CN216793615U - Large-current power module sintering clamp - Google Patents

Large-current power module sintering clamp Download PDF

Info

Publication number
CN216793615U
CN216793615U CN202220327868.2U CN202220327868U CN216793615U CN 216793615 U CN216793615 U CN 216793615U CN 202220327868 U CN202220327868 U CN 202220327868U CN 216793615 U CN216793615 U CN 216793615U
Authority
CN
China
Prior art keywords
frame
clamp
substrate
positioning boss
current power
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202220327868.2U
Other languages
Chinese (zh)
Inventor
李亮亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Scilicon Electric Co ltd
Original Assignee
Chengdu Scilicon Electric Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chengdu Scilicon Electric Co ltd filed Critical Chengdu Scilicon Electric Co ltd
Priority to CN202220327868.2U priority Critical patent/CN216793615U/en
Application granted granted Critical
Publication of CN216793615U publication Critical patent/CN216793615U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model discloses a large-current power module sintering clamp which comprises an upper frame clamp, a lower frame clamp, a frame, a substrate, reinforcing ribs, mounting holes, a frame clamp positioning boss, a frame positioning boss, a substrate tray positioning groove, substrate tray radiating teeth and a substrate positioning boss. The utility model improves the efficiency and reliability of welding the high-current power module.

Description

Large-current power module sintering clamp
Technical Field
The utility model relates to the field of electronic component processing, in particular to a large-current power module sintering clamp.
Background
In the fields of semiconductors, microwave communication and the like, chip welding is very extensive, and in the welding production process, the chip welding device comprises a sintering process, wherein the sintering process is to weld a chip (substrate) on a frame, the processing quality of the sintering process can directly influence the performance of a finished product, the conventional sintering clamp is used for generally fixing a main chip on a radiator and then sintering the main chip, a small-current power module is mainly convenient to process, the thickness of the small-current power module is smaller, and the fixing strength of a sintering tool is smaller.
However, the pins (terminals) of some high-current power modules are thick (greater than 1mm), the frame stress is large and uneven, the frame and the substrate are difficult to combine in the production process, and the problem that a finished product has defects or needs to be re-welded due to insufficient welding is easy to occur.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the high-current power module sintering clamp provided by the utility model solves the problems of poor welding efficiency and unreliable welding of the frame terminal and the substrate.
In order to achieve the purpose of the utility model, the utility model adopts the technical scheme that:
provided is a large current power module sintering jig, which includes: a frame clamp, a substrate tray, a frame and a substrate; the frame clamp comprises a frame clamp upper clamp and a frame clamp lower clamp;
the upper clamp of the frame clamp and the lower clamp of the frame clamp are matched with each other and clamp the frame; the lower fixture of the frame fixture is matched with the substrate tray and supports the substrate.
Further, the method comprises the following steps:
the pins of the frame and the substrate are in contact with each other.
Further:
the upper fixture of the frame fixture is of a hollow structure, two opposite sides of the upper fixture are respectively provided with reinforcing ribs, and the reinforcing ribs on the two sides are respectively provided with four mounting holes.
Further:
the lower clamp of the frame clamp comprises a frame clamp positioning boss and a frame positioning boss; the lower clamp of the frame clamp is of a hollow structure, mounting nails are arranged through mounting holes and are mutually and fixedly matched with the upper clamp of the frame clamp, and the position of the frame is fixed through a frame positioning boss; the lower fixture of the frame fixture is mutually embedded and matched with the positioning groove of the substrate tray through the positioning lug boss of the frame fixture.
Further:
the substrate tray comprises substrate tray radiating teeth and a substrate positioning boss; fixing the position of the substrate through the substrate positioning boss; the base plate positioning boss is in a chamfer angle structure.
The utility model has the beneficial effects that: the efficiency and the reliability of heavy current power module welding are promoted.
Drawings
FIG. 1 is an overall block diagram of the present invention;
FIG. 2 is a top view of the frame clamp;
FIG. 3 is a frame clamp lower clamp;
FIG. 4 is a view of the frame and the frame clamp lower clamp;
FIG. 5 illustrates a substrate and a substrate tray;
FIG. 6 is a top plan data view of the frame clamp lower clamp;
FIG. 7 is a side plan view of the frame clamp lower clamp;
FIG. 8 is a top plan data view of a substrate tray;
wherein: 1. a frame clamp upper clamp; 2. a frame clamp lower clamp; 3. a frame; 4. a substrate; 5. reinforcing ribs; 6. mounting holes; 7. a frame clamp positioning boss; 8. a frame positioning boss; 9. a substrate tray positioning groove; 10. a substrate tray heat dissipating tooth; 11. the base plate location boss.
Detailed Description
The following description of the embodiments of the present invention is provided to facilitate the understanding of the present invention by those skilled in the art, but it should be understood that the present invention is not limited to the scope of the embodiments, and it will be apparent to those skilled in the art that various changes may be made without departing from the spirit and scope of the utility model as defined and defined in the appended claims, and all matters produced by the utility model using the inventive concept are protected.
As shown in fig. 1, 2, 3, 4 and 5, the large current power module sintering jig includes: a frame jig, a substrate tray, a frame 3, and a substrate 4; the frame clamp comprises a frame clamp upper clamp 1 and a frame clamp lower clamp 2;
the upper frame clamp 1 and the lower frame clamp 2 are matched with each other and clamp the frame 3; the frame jig lower jig 2 is fitted to the substrate tray and holds the substrate 4.
The leads of the frame 3 and the substrate 4 are in contact with each other.
The upper fixture 1 of the frame fixture is of a hollow structure, two opposite sides of the upper fixture are respectively provided with reinforcing ribs 5, and the reinforcing ribs 5 on the two sides are respectively provided with four mounting holes 6.
The frame clamp lower clamp 2 comprises a frame clamp positioning boss 7 and a frame positioning boss 8; the lower frame clamp 2 is of a hollow structure, is provided with a mounting nail through a mounting hole 6 and is mutually fixedly matched with the upper frame clamp 1, and the position of the frame 3 is fixed through a frame positioning boss 8; the lower clamp 2 of the frame clamp is mutually embedded and matched with a base plate tray positioning groove 9 of the base plate tray through a frame clamp positioning boss 7.
The substrate tray comprises substrate tray radiating teeth 10 and a substrate positioning boss 11; the position of the substrate 4 is fixed through the substrate positioning boss 11; the substrate positioning boss 11 is of a chamfer structure.
Data of the present invention:
the length of the reinforcing rib 5 of the upper clamp 1 of the frame clamp is 120mm, the width of the reinforcing rib 5 is 4.98 mm-5.02 mm, preferably 5mm, and the internal and external milling of the reinforcing rib 5 is 0.1 mm;
as shown in fig. 6, the width of the frame jig lower jig 2 is 80 mm; the farthest distance of the frame positioning boss 8 is 68.95 mm-69.05 mm, preferably 69mm, and the frame positioning boss 8 is a square structure with the width of 5 mm; four corners of the hollow structure are of a quarter circular arc structure with the radius of 3 mm; the eight frame clamp positioning bosses 7 are hollow cylinders with the radius of 4 mm;
as shown in fig. 7, the thickness of the frame jig lower jig 2 was 2.15 mm; the thickness of the convex surface of the clamp 1-1 on the frame connecting clamp of the frame positioning boss 8 is 0.8 mm; the thickness of the convex surface of the substrate-connecting tray of the frame positioning boss 8 is 5 mm; milling a lower clamp 2 of the frame clamp to be 0.5 mm;
as shown in fig. 8, the length of the substrate tray is 130 mm; the length of the base plate tray positioning groove 9 is 120mm, the width is 4.9 mm-5.1 mm, and preferably 5 mm; the number of the substrate positioning bosses 11 is eight, and the length of the minimum rectangle formed by the substrate positioning bosses is 42.4mm, and the width of the minimum rectangle is 35.1 mm.
The working principle of the utility model is as follows:
arranging a frame 3 between an upper frame clamp 1 and a lower frame clamp 2 of a frame clamp, and fixing the position of the frame 3 through a frame positioning boss 8 so as to avoid deviation; the frame clamp upper clamp 1 and the frame clamp lower clamp 2 are fixed by screws passing through the mounting holes 6, and the frame 3 is clamped smoothly;
the reinforcing ribs 5 of the frame jig upper jig 1 can prevent the device from being deformed (tilted) due to heat generation during the sintering process;
brushing solder paste in the middle of a substrate positioning boss 11 of a substrate tray, and placing a substrate 4 in the middle of the substrate positioning boss 11 (the chamfer angle structure of the substrate positioning boss 11 is convenient to place, and the substrate tray heat dissipation teeth 10 ensure rapid temperature rise and heat dissipation in the sintering process and ensure the welding quality);
and connecting the combined substrate tray and the frame clamp through a frame clamp positioning boss 7, so that the pins of the frame 3 are contacted with the substrate 4, sintering the frame 3 and the substrate 4, and welding the substrate 4 to the pins of the frame 3.
The utility model improves the efficiency and reliability of welding the large-current power module.

Claims (5)

1. A high current power module sintering jig, comprising: a frame clamp, a substrate tray, a frame (3) and a substrate (4); the frame clamp comprises an upper frame clamp (1) and a lower frame clamp (2);
the upper frame clamp (1) and the lower frame clamp (2) are matched with each other and clamp the frame (3); the lower clamp (2) of the frame clamp is matched with the substrate tray and supports the substrate (4).
2. The high current power module sintering jig of claim 1, wherein:
the leads of the frame (3) and the substrate (4) are in contact with each other.
3. The high current power module sintering jig of claim 1, wherein:
the upper fixture (1) of the frame fixture is of a hollow structure, reinforcing ribs (5) are arranged on two opposite sides of the upper fixture respectively, and four mounting holes (6) are arranged on the reinforcing ribs (5) on the two sides respectively.
4. The high current power module sintering jig of claim 3, wherein:
the frame clamp lower clamp (2) comprises a frame clamp positioning boss (7) and a frame positioning boss (8); the lower frame clamp (2) is of a hollow structure, a mounting nail is arranged through a mounting hole (6) and is mutually fixedly matched with the upper frame clamp (1), and the position of the frame (3) is fixed through a frame positioning boss (8); the lower fixture (2) of the frame fixture is mutually embedded and matched with a base plate tray positioning groove (9) of the base plate tray through a frame fixture positioning boss (7).
5. The high current power module sintering jig of claim 1, wherein:
the substrate tray comprises substrate tray radiating teeth (10) and a substrate positioning boss (11); the position of the substrate (4) is fixed through the substrate positioning boss (11); the substrate positioning boss (11) is of a chamfer angle structure.
CN202220327868.2U 2022-02-17 2022-02-17 Large-current power module sintering clamp Active CN216793615U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220327868.2U CN216793615U (en) 2022-02-17 2022-02-17 Large-current power module sintering clamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220327868.2U CN216793615U (en) 2022-02-17 2022-02-17 Large-current power module sintering clamp

Publications (1)

Publication Number Publication Date
CN216793615U true CN216793615U (en) 2022-06-21

Family

ID=82017511

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220327868.2U Active CN216793615U (en) 2022-02-17 2022-02-17 Large-current power module sintering clamp

Country Status (1)

Country Link
CN (1) CN216793615U (en)

Similar Documents

Publication Publication Date Title
CN101890605B (en) Power semiconductor chip welding device
US11088053B2 (en) Encapsulation structure with high density, multiple sided and exposed leads and method for manufacturing the same
CN111151838B (en) Welding fixture and method for copper-clad ceramic substrate inside power semiconductor module
CN216793615U (en) Large-current power module sintering clamp
US11973462B1 (en) Axial diode junction box and method for manufacturing the same
CN213003432U (en) Welding tool for IGBT module
CN211708330U (en) Welding tool for copper-clad ceramic substrate inside power semiconductor module
JP6010942B2 (en) Semiconductor device and manufacturing method thereof
CN110620094A (en) Packaging structure and packaging process of power semiconductor device
CN216566898U (en) Packaging clamp for improving packaging efficiency of IGBT module
CN111618766B (en) Fixing jig for heat dissipation sheet
JP2012238684A (en) Power semiconductor device
CN211219353U (en) Die with good heat dissipation effect for welding uniform-temperature copper sheet
CN219944921U (en) Terminal positioning device for ultrasonic welding
CN220498009U (en) Welding fixture
CN219917093U (en) Gold wire bonding tool
CN218998438U (en) Crimping device
CN110829901A (en) Brushless motor controller system and assembling method thereof
CN116944656A (en) Ultrasonic welding method for terminals of bottomless semiconductor power module
CN218975415U (en) Auxiliary positioning device for silicon carbide module packaging
CN219534522U (en) Package structure, circuit structure and frame structure for manufacturing package structure
CN218321722U (en) Ceramic substrate electroplating jig
CN214542218U (en) Packaging structure of chip
CN111146096B (en) Double-sided heat dissipation semiconductor device and single-reflow soldering method thereof
CN219180495U (en) Photovoltaic diode module

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant