CN212694231U - DMD assembly and projection optical machine - Google Patents

Abstract

The utility model provides a DMD assembly and a projection optical machine, wherein the DMD assembly comprises a DMD packaging structure, a circuit board, a fixed seat and a heat dissipation structure which are arranged in sequence, and a heat transfer part of the heat dissipation structure passes through the fixed seat and the circuit board and is contacted with the DMD packaging structure through a heat conduction pad; the DMD packaging structure further comprises a sealing structure and an elastic compression structure, wherein the sealing structure comprises a first sealing element, a second sealing element and a third sealing element, and the first sealing element seals the peripheral side of the DMD packaging structure; the second sealing element is in interference fit with the outer wall of the heat transfer part of the heat dissipation structure, and at least extends to cover the locking hole; the third sealing element is arranged at one end of the locking hole close to the second sealing element in a sealing mode; the elastic compression structure is arranged between the second sealing element and the fixed seat, is fixed on the fixed seat and is used for compressing the circuit board to the DMD packaging structure. The utility model discloses can improve the leakproofness of projection ray apparatus.

Description

DMD assembly and projection optical machine

Technical Field

The utility model relates to a DMD installation technical field, concretely relates to DMD subassembly and projection ray apparatus.

Background

A DMD (Digital micromirror Device) is a core Device of Digital Light Processing (DLP), and light emitted from a laser in a projection light machine enters an optical system after being processed by the DMD to finally form an image. Some manufacturers fix the DMD in the substrate through the fixing seat, and the DMD generates heat seriously, so the heat sink is disposed outside the substrate, and the heat of the DMD is conducted to the heat sink through the columnar heat conducting portion.

However, some gaps are inevitably formed between the base body and the DMD, the fixing seat and the heat sink, and particularly, in the process of fixing the heat sink and the fixing seat, the screws can generate some fragments in the screwing process, the whole projection light machine inevitably vibrates in the transportation and use processes, impurities such as dust and the fragments can easily enter the installation cavity of the DMD and further enter the optical system of the projection light machine, the DMD and the optical system are particularly sensitive to the impurities such as the dust, if the sealing is not good, the light path can be seriously affected, and the fragments can cause circuit faults such as short circuit.

SUMMERY OF THE UTILITY MODEL

Based on above-mentioned current situation, the utility model discloses a main aim at provides a DMD subassembly and projection ray apparatus to solve the above-mentioned problem that current DMD assembly scheme exists.

In order to achieve the above object, the utility model adopts the following technical scheme:

the utility model provides a first aspect of the DMD component, which comprises a DMD packaging structure, a circuit board, a fixed seat and a heat dissipation structure, wherein the fixed seat is used for fixing the DMD packaging structure and the circuit board on a base body, and a locking hole is arranged on the fixed seat; the heat dissipation structure comprises a heat dissipation part and a heat transfer part which are connected, the heat dissipation part is fixed on the fixed seat through the locking hole, and the heat transfer part penetrates through the fixed seat and the circuit board and is in contact with the DMD packaging structure through a heat conduction pad;

the DMD packaging structure comprises a circuit board, a DMD packaging structure and a sealing structure, wherein the circuit board is arranged on the circuit board, and the DMD packaging structure is arranged on the circuit board;

the second sealing element is provided with a through hole for the heat transfer part to pass through, the second sealing element is arranged between the elastic compression structure and the circuit board, the inner wall of the through hole is in interference fit with the outer wall of the heat transfer part, and the second sealing element at least extends to cover the locking hole;

the third sealing element is arranged at one end of the locking hole close to the second sealing element in a sealing mode; the elastic compression structure is arranged between the second sealing element and the fixed seat, is fixed on the fixed seat and is used for compressing the circuit board to the DMD packaging structure.

Preferably, the circuit board includes a first sub-board opposite to the DMD package structure and a second sub-board connected to a side of the first sub-board; along the thickness direction of the DMD packaging structure, the projection of the first sub-board is positioned in the outer edge of the projection of the second sealing piece; the second daughter board extends out of the fixed seat and forms an included angle with the first daughter board.

Preferably, the elastic pressing structure comprises a fixing part and an elastic pressing part which are connected with each other; a groove is formed in one surface, facing the circuit board, of the fixed seat, the fixed part is installed in the groove, and the elastic pressing part at least partially extends out of the groove in a free state; the edge of the second seal is located outside the groove.

Preferably, the fixing portion and the elastic pressing portion are both provided in two, and are disposed at an interval on the periphery of the heat transfer portion; the DMD packaging structure is an LGA package and comprises a DMD device and an LGA connector, and two rows of contacts of the LGA connector are arranged; the two elastic pressing parts are arranged corresponding to the two rows of contacts, and each elastic pressing part extends along the arrangement direction of the corresponding row of contacts and comprises a plane section which is opposite to the contacts.

Preferably, the locking hole is a through hole; the third sealing element is positioned on one surface of the fixed seat facing the circuit board and covers the locking hole.

Preferably, the third sealing member comprises a body layer and a glue layer, the glue layer faces the locking hole;

the first sealing element and the second sealing element are foam pads.

Preferably, along the thickness direction of the DMD package structure, a partial area of a projected outer edge of the circuit board is located in a projected outer edge of the first sealing member, so that when the fixing seat presses the DMD package structure and the circuit board, both the first surface and the side surface of the circuit board are attached to the first sealing member.

Preferably, the first sealing element is annular, an inner ring of the first sealing element is consistent with an outer contour of the DMD packaging structure, and a gap is reserved between the inner ring and an outer side wall of the DMD packaging structure.

The invention provides a projection optical machine, which comprises a base body and the DMD component, wherein the DMD component is arranged on the base body through the fixing seat.

Preferably, the base body is provided with a mounting cavity in a stepped structure, and the mounting cavity comprises a first cavity for accommodating the DMD package structure, a second cavity for accommodating the first sealing element and a third cavity for accommodating the circuit board and the second sealing element from small to large; the periphery of the side walls of the first cavity and the second cavity is sealed, and an open opening is formed in the side wall of the third cavity; part of the DMD packaging structure extends into the second cavity;

the first sealing element is in sealing fit with the side wall of the second cavity; and a gap is reserved between the second sealing element and the side wall of the third cavity.

The utility model provides a be provided with first sealing member, second sealing member and third sealing member in the DMD subassembly, seal the periphery side of DMD packaging structure through first sealing member and second sealing member, second sealing member and heat transfer portion interference fit simultaneously, thereby prevent that impurity such as dust from entering into DMD packaging structure's surface along the heat transfer portion, in order to realize sealed to DMD packaging structure, furtherly, the utility model discloses still seal the locking hole through the third sealing member, so, even produce the piece when the screw is screwed up, also can be blockked in the outside by the third sealing member, and then avoid the piece to fall into the transmission that DMD packaging structure or other parts department influence the light path, and avoid causing the interference of signal of telecommunication or even short circuit, consequently, can improve whole DMD packaging structure's reliability, guarantee the image quality of projection ray apparatus.

Drawings

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. In the figure:

fig. 1 is a schematic view of a partial structure of a projection optical machine according to an embodiment of the present invention;

fig. 2 is a partial cross-sectional view of a projection optical machine according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a DMD assembly according to an embodiment of the present invention;

fig. 4 is an exploded view of a DMD assembly according to an embodiment of the invention;

fig. 5 is an exploded view of the fixing base, the second sealing member and the elastic pressing structure in the DMD assembly according to the embodiment of the present invention;

fig. 6 is a schematic view of a partial structure of a substrate in a projection optical machine according to an embodiment of the present invention.

In the figure:

10. a substrate; 11. a mounting cavity; 111. a first cavity; 112. a second cavity; 113. a third cavity; 1131. an opening is formed; 114. a first step surface; 115. a second step surface; 12. a positioning column;

20. a DMD package structure; 21. a DMD device; 22. an LGA connector;

30. a circuit board; 31. a first sub-board; 32. a second sub-board;

40. a fixed seat; 41. a locking hole; 42. a groove; 43. mounting holes; 44. positioning holes; 45. positioning the through groove; 46. a unfilled corner-shaped groove;

50. a heat dissipation structure; 51. a heat dissipating section; 511. a connecting plate; 512. a heat sink; 52. a heat transfer portion;

60. a thermally conductive pad;

70. an elastic compression structure; 71. a fixed part; 711. a strip-shaped notch; 712. a circular hole; 72. an elastic pressing part; 721. a planar section; 722. a connecting section;

81. a first locking member; 82. a second locking member; 83. a third locking member; 84. spiral spring

90. A sealing structure; 91. a first seal member; 92. a second seal member; 921. a through hole; 93. a third seal.

Detailed Description

The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in order to avoid obscuring the spirit of the present invention, well-known methods, procedures, flows, and components have not been described in detail.

Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

Unless the context clearly requires otherwise, throughout the description and the claims, the words "comprise", "comprising", and the like are to be construed in an inclusive sense as opposed to an exclusive or exhaustive sense; that is, what is meant is "including, but not limited to".

In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

The application provides a projection light machine, as shown in fig. 1-6, comprising a base 10 and a DMD component, wherein the DMD component is mounted on the base 10. Specifically, the DMD assembly includes a DMD package structure 20, a circuit board 30, a fixing base 40, and a heat dissipation structure 50, which are sequentially disposed, where the DMD package structure 20 is a structure obtained by packaging a DMD device by using a packaging technique, for example, a structure obtained by packaging by using an LGA packaging technique. The fixing base 40 is used to fix the DMD package 20 and the circuit board 30 to the substrate 10, that is, when the DMD package is mounted on the substrate 10, the DMD package is fixed on the substrate 10 through the fixing base 40, wherein the fixing base 40 is provided with a locking hole 41. The heat dissipation structure 50 includes a heat dissipation portion 51 and a heat transfer portion 52 connected to each other, the heat dissipation portion 51 is fixed to the fixing base 40 through the locking hole 41, in order to achieve a better heat dissipation effect, the heat dissipation portion 51 needs to be disposed at an outer side, that is, the heat dissipation portion 51 is installed at a side of the fixing base 40 away from the DMD package structure 20 through the cooperation of the first locking member 81 such as a screw and the locking hole 41, so that heat of the inside DMD package structure 20 needs to be transferred to the heat dissipation portion 51 through the heat transfer portion 52 for heat dissipation, the heat transfer portion 52 passes through the fixing base 40 and the circuit board 30 and contacts with the DMD package structure 20 through the heat conduction pad 60, that the fixing base 40 and the circuit board 30 are both provided with through holes for the heat transfer portion 52 to pass through, specifically, one end of the heat transfer portion 52 is connected to the heat dissipation portion 51, and the other end contacts with the, The heat transfer portion 52 is transferred to the heat dissipation portion 51 to dissipate heat.

In the above embodiment, after the heat dissipation structure 50 is mounted on the fixing base 40, impurities such as dust and water vapor may reach the DMD package structure 20 and the inner side thereof (the side away from the heat dissipation structure 50) along the gap between the first locking member 81 and the locking hole 41, the outer wall of the heat transfer portion 52 (i.e. the gap between the heat transfer portion 52 and the circuit board 30 and the through hole on the fixing base 40), and may also reach the DMD package structure 20 and the inner side thereof along the gap between the fixing base 40, the circuit board 30 and the substrate 10, which may cause damage to the circuit board 30 and the DMD package structure 20, especially, the DMD package structure is particularly sensitive to light rays, and the requirement of the projector on the light path is particularly high, and these impurities such as dust may affect the light path of the whole projector when the DMD package structure 20 works, thereby affecting the. During the process of mounting the heat dissipation structure 50 and the fixing base 40, when the first locking member 81 is locked with the locking hole 41, some chips may be generated, and the chips may also reach the circuit board 30 and the DMD package structure 20 along the path formed by the gap, which may cause a short circuit inside the projector and may also affect the light transmission inside the projector.

In order to solve the above problem, the DMD assembly of the present invention further includes an elastic pressing structure 70 and a sealing structure 90, wherein the elastic pressing structure 60 is fixed on one surface of the fixing base 40 facing the circuit board 30, for pressing the circuit board 30 to the DMD packaging structure 20. The sealing structure 90 includes a first sealing element 91, a second sealing element 92 and a third sealing element 93, where the first sealing element 91 is disposed on a side of the circuit board 30 facing the DMD package structure 20 and seals an outer peripheral side of the DMD package structure 20, that is, the first sealing element 91 is disposed on the outer peripheral side of the DMD package structure 20 and is in sealing fit with a first surface of the circuit board 30 facing the DMD package structure 20 (that is, two opposite surfaces of the circuit board 20 having a larger area are a first surface and a second surface, respectively, and the first surface is a surface facing the DMD package structure 20). The second sealing member 92 is provided with a through hole 921 for the heat transfer portion 52 to pass through, the second sealing member 92 is disposed between the elastic pressing structure 70 and the circuit board 30, and an inner wall of the through hole 921 is in interference fit with an outer wall of the heat transfer portion 52, that is, the second sealing member 92 is in close fit with the heat transfer portion 52, and the second sealing member 92 at least extends to cover the locking hole 41, that is, in the thickness direction X, a projection of the locking hole 41 falls within a projection of the second sealing member 92. The third sealing member 93 is disposed at an end of the locking hole 41 near the second sealing member 92.

The DMD assembly of the above embodiment is provided with the first sealing member 91 and the second sealing member 92, on one hand, the first sealing member 91 is disposed on the outer periphery side of the DMD package structure 20, so as to prevent dust, moisture and debris generated when the first locking member 81 is locked with the locking hole 41 from reaching the DMD package structure 20 and the inner side thereof along the outer periphery side of the DMD package structure 20; and through the interference fit between the second sealing member 92 and the heat transfer portion 52, dust and moisture are prevented from reaching the DMD package structure 20 and the inner side thereof along the heat transfer portion 52, and the first sealing member 91 is sealed with the first surface of the circuit board 30, so that the area of the first surface side of the circuit board 30 is completely sealed through the first sealing member 91 and the second sealing member 92, thereby preventing dust, moisture, and debris from entering the DMD package structure 20 and the inner side thereof (i.e., the side away from the heat dissipation structure 50) to affect the transmission of light in the projection light engine, and further improving the image quality of the projection light engine.

On the other hand, considering that the chips may fall from the locking hole 41 onto the circuit board 30, and the DMD package structure 20 needs to be adjusted during assembly, the heat dissipation structure 50, the fixing seat 40, etc. are often disassembled, and also need to be disassembled during maintenance of the projection light machine, when adjusting and disassembling, the first sealing member 91 and the second sealing member 92 will become loose, if the chips or impurities remain in the locking hole 41, they may fall down during disassembly, and the falling position is not controllable, if they fall onto the circuit board 30 and the DMD package structure 20, even in the base body 10, they are difficult to be cleaned, and they affect the optical path in the projection light machine, and these chips may even cause damage to the optical system, and in order to avoid these chips falling out, the utility model discloses be provided with the third sealing member 93, the occurrence of the above problems can be avoided.

In order to avoid the falling of the debris, the locking hole 41 may be a blind hole, that is, the third sealing member 93 and the fixing seat 40 may be integrally formed, and the bottom of the blind hole is the third sealing member 93. However, in order to achieve the locking reliability, the locking length of the first locking member 81 (i.e. the matching length of the locking hole 41 and the first locking member 81) at least needs to satisfy a predetermined length, and if the locking hole 41 is set as a blind hole, the thickness of the fixing base 40 (i.e. along the arrangement direction of the DMD package structure 20, the circuit board 30, the fixing base 40 and the heat dissipation structure 50, i.e. the thickness direction X of the DMD package structure 20) is inevitably increased due to the limitation of the processing technology, which may cause the thickness of the whole DMD assembly to be increased, and affect the volume of the whole projection optical engine; in the machining process of the blind hole, the residual scraps and oil in the blind hole are difficult to clean, and can fall into the circuit board 30, the DMD packaging structure 20 and even the base body 10 of the projection optical machine in subsequent assembly, so that the use reliability and safety of the projection optical machine are affected. The utility model discloses a preferred embodiment, locking hole 41 is the perforating hole, locking hole 41 link up fixing base 40 along above-mentioned thickness direction X promptly, third sealing member 93 is independent part, laminate in the one side of fixing base 40 towards second sealing member 92, and sealed locking hole 41, third sealing member 93 is located between second sealing member 92 and the fixing base 40 promptly, locking hole 41 and the third sealing member 93 through setting up having a perfect understanding can avoid above-mentioned problem, promptly through setting up third sealing member 93, make its locking hole 41 department of directly laminating in fixing base 40, so, even have to remain the piece also can be sealed in locking hole 41, and can not cause uncontrollable dropping everywhere, therefore, the utility model discloses can avoid the harm and the influence that impurity such as piece in the locking hole 41 caused the projection ray machine well. Further, the second sealing member 92 of the present invention extends to cover the locking hole 41, so that when the fixing base 40 is locked with the base 10, the third sealing member 93 is pressed by the second sealing member 92, and the third sealing member 93 can be better attached to the fixing base 40, so as to better seal the chips in the locking hole 41; even if some chips, impurities and the like fall out from one end of the locking hole 41, which is far away from the circuit board 30, when the DMD package structure 20 is adjusted and disassembled, the chips, the impurities and the like can be blocked by the second sealing member 92, so that the safety and the reliability of the DMD assembly are improved; and through setting the locking hole 41 to the perforating hole, can enough reduce the thickness of whole fixing base 40, can guarantee locking length again.

On the other hand, consider to be provided with second sealing member 92 between fixing base 40 and the circuit board 30, probably cause circuit board 30 and DMD packaging structure 20 contact failure, the utility model discloses be provided with elasticity compact structure 70 between second sealing member 92 and fixing base 40, so, when fixing base 40 and base member 10 lock, elasticity compact structure 70 extrudees second sealing member 92 and circuit board 30 through elastic deformation, and then makes circuit board 30 and DMD packaging structure 20 in close contact with, guarantees the reliability of the two contact, improves the stability of the work of projection ray apparatus.

In order to better utilize the space of the projector and to make the volume of the DMD assembly smaller, in a preferred embodiment of the present invention, referring to fig. 1 to 3, the circuit board 30 includes a first sub-board 31 opposite to the DMD package structure 20 and a second sub-board 32 connected to the side of the first sub-board 31; the second daughter board 32 extends out of the fixing seat 40, and forms an included angle with the first daughter board 31, such as the first daughter board 31 and the second daughter board 32 are vertically disposed, or the included angle is 100 degrees, the included angle can be bent according to the space inside the whole DMD assembly and the projection light machine, as shown in fig. 1, the first daughter board 31 and the second daughter board 32 are vertically disposed, and the second daughter board 32 is fixed on the side surface of the base 10. That is, the first sub-board 31 is disposed between the second sealing member 92 and the DMD package 20, and the second sub-board 32 and the first sub-board 40 are located outside a space between the second sealing member 92 and the DMD package 20, for example, may be located on a side surface (a surface parallel to the thickness direction X) of the DMD assembly, so that the space on the side surface of the DMD assembly can be fully utilized. It is understood that the first sub-board 31 and the second sub-board 32 may be a hard circuit board (e.g., a PCB), and in order to facilitate connection of the two, the circuit board 30 may further include a flexible circuit board (e.g., an FPC), and the flexible circuit board may not only be used for connecting the first sub-board 31 and the second sub-board 32, but also substantially cover a portion of the first sub-board 31 facing the DMD package structure 20, and extend out of a side of the first sub-board 31 facing away from the second sub-board 32, so as to better utilize the space of the projection optical engine and facilitate electrical connection with each electronic device inside the base body 10. In this embodiment, the side edge of the first sub-board 31 may form the above-mentioned stopper portion for the manufacture when the circuit board 30 is mounted.

Along the thickness direction (as X direction in the figure) of DMD package 20, a partial area of the projected outer edge of circuit board 30 is located in the projected outer edge of first sealing member 91, so that when DMD package 20 and circuit board 30 are pressed by fixing base 40, the first surface and the side surface of circuit board 30 are both attached to first sealing member 91, as shown in fig. 2, when DMD package 20 and circuit board 30 are fixed to base 10 by fixing base 40, the edge portion of circuit board 30 will press first sealing member 91, as shown in the structure that the first sealing member 91 is protruded from the right side of the figure, the portion of first sealing member 91 facing circuit board 30 will be pressed to be attached to the first surface of circuit board 30, the portion of first sealing member 91 beyond the edge of circuit board 30 will surround the side surface of circuit board 30, and DMD package 20 is located inside first sealing member 91, so that DMD package 20 is located in a better sealed space, the sealing performance of the projection light machine is improved, and further the influence of dust, water vapor, debris and the like on a light path system in the projection light machine is better avoided.

Specifically, the first sealing member 91 may have a bar shape and directly surround the DMD package structure 20 along the outer circumferential side thereof. In a preferred embodiment of the present invention, the first sealing member 91 is annular, and the inner ring of the first sealing member 91 is consistent with the outer contour of the DMD package structure 20 and has a gap with the outer sidewall of the DMD package structure 20. By using the annular sealing member, the first sealing member 91 can seal the outside of the DMD package 20 more tightly, and can better prevent impurities such as debris, dust, and moisture from entering the inside of the DMD package 20 from the edge of the DMD package 20. Considering that when the first sealing member 91 is configured in a ring shape, during the process of locking the fixing base 40 and the base 10, the first sealing member 91 is pressed and deformed to be tightly attached to the DMD package structure 20, which results in that the first sealing member 91 is not tightly attached to the first surface of the circuit board 30, and therefore the sealing performance is not tight, especially in the embodiment where the first sealing member 91 is attached to the side wall of the second cavity 112 (as described in detail below), the problem is particularly significant, that if the first sealing member 91 is limited to both the inner ring wall and the outer ring wall, a serious unevenness problem is caused, and the risk of the sealing performance is increased. Therefore, the utility model discloses make simultaneously and leave the clearance between first sealing member 91 and the DMD packaging structure 20, provide sufficient deformation space for first sealing member 91, make its deformation direction controllable to above-mentioned problem has been solved well.

In the embodiment provided with the first sub-board 31, the first seal member 91 and the second seal member 92 are respectively located on both main surfaces (the main surfaces refer to the opposite surfaces having a large area) of the first sub-board 31. Specifically, along the thickness direction X of the DMD package structure 20, the projection of the first sub-board 31 is located inside the outer edge of the projection of the second sealing member 92, that is, the edge of the second sealing member 92 extends beyond the edge of the first sub-board 31, so that the second sealing member 92 not only seals the outer gap of the heat transfer portion 52, but also can reseal the outer edge of the first sub-board 31, and in the case of an insulating sealing member, can also perform an insulating protection function on the entire main surface of the first sub-board 31.

Further, a gap is left between the first seal 91 and the second seal 92 in the thickness direction X of the DMD package structure 20. In the embodiment that the edges of the first sealing member 91 and the second sealing member 92 exceed the first sub-plate 31, when the fixing base 40 is locked with the base 10, the first sealing member 91 and the second sealing member 92 are deformed by being pressed, and a part of the first sub-plate 31 will be sunk into the first sealing member 91 or the second sealing member 92, which may cause interference between the first sealing member 91 and the second sealing member 92 in the thickness direction X, resulting in uncontrollable deformation of the first sealing member 91 and the second sealing member 92, and affecting the sealing effect.

It should be noted that, although the above-mentioned embodiment in which the circuit board 30 includes the first sub-board 31 is described, the present invention is not limited to this, and in the case that the circuit board 30 is one board or more boards, the arrangement of the first sealing member 91 and the second sealing member 92 may adopt the above-mentioned structure, and only an adaptive modification is needed, for example, when the circuit board 30 is one board, the edges of the first sealing member 91 and the second sealing member 92 may extend out of a part of or all of the edges of the circuit board.

It should be understood that, in order to improve the heat dissipation effect, the heat dissipation structure 50 is preferably made of a metal component, and the fixing base 40 may be made of a metal component or a plastic component, especially when it is a metal component, an insulating component is further required to be disposed between the fixing base 40 and the circuit board 30. The utility model discloses a in a preferred embodiment, second sealing member 92 is insulating sealing member to make it can enough play insulating effect, can carry out the separation to impurity such as dust, steam again. Likewise, the first and third seals 91 and 93 are preferably insulating seals. Specifically, the first and second seals 91 and 92 may be sealing foam to reduce cost and reduce resistance to elastic deformation of the elastic pressing structure 70, thereby bringing the circuit board 30 into contact with the DMD package structure 20 more reliably.

Further, the third sealing member 93 includes a body layer and a glue layer facing the locking hole 41, that is, the third sealing member 93 has viscosity, so that when the first locking member 81 is locked with the locking hole 41, debris is generated and adhered to the third sealing member 93, so that the debris is difficult to fall out when the first locking member 81 is disassembled during the adjustment of the DMD package structure 20 and the maintenance of the projection light engine, especially during the assembly and transportation of the projection light engine, even if vibration occurs, the debris is not substantially fallen out, therefore, the possibility that the debris is randomly fallen out can be further reduced by using the third sealing member 93 with viscosity, and the reliability of the projection light engine can be better ensured. Specifically, the third sealing member 93 may be a sealing member having viscosity such as a gummed paper, and such gummed paper is preferably made of a material having an antistatic effect.

Of course, the first seal 91, the second seal 92, and the third seal 93 may be seals made of other materials such as rubber.

Referring to fig. 4-5, a recess 42 is formed on a side of the fixing base 40 facing the circuit board 30, and the recess 42 may be formed by recessing a side of the fixing base 40 facing the circuit board 30. The elastic pressing structure 70 is opposite to the groove 42, the elastic pressing structure 70 comprises a fixing part 71 and an elastic pressing part 72 which are connected with each other, the fixing part 71 is installed in the groove 42, and the elastic pressing part 43 at least partially extends out of the groove 42 in a free state. The edge of the second sealing member 92 is located outside the groove 42, that is, the second sealing member 92 is located between the elastic pressing structure 70 and the circuit board 30 in the region where the groove 42 is provided, and the second sealing member 92 is actually located between the fixing base 40 and the circuit board 30 in the region outside the groove 42. With the above structure, on one hand, more elastic space can be provided for the elastic pressing structure 70 by arranging the groove 42, so that the pressing effect on the circuit board 30 and the DMD packaging structure 20 can be improved; on the other hand, by providing the groove 42, the thickness (i.e., the dimension in the X direction) of the entire DMD assembly can also be reduced while ensuring that the elastic pressing structure 70 is also elastically deformed; on the other hand, the elastic pressing structure 70 is only opposite to the groove 42, so that when the fixing seat 40 is locked with the base body 10, the edge portion of the second sealing member 92 is in direct contact with the outer side of the groove 42 of the fixing seat 40, thereby better performing a sealing function.

Specifically, the fixing base 40 may be configured to have any structure capable of achieving the above functions, such as a block structure or an irregular shell structure, and in order to make the structure more compact, preferably, as shown in fig. 3 to 5, the fixing base 40 has an elongated plate-shaped structure, two opposite surfaces of the elongated plate-shaped structure having the largest area are respectively defined as a first side surface and a second side surface (i.e., a surface where the groove 42 is disposed), the first side surface is opposite to the heat dissipation portion 51 (may be in contact with or not in contact with the heat dissipation portion), and the second side surface is in contact with the elastic pressing structure 70. The elastic compression structure 70 is matched with the middle structure of the extension direction of the fixing seat 40, the two side structures of the fixing seat 40 are matched with the base body 10, the second sealing element 92 and the heat dissipation part 51, the arrangement mode is more reasonable in structure, the assembly is more convenient, and the whole structure after the assembly is more reliable. As shown in fig. 1, 4 and 5, mounting holes 43 may be provided at the edge of the fixing base 40, for example, mounting holes 43 are respectively provided at four corners of the fixing base 40, and the fixing base 40 is fixedly locked with the base 10 by the second locking member 82 passing through the mounting holes 43. Further preferably, as shown in fig. 4, corner lacking grooves 46 are formed in four corners of the first side surface of the fixing base 40, the mounting hole 43 is formed in the corner lacking groove 66, the corner lacking groove 46 means that the shape of the groove is a corner lacking structure, the groove can be formed by inward recess of the first side surface and extends to the edge of the fixing base 40, and the mounting space of the second locking member 82 can be increased by the arrangement, so that the mounting and dismounting convenience of the second locking member 82 is improved, and the size of the DMD assembly in the X direction is reduced.

Similarly, the edge of the second sealing element 92 is provided with an avoiding notch, which is opposite to the mounting hole 43, so that the fixing seat 40 can be in direct contact with the base body 10, and further the second sealing element 92 and the elastic pressing structure 70 are pressed better, thereby improving the sealing effect of the projection light machine.

With continued reference to fig. 5, the elastic pressing structure 70 is a sheet structure, i.e. the fixing portion 71 is a fixing sheet, and the elastic pressing portion 72 is an elastic pressing sheet, so that the pressing effect can be improved. The fixing portion 71 is attached to the bottom of the recess 42 and connected to the fixing base 40 through the third locking member 83, and at least a portion of the elastic pressing portion 72 extends out of the recess 42 so as to press the circuit board 30. The number of the fixing portions 71 and the elastic pressing portions 72 is not limited, one elastic pressing portion 72 may be disposed on one fixing portion 71, two or more elastic pressing portions 72 may be disposed on one fixing portion 71, or one elastic pressing portion 72 connects two or more fixing portions 71, in order to facilitate installation and ensure reliability of the structure, in the embodiment shown in fig. 5, the fixing portion 71 is in a straight strip shape, and the elastic pressing portion 72 is in a long strip arch shape, it can be understood that the arch shape refers to a shape formed by bending or curving the two ends protruding from the middle of the fixing portion 71, for example, the shape may be an arc shape, an isosceles trapezoid shape, etc., and the elastic pressing portion 72 is set in a long strip arch shape to reduce the stressed area, and increase the pressure under the condition of constant force, so that the circuit board 30 and the DMD package structure 20 are attached more tightly.

Preferably, two fixing portions 71 and two elastic pressing portions 72 are provided, and are provided at intervals on the outer circumference of the heat transfer portion 52. Each elastic pressing portion 72 has a strip-shaped structure, and includes a plane section 721 in the middle and a connection section 722 connected to two ends of the plane section 721, so that the elastic pressing portion 72 can be better press-fitted with the circuit board 20. Wherein, the connection section 722 is a bending structure and is in smooth transition connection with the plane section 721, and this structure can make the elastic pressing portion 72 press the circuit board 30 to the DMD package structure 20 better on the one hand, and on the other hand, can also ensure the structural strength, prolong the service life, thereby improving the reliability of the whole structure. Preferably, the two fixing portions 71 and the two elastic pressing portions 72 are alternately connected end to form a square, that is, the two fixing portions 71 are arranged oppositely, two ends of the two fixing portions 71 are respectively connected with two ends of the two elastic pressing portions 72, during assembly, only the square structure needs to be installed in the groove 42 and screwed by the third locking member 83, with this structure, when the fixing base 40 is locked with the base 10, only the plane section 721 on the elastic pressing structure 70 is in contact with the second sealing member 92 to be pressed, and the rest of the second sealing member 92 is mainly pressed by the fixing base 40 and the circuit board 30 (the first daughter board 31 when the first daughter board 31 is included), so that the influence of the elastic pressing structure 70 on the sealing effect of the second sealing member 92 can be reduced as much as possible, and the sealing effect of the projection optical engine can be improved. Further preferably, the two fixing portions 71 and the two elastic pressing portions 72 are formed as an integral structure, which facilitates the processing and has high structural reliability after the processing.

The elastic pressing structure 70 is particularly suitable for the embodiment where the DMD package 20 is an LGA package, and specifically, in the embodiment where the DMD package 20 is an LGA package, the DMD package 20 includes a DMD device 21 and an LGA connector 22, contacts on the LGA connector 22 contact with contacts on the circuit board 30 to realize electrical connection, and the contacts on the LGA connector 22 are arranged in two rows. In the embodiment where two elastic pressing portions 72 are provided, two elastic pressing portions 72 are disposed corresponding to two rows of the contacts, and each elastic pressing portion 72 extends along the arrangement direction of one row of the contacts corresponding to the elastic pressing portion 72, that is, in the assembled state, two elastic pressing portions 72 correspond to two rows of the contacts respectively, that is, the extension direction of the elastic pressing portion 72 is consistent with the arrangement direction of the contacts on the circuit board 30, so that the elastic pressing portions 72 act on the contacts better, and the contact between the LGA connector 22 and the circuit board 30 is more accurate and stable, so as to ensure the projection effect of the projection optical engine using the DMD assembly.

In the process of locking the fixing seat 40 and the base 10, the elastic pressing structure 70 is likely to move in the process of elastic deformation, and in order to control the movement, the fixing portion 71 is provided with a strip-shaped gap 711, as shown in fig. 5, the extending direction of the strip-shaped gap 711 is consistent with the extending direction of the elastic pressing portion 72, and the strip-shaped gap 711 is provided with a third locking member 83, so that, after the elastic pressing structure 70 is extruded, the third locking member 83 can only move along the fixing direction under the matching of the strip-shaped gap 711 and the third locking member 83. It should be noted that the strip-shaped notch 711 can also be replaced by a strip-shaped hole, and in the embodiment where two fixing portions 71 are provided, the strip-shaped notch 711 or the strip-shaped hole on one fixing portion 71, which is matched with the third locking member 83, and the round hole 712 on the other fixing portion 71, which is matched with the third locking member 83, can be used.

Although the above embodiment shows an embodiment in which the elastic pressing structure 70 is a sheet structure, the elastic pressing structure 70 of the present invention is not limited to this, and may be a press block, a press plate, or the like.

When the DMD assembly is mounted on the base 10, the fixing base 40 is directly attached to the end surface of the base 10, and is locked with the base 10 by passing through the mounting hole 43 through the second locking member 82. Specifically, referring to fig. 6, the base 10 is provided with a mounting cavity 11 having a stepped structure, and the mounting cavity 11 includes, from small to large, a first cavity 111 accommodating the DMD package structure 20, a second cavity 112 accommodating the first sealing element 91, and a third cavity 113 accommodating the circuit board 30 and the second sealing element 92, that is, the mounting cavity 11 has two stepped surfaces, namely, a first stepped surface 114 and a second stepped surface 115, so as to form three cavities with different opening sizes: a first cavity 111, a second cavity 112, and a third cavity 113. The peripheries of the sidewalls of the first cavity 111 and the second cavity 112 are all closed, and the sidewall of the third cavity 113 is provided with an opening 1131, so that the installation is convenient, or the circuit board 30 can extend out of the base 10 through the opening 1131. During assembly, a portion of the DMD package structure 20 extends into the second cavity 112, the first sealing member 91 is attached to the first step surface 114, the position-limiting portion 35 of the circuit board 30 is attached to the second step surface 115, in a free state (i.e. when the fixing seat 40 and the base 10 are not locked together), the second sealing member 92 at least partially extends into the third cavity 113, the fixing seat 40 is attached to the end surface of the base 10 where the mounting cavity 11 is disposed, when the fixing base 40 is locked with the base 10 by the second locking member 82, the first sealing member 91 and the second sealing member 92 are pressed, a part of the edge of the first sub-board 31 sinks into the first sealing member 91, the first sealing member 91 seals the side of the circuit board 30 facing the DMD package structure 20, thereby sealing the outer peripheral side of the DMD package 20 and the second sealing member 92 seals the outer side of the heat transfer portion 52 and the surface of the circuit board 30 facing the holder 40, thus making the space inside the mounting chamber 11 more hermetically sealed. The installation cavity adopting the stepped structure is beneficial to positioning of all parts and can form a tighter sealing space with the first sealing element 91 and the second sealing element 92, and impurities such as dust and water vapor are better prevented from entering the installation cavity 11 to influence the working performance of the projection optical machine.

Further, the first sealing element 91 is attached to the side wall of the second cavity 112 in a sealing manner, so that the first sealing element 91 can better seal the periphery of the DMD package structure 20.

Similarly, the second sealing element 92 and the side wall of the third cavity 113 can be attached in a sealing manner, but considering that the through hole 921 of the second sealing element 92 is in interference fit with the heat transfer portion 52, if the outer edge of the second sealing element 92 is too tight to be attached to the third cavity 113, especially when being squeezed by the fixing base 40, the surface of the second sealing element 92 with large surface area may be wrinkled and uneven, which may reduce the sealing effect, for this reason, in a preferred embodiment of the present invention, a gap is left between the side wall of the second sealing element 92 and the side wall of the third cavity 113, so as to ensure that the second sealing element 92 can be in contact with the surface of the circuit board 30 even under the squeezing of the fixing base 40, thereby improving the sealing performance of the projection optical engine.

In actual assembly, the fixing base 40 and the elastic pressing structure 70 are assembled together to form a whole, and then the whole, together with the second sealing member 92, the circuit board 30, the first sealing member 91 and the DMD package 20, is mounted to the base 10. Fixing base 40, elasticity compact structure 70 are dismantled and are installed as a whole, when adjusting circuit board 30 and DMD packaging structure 20 counterpoint, these two structures also adjust as a whole, consequently, the assembly efficiency has been improved greatly, in addition, because elasticity compact structure 70 just no longer unpacks apart after well assembling with fixing base 40, the position between each other is definite, can not accumulate the installation error again, thereby can guarantee the installation accuracy, reduce the number of times of dismouting.

For the installation of the heat dissipation structure 50, after the fixing base 40 and the elastic pressing structure 70 are assembled into a whole, the heat dissipation structure 50 is installed on the fixing base 40, and then the heat dissipation structure 50, the second sealing member 92, the circuit board 30, the first sealing member 91, and the DMD package structure 20 are installed on the substrate 10. In this way, since the fixing base 40 is disposed between the heat dissipating portion 51 and the elastic pressing structure 50, and the heat dissipating portion 51 is located at the outermost side, in order to ensure the detachment and installation of the second locking member 82, an avoiding structure needs to be disposed in an area of the heat dissipating portion 51 corresponding to the second locking member 82, so as to avoid an installation space of the second locking member 82. In a preferred embodiment, after the fixing base 40 and the elastic pressing structure 70 are assembled into a whole, the fixing base is first mounted to the base 10 together with the second sealing member 92, the circuit board 30, the first sealing member 91 and the DMD package 20, and then the heat dissipation structure 50 with the third sealing member 93 mounted thereon is mounted to the fixing base 40 through the first locking member 81, so that the heat dissipation structure 50 may or may not be provided with a structure for avoiding the second locking member 82.

The heat dissipating part 51 may have any structure for dissipating heat, for example, in the embodiment shown in fig. 1, the heat dissipating part 51 includes a connecting plate 511 and a plurality of heat dissipating fins 512 disposed on the connecting plate 511, and the connecting plate 511 is used for carrying the heat dissipating fins 512 and the heat transferring part 52, and is used for connecting with the fixing base 40. Specifically, the connection plate 511 includes opposite side surfaces, one of which is provided with the heat radiation fins 512, and the other of which is provided with the heat transfer portion 52. The heat sink fins 512 are disposed at an angle to the connection plate 511, and preferably perpendicular to each other. The side of the connection plate 511 where the heat transfer portion 52 is provided is disposed opposite to the first side of the holder 40. In order to secure as large a heat dissipation area as possible, it is preferable that the edge profile of the connection plate 511 is substantially the same as the edge profile of the fixing base 40.

Specifically, the connection plate 511 and the fixing base 40 may contact, but in order to prevent interference between the heat dissipation structure 50 and the fixing base 40 due to errors in manufacturing and assembly, it is preferable that a gap is left between the connection plate 511 and the fixing base 40, as shown in fig. 2.

The heat transfer portion 52 is a cylindrical structure, through holes for the heat transfer portion 52 to pass through are correspondingly formed on the fixing base 40 and the circuit board 30, the elastic pressing structure 70 may be disposed to avoid the heat transfer portion 52, or through holes for the heat transfer portion 52 to pass through may be correspondingly formed on the elastic pressing structure 70. Preferably, in the embodiment shown in fig. 5, the through hole of the fixing seat 40 is disposed at the position of the groove 42 and between the two elastic pressing portions 72, so that the heat transfer portion 52 can pass between the two elastic pressing portions 52.

The connection plate 511 and the fixing base 40 can be lockingly engaged with the locking hole 41 by the first locker 81. In order to avoid the first locking member 81, the heat radiation fin 52 may not be provided at the position where the first locking member 81 is provided, or the heat radiation fin 512 may be provided as shown in fig. 1, and a notch may be provided in the heat radiation fin 512 to avoid the first locking member 81, which is more advantageous to increase the heat radiation area.

Wherein, first retaining member 81, second retaining member 82 and third retaining member 83 can be the structure that screw, rivet, pin etc. can realize fastening connection, and for making things convenient for the dismouting, preferably, first retaining member 81, second retaining member 82 and third retaining member 83 are the screw.

In order to further improve the connection reliability of the heat dissipation structure 50 and the fixing base 40, it is preferable that an elastic member, such as an elastic sheet or a coil spring 84 shown in fig. 4, is disposed between the first locking member 81 and the connection plate 511, and in view of the easy setting and control of the elastic force of the coil spring 84, the coil spring 84 is preferable to select the elastic force of the coil spring 84 and the pressure applied by the controller according to the pressure range that the DMD device 21 can bear.

The number of the locking holes 41 may be one or multiple, and in order to improve the installation reliability, the locking holes 41 are preferably provided in multiple numbers, and the locking holes 41 are symmetrically distributed on two sides of the middle structure of the fixing base 40, for example, in the embodiment shown in fig. 5, the locking holes 41 are provided in two numbers, and are respectively located on two sides of the groove 42.

Further preferably, in order to improve the installation efficiency, the fixing base 40 is provided with a positioning structure for positioning the fixing base 40 on the base 10, the positioning structure may be, for example, a positioning post, a positioning plate, and the like, in a preferred embodiment, as shown in fig. 5, the positioning structure includes a positioning hole 44 disposed on one side of the groove 42 and a positioning through groove 45 disposed on the other side, the positioning hole 44 is a circular hole, the positioning through groove 45 is a groove penetrating through the fixing base 40 in the thickness direction (i.e., the X direction) and is respectively used for matching with a structure on the base 10, for example, as shown in fig. 6, the base 10 is provided with two positioning posts 12, one of the positioning posts 12 is matched and positioned with the positioning hole 44, the other positioning post 12 is matched and positioned with the positioning through groove 45, so that the positioning hole 44 is used as a main positioning structure, and the, the function of compensating and adjusting the processing deviation is achieved. In addition, the positioning through groove 45 may be replaced by a waist-shaped hole or other structures as long as the function of compensating and adjusting the machining deviation can be achieved. Of course, it can be understood that the positioning structures may be positioning holes or positioning through grooves.

It will be appreciated by those skilled in the art that the above-described preferred embodiments may be freely combined, superimposed, without conflict.

It will be understood that the above-described embodiments are illustrative only and not restrictive, and that various obvious and equivalent modifications and substitutions may be made in the details described herein by those skilled in the art without departing from the basic principles of the invention.

Claims (10)

1. A DMD assembly comprises a DMD packaging structure (20), a circuit board (30), a fixed seat (40) and a heat dissipation structure (50), wherein the DMD packaging structure (20) and the circuit board (30) are sequentially arranged, the fixed seat (40) is used for fixing the DMD packaging structure (20) and the circuit board (30) on a base body (10), and a locking hole (41) is formed in the fixed seat; the heat dissipation structure (50) comprises a heat dissipation part (51) and a heat transfer part (52) which are connected, the heat dissipation part (51) is fixed on the fixed seat (40) through the locking hole (41), and the heat transfer part (52) penetrates through the fixed seat (40) and the circuit board (30) and is in contact with the DMD packaging structure (20) through a heat conduction pad (60); it is characterized by also comprising:

a sealing structure (90) and a resilient compression structure (70), the sealing structure (90) comprising a first seal (91), a second seal (92) and a third seal (93),

the first sealing element (91) is arranged on one side, facing the DMD packaging structure (20), of the circuit board (30) and seals the periphery side of the DMD packaging structure (20);

the second sealing element (92) is provided with a through hole (921) for the heat transfer part (52) to pass through, the second sealing element (92) is arranged between the elastic pressing structure (70) and the circuit board (30), the inner wall of the through hole (921) is in interference fit with the outer wall of the heat transfer part (52), and the second sealing element (92) at least extends to cover the locking hole (41);

the third sealing element (93) is arranged at one end of the locking hole (41) close to the second sealing element (92) in a sealing mode; the elastic pressing structure (70) is disposed between the second sealing element (92) and the fixing seat (40), fixed to the fixing seat (40), and used for pressing the circuit board (30) to the DMD packaging structure (20).

2. The DMD assembly of claim 1, wherein the circuit board (30) comprises a first sub-board (31) opposite the DMD package structure (20) and a second sub-board (32) connected to a side of the first sub-board (31); -along the thickness direction of the DMD package structure (20), a projection of the first sub-board (31) is located within an outer edge of a projection of the first seal (91); the second sub-board (32) extends out of the fixed seat (40) and forms an included angle with the first sub-board (31).

3. DMD assembly according to claim 1, characterised in that the elastic compression structure (70) comprises a fixation part (71) and an elastic compression part (72) connected to each other; a groove (42) is formed in one surface, facing the circuit board (30), of the fixed seat (40), the fixed part (71) is installed in the groove (42), and the elastic pressing part (72) at least partially extends out of the groove (42) in a free state; the edge of the second seal (92) is located outside the groove (42).

4. A DMD assembly according to claim 3, wherein the fixing portion and the elastic pressing portion (72) are provided in two and spaced apart from each other at the periphery of the heat transfer portion (52); the DMD packaging structure (20) is an LGA package and comprises a DMD device (21) and an LGA connector (22), and two rows of contacts of the LGA connector (22) are arranged; the two elastic pressing parts (72) are arranged corresponding to the two rows of contacts, and each elastic pressing part (72) extends along the arrangement direction of the corresponding row of contacts and comprises a plane section (721) opposite to the contacts.

5. The DMD assembly according to claim 1, wherein the locking apertures (41) are through holes; the third sealing element (93) is positioned on one surface, facing the circuit board (30), of the fixed seat (40) and covers the locking hole (41).

6. The DMD assembly according to claim 5, characterized in that said third seal (93) comprises a body layer and a glue layer, said glue layer facing said locking holes (41);

the first seal (91) and the second seal (92) are foam pads.

7. The DMD assembly according to claim 1, wherein, in the thickness direction of the DMD package (20), a partial area of the projected outer edge of the circuit board (30) is located within the projected outer edge of the first sealing member (91), so that when the DMD package (20) is pressed against the circuit board (30) by the fixing seat (40), the first surface and the side surface of the circuit board (30) are both attached to the first sealing member (91).

8. The DMD assembly of claim 1, wherein the first seal (91) is ring-shaped, an inner ring of the first seal (91) conforming to an outer contour of the DMD package (20) and leaving a gap with an outer sidewall of the DMD package (20).

9. Projection light engine, characterized in that it comprises a base body (10) and a DMD assembly according to any one of claims 1 to 8, said DMD assembly being mounted to said base body (10) by means of said holders (40).

10. The optical projection engine according to claim 9, wherein the base (10) is provided with a mounting cavity (11) having a stepped structure, and the mounting cavity (11) comprises, from small to large, a first cavity (111) for accommodating the DMD package structure (20), a second cavity (112) for accommodating the first sealing member (91), and a third cavity (113) for accommodating the circuit board (30) and the second sealing member (92); the peripheries of the side walls of the first cavity (111) and the second cavity (112) are closed, and an opening (1131) is formed in the side wall of the third cavity (113); part of the DMD package structure (20) extends into the second cavity (112);

the first sealing element (91) is in sealing fit with the side wall of the second cavity (112); a gap is left between the second sealing piece (92) and the side wall of the third cavity (113).

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