CN219917093U - Gold wire bonding tool - Google Patents
Gold wire bonding tool Download PDFInfo
- Publication number
- CN219917093U CN219917093U CN202321354597.0U CN202321354597U CN219917093U CN 219917093 U CN219917093 U CN 219917093U CN 202321354597 U CN202321354597 U CN 202321354597U CN 219917093 U CN219917093 U CN 219917093U
- Authority
- CN
- China
- Prior art keywords
- block
- operation hole
- fixed block
- bonding operation
- placement groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002390 adhesive tape Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 abstract description 28
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Abstract
The utility model belongs to the technical field of gold wire bonding, and discloses a gold wire bonding tool; the device comprises a lower fixed block and an upper fixed block which are matched for use, wherein the upper fixed block is arranged above the lower fixed block; a placement groove is formed in the top of the lower fixed block, and a rectangular positioning block is arranged in the center of the placement groove; the upper fixing block is provided with a bonding operation hole, the bottom opening width of the bonding operation hole is smaller than the top opening width of the placing groove, and the bottom opening length of the bonding operation hole is larger than the top opening length of the placing groove; the bonding operation hole is aligned with the placement groove, and the rectangular positioning block is positioned at the center right below the bonding operation hole. The substrates with different sizes are provided with the same concave parts, so that the substrates with different sizes can be positioned in the placing grooves through the rectangular positioning blocks, the positioning of the substrates is not affected by the size of the placing grooves, and the substrates with various sizes can be placed in the placing grooves of the lower fixing blocks.
Description
Technical Field
The utility model belongs to the technical field of gold wire bonding, and relates to a gold wire bonding tool.
Background
The gold wire bonding machine uses thin metal wires to enable the metal leads to be tightly welded with bonding pads on the substrate or the frame, so that electric interconnection between chips and information intercommunication between chips are realized. In the current bonding operation, a bonding tool is fixed on a press welder table, a substrate is placed in the bonding tool, parameters are adjusted, the press welder table is used for fixing the bonding tool through clamping jaws at two sides, and then an alloy wire bonding machine is matched for bonding operation.
However, the circuit substrates have different sizes, and a tooling corresponding to the sizes of the circuit substrates needs to be prepared with a small difference, so that the manufacturing cost is high.
Disclosure of Invention
The technical problem solved by the utility model is to provide the gold wire bonding tool, which is characterized in that the rectangular positioning block is used for fixing the position of the substrate placed in the placement groove, and then the substrate is tightly pressed by being matched with the upper fixing block.
The utility model is realized by the following technical scheme:
a gold wire bonding tool comprises a lower fixed block and an upper fixed block which are matched for use, wherein the upper fixed block is arranged above the lower fixed block;
a placement groove is formed in the top of the lower fixed block, and a rectangular positioning block is arranged in the center of the placement groove;
the upper fixing block is provided with a bonding operation hole, the bottom opening width of the bonding operation hole is smaller than the top opening width of the placing groove, and the bottom opening length of the bonding operation hole is larger than the top opening length of the placing groove; the bonding operation hole is aligned with the placement groove, and the rectangular positioning block is positioned at the center right below the bonding operation hole.
Further, the bottom of the lower fixed block is provided with a connecting block, and an included angle between the side surface of the connecting block and the lower surface of the lower fixed block is 45 degrees.
Further, two ends of the top of the upper fixing block are provided with limiting clamping blocks; the limiting clamping block is provided with a positioning hole.
Further, an included angle between the side wall of the bonding operation hole and the lower surface of the upper fixing block is 30 degrees;
further, an adhesive tape is attached around the bonding operation hole on the lower surface of the upper fixing block, and the highest working temperature of the adhesive tape is 260 ℃.
Compared with the prior art, the utility model has the following beneficial technical effects:
according to the gold wire bonding tool provided by the utility model, the upper fixing block and the lower fixing block are matched for use so as to fix the substrate placed in the placement groove, and bonding operation is performed through the bonding operation hole; the substrates with different sizes are provided with the same concave parts, so that the substrates with different sizes can be positioned in the placing grooves through the rectangular positioning blocks, the positioning of the substrates is not influenced by the size of the placing grooves, the substrates with various sizes can be placed in the placing grooves of the lower fixing blocks, and the bonding operation of the substrates with various sizes is finished by using the same tool; the bottom end opening width of the bonding operation hole is smaller than the top opening width of the placement groove, the bottom end opening length of the bonding operation hole is larger than the top opening length of the placement groove, and the substrate can be pressed through the part, which is not leaked out by the bonding operation hole, of the upper fixing block, so that the substrate is prevented from shaking in the placement groove.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a wire bonding tool;
FIG. 2 is a top view of a wire bonding tool;
FIG. 3 is a schematic view of the structure of the lower fixing block;
FIG. 4 is a schematic structural view of an upper fixing block;
FIG. 5 is a cross-sectional view of the upper anchor block;
reference numerals: 1 is a lower fixed block, 2 is an upper fixed block, 3 is a placement groove, 4 is a rectangular positioning block, 5 is a bonding operation hole, 6 is a connecting block, 7 is a limiting clamping block, and 8 is a positioning hole.
Detailed Description
The utility model will now be described in further detail with reference to the accompanying drawings, which illustrate but do not limit the utility model.
See fig. 1-5; the utility model discloses a gold wire bonding tool which comprises a lower fixed block 1 and an upper fixed block 2 which are matched for use, wherein the upper fixed block 2 is arranged above the lower fixed block 1; a placement groove 3 is formed in the top of the lower fixed block 1, and a rectangular positioning block 4 is arranged in the center of the placement groove 3; the upper fixed block 2 is provided with a bonding operation hole 5, the bottom opening width of the bonding operation hole 5 is smaller than the top opening width of the placement groove 3, and the bottom opening length of the bonding operation hole 5 is larger than the top opening length of the placement groove 3; the bonding operation hole 5 is aligned with the placement groove 3, and the rectangular positioning block 4 is positioned at the center right below the bonding operation hole 5.
Placing the substrates to be bonded into the placing grooves 3, and limiting the positions of the substrates in the placing grooves 3 by the rectangular positioning blocks 4; the positioning of the substrate in the lower fixed block 1 is not affected by the size of the placement groove 3; the placing groove 3 of the lower fixing block 1 can be used for placing substrates with various sizes.
The bottom of the lower fixed block 1 is provided with a connecting block 6, and an included angle between the side surface of the connecting block 6 and the lower surface of the lower fixed block 1 is 45 degrees.
The connecting block 6 is used for connecting an external press welder table and the lower fixed block 1, an included angle between the side surface of the connecting block 6 and the lower surface of the lower fixed block 1 is 45 degrees, and the clamping block of the press welder table is beneficial to locking the connecting block 6, so that the position of the lower fixed block 1 on the press welder table is fixed.
Both ends of the top of the upper fixed block 2 are provided with limiting clamping blocks 7; the limiting clamping block 7 is provided with a positioning hole 8.
When the upper fixing block 2 is installed, the limiting clamping block 7 is clamped into the clamping jaw of the press welder table, and the clamping jaw limits the displacement of the upper fixing block 2 in the vertical direction; and then the clamping blocks on the clamping jaw are clamped into the positioning holes 8, so that the displacement of the upper fixing block 2 in the vertical direction is limited.
The included angle between the side wall of the bonding operation hole 5 and the lower surface of the upper fixed block 2 is 30 degrees; an adhesive tape is attached around the bonding operation hole 5 on the lower surface of the upper fixing block 2, and the highest working temperature of the adhesive tape is 260 ℃.
The included angle between the side wall of the bonding operation hole 5 and the lower surface of the upper fixed block 2 is 30 degrees, which is helpful for the gold wire bonding machine to perform bonding operation on the substrate placed in the placement groove 3; the highest working temperature of the adhesive tape is 260 ℃, so that the adhesive tape can not be melted due to heat generated by bonding in the process of protecting the pins of the substrate from being damaged.
The utility model discloses a gold wire bonding tool, which is characterized in that a substrate is placed in a placement groove 3, and the substrate is positioned in the placement groove 3 by a rectangular positioning block 4; the upper fixed block 2 is placed on the top of the lower fixed block 1, the limiting clamping blocks 7 at the two ends of the upper fixed block 2 are respectively clamped into clamping jaws of a press welder table, and the clamping jaws limit the displacement of the upper fixed block 2 in the vertical direction; then clamping the clamping blocks on the clamping jaw into the positioning holes 8 to limit the displacement of the upper fixed block 2 in the vertical direction; the clamping jaws at two ends of the press welder bench move downwards simultaneously to attach the upper fixing block 2 to the lower fixing block 1, so that the substrate is pressed; the gold wire bonder performs bonding operation on the substrate through the bonding operation hole 5.
The embodiments given above are preferred examples for realizing the present utility model, and the present utility model is not limited to the above-described embodiments. Any immaterial additions and substitutions made by those skilled in the art according to the technical features of the technical scheme of the utility model are all within the protection scope of the utility model.
Claims (5)
1. The gold wire bonding tool is characterized by comprising a lower fixed block (1) and an upper fixed block (2) which are matched for use, wherein the upper fixed block (2) is arranged above the lower fixed block (1);
a placement groove (3) is formed in the top of the lower fixed block (1), and a rectangular positioning block (4) is arranged in the center of the placement groove (3);
the upper fixing block (2) is provided with a bonding operation hole (5), the bottom opening width of the bonding operation hole (5) is smaller than the top opening width of the placement groove (3), and the bottom opening length of the bonding operation hole (5) is larger than the top opening length of the placement groove (3); the bonding operation hole (5) is aligned with the placement groove (3), and the rectangular positioning block (4) is positioned at the center under the bonding operation hole (5).
2. The gold wire bonding tool according to claim 1, wherein a connecting block (6) is arranged at the bottom of the lower fixing block (1), and an included angle between the side surface of the connecting block (6) and the lower surface of the lower fixing block (1) is 45 degrees.
3. The gold wire bonding tool according to claim 1, wherein limiting clamping blocks (7) are arranged at two ends of the top of the upper fixing block (2), and positioning holes (8) are formed in the limiting clamping blocks (7).
4. The wire bonding tool according to claim 1, wherein an included angle between the side wall of the bonding operation hole (5) and the lower surface of the upper fixing block (2) is 30 °.
5. The gold wire bonding tool according to claim 1, wherein an adhesive tape is attached around the bonding operation hole (5) on the lower surface of the upper fixing block (2), and the highest working temperature of the adhesive tape is 260 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321354597.0U CN219917093U (en) | 2023-05-31 | 2023-05-31 | Gold wire bonding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321354597.0U CN219917093U (en) | 2023-05-31 | 2023-05-31 | Gold wire bonding tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219917093U true CN219917093U (en) | 2023-10-27 |
Family
ID=88434495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321354597.0U Active CN219917093U (en) | 2023-05-31 | 2023-05-31 | Gold wire bonding tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219917093U (en) |
-
2023
- 2023-05-31 CN CN202321354597.0U patent/CN219917093U/en active Active
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