CN216698414U

CN216698414U - LED light-emitting chip packaging structure

Info

Publication number: CN216698414U
Application number: CN202220216866.6U
Authority: CN
Inventors: 李康; 李超; 何鹏
Original assignee: Xiangneng Hualei Optoelectrical Co Ltd
Current assignee: Xiangneng Hualei Optoelectrical Co Ltd
Priority date: 2022-01-26
Filing date: 2022-01-26
Publication date: 2022-06-07
Anticipated expiration: 2032-01-26

Abstract

The utility model provides an LED light-emitting chip packaging structure, which comprises: a bottom shell, an upper shell and a radiating fin; the lower parts of the two sides of the bottom shell are provided with fixed seats, and the bottom shell is fixedly connected with the fixed seats in a welding mode; the wire grooves are respectively positioned on one sides of the bottom shell and the upper shell, and the wire grooves, the bottom shell and the upper shell are of an integrated structure; the silicon carbide substrate is arranged at the lower part of the bottom shell and is connected with the bottom shell in a bonding mode; the upper shell is arranged at the upper part of the bottom shell and fixedly connected with the bottom shell through bolts; the radiating fins are arranged inside the upper shell and connected with the upper shell in an embedding mode. Through the improvement structurally, it is good to have the radiating effect, and sealing performance is strong, improves its practical performance and practical value advantage greatly to effectual problem and the not enough that appear in having solved current device.

Description

LED light-emitting chip packaging structure

Technical Field

The utility model relates to the technical field of LED chip packaging, in particular to an LED light-emitting chip packaging structure.

Background

The main material of the LED light-emitting chip is monocrystalline silicon. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. When the two semiconductors are connected, a P-N junction is formed between them. When current is applied to the wafer through the wire, electrons are pushed to the P region where they recombine with holes and then emit energy in the form of photons, which is the principle of LED light emission.

However, the existing packaging structure of the LED chip has certain disadvantages, for example, the heat of the LED chip cannot be well dissipated after the LED chip is packaged, so that the LED chip is damaged or the service life of the LED chip is reduced due to too high heat, and the packaged LED chip has a poor sealing effect and is easy to enter dust to affect light emission, thereby causing problems such as great loss of practical performance.

In view of the above, research and improvement are made to solve the existing problems, and an LED light emitting chip package structure is provided to achieve the purpose of solving the problems and improving the practical value through the technology.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to an LED light emitting chip package structure to solve the above problems and disadvantages of the related art.

In order to achieve the above object, the present invention provides an LED light emitting chip package structure, which is achieved by the following specific technical means:

an LED light emitting chip package structure comprising: the device comprises a bottom shell, a fixed seat, a wire groove, a silicon carbide substrate, a sealing gasket, an upper shell and a radiating fin; the lower parts of the two sides of the bottom shell are provided with fixed seats, and the bottom shell is fixedly connected with the fixed seats in a welding mode; the wire grooves are respectively positioned on one sides of the bottom shell and the upper shell, and the wire grooves, the bottom shell and the upper shell are of an integrated structure; the silicon carbide substrate is arranged at the lower part of the bottom shell and is connected with the bottom shell in a bonding mode; the sealing gasket is arranged on the upper surface of the bottom shell and connected with the bottom shell in an adhesion mode; the upper shell is arranged at the upper part of the bottom shell and fixedly connected with the bottom shell through bolts; the cooling fin sets up the inside at the epitheca, and the cooling fin is connected through the embedding mode with the epitheca.

As a further optimization of the technical solution, in the LED light emitting chip package structure of the present invention, the heat dissipation plate is a rectangular sheet structure, and a plurality of positions are arranged inside the upper case in a transverse arrangement manner.

As a further optimization of the technical scheme, one end of the radiating fin of the LED light-emitting chip packaging structure is flush with the inner wall of the upper shell, the other end of the radiating fin is 3mm higher than the outer wall of the upper shell, and the radiating fin is made of brass.

As a further optimization of the technical scheme, the wire groove of the LED light-emitting chip package structure of the present invention is an arc-shaped groove, and the wire groove on the bottom shell and the wire groove on the top shell form a circular hole-shaped structure.

As a further optimization of the technical scheme, in the LED light emitting chip package structure of the present invention, the sealing gasket is a rectangular frame-shaped structure made of a rubber gasket, and the sealing gasket is fixedly disposed between the bottom case and the upper case.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

1. according to the LED light-emitting chip packaging structure, the radiating fins are arranged in the upper shell, so that heat generated by the LED chip packaged in the device can be conducted out and dissipated in time by the radiating fins, the heat of the LED chip is reduced, the service life of the LED chip is prolonged, the LED chip packaging structure is not easy to damage, and the radiating effect and the practicability of the device are greatly improved.

2. According to the LED light-emitting chip packaging structure, the sealing gasket is arranged between the bottom shell and the upper shell, so that the sealing effect after packaging between the bottom shell and the upper shell can be improved, dust is prevented from entering the interior to cause influence, and the practical value of the device is greatly improved.

3. The utility model has the advantages of good heat dissipation effect, strong sealing performance, great improvement of practical performance and practical value and the like by improving the structure of the device, thereby effectively solving the problems and the defects in the existing device.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic illustration of an explosive structure according to the present invention;

FIG. 2 is a schematic view of an assembly structure of the present invention;

fig. 3 is a schematic view of the upper case structure of the present invention.

In the figure: bottom shell 1, fixing base 2, wire casing 3, carborundum substrate 4, sealed pad 5, epitheca 6, fin 7.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

It is to be noted that, in the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the utility model.

Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Meanwhile, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, for example, as being fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 3, the present invention provides a specific technical embodiment of an LED light emitting chip package structure:

an LED light emitting chip package structure comprising: the device comprises a bottom shell 1, a fixed seat 2, a wire casing 3, a silicon carbide substrate 4, a sealing gasket 5, an upper shell 6 and a radiating fin 7; the lower parts of the two sides of the bottom shell 1 are provided with fixed seats 2, and the bottom shell 1 is fixedly connected with the fixed seats 2 in a welding mode; the wire groove 3 is respectively positioned at one side of the bottom shell 1 and the upper shell 6, and the wire groove 3, the bottom shell 1 and the upper shell 6 are of an integrated structure; the silicon carbide substrate 4 is arranged at the lower part of the bottom shell 1, and the silicon carbide substrate 4 is connected with the bottom shell 1 in an adhesion mode; the sealing gasket 5 is arranged on the upper surface of the bottom shell 1, and the sealing gasket 5 is connected with the bottom shell 1 in an adhesion mode; the upper shell 6 is arranged at the upper part of the bottom shell 1, and the upper shell 6 is fixedly connected with the bottom shell 1 through bolts; the heat sink 7 is disposed inside the upper case 6, and the heat sink 7 is connected to the upper case 6 by an embedding manner.

Specifically, the heat dissipation fins 7 are rectangular sheet-shaped structures, and the heat dissipation fins 7 are arranged in a plurality of positions in the upper case 6 in a transverse arrangement manner.

Specifically, the one end of fin 7 flushes with the inner wall of epitheca 6, and the other end exceeds 6 outer walls of epitheca 3mm, and fin 7 adopts the brass to make to the one end of fin 7 is connected with the LED chip laminating of encapsulation drain pan 1 and epitheca 6, is convenient for give off the timely derivation of the heat that the LED chip produced, thereby plays radiating effect.

Specifically, the wire casing 3 is an arc-shaped groove, and the wire casing 3 on the bottom case 1 and the wire casing 3 on the upper case 6 form a circular hole-shaped structure, and the circular hole-shaped structure formed by the wire casings 3 can facilitate the LED chip to connect the power line.

Specifically, sealed 5 of filling up is the rectangle frame column structure that the rubber pad was made, and sealed 5 of filling up is fixed to be set up in the centre of drain pan 1 and epitheca 6, and sealed 5 of filling up can improve the sealed effect after the encapsulation between drain pan 1 and the epitheca 6, avoids the dust to get into inside mouth LED chip and causes the influence.

The method comprises the following specific implementation steps:

when the device is used, the LED chip lamp beads are placed in the bottom shell 1 towards the silicon carbide substrate 4, the welded power lead is clamped into the wire slot 3, then the upper shell 6 is buckled on the bottom shell 1 and is fixed by using the bolt, so that the LED chip can be packaged, meanwhile, heat generated by the LED chip can be timely derived and emitted through the upper radiating fins 7, the radiating effect is improved, the service life is prolonged, the damage is reduced, and the practical performance and the practical value of the device are greatly improved.

In summary, the following steps: according to the LED light-emitting chip packaging structure, the radiating fins are arranged in the upper shell, so that heat generated by the LED chip packaged in the device can be conducted and dissipated in time by utilizing the radiating fins, the heat of the LED chip is reduced, the service life of the LED chip is prolonged, the LED chip packaging structure is not easy to damage, and the radiating effect and the practicability of the device are greatly improved; through set up sealed the pad between drain pan and epitheca to can improve the sealed effect after the encapsulation between the two, avoid the dust to get into inside and cause the influence, improve the device's practical value then greatly, thereby the effectual problem and the not enough that appear in having solved current device.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An LED light emitting chip package structure comprising: the device comprises a bottom shell (1), a fixed seat (2), a wire groove (3), a silicon carbide substrate (4), a sealing gasket (5), an upper shell (6) and a radiating fin (7); the method is characterized in that: the lower parts of two sides of the bottom shell (1) are provided with fixed seats (2), and the bottom shell (1) is fixedly connected with the fixed seats (2) in a welding mode; the wire grooves (3) are respectively positioned on one sides of the bottom shell (1) and the upper shell (6), and the wire grooves (3), the bottom shell (1) and the upper shell (6) are of an integrated structure; the silicon carbide substrate (4) is arranged at the lower part of the bottom shell (1), and the silicon carbide substrate (4) is connected with the bottom shell (1) in an adhesion mode; the sealing gasket (5) is arranged on the upper surface of the bottom shell (1), and the sealing gasket (5) is connected with the bottom shell (1) in an adhesion mode; the upper shell (6) is arranged at the upper part of the bottom shell (1), and the upper shell (6) is fixedly connected with the bottom shell (1) through bolts; the radiating fins (7) are arranged inside the upper shell (6), and the radiating fins (7) are connected with the upper shell (6) in an embedding mode.

2. The LED light emitting chip package structure of claim 1, wherein: the radiating fins (7) are of rectangular sheet structures, and the radiating fins (7) are arranged in the upper shell (6) in a transverse arrangement mode at multiple positions.

3. The LED light emitting chip package structure of claim 1, wherein: one end of the radiating fin (7) is flush with the inner wall of the upper shell (6), the other end of the radiating fin is 3mm higher than the outer wall of the upper shell (6), and the radiating fin (7) is made of brass.

4. The LED light emitting chip package structure of claim 1, wherein: the wire casing (3) is an arc-shaped groove, and the wire casing (3) on the bottom shell (1) and the wire casing (3) on the upper shell (6) form a circular hole-shaped structure.

5. The LED light emitting chip package structure of claim 1, wherein: the sealing gasket (5) is of a rectangular frame-shaped structure made of rubber gaskets, and the sealing gasket (5) is fixedly arranged between the bottom shell (1) and the upper shell (6).