CN104332453A - Double-side-fixed heat radiation structure based on plastic package type IPM lead frame - Google Patents
Double-side-fixed heat radiation structure based on plastic package type IPM lead frame Download PDFInfo
- Publication number
- CN104332453A CN104332453A CN201310309529.7A CN201310309529A CN104332453A CN 104332453 A CN104332453 A CN 104332453A CN 201310309529 A CN201310309529 A CN 201310309529A CN 104332453 A CN104332453 A CN 104332453A
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- China
- Prior art keywords
- lead frame
- double
- ipm
- radiator structure
- extension
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a double-side-fixed heat radiation structure based on a plastic package type IPM lead frame, which comprises a first lead frame and a second lead frame which are embedded into two sides of the IPM, and a third lead frame which is arranged at the bottom surface of the IPM. The first lead frame, the third lead frame and the second lead frame are successively connected and are integrally formed. The third lead frame is totally or partially provided with heat radiating plates. According to the double-side-fixed heat radiation structure based on the plastic package type IPM lead frame, sinking treatment is performed on two sides of the lead frame so that the third lead frame at the bottom surface is connected with two sides of the lead frame. An enough supporting force for sufficiently exposing the heat radiating plates can be ensured, and furthermore the heat radiating plates and the upper surface of the IPM are in one same horizontal surface, thereby improving heat radiation effect and improving reliability and stability of the product.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation, particularly relate to a kind of double-side fastening radiator structure based on plastic sealed IPM lead frame.
Background technology
Plastic sealed IPM(Intelligent Power Module, Intelligent Power Module), be the Novel control module that igbt chip and drive circuit, control circuit and overcurrent, under-voltage, short circuit, the protective circuit such as overheated are integrated in one.It is a kind of complexity, advanced power model, automatically can realize overcurrent, under-voltage, short circuit and the complicated protection function such as overheated, thus have intelligent characteristic.Simultaneously it has the advantages such as low cost, miniaturization, highly reliable, easy use, and be widely used in the fields such as frequency-conversion domestic electric appliances, inverter, Industry Control, Social benefit and economic benefit is very considerable.
For plastic sealed IPM, it be a fin just above, be very large containing the difficulty of gelled IPM in Shooting Technique, should ensure that fin can expose completely, also will ensure that fin and module upper surface are same level.
Shown in ginseng Fig. 1, in prior art plastic sealed IPM module, institute's extensive use is the monolateral fixing cooling fins of lead frame, and what that is rely on lead frame fixes fin, and another side is used for welding driving chip.It has following shortcoming:
The monolateral fixing cooling fins of lead frame can cause fin cannot be exposed at IPM upper surface completely;
Fin surface may cannot be in same level with IPM upper surface because of the skew of fixing point, thus reduces the radiating effect of IPM.
Therefore, for above-mentioned technical problem, be necessary to provide a kind of double-side fastening radiator structure based on plastic sealed IPM lead frame.
Summary of the invention
In view of this, the invention provides a kind of double-side fastening radiator structure based on plastic sealed IPM lead frame.
To achieve these goals, the technical scheme that provides of the embodiment of the present invention is as follows:
A kind of double-side fastening radiator structure based on plastic sealed IPM lead frame, comprise the first lead frame and the second lead frame that are embedded at IPM both sides and the 3rd lead frame being positioned at IPM bottom surface, described first lead frame, the 3rd lead frame are connected and one-body molded setting successively with the second lead frame, all or part ofly under described 3rd lead frame are fitted with fin.
As a further improvement on the present invention, described 3rd lead frame comprises main part and is positioned at the first extension and the second extension that main part both sides are connected with the first lead frame and the second lead frame respectively.
As a further improvement on the present invention, all or part ofly under described main part be fitted with fin, described fin scribble heat-conducting silicone grease or heat-conduction epoxy resin.
As a further improvement on the present invention, described first extension and/or the second extension and main part are not in same level.
As a further improvement on the present invention, the top of described first extension and the second extension is positioned in same level.
As a further improvement on the present invention, described first lead frame and the second lead frame are positioned in same level.
As a further improvement on the present invention, described first lead frame and the second lead frame kink that comprises the installation portion parallel with IPM bottom surface respectively and be connected with installation portion.
As a further improvement on the present invention, described first lead frame, the second lead frame or the 3rd lead frame are welded with some chips.
As a further improvement on the present invention, described chip comprises driving chip and some power chips.
As a further improvement on the present invention, described chip and the first lead frame, the second lead frame or the 3rd lead frame are electrically conducted by bonding line.
Sinking process is carried out in the both sides of lead frame by the double-side fastening radiator structure that the present invention is based on plastic sealed IPM lead frame, the 3rd lead frame of bottom surface is made to be connected to the both sides of lead frame, can ensure that fin can obtain enough support forces and fully expose, and be in same level with IPM upper surface, improve the effect of heat radiation, improve the reliability and stability of product.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation based on the monolateral fixing radiator structure of plastic sealed IPM lead frame in prior art;
Fig. 2 is the structural representation based on the double-side fastening radiator structure of plastic sealed IPM lead frame in an embodiment of the present invention.
Embodiment
The invention discloses a kind of double-side fastening radiator structure based on plastic sealed IPM lead frame, comprise the first lead frame and the second lead frame that are embedded at IPM both sides and the 3rd lead frame being positioned at IPM bottom surface, first lead frame, the 3rd lead frame are connected and one-body molded setting successively with the second lead frame, all or part ofly under the 3rd lead frame are fitted with fin.
Preferably, the 3rd lead frame comprises main part and is positioned at the first extension and the second extension that main part both sides are connected with the first lead frame and the second lead frame respectively.
Preferably, all or part ofly under main part be fitted with fin, fin scribble heat-conducting silicone grease or heat-conduction epoxy resin.
Preferably, the first extension and/or the second extension and main part are not in same level.
Preferably, the top of the first extension and the second extension is positioned in same level.
Preferably, the first lead frame and the second lead frame are positioned in same level.
Preferably, the first lead frame and the second lead frame kink that comprises the installation portion parallel with IPM bottom surface respectively and be connected with installation portion.
Preferably, the first lead frame, the second lead frame or the 3rd lead frame are welded with some chips.
Preferably, chip comprises driving chip and some power chips.
Preferably, chip and the first lead frame, the second lead frame or the 3rd lead frame are electrically conducted by bonding line.
Sinking process is carried out in the both sides of lead frame by the double-side fastening radiator structure that the present invention is based on plastic sealed IPM lead frame, connecting portion is made to be fixed on the both sides of lead frame, can ensure that heat dissipating layer fully exposes, and be in same level with IPM upper surface, improve the effect of heat radiation, improve the reliability and stability of product.Technical scheme in the present invention is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Ginseng Figure 1 shows that the structural representation based on the monolateral fixing radiator structure of plastic sealed IPM lead frame in prior art.Comprise an IPM shell 1 ', be installed on the 3rd lead frame 2 ' of IPM enclosure, the first lead frame 3 ' being installed on IPM shell both sides and the second lead frame 4 '.First lead frame 3 ' and the second lead frame 4 ' are fixedly installed respectively and are fixedly installed with IPM shell 1 ', and the first lead frame 3 ' and the one-body molded setting of the 3rd lead frame 2 ', the second lead frame 4 ' is separated setting separately.
Wherein, the extension 22 ' that the 3rd lead frame 2 ' comprises main part 21 ' and is connected with main part 21 ', extension 22 ' and main part 21 ' bend and arrange, and are not positioned in same level.First lead frame 3 ' is fixedly connected with the extension 22 ' of the 3rd lead frame 2 ', and the main part 21 ' of the second lead frame 4 ' and the 3rd lead frame 2 ' is electrically conducted by bonding line 5 '.The bottom of the 3rd lead frame 2 ' is provided with fin, thus increases radiating effect.
The main part 21 ' of the 3rd lead frame 2 ' is provided with some power chips 61 ', driving chip 62 ' is arranged on the second lead frame 4 ', and power chip 61 ' and the first lead frame 3 ', the second lead frame 4 ' or the 3rd lead frame 2 ' and driving chip 62 ' and the second lead frame 4 ' are all electrically conducted by bonding line 5 '.
Adopt the monolateral fixing radiator structure of lead frame that the main part of the 3rd lead frame can be caused cannot to be exposed at IPM upper surface completely in prior art; Meanwhile, fin surface may cannot be in same level with IPM upper surface because of the skew of fixing point, thus reduces the radiating effect of IPM.
Ginseng Figure 2 shows that the structural representation based on the double-side fastening radiator structure of plastic sealed IPM lead frame in an embodiment of the present invention.
Comprise an IPM shell 1 based on the double-side fastening radiator structure of plastic sealed IPM lead frame in present embodiment, be installed on the 3rd lead frame 2, first lead frame 3 and the second lead frame 4 of IPM enclosure.First lead frame 3 and the second lead frame 4 are fixedly installed respectively and arrange with IPM shell 1 fixed symmetrical.
Wherein, the 3rd lead frame 2 comprises main part 21 and the first extension 22 of being extended by main part 21 both sides and the second extension 23, first extension 22 and the second extension 23 bend with main part 21 and arrange, and is not positioned in same level.Preferably, the first extension 22 is equal with main part 21 bending angle with the second extension 23 in the present embodiment, and length is also equal, and the top of the first extension 22 and the second extension 23 is positioned in same level.In other embodiments, length and the bending angle of the first extension 22 and the second extension 23 can be arranged according to different needs, as long as the first lead frame 3 and the second lead frame 4 and the first extension 22 and the second extension 23 can be made to fixedly mount the effect that can play location.
First lead frame 3 is fixedly connected with the first extension 22 of the 3rd lead frame 2, and the second lead frame 4 is fixedly connected with the second extension 23 of the 3rd lead frame 2.Main part 21 and the IPM shell 1 of the 3rd lead frame 2 are in same level, main part 21 bottom is attached to that IPM enclosure bottom place is all or part of is provided with fin (not shown), fin can be the very thin one deck copper sheet or the aluminum alloy sheet that are attached to bottom, scribble heat-conducting silicone grease or epoxy resin on a heat sink, thus improve the effect of heat radiation.
In present embodiment, the main part 21 of the 3rd lead frame 2 is provided with some power chips 61 and driving chip 62.Power chip 61 and the first lead frame 3, the 3rd lead frame 2 and driving chip 62 and the 3rd lead frame 2 are all electrically conducted by bonding line 5.
The kink (non-label) that first lead frame 3 and the second lead frame 4 comprise the installation portion (non-label) parallel with IPM bottom surface respectively and be connected with installation portion, installation portion and kink are that certain angle is arranged, and in present embodiment, angle is set to slightly larger than 90 °.
Preferably, in present embodiment, the double-side fastening radiator structure of IPM lead frame adopts plastic sealed encapsulation, certainly also can adopt the packaged type of other materials or form in other embodiments.
Compared with prior art, lead frame both sides sink design that what the wire frame double-side fastening radiator structure of plastic sealed IPM of the present invention adopted is, by the both sides of lead frame all to bottom fold, and heat dissipating layer is fixedly got on, first lead frame and the second lead frame and the one-body molded setting of the 3rd lead frame, fixedly can be fitted in the 3rd lead frame on IPM bottom surface by the extension of both sides.
As can be seen from the above technical solutions, sinking process is carried out in the both sides of lead frame by the double-side fastening radiator structure that the present invention is based on plastic sealed IPM lead frame, the 3rd lead frame of bottom surface is made to be connected to the both sides of lead frame, can ensure that fin can obtain enough support forces and fully expose, and be in same level with IPM upper surface, improve the effect of heat radiation, improve the reliability and stability of product.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through suitable conjunction, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (10)
1. the double-side fastening radiator structure based on plastic sealed IPM lead frame, comprise the first lead frame and the second lead frame that are embedded at IPM both sides and the 3rd lead frame being positioned at IPM bottom surface, it is characterized in that, described first lead frame, the 3rd lead frame are connected and one-body molded setting successively with the second lead frame, all or part ofly under described 3rd lead frame are fitted with fin.
2. double-side fastening radiator structure according to claim 1, is characterized in that, described 3rd lead frame comprises main part and is positioned at the first extension and the second extension that main part both sides are connected with the first lead frame and the second lead frame respectively.
3. double-side fastening radiator structure according to claim 2, is characterized in that, all or part ofly under described main part is fitted with fin, described fin scribbles heat-conducting silicone grease or heat-conduction epoxy resin.
4. double-side fastening radiator structure according to claim 2, is characterized in that, described first extension and/or the second extension and main part are not in same level.
5. double-side fastening radiator structure according to claim 2, is characterized in that, the top of described first extension and the second extension is positioned in same level.
6. double-side fastening radiator structure according to claim 5, is characterized in that, described first lead frame and the second lead frame are positioned in same level.
7. double-side fastening radiator structure according to claim 1, is characterized in that, the kink that described first lead frame and the second lead frame comprise the installation portion parallel with IPM bottom surface respectively and be connected with installation portion.
8. double-side fastening radiator structure according to claim 1, is characterized in that, described first lead frame, the second lead frame or the 3rd lead frame are welded with some chips.
9. double-side fastening radiator structure according to claim 8, is characterized in that, described chip comprises driving chip and some power chips.
10. double-side fastening radiator structure according to claim 8, is characterized in that, described chip and the first lead frame, the second lead frame or the 3rd lead frame are electrically conducted by bonding line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310309529.7A CN104332453A (en) | 2013-07-22 | 2013-07-22 | Double-side-fixed heat radiation structure based on plastic package type IPM lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310309529.7A CN104332453A (en) | 2013-07-22 | 2013-07-22 | Double-side-fixed heat radiation structure based on plastic package type IPM lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104332453A true CN104332453A (en) | 2015-02-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310309529.7A Pending CN104332453A (en) | 2013-07-22 | 2013-07-22 | Double-side-fixed heat radiation structure based on plastic package type IPM lead frame |
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| CN (1) | CN104332453A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106098652A (en) * | 2016-08-19 | 2016-11-09 | 广东美的制冷设备有限公司 | A kind of SPM and manufacture method thereof |
| CN106098650A (en) * | 2016-07-29 | 2016-11-09 | 广东美的制冷设备有限公司 | A kind of SPM and manufacture method thereof |
| CN106158801A (en) * | 2016-07-29 | 2016-11-23 | 广东美的制冷设备有限公司 | A kind of SPM and manufacture method thereof |
| CN106313422A (en) * | 2015-06-30 | 2017-01-11 | 西安永电电气有限责任公司 | Injection molding method for plastic encapsulated type IPM and plastic encapsulated type IPM |
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| Publication number | Priority date | Publication date | Assignee | Title |
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Application publication date: 20150204 |