CN114077126A - Projection optical machine and projector - Google Patents
Projection optical machine and projector Download PDFInfo
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- CN114077126A CN114077126A CN202110883127.2A CN202110883127A CN114077126A CN 114077126 A CN114077126 A CN 114077126A CN 202110883127 A CN202110883127 A CN 202110883127A CN 114077126 A CN114077126 A CN 114077126A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 238000004806 packaging method and process Methods 0.000 claims abstract description 35
- 238000003825 pressing Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000000741 silica gel Substances 0.000 claims description 16
- 229910002027 silica gel Inorganic materials 0.000 claims description 16
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 239000000565 sealant Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
- G03B21/008—Projectors using an electronic spatial light modulator but not peculiar thereto using micromirror devices
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Projection Apparatus (AREA)
Abstract
The invention provides a projection optical machine and a projector, wherein the projection optical machine comprises a base body, a DMD packaging structure and a heat dissipation assembly, wherein the DMD packaging structure is arranged on the base body; the heat dissipation assembly comprises a radiator, a heat conduction layer and a heat transfer layer, wherein the radiator, the heat transfer layer and the heat conduction layer are sequentially arranged; the heat conducting layer comprises a first portion and a second portion, the first portion is in contact with the heat dissipation surface of the DMD packaging structure, and the second portion is in contact with the heat conducting layer so as to conduct heat from the DMD packaging structure to the heat conducting layer; the heat transfer layer is provided with a hollow part and frames forming the hollow part, and the frames comprise two transverse side frames and two longitudinal side frames, wherein the two transverse side frames are in contact with the second part of the heat conduction layer; the radiator is provided with extension parts at two longitudinal sides, and the extension parts are in contact with two longitudinal side frames of the heat transfer layer. The invention has simple structure, strong applicability and good heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of DMD installation, in particular to a projection optical machine and a projector.
Background
Digital Light Processing (DLP) projection display has become one of the mainstream projection display methods at present.
DLP projecting apparatus passes through Digital micro mirror device (DMD) and reflects light with the signal according to external input, and the DMD packaging structure can make the temperature show to rise because light shines and self internal circuit generates heat at the course of the work, needs heat radiation structure to cooperate and realizes the heat dissipation, and the projection ray apparatus is because the internal work component is numerous, and heat radiation structure's setting still avoids influencing the normal cooperation between other working components. There is a need to provide a projection optical device with simple structure, strong applicability and good heat dissipation effect.
Disclosure of Invention
In view of the above situation, a primary object of the present invention is to provide a projection optical device and a projector, which have simple structures, are easy to manufacture, have high applicability, and have excellent heat dissipation effects.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, the invention provides a projection optical machine, which comprises a base body, a DMD package structure and a heat dissipation assembly, wherein the DMD package structure is mounted on the base body; the heat dissipation assembly includes a heat sink having a heat sink body,
the heat dissipation assembly further comprises a heat conduction layer and a heat transfer layer, and the radiator, the heat transfer layer and the heat conduction layer are sequentially arranged;
the heat conducting layer comprises a first portion and a second portion, the first portion is in contact with the heat dissipation surface of the DMD packaging structure, and the second portion is in contact with the heat conducting layer so as to conduct heat from the DMD packaging structure to the heat conducting layer;
the heat transfer layer is provided with a hollow part and frames forming the hollow part, and the frames comprise two transverse side frames and two longitudinal side frames, wherein the two transverse side frames are in contact with the second part of the heat conduction layer;
the radiator is provided with extension parts at two longitudinal sides, and the extension parts are in contact with two longitudinal side frames of the heat transfer layer.
Preferably, the thermally conductive layer is a flexible thermally conductive layer.
Preferably, the lateral side frame is provided with a local notch, the local notch includes a start end and a tail end, and the start end is closer to the hollow part than the tail end.
Preferably, the DMD package structure includes two heat dissipation surfaces, and the two heat dissipation surfaces are arranged at intervals; the heat-conducting layer is the heat-conducting pad that has the trompil inside, DMD packaging structure passes the trompil, two cooling surfaces contact respectively two terminal surfaces of trompil, the first part of heat-conducting layer includes two terminal surfaces.
Preferably, the projection optical machine further comprises an elastic metal pressing piece and a circuit board; the radiator, the elastic metal pressing piece, the circuit board and the heat transfer layer are sequentially arranged;
a groove is formed in one surface, facing the DMD packaging structure, of the radiator, the groove is used for containing the elastic metal pressing piece and the circuit board, and the groove depth of the groove is smaller than the sum of the height of the elastic metal pressing piece in an uncompressed state and the height of the circuit board;
the first fixing component fixedly connects the extension part of the heat sink with the base body to generate pressure on the elastic metal pressing part, so that the elastic metal pressing part presses the circuit board on the DMD packaging structure, and the DMD packaging structure is pressed on the base body.
Preferably, the optical projection engine further comprises a flexible silica gel piece and a circuit board; the radiator, the flexible silica gel piece, the circuit board and the heat transfer layer are sequentially arranged;
a groove is formed in one surface, facing the DMD packaging structure, of the radiator, the groove is used for containing the flexible silica gel piece and the circuit board, and the groove depth of the groove is smaller than the sum of the height of the flexible silica gel piece in an uncompressed state and the height of the circuit board; the second fixing component is used for fixedly connecting the heat radiator with the base body so as to generate pressure on the flexible silica gel piece, so that the flexible silica gel piece presses the circuit board on the DMD packaging structure, and the DMD packaging structure is pressed on the base body.
Preferably, the heat transfer layer comprises a first bent part and a second bent part, and the first bent part and the second bent part intersect;
the substrate comprises a first surface and a second surface, the second surface is adjacent to the first surface, the first bent portion is parallel to the first surface, and the second bent portion is parallel to the second surface.
Preferably, a sealant is disposed in a gap between the heat sink and the base body.
Preferably, a sealing pad layer is provided between the heat transfer layer and the circuit board.
In a second aspect, the invention further provides a projector including the light engine as described above.
In the optical projection machine and the projector provided by the invention, the heat transfer layer is a frame body, wherein two transverse side frames are in contact with the heat conduction layer, the heat conduction layer in close contact with the DMD packaging structure conducts heat to the two transverse side frames of the heat transfer layer, the two longitudinal side frames of the heat transfer layer are in contact with the radiator, and the heat from the DMD packaging structure, the heat conduction layer and the heat transfer layer is conducted to the radiator and then conducted to the outside by the radiator. The invention is suitable for various different types of projection light machines, has good heat dissipation effect, simple structure and convenient processing and manufacturing, does not increase the size of the light machine obviously due to the arrangement of the heat dissipation structure, and improves the production efficiency and the projection effect of the projection light machine.
Other advantages of the present invention will be described in the detailed description, and those skilled in the art will understand the technical features and technical solutions presented in the description.
Drawings
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the figure:
FIG. 1 is a schematic perspective view of a preferred embodiment of a projection optical machine according to the present invention;
FIG. 2 is an exploded view of a preferred embodiment of a projection light machine according to the present invention;
fig. 3 is a schematic perspective view of a substrate, a DMD package structure, a heat transfer layer and a heat transfer layer of a preferred embodiment of the projection optical device according to the present invention after being mounted;
fig. 4 is a schematic perspective view of a substrate, a DMD package structure and a heat conductive layer of a preferred embodiment of a projection optical device according to the present invention after being mounted;
FIG. 5 is a front view of a heat transfer layer in a preferred embodiment of a projection light engine provided in accordance with the present invention;
FIG. 6 is a schematic perspective view of a heat sink in a preferred embodiment of the projection optical system provided in the present invention;
FIG. 7 is an exploded view of another preferred embodiment of a projection light machine according to the present invention;
fig. 8 is a schematic perspective view of a substrate, a DMD package structure and a heat conducting layer of another preferred embodiment of the projection optical device according to the present invention after being mounted;
fig. 9 is a schematic perspective view of a heat transfer layer in a preferred embodiment of a projection optical machine according to the present invention.
Detailed Description
The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in order to avoid obscuring the nature of the present invention, well-known methods, procedures, and components have not been described in detail.
Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
In a first aspect, referring to fig. 1 to 4 and fig. 7 to 8, the invention provides a projection optical machine, including a substrate 500, a DMD package structure 400 and a heat dissipation assembly, where the DMD package structure 400 is mounted on the substrate 500; the heat dissipation assembly comprises a heat sink 100, a heat conduction layer 300 and a heat transfer layer 200, wherein the heat sink 100, the heat transfer layer 200 and the heat conduction layer 300 are sequentially arranged; the heat conducting layer 300 includes a first portion in contact with the heat dissipation surface 410 of the DMD package structure 400 and a second portion in contact with the heat transfer layer 200 to conduct heat from the DMD package structure 400 to the heat transfer layer 200; the heat transfer layer 200 has a hollow 210 and rims forming the hollow, the rims including two lateral side rims 220 and two longitudinal side rims 230, wherein the two lateral side rims 220 are in contact with the second portion of the heat conductive layer 300; the heat sink 100 has extensions 110 on both longitudinal sides, which are in contact with both longitudinal side rims of the heat transfer layer.
Generally, for a DMD package structure, it needs to be tightly fitted with a circuit board at another end surface (usually, the end surface where a contact or a connecting seat is located) opposite to the end surface installed on a substrate, so that the circuit board is tightly contacted with the contact of the DMD package structure or the male and female connecting seats are inserted to each other, so as to realize normal operation of the DMD package structure.
The projection optical machine provided by the invention does not need to arrange a protruding heat conduction boss on one surface of the radiator facing the base body, does not need to perform middle hollowing treatment on the circuit board, and conducts the heat of the DMD packaging structure 400 to the frame-shaped heat transfer layer 200 through the layered heat conduction layer 300 and then to the radiator 100.
Specifically, the heat conducting layer 300 includes two portions, a first portion and a second portion, the first portion directly contacts the heat dissipation surface 410 of the DMD package structure 400, the heat generated by the DMD package structure 400 is transferred to the first portion of the heat conducting layer 300 and then from the first portion to the second portion of the heat conducting layer 300, and the second portion directly contacts the heat conducting layer 200, so that the heat from the DMD package structure 400 is transferred from the heat conducting layer 300 to the heat conducting layer 200 (as will be understood by those skilled in the art, the first portion and the second portion do not necessarily have a definite physical boundary therebetween, and the heat conducting layer is distinguished from the first portion and the second portion by name, just to better illustrate the path of heat conduction).
The heat transfer layer 200 is a frame, wherein two lateral side frames 230 are in contact with the heat conduction layer 300, that is, after the heat from the DMD package structure 400 passes through the heat conduction layer 300, the heat reaches the two lateral side frames 230 of the heat transfer layer 200, and then the heat is conducted from the two lateral side frames 230 of the heat transfer layer 200 to the two longitudinal side frames 220, and the two longitudinal side frames 220 of the heat transfer layer 200 are in contact with the two extending portions 110 of the heat sink 100, and the heat conducted to the two extending portions 110 of the heat sink 100 is conducted to the main body portion of the heat sink 100 (see fig. 6), so that the heat from the DMD package structure 400, the heat conduction layer 300, and the heat transfer layer 200 is conducted to the heat sink 100 and then conducted from the heat sink 100 to the outside.
The heat transfer layer 200 may be a thin frame body, which is convenient to be directly mounted and fixed on the periphery of an end surface 510 of the substrate 500 for mounting the DMD package structure 400, wherein the hollow portion 210 is used to expose an end surface 420 where a contact or a connection seat of the DMD package structure 400 is located, so that the DMD package structure 400 can be tightly fitted with the circuit board 600; the heat conducting layer 300 can be pressed by the heat conducting layer 200 and pressed in an inner space 520 formed by the periphery of one end surface 510 of the substrate 500 for mounting the DMD package structure 400; the two extending portions 110 of the heat sink 100 may also be fixed on one end surface 510 of the base 500 for mounting the DMD package structure 400, so that the extending portions 110 of the heat sink 100, the longitudinal side frames 220 of the heat transfer layer 200 and the base 500 are sequentially fixed as a whole.
Therefore, the projection optical machine has simple structure and is convenient to process and manufacture; also can not show increase optical engine size because of heat radiation structure's setting, accord with the urgent demand to miniaturized optical engine on the existing market, and applicable in the projection ray apparatus model of multiple difference, also have good radiating effect, promoted the production efficiency and the projection effect of projection ray apparatus.
It will be understood by those skilled in the art that the four borders of the heat transfer layer 300 are described as "lateral side borders" and "longitudinal side borders", and that "lateral" and "longitudinal" do not refer to a specific direction on the substrate for the purpose of illustrating the relative positional relationship between the four borders.
Preferably, the thermally conductive layer 300 is a flexible thermally conductive layer.
By using a flexible heat conducting layer, such as heat conducting rubber, it is possible to ensure close contact between the heat conducting layer 300 and the non-flexible DMD package structure 400, and conversely, if a hard material is used to make the heat conducting layer, the heat conducting effect may be poor due to an inevitable gap between the hard heat conducting layer and the hard DMD package structure, and the heat from the DMD package structure may not be sufficiently conducted away.
Also, it is understood that the heat conductive layer 300 is made of a flexible material, and the close contact between the heat conductive layer 300 and the heat transfer layer 200 can be ensured, so that the heat of the heat conductive layer 300 is sufficiently transferred to the heat transfer layer 200. Still further, in order to ensure intimate contact between the heat conductive layer 300 and the heat transfer layer 200, a moderate excess of flexible material of the heat conductive layer 300 may be allowed, i.e. because the excessively thick heat conductive layer 300 causes the areas 231 of the two lateral side rims 230 of the heat transfer layer 200 in direct contact with the heat conductive layer to be slightly raised (rather than being purely planar).
Preferably, referring to fig. 5, the lateral side frame 230 is provided with a local notch 233, and the local notch 233 includes a start end and a tail end, and the start end is closer to the hollow portion 210 than the tail end.
By the arrangement of the local notch 233, the flatness of the heat transfer layer 200 can be improved, the heat sink 100 and the heat transfer layer 200 can be in smooth contact, and the heat transfer effect of the heat transfer layer 200 can be enhanced. Local notches 233 may be provided in areas 232 of the lateral side frames 230 that are not in direct contact with the thermally conductive layer.
Preferably, referring to fig. 2-4, the DMD package 400 includes two heat dissipation surfaces 410, and the two heat dissipation surfaces 410 are spaced apart from each other; the heat conducting layer is a heat conducting pad having an opening 310 therein, the DMD package structure 400 passes through the opening 310, the two heat dissipation surfaces 410 contact two end surfaces 311 of the opening 310, respectively, and the first portion of the heat conducting layer 300 includes the two end surfaces 311.
In the embodiment shown in fig. 2-4, the DMD package is packaged by LGA (Land Grid Array) technology, and the DMD package and the circuit board are tightly pressed and attached by using contacts, and the contacts of the DMD are located on an end surface of the DMD package facing away from the substrate, and then the DMD package can be set to include two heat dissipation surfaces 410 arranged at intervals (for example, the heat dissipation surfaces 410 are the upper surface and the lower surface of the DMD package, and the end surface where the contacts are located is located between the upper surface and the lower surface, and the upper surface is shown in the embodiment of fig. 2), so that the heat conduction layer 300 can be in close contact with the two heat dissipation surfaces 410 of the DMD package 400 (in fig. 3 and 4, in order to clearly show the boundary between the heat conduction layer 300 and the heat dissipation surface 410 of the DMD package, there is an interval between the heat conduction layer 300 and the heat dissipation surface 410 of the DMD package, those skilled in the art will appreciate that in practical applications, the thermal pad layer and the heat dissipation surface 410 of the DMD package structure are not spaced as described above), which is advantageous for ensuring good heat dissipation. The heat conduction layer 300 is arranged in the form of a heat conduction pad with an inner opening 310, and the heat conduction layer 300 which is in close contact with the two heat dissipation surfaces 410 of the DMD package structure 400 can be formed by one-step manufacturing, so that the heat conduction layer 300 is arranged around the DMD package structure 400, and the production and processing efficiency is improved; the internal opening 310 facilitates the DMD package structure 400 to pass through without affecting the close contact between the circuit board 600 and the mating portion of the DMD package structure 400.
Two thermally conductive subpad layers may also be used to form the thermally conductive layer 300, each covering a heat dissipating surface of the DMD package.
In addition, referring to the embodiment of fig. 7, in this embodiment, the DMD package and the circuit board are tightly fitted by inserting the male and female connector sockets, and the connector socket of the DMD package is located on an end surface 510 of the DMD package 400, which faces away from the substrate, at this time, an area on the periphery of the connector socket on the end surface may be a heat dissipation surface 410, that is, the heat dissipation surface 410 and the connector socket are located on the same end surface of the DMD package 400. At this time, the heat conduction layer 300 may be a heat conduction pad with an inner opening 310, the DMD package 400 passes through the opening 310, and the first portion of the heat conduction layer 300 includes the inner surface of the heat conduction layer 300 contacting the DMD package 400.
Preferably, referring to the embodiment shown in fig. 2, the optical projection engine further includes an elastic metal pressing member 700 and a circuit board 600; the heat sink 100, the elastic metal pressing member 700, the circuit board 600 and the heat transfer layer 200 are sequentially arranged; a groove 120 is formed in a surface of the heat sink 100 facing the DMD package structure 400, the groove 120 is used for accommodating the elastic metal pressing member 700 and the circuit board 600, and a groove depth of the groove 120 is smaller than a sum of a height of the elastic metal pressing member 700 under an unstressed state and a height of the circuit board 600; the first fixing component 130 fixedly connects the extension 110 of the heat sink 100 and the base 500 to generate a pressure on the elastic metal pressing member 700, so that the elastic metal pressing member 700 presses the circuit board 600 on the DMD package 400, and the DMD package 400 is pressed on the base 500.
For the DMD projection optical engine packaged by LGA technology, the heat sink 100 in the present invention can be used as one of the pressing structure elements of the DMD packaging structure 400 besides the heat dissipation function, that is, the heat sink 100 can also participate in pressing the DMD packaging structure 400 while dissipating heat generated during the normal working process of the DMD packaging structure 400, thereby realizing the function reuse of the heat sink 100 and simplifying the structure of the projection optical engine.
Specifically, when the heat sink is used as one of the pressing elements of the DMD packaged in the LGA, a groove 120 is opened on one surface of the heat sink 100 facing the DMD package structure 400 to accommodate the elastic pressing member 700 and the circuit board 600, and the depth of the groove 110 is controlled to be smaller than the sum of the height of the elastic pressing member 700 in the non-pressed state and the height of the circuit board 600, so that, when the heat sink 100 is mounted to the substrate 500 through the first fixing member 130, since a portion (e.g., a groove wall portion) of the side of the heat sink 100 facing the DMD package structure 400 is usually in direct contact with the surface of the substrate 500, so that the distance between the heat sink 100 and the base 500 is equal to the depth of the groove 120, the elastic pressing member 700 naturally receives a pressure from the heat sink 100, this pressure forces the elastic pressing member 700 to deform, and the elastic pressing member 700 thus generates sufficient pressure on the circuit board 600, so that the circuit board 600 is pressed against the DMD package structure 400.
The fixing member may be a bolt, and the first fixing assembly 130 may include three first fixing members, and the connection lines of the three fixing members form a triangle. By three-point locking, the heat sink 100 can be ensured to provide enough pressure to the elastic pressing member 700, so that the circuit board 600 and the contact of the DMD packaged by the LGA cannot be in close contact.
Preferably, referring to the embodiment shown in fig. 7, the optical projection engine further includes a flexible silicone piece and a circuit board; the radiator, the flexible silica gel piece, the circuit board and the heat transfer layer are sequentially arranged; a groove is formed in one surface, facing the DMD packaging structure, of the radiator, the groove is used for containing the flexible silica gel piece and the circuit board, and the groove depth of the groove is smaller than the sum of the height of the flexible silica gel piece in an uncompressed state and the height of the circuit board; the second fixing component is used for fixedly connecting the heat radiator with the base body so as to generate pressure on the flexible silica gel piece, so that the flexible silica gel piece presses the circuit board on the DMD packaging structure, and the DMD packaging structure is pressed on the base body.
For a projection optical machine adopting a DMD package structure with a male and female connector socket in a plugging fit, the heat sink 100 of the present invention can also be used as one of the pressing structural elements of the DMD package structure 400, except for the heat dissipation function.
Specifically, when the heat sink presses the DMD package structure and the circuit board in which the male and female connection sockets are inserted and matched, a groove 120 is formed on a surface of the heat sink 100 facing the DMD package structure 400 to accommodate the flexible silicone element 800 and the circuit board 600, and the depth of the groove 120 is controlled to be smaller than the sum of the height of the flexible silicone element 800 in an uncompressed state and the height of the circuit board 600, so that, when the heat sink 100 is mounted to the substrate 500 through the second fixing component, since a portion (e.g., a groove wall portion) of the side of the heat sink 100 facing the DMD package structure 400 is usually in direct contact with the surface of the substrate 500, so that the distance between the heat sink 100 and the substrate 500 is equal to the depth of the groove 120, the flexible silicone member 800 is naturally subject to pressure from the heat sink 100, this pressure forces the flexible silicone piece 800 to deform, and the flexible silicone piece 800 thereby generates sufficient pressure on the circuit board 600 such that the circuit board 600 is pressed against the DMD package structure 400.
The fixing members may be bolts, and the second fixing assembly 140 may include only two second fixing members. At the moment, the DMD packaging structure and the circuit board are in plug-in fit through the male and female connecting seats, so that the radiator is not required to provide large pressure, a three-point locking mode is not required, and moderate pressure can be provided for the radiator by adopting two-point locking.
Preferably, referring to the embodiment shown in fig. 7 and 9, the heat transfer layer 200 includes a first bend 240 and a second bend 250, and the first bend 240 and the second bend 250 intersect; the substrate 500 includes a first surface 510 and a second surface 520, the second surface 520 is adjacent to the first surface 510, the first bent portion 240 is parallel to the first surface 510, and the second bent portion 250 is parallel to the second surface 520.
The first surface 510 of the base 500 is a surface that can be used for mounting the DMD package structure, and the first bent portion 240 of the heat transfer layer 200 is mounted on the first surface 510 of the base 500, such that the first bent portion 240 is parallel to the first surface 510, where the first bent portion 510 includes the two lateral side frames 230 and the two longitudinal side frames 240; the second bent portion 250 forms an angle with the first bent portion 240, and covers the second surface 530 adjacent to the first surface 510 of the substrate 500, and the second bent portion 250 can ensure the strength of the entire heat transfer layer 200, so that the heat transfer layer 200 is not easily deformed.
Preferably, a sealant is disposed in a gap between the heat sink 100 and the base 500.
After the components such as the heat sink 100, the circuit board 600, and the DMD package structure 400 that are indispensable for the normal operation of the projection light machine are all mounted on the base 500, some gaps are inevitably present between the heat sink 100 and the base 500, if these gaps are normally present, during the transportation and use of the projection light machine, external dust and other impurities are easy to enter these gaps, which affects the normal operation of the high-precision components such as the DMD package structure 400 and the internal circuit of the projection light machine, and the gap between the heat sink 100 and the base 500 is filled with the sealant, which can reduce the occurrence of the aforementioned adverse effects.
Preferably, a sealing pad layer is disposed between the heat transfer layer 200 and the circuit board 600.
As described above, the heat transfer layer 200 includes the hollow portion 210, and the DMD package structure 400 passes through the hollow portion 210 such that the end surface 510 with the contact or the connection socket is in close contact with the circuit board 600, and when there is a gap between the heat transfer layer 200 and the circuit board 600, the gap can be filled by providing a gasket layer, preventing the entry of impurities. Further, the seal pad layer may be configured to be annular, and an inner ring of the seal pad layer is consistent with an outer contour of the DMD package structure 400.
In a second aspect, the invention provides a projector comprising the light engine as described above.
It will be appreciated by those skilled in the art that the above-described preferred embodiments may be freely combined, superimposed, without conflict.
It will be understood that the embodiments described above are illustrative only and not restrictive, and that various obvious and equivalent modifications and substitutions for details described herein may be made by those skilled in the art without departing from the basic principles of the invention.
Claims (10)
1. A projection optical machine comprises a base body, a DMD packaging structure and a heat dissipation assembly, wherein the DMD packaging structure is arranged on the base body; the heat dissipation assembly includes a heat sink having a heat sink body,
it is characterized in that the preparation method is characterized in that,
the heat dissipation assembly further comprises a heat conduction layer and a heat transfer layer, and the radiator, the heat transfer layer and the heat conduction layer are sequentially arranged;
the heat conducting layer comprises a first portion and a second portion, the first portion is in contact with the heat dissipation surface of the DMD packaging structure, and the second portion is in contact with the heat conducting layer so as to conduct heat from the DMD packaging structure to the heat conducting layer;
the heat transfer layer is provided with a hollow part and frames forming the hollow part, and the frames comprise two transverse side frames and two longitudinal side frames, wherein the two transverse side frames are in contact with the second part of the heat conduction layer;
the radiator is provided with extension parts at two longitudinal sides, and the extension parts are in contact with two longitudinal side frames of the heat transfer layer.
2. The light engine of claim 1, wherein the thermally conductive layer is a flexible thermally conductive layer.
3. The light projector as claimed in claim 1, wherein the lateral side frame has a local notch formed therein, the local notch including a start end and a tail end, the start end being closer to the hollow portion than the tail end.
4. The light engine of claim 1, wherein the DMD package structure comprises two heat dissipation surfaces, the two heat dissipation surfaces being spaced apart; the heat-conducting layer is the heat-conducting pad that has the trompil inside, DMD packaging structure passes the trompil, two cooling surfaces contact respectively two terminal surfaces of trompil, the first part of heat-conducting layer includes two terminal surfaces.
5. The light engine of any of claims 1-4, further comprising a resilient metal hold down and a circuit board; the radiator, the elastic metal pressing piece, the circuit board and the heat transfer layer are sequentially arranged;
a groove is formed in one surface, facing the DMD packaging structure, of the radiator, the groove is used for containing the elastic metal pressing piece and the circuit board, and the groove depth of the groove is smaller than the sum of the height of the elastic metal pressing piece in an uncompressed state and the height of the circuit board;
the first fixing component fixedly connects the extension part of the heat sink with the base body to generate pressure on the elastic metal pressing part, so that the elastic metal pressing part presses the circuit board on the DMD packaging structure, and the DMD packaging structure is pressed on the base body.
6. The light engine of any of claims 1-4, further comprising a flexible silicone and a circuit board; the radiator, the flexible silica gel piece, the circuit board and the heat transfer layer are sequentially arranged;
a groove is formed in one surface, facing the DMD packaging structure, of the radiator, the groove is used for containing the flexible silica gel piece and the circuit board, and the groove depth of the groove is smaller than the sum of the height of the flexible silica gel piece in an uncompressed state and the height of the circuit board; the second fixing component is used for fixedly connecting the heat radiator with the base body so as to generate pressure on the flexible silica gel piece, so that the flexible silica gel piece presses the circuit board on the DMD packaging structure, and the DMD packaging structure is pressed on the base body.
7. The light engine of claim 1, wherein the heat transfer layer comprises a first bend and a second bend, the first bend and the second bend intersecting;
the substrate comprises a first surface and a second surface, the second surface is adjacent to the first surface, the first bent portion is parallel to the first surface, and the second bent portion is parallel to the second surface.
8. The optical projection engine as claimed in claim 5 or 6, wherein a sealant is disposed in a gap between the heat sink and the substrate.
9. The light engine of claim 5 or 6, wherein a gasket layer is disposed between the heat transfer layer and the circuit board.
10. A projector comprising the light engine of any of claims 1-9.
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| CN202110883127.2A CN114077126B (en) | 2021-08-02 | 2021-08-02 | Projection ray apparatus and projecting apparatus |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110883127.2A CN114077126B (en) | 2021-08-02 | 2021-08-02 | Projection ray apparatus and projecting apparatus |
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| CN114077126B CN114077126B (en) | 2024-04-02 |
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| CN114077125A (en) * | 2021-08-02 | 2022-02-22 | 深圳市安华光电技术有限公司 | DMD packaging structure compresses tightly radiator unit and projection ray apparatus |
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| CN114077126B (en) | 2024-04-02 |
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Address after: 518067 3C, 3D, Block CD, Building 7, Xinghua Industrial Building, No. 4, Industrial 6th Road, Huaguoshan Community, Merchants Street, Nanshan District, Shenzhen, Guangdong Province Applicant after: Shenzhen Anhua Photoelectric Technology Co.,Ltd. Address before: 518055 floor 21, block a, building 8, Shenzhen International Innovation Valley, Dashi 1st Road, Nanshan District, Shenzhen, Guangdong Province; Third floor, blocks C and D, building 7, Xinghua Industrial Building, Gongye 6th Road, Nanshan District Applicant before: SHENZHEN ANHUA OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |
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