CN214411167U - Easy-to-package integrated circuit packaging structure - Google Patents
Easy-to-package integrated circuit packaging structure Download PDFInfo
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- CN214411167U CN214411167U CN202120952764.6U CN202120952764U CN214411167U CN 214411167 U CN214411167 U CN 214411167U CN 202120952764 U CN202120952764 U CN 202120952764U CN 214411167 U CN214411167 U CN 214411167U
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Abstract
The utility model discloses an easy encapsulation integrated circuit packaging structure, which comprises a substrate, the top of base plate is equipped with integrated circuit board and solid fixed ring, and the through wires hole has all been seted up to solid fixed ring's both sides, and the inside in through wires hole is equipped with a plurality of seal covers, gu fixed ring's top is equipped with the clamp plate, the clamp plate with gu be equipped with sealed the pad between the fixed ring, gu fixed ring's both sides all bond there is first fixture block, the top of clamp plate is equipped with the heating panel, and the bottom both sides of heating panel all are equipped with the threaded rod, and the bottom of threaded rod is rotated and is connected with the elastic rod. The utility model discloses a clamp plate pushes down to cover integrated circuit board, sealed pad and a plurality of seal cover can hoisting device's sealing performance, the second fixture block of elastic rod one side can with first fixture block card each other with, thereby fix the clamp plate, it is comparatively convenient to encapsulate, can make second fixture block and first fixture block separation through pulling the elastic rod simultaneously, thereby be convenient for taking off of clamp plate, repair integrated circuit board.
Description
Technical Field
The utility model relates to a circuit board packaging technology field especially relates to an easily encapsulate integrated circuit packaging structure.
Background
The integrated circuit packaging technology is a process technology for wrapping a chip to avoid the chip from contacting with the outside and preventing the chip from being damaged by the outside, and impurities, harmful gases and even water vapor in the air can corrode a precise circuit on the chip, so that the electrical performance is reduced; in the prior art, the package of the integrated circuit is divided into a detachable type and a non-detachable type.
The undetachable integrated circuit has good sealing performance, but is not easy to repair when damaged, the detachable integrated circuit is often not good, the integrated circuit is easy to damage after long-time use, and meanwhile, the integrated circuit is not easy to install after being detached.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing an easy-to-package integrated circuit package structure.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an easy encapsulation integrated circuit packaging structure, includes the base plate, the top of base plate is equipped with integrated circuit board and solid fixed ring, and the through wires hole has all been seted up to solid fixed ring's both sides, and the inside in through wires hole is equipped with a plurality of seal covers, gu fixed ring's top is equipped with the clamp plate, the clamp plate with gu be equipped with sealed the pad between the fixed ring, gu fixed ring's both sides all bond and have first fixture block, the top of clamp plate is equipped with the heating panel, and the bottom both sides of heating panel all are equipped with the threaded rod, and the bottom of threaded rod is rotated and is connected with the elastic rod, and one side of elastic rod bonds and has the second fixture block.
Furthermore, a plurality of annular grooves are formed in the inner wall of the threading hole, and the seal sleeve is located inside the annular grooves.
Furthermore, a plurality of sealing strips are bonded to the top end of the sealing pad, a plurality of first grooves are formed in the bottom of the pressing plate, and the first grooves are matched with the sealing strips.
Furthermore, the bottom of the pressing plate is provided with a heat absorbing plate, the top end of the heat absorbing plate is welded with a plurality of heat conducting plates, the heat conducting plates penetrate through the pressing plate, and the top ends of the heat conducting plates are welded with the heat radiating plate.
Furthermore, first through-holes are formed in the two sides of the top end of the heat dissipation plate, threaded sleeves are welded at the tops of the first through-holes, and the threaded rods penetrate through the threaded sleeves.
Furthermore, a rotating plate is welded at the top of the threaded rod.
Furthermore, a pulling block is bonded at the bottom of the elastic rod, and one side of the bottom of the pulling block is inclined.
Furthermore, one side of the top of the first clamping block and one side of the bottom of the second clamping block are both inclined.
Furthermore, a plurality of radiating fins are welded at the top of the radiating plate.
The utility model has the advantages that:
1. the pressing plate, the sealing gaskets and the sealing sleeves are arranged, the pressing plate is pressed downwards to cover the integrated circuit board, the sealing gaskets can seal the integrated circuit board, meanwhile, the sealing sleeves can seal the lead-out positions of the leads, and the sealing performance of the device is improved;
2. by arranging the elastic rod, the first fixture block and the second fixture block, when the pressing plate is pressed downwards, the second fixture block on one side of the elastic rod can be clamped with the first fixture block, so that the pressing plate is fixed, the packaging is convenient, and meanwhile, the second fixture block can be separated from the first fixture block by pulling the elastic rod, so that the pressing plate can be conveniently taken down to repair the integrated circuit board;
3. by arranging the sealing strip, after the pressing plate is fixed, the sealing strip can enter the first groove, so that the device is sealed;
4. by arranging the heat absorbing plate, the heat conducting plate and the heat radiating plate, the heat absorbing plate can absorb heat generated in the device, and the heat conducting plate and the heat radiating plate are used for heat radiation and temperature reduction, so that the service life of the device is prolonged;
5. by arranging the threaded rod and the threaded sleeve, the threaded rod can move upwards by rotating the threaded rod, so that the elastic rod is driven to ascend, the pressing plate is in closer contact with the fixing ring, and the sealing performance of the device is improved;
6. through the arrangement of the pull block, the pull block is convenient for pulling the elastic rod to separate the second fixture block from the first fixture block, so that the pressing plate is detached;
7. the first clamping block and the second clamping block on one side of the inclined plate are arranged, so that when the pressing plate is pressed down, the first clamping block and the second clamping block can slide away from each other, and then clamping and fixing are carried out;
8. through setting up the fin, the fin can further promote device's radiating effect, promotes integrated circuit board's life.
Drawings
Fig. 1 is a front sectional view of an easy-to-package ic package structure according to embodiment 1;
fig. 2 is a schematic cross-sectional view of an easy package integrated circuit package structure according to embodiment 1;
fig. 3 is a schematic cross-sectional structure diagram of an easy-package integrated circuit package structure according to embodiment 2.
In the figure: the heat-conducting plate comprises a base plate 1, a fixing ring 2, a threading hole 3, a sealing sleeve 4, a sealing gasket 5, a sealing strip 6, a pressing plate 7, a heat-radiating plate 8, a heat-conducting plate 9, a heat-absorbing plate 10, an integrated circuit board 11, a rotating plate 12, a threaded sleeve 13, a threaded rod 14, an elastic rod 15, a first clamping block 16, a second clamping block 17, a pulling block 18 and a radiating fin 19.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Referring to fig. 1-2, an easily packaged integrated circuit package structure includes a substrate 1, an integrated circuit board 11 and a fixing ring 2 are disposed on the top of the substrate 1, threading holes 3 are disposed on both sides of the fixing ring 2, a plurality of sealing sleeves 4 are disposed inside the threading holes 3, a pressing plate 7 is disposed on the top of the fixing ring 2, a sealing gasket 5 is disposed between the pressing plate 7 and the fixing ring 2, first clamping blocks 16 are bonded on both sides of the fixing ring 2, a heat dissipation plate 8 is disposed on the top end of the pressing plate 7, threaded rods 14 are disposed on both sides of the bottom end of the heat dissipation plate 8, an elastic rod 15 is rotatably connected to the bottom of the threaded rods 14, a second clamping block 17 is bonded on one side of the elastic rod 15 and is pressed down by the pressing plate 7 to cover the integrated circuit board 11, the sealing gasket 5 can seal the integrated circuit board 11, the threading holes 3 can lead out wires, and the sealing sleeves 4 can seal the lead-out portions of the wires, when clamp plate 7 pushes down, second fixture block 17 on one side of elastic rod 15 can block with first fixture block 16 each other to fix clamp plate 7, it is comparatively convenient to encapsulate, can make second fixture block 17 and first fixture block 16 separate through pulling elastic rod 15 simultaneously, thereby be convenient for taking off of clamp plate 7, repair integrated circuit board 11.
Wherein, a plurality of annular grooves have been seted up to the inner wall of through wires hole 3, and seal cover 4 is in annular groove's inside, can fix seal cover 4 through annular groove, and the seal cover 4 of being convenient for simultaneously carries out sealing treatment to the wire.
Wherein, the top of sealed pad 5 bonds and has had a plurality of sealing strips 6, and a plurality of first recesses have been seted up to the bottom of clamp plate 7, first recess and the adaptation of sealing strip 6 looks, and after clamp plate 7 was fixed, sealing strip 6 can get into the inside of first recess to seal the processing to the device.
Wherein, the bottom of clamp plate 7 is equipped with absorber plate 10, and the top welding of absorber plate 10 has a plurality of heat-conducting plates 9, and heat-conducting plate 9 runs through clamp plate 7, and the top of heat-conducting plate 9 and the welding of heating panel 8 can the inside heat that produces of absorbing device through absorber plate 10 to carry out the cooling of dispelling the heat through heat-conducting plate 9 and heating panel 8, extension fixture's life.
Wherein, first through-hole has all been seted up to the top both sides of heating panel 8, and the top welding of first through-hole has thread bush 13, and threaded rod 14 runs through thread bush 13, can make threaded rod 14 upward movement through rotating threaded rod 14 to drive elastic rod 15 and rise, thereby make clamp plate 7 inseparabler with solid fixed ring 2 contacts, hoisting device's leakproofness.
Wherein, the top of threaded rod 14 is welded with rotating plate 12, is convenient for rotating threaded rod 14 through rotating plate 12.
The bottom of the elastic rod 15 is bonded with a pull block 18, one side of the bottom of the pull block 18 is inclined, the elastic rod 15 is conveniently pulled through the pull block 18, the second fixture block 17 is separated from the first fixture block 16, and therefore the pressing plate 7 is detached.
Wherein, top one side of first fixture block 16 and bottom one side of second fixture block 17 all are the slope form, and when being convenient for clamp plate 8 to push down on the one side that is the slope form, first fixture block 16 can slide each other with second fixture block 17, blocks afterwards and fixes.
The working principle is as follows: the pressing plate 7 is pressed downwards to cover the integrated circuit board 11, the sealing gasket 5 can seal the integrated circuit board 11, the lead-out holes 3 can lead out leads, the sealing sleeves 4 can seal the lead-out positions, when the pressing plate 7 is pressed downwards, the second clamping block 17 on one side of the elastic rod 15 is clamped with the first clamping block 16, the pressing plate 7 is fixed, the sealing is convenient, and meanwhile, the elastic rod 15 can be pulled to separate the second clamping block 17 from the first clamping block 16, so that the pressing plate 7 can be conveniently taken down to repair the integrated circuit board 11;
the sealing sleeve 4 can be fixed through the annular groove, and meanwhile, the sealing sleeve 4 can conveniently seal the lead;
after the pressing plate 7 is fixed, the sealing strip 6 enters the interior of the first groove, so that the device is sealed;
the heat generated in the device can be absorbed by the heat absorbing plate 10, and the heat is dissipated and cooled by the heat conducting plate 9 and the heat dissipating plate 8, so that the service life of the device is prolonged;
the threaded rod 14 can move upwards by rotating the threaded rod 14, so that the elastic rod 15 is driven to ascend, the pressing plate 7 is in closer contact with the fixing ring 2, and the sealing performance of the device is improved;
the elastic rod 15 is conveniently pulled through the pulling block 18, so that the second fixture block 17 is separated from the first fixture block 16, and the pressing plate 7 is detached;
the inclined side facilitates the sliding of the first latch 16 and the second latch 17 away from each other when the pressing plate 8 is pressed down, and then the latching and fixing are performed.
Example 2
Referring to fig. 3, in this embodiment, compared with embodiment 1, in order to increase the practicability of the device, a plurality of heat dissipation fins 19 are welded on the top of the heat dissipation plate 8, so that the heat dissipation effect of the device can be further improved by the heat dissipation fins 19, and the service life of the integrated circuit board 11 is prolonged.
The working principle is as follows: the pressing plate 7 is pressed downwards to cover the integrated circuit board 11, the sealing gasket 5 can seal the integrated circuit board 11, the lead-out holes 3 can lead out leads, the sealing sleeves 4 can seal the lead-out positions, when the pressing plate 7 is pressed downwards, the second clamping block 17 on one side of the elastic rod 15 is clamped with the first clamping block 16, the pressing plate 7 is fixed, the sealing is convenient, and meanwhile, the elastic rod 15 can be pulled to separate the second clamping block 17 from the first clamping block 16, so that the pressing plate 7 can be conveniently taken down to repair the integrated circuit board 11;
the sealing sleeve 4 can be fixed through the annular groove, and meanwhile, the sealing sleeve 4 can conveniently seal the lead;
after the pressing plate 7 is fixed, the sealing strip 6 enters the interior of the first groove, so that the device is sealed;
the heat generated in the device can be absorbed by the heat absorbing plate 10, and the heat is dissipated and cooled by the heat conducting plate 9 and the heat dissipating plate 8, so that the service life of the device is prolonged;
the threaded rod 14 can move upwards by rotating the threaded rod 14, so that the elastic rod 15 is driven to ascend, the pressing plate 7 is in closer contact with the fixing ring 2, and the sealing performance of the device is improved;
the elastic rod 15 is conveniently pulled through the pulling block 18, so that the second fixture block 17 is separated from the first fixture block 16, and the pressing plate 7 is detached;
the inclined side is convenient for the first fixture block 16 and the second fixture block 17 to slide away from each other when the pressing plate 8 is pressed down, and then the first fixture block and the second fixture block are clamped and fixed;
the heat dissipation effect of the device can be further improved through the heat dissipation fins 19, and the service life of the integrated circuit board 11 can be prolonged.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (9)
1. The utility model provides an easy encapsulation integrated circuit packaging structure, includes base plate (1), its characterized in that, the top of base plate (1) is equipped with integrated circuit board (11) and solid fixed ring (2), and through wires hole (3) have all been seted up to the both sides of solid fixed ring (2), and the inside of through wires hole (3) is equipped with a plurality of seal covers (4), the top of solid fixed ring (2) is equipped with clamp plate (7), clamp plate (7) with gu be equipped with sealed pad (5) between fixed ring (2), gu the both sides of fixed ring (2) all bond and have first fixture block (16), the top of clamp plate (7) is equipped with heating panel (8), and the bottom both sides of heating panel (8) all are equipped with threaded rod (14), and the bottom of threaded rod (14) is rotated and is connected with elastic rod (15), and one side bonding of elastic rod (15) has second fixture block (17).
2. The package structure of an easily packaged integrated circuit according to claim 1, wherein the inner wall of the threading hole (3) is formed with a plurality of annular grooves, and the sealing sleeve (4) is located inside the annular grooves.
3. The package structure of an easily packaged ic according to claim 1, wherein the top end of the sealing gasket (5) is bonded with a plurality of sealing strips (6), the bottom of the pressing plate (7) is provided with a plurality of first grooves, and the first grooves are matched with the sealing strips (6).
4. The easy-to-package integrated circuit package structure according to claim 1, wherein the bottom of the pressing plate (7) is provided with a heat absorbing plate (10), the top end of the heat absorbing plate (10) is fixedly connected with a plurality of heat conducting plates (9), the heat conducting plates (9) penetrate through the pressing plate (7), and the top ends of the heat conducting plates (9) are welded with the heat dissipating plate (8).
5. The package structure of an easily packaged ic according to claim 1, wherein the top of the heat dissipation plate (8) has first through holes on both sides, the top of the first through hole is fixedly connected with a threaded sleeve (13), and the threaded rod (14) penetrates through the threaded sleeve (13).
6. The easy-to-package integrated circuit package structure of claim 5, wherein a rotating plate (12) is fixedly connected to the top of the threaded rod (14).
7. The easy-to-package integrated circuit package structure of claim 1, wherein a pull block (18) is bonded to the bottom of the elastic rod (15), and one side of the bottom of the pull block (18) is inclined.
8. The package structure of claim 1, wherein the top side of the first latch (16) and the bottom side of the second latch (17) are both inclined.
9. An easily encapsulated ic package according to any of claims 1-8, characterized in that a plurality of heat sinks (19) are fixedly attached to the top of the heat spreader (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120952764.6U CN214411167U (en) | 2021-05-07 | 2021-05-07 | Easy-to-package integrated circuit packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120952764.6U CN214411167U (en) | 2021-05-07 | 2021-05-07 | Easy-to-package integrated circuit packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN214411167U true CN214411167U (en) | 2021-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120952764.6U Active CN214411167U (en) | 2021-05-07 | 2021-05-07 | Easy-to-package integrated circuit packaging structure |
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| Country | Link |
|---|---|
| CN (1) | CN214411167U (en) |
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2021
- 2021-05-07 CN CN202120952764.6U patent/CN214411167U/en active Active
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