CN216133860U - Pin frame's preforming frame and preforming frame integrated configuration - Google Patents
Pin frame's preforming frame and preforming frame integrated configuration Download PDFInfo
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- CN216133860U CN216133860U CN202121728622.8U CN202121728622U CN216133860U CN 216133860 U CN216133860 U CN 216133860U CN 202121728622 U CN202121728622 U CN 202121728622U CN 216133860 U CN216133860 U CN 216133860U
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- frame
- rubber pad
- pin
- lead frame
- fixed
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Abstract
The utility model discloses a pressing sheet frame of a pin frame and a pressing sheet frame combined structure, wherein a main frame is arranged and comprises a first side part, a second side part and a connecting part; the pin structure comprises a first pin part and a second pin part, wherein the first pin part comprises a first elastic element and a first rubber pad, the second pin part comprises a second elastic element and a second rubber pad, the first elastic element is fixed with the first rubber pad and the first side part, and the second elastic element is fixed with the second rubber pad and the second side part; the first rubber pad and the second rubber pad are used for being in contact with the pin frame; the pin structure formed by the elastic element and the rubber pad is adopted, the rubber pad is pressed downwards by the elastic element to ensure that the pressing sheet frame is in good contact with the surfaces of the two sides of the pin frame, and the height can be adjusted; the rubber pad and the contact of the pin frame can limit the movement or the shaking of the pin frame in the track, improve the stability, avoid the damage to the pin frame and be widely applied to the technical field of packaging.
Description
Technical Field
The utility model relates to the technical field of packaging, in particular to a pressing sheet frame of a lead frame and a pressing sheet frame combined structure.
Background
With the development of power semiconductor packages towards intellectualization and intensification, in order to mount more chips and electronic components on a Copper-clad ceramic substrate (DBC) in a module, it is generally necessary to control the accuracy of da (die attach) within a certain range. When chip mounting is performed, various factors including vibration of moving parts of the device may cause a lead frame (lead frame) to shake in a track, so that a mounting area is changed after the device completes pr (pattern recognition), thereby seriously affecting mounting accuracy and having low stability.
SUMMERY OF THE UTILITY MODEL
To solve the above technical problems, the present invention aims to: a wafer frame and wafer frame integrated configuration of a lead frame that provides stability.
The technical scheme adopted by the utility model is as follows:
a leadframe wafer frame, comprising:
the main frame comprises a first side part, a second side part and a connecting part, and the connecting part is fixedly connected with the first side part and the second side part;
the pin structure comprises a first pin part and a second pin part, wherein the first pin part comprises a first elastic element and a first rubber pad, the second pin part comprises a second elastic element and a second rubber pad, the first elastic element is fixed with the first rubber pad and the first side part, and the second elastic element is fixed with the second rubber pad and the second side part; the first rubber pad and the second rubber pad are used for contacting with the lead frame.
Further, the connecting part is used for being fixed with a lifting module of the loading machine.
Further, the first side portion and the second side portion are hollowed out and used for exposing the copper-clad ceramic substrate.
Further, pin frame's preforming frame still includes detachable crossbeam portion, crossbeam portion one end with first lateral part is fixed, the crossbeam portion other end is fixed in the second lateral part.
Further, first side includes a plurality of mounting hole, a plurality of the mounting hole is followed the extending direction interval of first side sets up, crossbeam portion one end has the bellying, the bellying with the mounting hole cooperation is fixed.
Further, the second side portion comprises a plurality of mounting grooves, the mounting grooves are arranged at intervals along the extending direction of the second side portion, and the other end of the beam portion is placed in the mounting grooves.
Further, the wafer frame of the lead frame further comprises a detachable wafer portion, and the wafer portion is fixed with the beam portion and the second side portion.
Further, the bead part is placed on the upper surface of the second side part.
Furthermore, the other end of the beam part comprises a first fixing hole, the pressing strip part comprises a plurality of second fixing holes, the second fixing holes are arranged at intervals along the extending direction of the pressing strip part, the first fixing hole enters the mounting groove, each second fixing hole corresponds to one mounting groove, and the first fixing hole and the second fixing hole are used for being fixed through a fixing piece.
The embodiment of the utility model also provides a pressing sheet frame combination structure which comprises a fixing piece and the pressing sheet frame of the lead frame.
The utility model has the beneficial effects that: the main frame comprises a first side part, a second side part and a connecting part, and the connecting part is fixedly connected with the first side part and the second side part; the pin structure comprises a first pin part and a second pin part, wherein the first pin part comprises a first elastic element and a first rubber pad, the second pin part comprises a second elastic element and a second rubber pad, the first elastic element is fixed with the first rubber pad and the first side part, and the second elastic element is fixed with the second rubber pad and the second side part; the first rubber pad and the second rubber pad are used for being in contact with the pin frame; the pin structure formed by the elastic element and the rubber pad is adopted, the rubber pad can be pressed downwards by the elastic element in a certain range, the good contact between the pressure sheet frame and the surfaces of the two sides of the pin frame (lead frame) is ensured, the height can be adjusted, and the compatibility is strong; the rubber pad and the contact of the lead frame (lead frame) can limit the movement or the shaking of the lead frame (lead frame) in the track, improve the stability and simultaneously avoid causing damage to the surface of the lead frame (lead frame).
Drawings
Fig. 1 is a schematic view of a wafer frame of a lead frame according to an embodiment of the utility model;
fig. 2 is a schematic view of a beam portion according to an embodiment of the present invention.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," "third," and the like in the description and claims of this application and in the drawings are used solely to distinguish one from another and are not used to describe a particular sequence. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The utility model will be further explained and explained with reference to the drawings and the embodiments in the description.
Referring to fig. 1 and 2, an embodiment of the utility model provides a tablet frame of a lead frame, which includes a main frame 1, a lead structure, a detachable beam portion 2, and a detachable bead portion 3.
Referring to fig. 1 and 2, in the embodiment of the present invention, the main frame 1 includes a first side portion 11, a second side portion 12, and a connecting portion, and the connecting portion is fixedly connected to the first side portion 11 and the second side portion 12. Optionally, the connection portion includes a first connection portion 13 and a second connection portion 14. Specifically, the first side portion 11 and the second side portion 12 extend in the longitudinal direction, one end of the first side portion 11 and one end of the second side portion 12 are connected and fixed by the first connecting portion 13, and the other end of the first side portion 11 and the other end of the second side portion 12 are connected and fixed by the second connecting portion 14.
In the embodiment of the present invention, the connection portion (specifically, the first connection portion 13) is used for being fixed with the lifting module of the upper sheet machine.
Referring to fig. 1, in the embodiment of the present invention, a space between a first side portion 11 and a second side portion 12 is hollowed, and the hollowed portion is used for exposing a copper-clad ceramic substrate (DBC).
In the embodiment of the present invention, a side of the first side portion 11 close to the hollowed-out portion has a plurality of mounting holes (not shown), and the plurality of mounting holes are arranged at intervals along the extending direction of the first side portion 11. The number of the mounting holes is set according to the requirement, and is not particularly limited.
Referring to fig. 1, in the embodiment of the present invention, a plurality of mounting grooves 121 are concavely formed on the upper surface of the second side portion 12, and the plurality of mounting grooves 121 are spaced along the extending direction of the second side portion 12 for placing the beam portion 2. Alternatively, the mounting grooves 121 and the mounting holes are provided in one-to-one correspondence in the extending direction of the first connecting portion 13 or the second connecting portion 14.
Referring to fig. 1 and 2, in the embodiment of the present invention, one end of the beam portion 2 is fixed to the first side portion 11, and the other end of the beam portion 2 is fixed to the second side portion 12. Specifically, the beam portion 2 has a protruding portion 21 at one end, and the protruding portion 21 is fixed in cooperation with the mounting hole. Alternatively, the other end of the beam portion 2 is placed in the mounting groove 121. Alternatively, the upper surface of the other end of the beam portion 2 is concavely provided with a first fixing hole 22.
Referring to fig. 1 and 2, in the embodiment of the present invention, the bead portion 3 is fixed to the beam portion 2 and the second side portion 12, and optionally, the bead portion 3 may be fixed by a separately configured fixing member, or may be fixed to the beam portion 2 and the second side portion 12 by an interference structure or a snap structure provided on the bead portion 3, which is not limited specifically; in the embodiments of the present invention, the fixing by the fixing member is described as an example. Specifically, the pressing strip portion 3 is used for pressing a copper-clad ceramic substrate (DBC), the pressing strip portion 3 includes a plurality of second fixing holes 31, the plurality of second fixing holes 31 are arranged at intervals along the extending direction of the pressing strip portion 3, the first fixing hole 22 enters any one of the mounting grooves 121, each second fixing hole 31 corresponds to one of the mounting grooves 121, and the first fixing hole 22 and the second fixing hole 31 are used for being fixed through a fixing piece. Alternatively, when the fixing member is inserted into the first fixing hole 22 and the second fixing hole 31 to fix the bead portion 3, the beam portion 2, and the second side portion 12, the bead portion 3 is placed on the upper surface of the second side portion 12.
Referring to fig. 1, in the embodiment of the utility model, the lead structure includes a first lead portion 4, a second lead portion 5, a third lead portion 6, and a fourth lead portion 7. The first lead portion 4 and the third lead portion 6 are fixed to the lower surface of the first side portion 11, and the second lead portion 5 and the fourth lead portion 7 are fixed to the lower surface of the second side portion 12. Specifically, the first lead portion 4 includes a first rubber pad 41 and a first elastic element 42, the second lead portion 5 includes a second elastic element (not shown) and a second rubber pad 51, the third lead portion 6 includes a third elastic element (not shown) and a third rubber pad 61, and the fourth lead portion 7 includes a fourth elastic element (not shown) and a fourth rubber pad 71. The first lead portion 4, the second lead portion 5, the third lead portion 6, and the fourth lead portion 7 have the same configuration, and the first lead portion 4 is taken as an example to explain the embodiment of the present invention. Alternatively, the first elastic element, the second elastic element, the third elastic element and the fourth elastic element may be springs or components made of elastic materials.
Specifically, one end of the first elastic element 42 is fixed to the first rubber pad 41, the other end of the first elastic element 42 is fixed to the first side 11, one end of the second elastic element is fixed to the second rubber pad 51, and the other end of the second elastic element is fixed to the second side 12. The first rubber pad 41, the second rubber pad 51, the third rubber pad 61, and the fourth rubber pad 71 are used for contacting with a lead frame (lead frame).
The following describes a specific working process of the embodiment of the present invention:
when a copper-clad ceramic substrate (DBC) needs to be subjected to surface mounting, a lifting module above a track in chip mounting equipment (chip loader/Die Attach equipment) is fixed with a first connecting part 13, clamping jaws in the track can clamp two sides of a lead frame (lead frame) to step a pressing frame to a preset position from a feed port along a slide rail in a workbench, and the X-axis motion range of a welding head (Bondhead) of the chip mounting equipment mainly comprises a suction nozzle for adsorbing a chip, a camera and a moving part is limited; before the lead frame (Leadframe) reaches the preset position, the lifting module and the wafer frame are in a lifting state, when the Leadframe (Leadframe) reaches the preset position, the lifting module and the wafer frame fall, the first lead part 4, the second lead part 5, the third lead part 6 and the fourth lead part 7 of the wafer frame are in contact with the Leadframe (Leadframe), the copper-clad ceramic substrate (DBC) can be pressed through the second connecting part 14, and then the chip pasting is started.
In the embodiment of the utility model, the pin structure formed by the elastic element and the rubber pad is adopted, the rubber pad can be pressed down by the elastic element in a certain range, so that the good contact between the pressure sheet frame and the surfaces on the two sides of the pin frame (lead frame) is ensured, the height can be adjusted, and the compatibility is strong; the rubber pad contacting the lead frame (lead frame) can limit the lead frame (lead frame) from moving or shaking in the track, and simultaneously avoid the damage to the surface of the lead frame (lead frame). In addition, through the setting of the protruding portion 21, the plurality of mounting holes, the plurality of mounting grooves 121 of the beam portion 2, make the beam portion 2 can be adjusted in the extending direction of the first side portion 11 and the second side portion 12 detachably, can effectively avoid the beam portion 2 and the Pad (the solder paste block) conflict of the paster on the copper-clad ceramic substrate (DBC), thereby disturb the movement of the bonding tool in the Z axis or destroy the Pad.
The embodiment of the utility model further provides a tablet frame combination structure, which comprises a fixing piece (not shown) and the tablet frame of the lead frame.
Alternatively, fasteners include, but are not limited to, screws, rivets, pins, and the like.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.
Claims (10)
1. A wafer frame for a lead frame, comprising:
the main frame comprises a first side part, a second side part and a connecting part, and the connecting part is fixedly connected with the first side part and the second side part;
the pin structure comprises a first pin part and a second pin part, wherein the first pin part comprises a first elastic element and a first rubber pad, the second pin part comprises a second elastic element and a second rubber pad, the first elastic element is fixed with the first rubber pad and the first side part, and the second elastic element is fixed with the second rubber pad and the second side part; the first rubber pad and the second rubber pad are used for contacting with the lead frame.
2. The wafer frame of a lead frame of claim 1, wherein: the connecting part is used for being fixed with a lifting module of the loading machine.
3. The wafer frame of a lead frame of claim 1, wherein: the first side part and the second side part are hollowed out and used for exposing the copper-clad ceramic substrate.
4. The wafer frame of a lead frame of claim 1, wherein: the tablet frame of the lead frame further comprises a detachable beam portion, one end of the beam portion is fixed to the first side portion, and the other end of the beam portion is fixed to the second side portion.
5. The wafer frame of a lead frame of claim 4, wherein: the first side portion comprises a plurality of mounting holes, the mounting holes are arranged at intervals along the extending direction of the first side portion, a protruding portion is arranged at one end of the beam portion, and the protruding portion is matched and fixed with the mounting holes.
6. The wafer frame of a lead frame of claim 4, wherein: the second side portion comprises a plurality of mounting grooves, the mounting grooves are arranged at intervals along the extending direction of the second side portion, and the other end of the beam portion is placed in the mounting grooves.
7. The wafer frame of a lead frame of claim 6, wherein: the wafer frame of the lead frame further comprises a detachable wafer pressing portion, and the wafer pressing portion is fixed with the beam portion and the second side portion.
8. The wafer frame of a lead frame of claim 7, wherein: the pressing strip portion is placed on the upper surface of the second side portion.
9. The wafer frame of a lead frame of claim 7, wherein: the other end of the beam part comprises a first fixing hole, the pressing strip part comprises a plurality of second fixing holes, the second fixing holes are arranged at intervals along the extending direction of the pressing strip part, the first fixing holes enter the mounting grooves, each second fixing hole corresponds to one mounting groove, and the first fixing holes and the second fixing holes are used for being fixed through fixing parts.
10. A preforming frame integrated configuration which characterized in that: a wafer frame comprising a fixture and the leadframe of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121728622.8U CN216133860U (en) | 2021-07-27 | 2021-07-27 | Pin frame's preforming frame and preforming frame integrated configuration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121728622.8U CN216133860U (en) | 2021-07-27 | 2021-07-27 | Pin frame's preforming frame and preforming frame integrated configuration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216133860U true CN216133860U (en) | 2022-03-25 |
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ID=80768274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121728622.8U Active CN216133860U (en) | 2021-07-27 | 2021-07-27 | Pin frame's preforming frame and preforming frame integrated configuration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216133860U (en) |
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2021
- 2021-07-27 CN CN202121728622.8U patent/CN216133860U/en active Active
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