pad 600 is disposed, and the portion of the heat conduction pad 600 directly contacting the DMD package structure may be disposed around the two heat dissipation surfaces of the DMD package structure, that is, the first portion of the heat conduction pad (the boundary between the heat conduction pad 600 and the heat dissipation surface 420 of the DMD package structure is illustrated for clearly showing the boundary between the heat conduction pad 600 and the heat dissipation surface 420 of the DMD package structure, and a space is formed between the heat conduction pad 600 and the heat dissipation surface 420 of the DMD package structure, as those skilled in the art will understand that in practical application, the first portion transfers the heat from the DMD package structure 400 to the second portion of the heat conduction pad 600, because the second portion of the heat conduction pad 600 directly contacts the heat conduction member 500, the heat 400 from the DMD package structure is transferred to the heat conduction member 500.
In the above case, the heat conductive member 500 may be formed to have a hollow portion 510 and a rim forming the hollow portion 510, the rim including two lateral side rims 530 and two longitudinal side rims 520, wherein the two lateral side rims 530 are in contact with the second portion of the heat conductive pad layer 600 and the two longitudinal rims 520 are in contact with the first groove wall set 111 of the heat sink 100; in this way, the heat generated by the DMD package structure 400 reaches the first groove wall set 111 of the heat sink 100 through the first portion of the heat conducting pad layer 600, the second portion of the heat conducting pad layer 600, the two lateral side frames 530 of the heat conducting member 500, and the two longitudinal side frames 520 of the heat conducting member 500, and is conducted to the outside.
Further, the lateral side frame 530 may further be provided with a partial notch 531, where the partial notch 531 includes a start end and an end, and the start end is closer to the hollow portion 510 than the end.
Through the setting of local breach 531, can improve the planarization of heat conduction spare 500, the contact of radiator 100 and heat conduction spare 500 of being convenient for is leveled, strengthens the heat transfer effect of heat conduction spare 500.
Preferably, referring to fig. 6, at least two through holes 120 are formed in the heat sink 100, the heat conducting member 500 is provided with a through hole 540 at a position corresponding to the through hole 120 of the heat sink 100, in the installed state, the through hole 120 and the through hole 540 are opposite to a threaded hole 720 formed in the base 700, and a bolt 900 sequentially passes through the through hole 120 of the heat sink 100, the through hole 540 of the heat conducting member 500 and the threaded hole 720 of the base 700 to fixedly connect the heat sink 100 and the heat conducting member 500 to the base 700, and the lower surface of the bolt head of the bolt 900 is in direct contact with the surface of the heat sink 100.
By the above arrangement, the heat sink 100, the heat conductive member 500, and the base 700 can be conveniently and fixedly connected. By the direct contact of the lower surface of the bolt head of the bolt 900 with the surface of the heat sink 100, a sufficient pressure can be provided to the heat sink 100 so that the elastic pressing member 200 can reach a desired deformation amount sufficient to press the circuit board 300 tightly against the DMD package structure.
Further, three through holes 120 are formed on the heat sink 100, correspondingly, three through holes 540 are formed on the heat conducting member 500, three threaded holes 720 are formed on the base 700, the heat sink 100, the heat conducting member 500 and the base 700 are fixedly connected by using three bolts 900, the connecting wires of the three bolts 900 form a triangle, and the heat sink 100 can be ensured to provide enough pressure for the elastic pressing member 200 through three-point locking, so that the contacts of the circuit board 300 and the DMD packaged by the LGA cannot be tightly contacted.
It will be appreciated by those skilled in the art that, without the heat conducting member 500, the heat sink and the base may be directly and fixedly connected by forming the through hole 120 in the heat sink and the threaded hole 720 in the base, so that the lower surface of the bolt head of the bolt 900 is directly contacted with the surface of the heat sink 100.
In a second aspect, referring to fig. 1 and 2, the present invention provides a projection optical engine, including a DMD package structure 400, a circuit board 300, a substrate 700, and a compression heat dissipation assembly of the DMD package structure 400 as described above; the two sides of the DMD package structure 400 are respectively provided with a positioning groove, the outer shell of the base 700 is provided with two guide posts 710 which are perpendicular to the base 700 and extend outwards, and the guide posts 710 are matched with the positioning grooves to position the DMD package structure 400.
Preferably, at least a part of the surface of the DMD package structure 400 has a contact 410, and the pressing portion 210 of the elastic pressing member 200 corresponds to the area where the contact 410 is located.
Preferably, two openings 310 are formed at corresponding portions of the circuit board 300, and the two guide posts 710 pass through the two openings 310.
By the arrangement, the guide post 710 can be inserted into the limit groove 220 of the elastic pressing member 200 after passing through the circuit board 300, and is matched with the limit groove 220 to limit the elastic pressing member 200.
Those skilled in the art will appreciate that the above-described preferred embodiments can be freely combined and stacked without conflict.
It will be understood that the above-described embodiments are merely illustrative and not restrictive, and that all obvious or equivalent modifications and substitutions to the details given above may be made by those skilled in the art without departing from the underlying principles of the invention, are intended to be included within the scope of the appended claims.
Claims (12)
1. The compressing and radiating assembly of the DMD packaging structure is used for installing the DMD packaging structure and the circuit board on the base body; the compressing and radiating assembly comprises a radiator and an elastic compressing piece, and in the installation state, the radiator, the elastic compressing piece, the circuit board and the DMD packaging structure are sequentially arranged;
It is characterized in that the method comprises the steps of,
A groove is formed in one surface of the radiator, facing the DMD packaging structure, and is used for accommodating the elastic pressing piece and the circuit board, and the depth of the groove is smaller than the sum of the height of the elastic pressing piece and the height of the circuit board in the state of not being under pressure;
the middle part of the elastic pressing piece is an arched pressing part, and limit grooves are respectively formed in two sides of the pressing part, so that the elastic pressing piece is I-shaped, the pressing part is closer to the circuit board relative to the bottom of the elastic pressing piece, and the limit grooves are used for being matched with guide posts arranged on the base body;
In the installation state, the radiator is fixedly connected to the base body so as to generate pressure on the elastic pressing piece; the elastic pressing piece deforms along a specific direction defined by the limit groove and the guide post in a matched mode, so that the pressing part presses the circuit board on the DMD packaging structure, and the DMD packaging structure is pressed on the base body;
After the elastic pressing piece is pressed, the arched pressing part is opposite to the contact point in the middle of one end face of the DMD packaging structure;
the groove is provided with a first groove wall group; the first groove wall group comprises two first groove walls which are fixedly connected with the base body, and the two first groove walls are arranged at intervals;
the compaction heat dissipation assembly further comprises a heat conduction piece, the heat conduction piece is arranged on one side of the first groove wall group facing the base body in an installation state, and the heat conduction piece can be directly or indirectly contacted with a heat dissipation surface of the DMD packaging structure.
2. The heat sink assembly of claim 1, wherein the resilient compression member includes a connection portion and a bottom planar portion on each side of the compression portion, the bottom planar portion contacting the bottom surface of the recess, the connection portion being configured to connect the compression portion to the bottom planar portion.
3. The compact heat sink assembly of claim 2 wherein the limiting slot is a notch, the notch including a start end, the start end being located at the compact portion, the notch extending from the compact portion through the connecting portion to the end of the bottom planar portion.
4. The compact heat sink assembly of claim 2 wherein the limiting slot is a kidney-shaped aperture.
5. The compact heat sink assembly as recited in any one of claims 1-4 wherein said groove has a second groove wall set;
the second groove wall group comprises two second groove walls, the two second groove walls are respectively positioned between the two first groove walls, and the two first groove walls and the two second groove walls are alternately connected end to end;
The distance between the wall top of the first groove wall and the groove bottom of the groove is a first wall height, the distance between the wall top of the second groove wall and the groove bottom of the groove is a second wall height, and the first wall height is larger than the second wall height.
6. The compact heat sink assembly as recited in claim 5 wherein the inner wall of each of said second slot walls is stepped and includes a primary step and a secondary step, the side of said step perpendicular to said slot bottom being a kick, the distance between the kick of two primary steps being less than the distance between the kick of two secondary steps.
7. The compression heat sink assembly of any one of claims 1-6, further comprising an adhesive pre-stop layer disposed on a bottom surface of the recess for pre-stopping the resilient compression member.
8. The compact heat sink assembly of claim 1 further comprising a thermally conductive pad layer comprising a first portion in direct contact with the heat dissipating surface of the DMD package structure and a second portion in direct contact with the thermally conductive member to conduct heat from the DMD package structure to the thermally conductive member in an installed state.
9. The heat sink assembly of claim 7 wherein the heat sink has at least two through holes formed therein, the heat conductive member has a through hole formed therein at a location corresponding to the through hole of the heat sink, and in the installed state, the through hole and the through hole are opposite to the threaded hole formed in the base, and the bolts sequentially pass through the through hole of the heat sink, the through hole of the heat conductive member, and the threaded hole of the base to fixedly connect the heat sink and the heat conductive member to the base.
10. A projection optical machine, which is characterized by comprising a DMD packaging structure, a circuit board, a matrix and the compacting and radiating component of the DMD packaging structure as claimed in any one of claims 1-9; the two sides of the DMD packaging structure are respectively provided with a positioning groove, the shell of the matrix is provided with two guide posts which are perpendicular to the matrix and extend outwards, and the guide posts are matched with the positioning grooves to position the DMD packaging structure.
11. The projection light engine of claim 10, wherein at least a portion of the surface of the DMD package has contacts, and the pressing portion of the elastic pressing member corresponds to the location of the contact.
12. The projection light engine of claim 10, wherein two openings are formed in corresponding portions of the circuit board, and the two guide posts pass through the two openings.
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| CN202110883126.8A CN114077125B (en) | 2021-08-02 | 2021-08-02 | Compressing and radiating assembly of DMD packaging structure and projection optical machine |
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| CN202110883126.8A CN114077125B (en) | 2021-08-02 | 2021-08-02 | Compressing and radiating assembly of DMD packaging structure and projection optical machine |
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| CN114077125B true CN114077125B (en) | 2024-04-19 |
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| CN211293569U (en) * | 2019-11-25 | 2020-08-18 | 青岛海信激光显示股份有限公司 | Projection device and lens |
| CN112433423A (en) * | 2020-08-18 | 2021-03-02 | 深圳市安华光电技术有限公司 | DMD assembly and projection optical machine |
| CN114077126A (en) * | 2021-08-02 | 2022-02-22 | 深圳市安华光电技术有限公司 | Projection optical machine and projector |
| CN218158694U (en) * | 2021-08-02 | 2022-12-27 | 深圳市安华光电技术有限公司 | DMD packaging structure's radiator unit and projection ray apparatus |
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| CN2606906Y (en) * | 2003-03-21 | 2004-03-17 | 光宝科技股份有限公司 | Flexible assembled system and its mechanism used for optical projection device |
| US7139174B1 (en) * | 2003-10-29 | 2006-11-21 | Cisco Technology, Inc. | Techniques for attaching a heat sink assembly to a circuit board component |
| CN211293569U (en) * | 2019-11-25 | 2020-08-18 | 青岛海信激光显示股份有限公司 | Projection device and lens |
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