CN209517375U - A kind of DMD component and DLP projection arrangement - Google Patents
A kind of DMD component and DLP projection arrangement Download PDFInfo
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- CN209517375U CN209517375U CN201920530669.XU CN201920530669U CN209517375U CN 209517375 U CN209517375 U CN 209517375U CN 201920530669 U CN201920530669 U CN 201920530669U CN 209517375 U CN209517375 U CN 209517375U
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- dmd
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- conducting block
- conduction material
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Abstract
The utility model discloses a kind of DMD component and DLP projection arrangements, the DMD component includes DMD, interposer plate, pcb board and the radiator for being formed with heat-conducting block, the heat-conducting block passes through the pcb board, the hollow portion of interposer plate and the DMD pass through Heat Conduction Material thermal contact conductance, the heat-conducting block has the contact surface opposite with the DMD and is connected on multiple sides of the contact surface, the contact surface, the first corner cut is formed between side, and/or the second corner cut for extending to the contact surface is formed between the adjacent side, and/or the contact surface is formed with first groove, and/or the side is formed with the second groove for extending to the contact surface, and/or the contact surface is formed through inside the heat-conducting block, side Duct.The utility model DMD component setting above structure move back Heat Conduction Material being diffused with road, so as to avoid in the prior art because of the problem of the poor contact of contacts caused by Heat Conduction Material diffusion.
Description
Technical field
The utility model belongs to optics and projection art, and in particular to a kind of DMD component and DLP projection arrangement.
Background technique
DLP (Digtal Light Procession, digital light processing) projection arrangement because it is high with primary contrast,
Machine miniaturization, optical path use the features such as closed, and increasingly by the favor of user, DLP projection is usually with DMD
(Digtal Micromirror Device, Digital Micromirror Device) is used as image device, realizes perspective view by adjusting reflected light
Picture.
In existing DMD component 100, Heat Conduction Material 150(is provided between radiator 110, DMD120 for example, thermal conductive silicon
Rouge, heat-conducting cream, phase transformation, non-heat conduction with phase change patch etc.), for improving heat transfer efficiency, Heat Conduction Material 150 is also functioned to absolutely under partial picture
Edge effect, with reference to shown in Fig. 1, Fig. 2, the heat-conducting block 111 on radiator 110 is on pcb board 130, interposer plate 140
Hollow portion (131,141), and the preset clearance for smearing Heat Conduction Material 150 is formed between DMD120, by filling heat conduction material
Material 150 realizes thermal contact conductance.
Since pcb board 130, interposer plate 140, DMD120 are each other after assembling there is also certain gap,
And Heat Conduction Material 150 can overflow diffusion when being squeezed and heating around, when diffusing to pcb board 130, interposer plate
140, it when in DMD120 between adjacent devices, then easily leads between pcb board 130, interposer plate 140 or interposer plate
140, the poor contact of contacts between DMD120 then makes DMD120 job insecurity, or even the problem of damage.
Summary of the invention
The purpose of this utility model is to provide a kind of DMD components, to solve in existing DMD component because Heat Conduction Material is spread
The problem of caused poor contact of contacts.
In order to achieve the above objectives, the utility model is achieved using following technical scheme:
On the one hand, the utility model provides a kind of DMD component, including DMD, interposer plate, pcb board and formation
There is the radiator of heat-conducting block, the heat-conducting block, which passes through across the hollow portion of the pcb board, interposer plate with the DMD, leads
Hot material thermal contact conductance, the heat-conducting block have the contact surface opposite with the DMD and are connected on the multiple of the contact surface
Side, is formed between the first corner cut and/or the adjacent side to be formed between the contact surface, side and extends to described connect
Second corner cut of contacting surface.
On the other hand, the utility model offer additionally provides a kind of DMD component, including DMD, interposer plate, pcb board
And be formed with the radiator of heat-conducting block, the heat-conducting block pass through the pcb board, interposer plate hollow portion with it is described
By Heat Conduction Material thermal contact conductance, the heat-conducting block has the contact surface opposite with the DMD and is connected on described contact DMD
Multiple sides in face, the contact surface is formed with first groove and/or the side is formed with and extends to the of the contact surface
Two grooves.
In DMD component as described above, the first groove is in closed-loop shaped.
In DMD component as described above, the first groove extends to the side.
In DMD component as described above, the first groove, which has, intersects connected multistage.
In DMD component as described above, the first groove, second groove, which are intersected, to be connected.
In another aspect, the utility model additionally provides a kind of DMD component, including DMD, interposer plate, pcb board and
It is formed with the radiator of heat-conducting block, it is logical that the heat-conducting block passes through the pcb board, the hollow portion of interposer plate and the DMD
Heat Conduction Material thermal contact conductance is crossed, the heat-conducting block has the contact surface opposite with the DMD and is connected on the contact surface
Multiple sides are formed through the duct of the contact surface, side inside the heat-conducting block.
Based on DMD component as described above, the utility model additionally provides a kind of DLP projection arrangement comprising institute as above
The DMD component stated.
Compared with prior art, the advantages of the utility model and beneficial effect is:
The utility model on heat-conducting block by forming the first corner cut, the second corner cut, first groove, second groove, duct
In it is any for Heat Conduction Material diffusion structure, can between heat-conducting block, DMD Heat Conduction Material spread when realize effectively evacuation, keep away
Exempt from Heat Conduction Material nowhere the material returned when be pressed against between pcb board, interposer plate or the problem of between interposer plate, DMD,
Specifically, after smearing Heat Conduction Material between contact surface and DMD opposite with DMD on heat-conducting block, when Heat Conduction Material is by crowded
When pressure, heating, between opposite pcb board, interposer plate and the close clearance between interposer plate, DMD, heat conduction material
Expect to be easier to when spreading to contact surface surrounding to spread where towards the above-mentioned structure spread for Heat Conduction Material, i.e. Heat Conduction Material
There is space that can move back in diffusion, therefore caused by can effectively overcoming spillings of the existing technology because of Heat Conduction Material to spread
The problem of poor contact of contacts, to be advantageously implemented the permanent reliability service of DMD component.
After the detailed description of the utility model embodiment is read in conjunction with the figure, other features and advantages of the utility model
It will become clearer.
Detailed description of the invention
Fig. 1 is the decomposition diagram of part of devices in existing DMD component；
Fig. 2 is the cross-sectional view of part of devices in existing DMD component；
Fig. 3 is the structural schematic diagram of radiator in the utility model embodiment one；
Fig. 4 is the structural schematic diagram of radiator in the utility model embodiment two；
Fig. 5 is the structural schematic diagram of radiator in the utility model embodiment three；
Fig. 6 is the structural schematic diagram of radiator in the utility model embodiment four；
Fig. 7 is the structural schematic diagram of radiator in the utility model embodiment five；
Fig. 8 is the structural schematic diagram of radiator in the utility model embodiment six；
Fig. 9 is the structural schematic diagram of radiator in the utility model embodiment seven.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, below with reference to drawings and examples,
Invention is further described in detail.It should be noted that in the description of the present invention, term " first ", " second " are only used
In description purpose, it is not understood to indicate or imply relative importance.
Embodiment one
In order to solve existing DMD component after assembling, easily there is Heat Conduction Material towards between pcb board, interposer plate
And spread between interposer plate, DMD, so that leading to the problem of poor contact of contacts, present embodiments provide a kind of DMD
Component comprising pcb board, interposer plate, DMD and the radiator 200 for being formed with heat-conducting block, heat-conducting block pass through pcb board,
By Heat Conduction Material thermal contact conductance between the hollow portion and DMD of interposer plate, heat-conducting block is in rectangular parallelepiped structure, have with
DMD opposite contact surface 210 and four sides to connect with contact surface 210, are smeared between contact surface 210, DMD after assembling
The Heat Conduction Material of set amount, for smearing heat-conducting cream, in order to avoid heat-conducting cream from being pressed into PCB when heat-conducting cream is spread
Between plate, interposer plate and between interposer plate, DMD, the present embodiment is formed between contact surface 210, side
First corner cut, by the first corner cut avoid be pressurized diffusion heat-conducting cream, and using the first corner cut itself limit receiving it is thermally conductive
The appearance material space of cream, or using the first corner cut and pcb board, interposer plate hollow portion together with limit receiving heat-conducting cream
Appearance material space avoid heat-conducting cream by the receiving to part heat-conducting cream because nowhere spreading and be extruded into peripheral devices
At contact.
Wherein, the first corner cut can be formed in the chamfering (including rounded corner, bevelling) between contact surface 210, side,
The gap slot that can also be formed between contact surface 210, side, gap slot can be V-shaped groove, L-shaped groove or have multistage table top
Step-like recesses.Quantity, the size of first corner cut be not unique, can be according to the dosage of Heat Conduction Material, the shape structure of heat-conducting block
It makes to determine.
As shown in figure 3, the chamfering as the first corner cut is respectively formed in the present embodiment between four sides and contact surface 210
211。
Embodiment two
As shown in figure 4, the present embodiment and the difference of embodiment one are, two be oppositely arranged side and contact surface 210
Between be formed with chamfering 211.In order to shorten the stroke that Heat Conduction Material diffuses to chamfering 211, the present embodiment is formed by two
Angle 211 is particularly located at the both ends of 210 width direction of contact surface.
Embodiment three
In order to solve existing DMD component after assembling, easily there is Heat Conduction Material towards between pcb board, interposer plate
And spread between interposer plate, DMD, so that leading to the problem of poor contact of contacts, present embodiments provide a kind of DMD
Component comprising pcb board, interposer plate, DMD and the radiator 200 for being formed with heat-conducting block, heat-conducting block pass through pcb board,
By Heat Conduction Material thermal contact conductance between the hollow portion and DMD of interposer plate, heat-conducting block is in rectangular parallelepiped structure, have with
DMD opposite contact surface and four sides 220 to connect with contact surface, have smeared setting after assembling between contact surface, DMD
The Heat Conduction Material of amount, for smearing heat-conducting cream, in order to when heat-conducting cream is spread, avoid heat-conducting cream be pressed into pcb board,
Between interposer plate and between interposer plate, DMD, the present embodiment is formed with extension between adjacent side 220
To the second corner cut of contact surface, the heat-conducting cream for the diffusion that is pressurized is avoided by the second corner cut, and is limited using the second corner cut itself
Accommodate the appearance material space of heat-conducting cream out, or using the second corner cut and pcb board, interposer plate hollow portion together with limit
The appearance material space of receiving heat-conducting cream is avoided heat-conducting cream and is extruded into because nowhere spreading by the receiving to part heat-conducting cream
At the contact of peripheral devices.
Wherein, the second corner cut can be formed in the chamfering (including rounded corner, bevelling) between adjacent side 220,
The gap slot that can be formed between adjacent side 220, gap slot can be V-shaped groove, L-shaped groove or the step with multistage table top
Formula groove.Quantity, the size of second corner cut be not unique, can be determined according to the shape design of the dosage of Heat Conduction Material, heat-conducting block.
As shown in figure 5, the chamfering 221 as the second corner cut is each formed in the present embodiment between all adjacent sides 220.
Example IV
In order to solve existing DMD component after assembling, easily there is Heat Conduction Material towards between pcb board, interposer plate
And spread between interposer plate, DMD, so that leading to the problem of poor contact of contacts, present embodiments provide a kind of DMD
Component comprising pcb board, interposer plate, DMD and the radiator 200 for being formed with heat-conducting block, heat-conducting block pass through pcb board,
By Heat Conduction Material thermal contact conductance between the hollow portion and DMD of interposer plate, heat-conducting block is in rectangular parallelepiped structure, have with
DMD opposite contact surface 230 and four sides to connect with contact surface 230, are smeared between contact surface 230, DMD after assembling
The Heat Conduction Material of set amount, for smearing heat-conducting cream, in order to avoid heat-conducting cream from being pressed into PCB when heat-conducting cream is spread
Between plate, interposer plate and between interposer plate, DMD, the present embodiment is formed with the first ditch on contact surface 230
Slot 231, the opening of first groove 231 are conducive to comprehensively accommodate Heat Conduction Material towards Heat Conduction Material in Heat Conduction Material diffusion,
Its structure, shape and size can determine according to the dosage of Heat Conduction Material, limit receiving by the concave inward structure of itself and lead
The appearance material space of hot cream avoids heat-conducting cream and is extruded into device around because nowhere spreading by the receiving to part heat-conducting cream
At the contact of part.
As shown in fig. 6, the first groove 231 in the present embodiment on contact surface 230 is in closed-loop shaped, in contact surface 230 in length
When rectangular, first groove 231 is corresponding rectangular grooves, by the way that first groove 231 is evenly arranged on contact surface 230 relatively,
Be conducive to Heat Conduction Material quickly to diffuse in first groove 231.
Embodiment five
As shown in fig. 7, the difference of the present embodiment and example IV is, the first ditch on the contact surface 240 of heat-conducting block
Slot 241 is the strip groove for extending to side, and the Heat Conduction Material of the side of heat-conducting block is diffused to along first groove 241, moreover it is possible to after
It is continuous along pcb board, interposer plate hollow portion and side between be diffused because inserting the inserting gap reserved due to cooperation.For
First groove 241 is more evenly arranged on contact surface 240, the present embodiment is formed with two sections of first grooves 241, two section of first ditch
Slot 241 extends along the length direction of contact surface 240, width direction respectively, mutual between two sections of first grooves 241 in order to realize
Cooperation, it is ensured that Heat Conduction Material is uniformly dispersed in two sections of first grooves 241, and two sections of first grooves 241 are contacting in the present embodiment
The middle part in face 240, which intersects, to be connected.
Embodiment six
In order to solve existing DMD component after assembling, easily there is Heat Conduction Material towards between pcb board, interposer plate
And spread between interposer plate, DMD, so that leading to the problem of poor contact of contacts, present embodiments provide a kind of DMD
Component comprising pcb board, interposer plate, DMD and the radiator 200 for being formed with heat-conducting block, heat-conducting block pass through pcb board,
By Heat Conduction Material thermal contact conductance between the hollow portion and DMD of interposer plate, heat-conducting block is in rectangular parallelepiped structure, have with
DMD opposite contact surface and four sides 250 to connect with contact surface, have smeared setting after assembling between contact surface, DMD
The Heat Conduction Material of amount, for smearing heat-conducting cream, in order to when heat-conducting cream is spread, avoid heat-conducting cream be pressed into pcb board,
Between interposer plate and between interposer plate, DMD, the present embodiment is formed on side 250 extends to contact
The second groove 251 in face, second groove 251 opening towards between pcb board, the hollow portion of interposer plate and side 250 because
Inserting cooperates and reserved inserting gap, since it extends to contact surface, therefore still can provide expansion when Heat Conduction Material is spread
Channel is dissipated, specifically, the appearance material space of receiving heat-conducting cream is limited by the concave inward structure of itself, by thermally conductive to part
The receiving of cream, avoids at the contact that heat-conducting cream is extruded into peripheral devices because nowhere spreading.In addition, 251 shape of second groove
At on side 250, it can preferably be kept in contact the flatness in face while enough appearance material spaces are provided, be conducive to lead
The smearing of hot material, structure, shape and size can also determine according to the dosage of Heat Conduction Material.
As shown in figure 8, second groove 251 is the strip groove being formed on side 250 in the present embodiment, and contact surface is wide
Two sides 250 being oppositely arranged on degree direction are respectively formed with one section of strip groove.
Embodiment seven
In order to solve existing DMD component after assembling, easily there is Heat Conduction Material towards between pcb board, interposer plate
And spread between interposer plate, DMD, so that leading to the problem of poor contact of contacts, present embodiments provide a kind of DMD
Component comprising pcb board, interposer plate, DMD and the radiator 200 for being formed with heat-conducting block, heat-conducting block pass through pcb board,
By Heat Conduction Material thermal contact conductance between the hollow portion and DMD of interposer plate, heat-conducting block is in rectangular parallelepiped structure, have with
DMD opposite contact surface and four sides 260 to connect with contact surface, have smeared setting after assembling between contact surface, DMD
The Heat Conduction Material of amount, for smearing heat-conducting cream, in order to when heat-conducting cream is spread, avoid heat-conducting cream be pressed into pcb board,
Between interposer plate and between interposer plate, DMD, be formed through inside the present embodiment heat-conducting block contact surface with
And the duct 261 of a side 260, the diffusion as shown in figure 9, the diffusion admittance evacuation formed by duct 261, receiving are pressurized
Heat-conducting cream avoids the contact that heat-conducting cream is extruded into peripheral devices because nowhere spreading by the receiving to part heat-conducting cream
Place.Since duct 261 is formed in inside heat-conducting block, the present embodiment heat-conducting block also can preferably keep the smooth of heat-conducting block outer surface
Degree, and the Heat Conduction Material diffused in duct 261 can also accelerate the heat transfer between heat-conducting block, Heat Conduction Material.
In some embodiments, the first above-mentioned corner cut, the second corner cut, first groove, second groove and duct etc. are used
It can be formed on the same heat-conducting block of radiator according to actually required appearance material space in the structure of Heat Conduction Material diffusion, no
It is connected with can also intersect between structure to accelerate the diffusion of Heat Conduction Material, for example, first groove, second groove are in contact surface, side
Joint intersects connected or first groove and extends in the first corner cut formed between contact surface, side between face.
The utility model on heat-conducting block by processing the first above-mentioned corner cut, the second corner cut, first groove, the second ditch
Slot and duct etc. are used for the structure of Heat Conduction Material diffusion, when Heat Conduction Material is squeezed, heats and overflow diffusion around,
By the evacuation to Heat Conduction Material, the guidance to Heat Conduction Material flow direction is formed, enables the Heat Conduction Material material returned to above-mentioned
In structure itself or its appearance material space limited with pcb board, together with the hollow portion of interposer plate, Heat Conduction Material is avoided
Overflow hollow portion while, moreover it is possible to effectively avoid Heat Conduction Material be squeezed between pcb board, interposer plate or
In close clearance between interposer plate, DMD, to also overcome asking for the poor contact of contacts that thus may cause
Topic.
Structure design based on above-mentioned DMD component, the utility model additionally provide a kind of implementation of DLP projection arrangement
Example, may include the DMD component in any of the above-described embodiment.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (8)
1. a kind of DMD component, described thermally conductive including DMD, interposer plate, pcb board and the radiator for being formed with heat-conducting block
Block passes through the pcb board, the hollow portion of interposer plate and the DMD and passes through Heat Conduction Material thermal contact conductance, which is characterized in that
The heat-conducting block has the contact surface opposite with the DMD and is connected on multiple sides of the contact surface, the contact surface,
The second corner cut for being formed between the first corner cut and/or the adjacent side and extending to the contact surface is formed between side.
2. a kind of DMD component, described thermally conductive including DMD, interposer plate, pcb board and the radiator for being formed with heat-conducting block
Block passes through the pcb board, the hollow portion of interposer plate and the DMD and passes through Heat Conduction Material thermal contact conductance, which is characterized in that
The heat-conducting block has the contact surface opposite with the DMD and is connected on multiple sides of the contact surface, the contact surface
It is formed with first groove and/or the side is formed with the second groove for extending to the contact surface.
3. DMD component according to claim 2, which is characterized in that the first groove is in closed-loop shaped.
4. DMD component according to claim 2, which is characterized in that the first groove extends to the side.
5. DMD component according to claim 2, which is characterized in that the first groove, which has, intersects connected multistage.
6. DMD component according to claim 2, which is characterized in that the first groove, second groove, which are intersected, to be connected.
7. a kind of DMD component, described thermally conductive including DMD, interposer plate, pcb board and the radiator for being formed with heat-conducting block
Block passes through the pcb board, the hollow portion of interposer plate and the DMD and passes through Heat Conduction Material thermal contact conductance, which is characterized in that
The heat-conducting block has the contact surface opposite with the DMD and is connected on multiple sides of the contact surface, the heat-conducting block
Inside is formed through the duct of the contact surface, side.
8. a kind of DLP projection arrangement, which is characterized in that including DMD component described in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920530669.XU CN209517375U (en) | 2019-04-18 | 2019-04-18 | A kind of DMD component and DLP projection arrangement |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920530669.XU CN209517375U (en) | 2019-04-18 | 2019-04-18 | A kind of DMD component and DLP projection arrangement |
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| CN209517375U true CN209517375U (en) | 2019-10-18 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111474967A (en) * | 2020-04-29 | 2020-07-31 | 苏州东方克洛托光电技术有限公司 | Dynamic temperature control device for improving environmental adaptability of digital micromirror |
| CN114077124A (en) * | 2021-07-30 | 2022-02-22 | 深圳市安华光电技术有限公司 | Projection optical machine and projection device |
| CN114077126A (en) * | 2021-08-02 | 2022-02-22 | 深圳市安华光电技术有限公司 | Projection optical machine and projector |
-
2019
- 2019-04-18 CN CN201920530669.XU patent/CN209517375U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111474967A (en) * | 2020-04-29 | 2020-07-31 | 苏州东方克洛托光电技术有限公司 | Dynamic temperature control device for improving environmental adaptability of digital micromirror |
| CN114077124A (en) * | 2021-07-30 | 2022-02-22 | 深圳市安华光电技术有限公司 | Projection optical machine and projection device |
| CN114077124B (en) * | 2021-07-30 | 2024-04-19 | 深圳市安华光电技术股份有限公司 | Projection ray apparatus and projection device |
| CN114077126A (en) * | 2021-08-02 | 2022-02-22 | 深圳市安华光电技术有限公司 | Projection optical machine and projector |
| CN114077126B (en) * | 2021-08-02 | 2024-04-02 | 深圳市安华光电技术股份有限公司 | Projection ray apparatus and projecting apparatus |
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