CN209754226U - Heat preservation structure in reflow soldering - Google Patents
Heat preservation structure in reflow soldering Download PDFInfo
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- CN209754226U CN209754226U CN201920479616.XU CN201920479616U CN209754226U CN 209754226 U CN209754226 U CN 209754226U CN 201920479616 U CN201920479616 U CN 201920479616U CN 209754226 U CN209754226 U CN 209754226U
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- reflow soldering
- heat insulation
- insulation plate
- heat
- heated board
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Abstract
The utility model relates to a thermal insulation structure in reflow soldering comprises heated board and fixed column, the heated board set up in the both sides of the PCB direction of transfer of reflow soldering heating region, also be exactly with the both sides of the parallel preceding back wall of reflow soldering direction of transfer, by the fixed column will the heated board is fixed, the heated board is with the size phase-match of reflow soldering lateral wall. Has the advantages of reasonable structural design, less heat dissipation and more favorable temperature uniformity.
Description
Technical Field
The utility model relates to a thermal insulation structure among the reflow soldering, especially a reflow soldering lateral wall heat retaining structure.
Background
In the reflow soldering technique, stable control of temperature and uniformity of temperature are the objectives sought for reflow soldering. Therefore, the temperature mixing technology is a pursuit of technical development. However, reflow soldering is a semi-closed space, the upper part and the lower part of a heating working area are provided with a heating device and a heat preservation structure, the problems of the two positions are not considered or found in the prior art at the front side wall and the rear side wall, the heat loss is considered to be almost negligible, and certain technical prejudice exists. The prior art therefore poses certain problems with respect to temperature uniformity.
Disclosure of Invention
The utility model aims to solve the technical problem that a insulation construction in reflow soldering that structural design is reasonable, the heat scatters and disappears less, more is favorable to the temperature uniformity is provided.
The utility model provides a technical scheme that above-mentioned technical problem adopted is the insulation construction in this reflow soldering, and its structural feature is: the PCB reflow soldering device is characterized by comprising a heat insulation plate and fixing columns, wherein the heat insulation plate is arranged on two sides of a PCB conveying direction of a reflow soldering heating area, namely two sides of a front wall and a rear wall which are parallel to the reflow soldering conveying direction, the heat insulation plate is fixed by the fixing columns, and the heat insulation plate is matched with the reflow soldering side walls in size.
Further, heated board on detain heating device edge in reflow soldering and with heating device zonulae occludens.
Further, heated board and reflow soldering in heating device mutually perpendicular.
Further, the heated board on be provided with the guiding gutter.
Further, heated board and reflow soldering inside lateral wall between be provided with thermal-insulated clearance.
Further, fixed column fixed connection heated board and reflow soldering inside lateral wall.
Compared with the prior art, the utility model have following advantage and effect: because two lateral wall rigidity have set up the heated board around PCB board direction of transfer is parallel for the temperature loss at reflow soldering middle part reduces, lets the homogeneity of temperature better from this. And more energy-saving. Set up the guiding gutter on the heat preservation board, the guiding gutter can let heating device's heat faster upwards conduct, mixes the temperature more evenly, also is more fast.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the horizontal partial section structure of the present invention.
Fig. 2 is the structure schematic diagram of the heat-insulating board of the utility model.
Description of reference numerals: the heat-insulating board comprises a front heat-insulating board 1, a rear heat-insulating board 2, a front fixing column 3, a rear fixing column 4, a lower heating device 5 and a diversion trench 6.
Detailed Description
The present invention will be described in further detail with reference to the following examples, which are illustrative of the present invention and are not intended to limit the present invention.
Example 1: as shown in fig. 1 and 2, this embodiment describes a heat insulating structure in reflow soldering, taking the lower temperature region of reflow soldering as an example. The main body of the heating device is a front side heat insulation board 1 and a rear side heat insulation board 2 which are vertically arranged on two sides of a lower heating device 5 through a front side fixing column 3 and a rear side fixing column 4 respectively, the lower end of the heating device is fixed with the lower heating device 5, and the upper end of the heating device is fixed with an upper heating device. The sizes of the side heat-insulation plate 1 and the rear heat-insulation plate 2 are matched with the sizes of the reflow soldering side surfaces.
Still be provided with guiding gutter 6 on front side heated board 1, rear side heated board 2, take front side heated board 1 and lower heating device 5 as an example, will be down the heat of 5 side conduction of heating device and pass through guiding gutter 6 and upwards conduct fast to realize more quick thoughtlessly warm, also reduced the peripheral temperature overheat of heating device.
In actual use, the heat insulation plate is arranged on the side surface of the whole reflow soldering, so that the upper and lower temperature boxes form a relatively sealed cavity. So that the temperature of the whole backflow cavity is more uniform, and the heat loss is reduced. Since the heat loss of the side wall and the effect on the mixing temperature are difficult to test, the prior art generally considers it negligible. And adopt the technical scheme of the utility model afterwards, survey the back to relevant data and discover, the utility model discloses an effect is still bigger, all has 20% effect promotion about to thermal scattering and disappearing problem and the problem of mixing the temperature.
The utility model discloses in, there is thermal-insulated clearance between heated board and the reflow soldering lateral wall, further improved the heat preservation effect.
In addition, it should be noted that the specific embodiments described in the present specification may differ in the shape of the components, the names of the components, and the like. All equivalent or simple changes made according to the structure, characteristics and principle of the utility model are included in the protection scope of the utility model. Various modifications, additions and substitutions may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.
Claims (6)
1. The utility model provides an insulation construction in reflow soldering which characterized by: the PCB reflow soldering device is characterized by comprising a heat insulation plate and fixing columns, wherein the heat insulation plate is arranged on two sides of a PCB conveying direction of a reflow soldering heating area, the heat insulation plate is fixed by the fixing columns, and the heat insulation plate is matched with the reflow soldering side walls in size.
2. The heat insulating structure in reflow soldering according to claim 1, wherein: the heat insulation plate is buckled on the edge of a heating device in reflow soldering and is tightly connected with the heating device.
3. The heat insulating structure in reflow soldering according to claim 1, wherein: the heat insulation plate is perpendicular to a heating device in reflow soldering.
4. The heat insulating structure in reflow soldering according to claim 1, wherein: the heat insulation plate is provided with a diversion trench.
5. The heat insulating structure in reflow soldering according to claim 1, 2, 3 or 4, wherein: and a heat insulation gap is arranged between the heat insulation plate and the inner side wall of the reflow soldering.
6. The heat insulating structure in reflow soldering according to claim 5, wherein: the fixing column is fixedly connected with the heat insulation board and the inner side wall of the reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920479616.XU CN209754226U (en) | 2019-04-10 | 2019-04-10 | Heat preservation structure in reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920479616.XU CN209754226U (en) | 2019-04-10 | 2019-04-10 | Heat preservation structure in reflow soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209754226U true CN209754226U (en) | 2019-12-10 |
Family
ID=68758655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920479616.XU Active CN209754226U (en) | 2019-04-10 | 2019-04-10 | Heat preservation structure in reflow soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209754226U (en) |
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2019
- 2019-04-10 CN CN201920479616.XU patent/CN209754226U/en active Active
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| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191218 Address after: 310000 west of the third floor, building 3, No. 8-2, Keji Avenue, Yuhang street, Yuhang District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Qidian Technology Co., Ltd Address before: 313300 No. 18 Tian Zi Hu Avenue, modern industrial park, Anji County, Huzhou, Zhejiang Patentee before: Zhejiang Deng Xin Technology Co., Ltd. |