CN211708330U - Welding tool for copper-clad ceramic substrate inside power semiconductor module - Google Patents
Welding tool for copper-clad ceramic substrate inside power semiconductor module Download PDFInfo
- Publication number
- CN211708330U CN211708330U CN202020183306.6U CN202020183306U CN211708330U CN 211708330 U CN211708330 U CN 211708330U CN 202020183306 U CN202020183306 U CN 202020183306U CN 211708330 U CN211708330 U CN 211708330U
- Authority
- CN
- China
- Prior art keywords
- positioning
- dbc
- positioning plate
- pressing block
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the technical field of the semiconductor technology and specifically relates to a welding frock of copper ceramic substrate is covered to inside of power semiconductor module. This welding frock includes: the DBC positioning plate, the pressing block positioning plate, the DBC substrate pressing block and the positioning pin are arranged on the base plate; the DBC positioning plate is provided with a plurality of limiting accommodating grooves for mounting the DCB substrate, the DBC positioning plate is provided with a plurality of positioning holes, and the positioning holes of the DBC positioning plate and the positioning holes of the heat dissipation bottom plate below the DBC positioning plate are concentrically arranged; the pressing block positioning plate is provided with a plurality of positioning holes, the pressing block positioning plate is provided with a plurality of clamping grooves, and each clamping groove is arranged corresponding to the limiting accommodating groove; the lower part of the positioning pin is arranged in a positioning hole between the DBC positioning plate and the heat dissipation bottom plate in a penetrating manner, and the upper part of the positioning pin is arranged in a positioning hole of the pressing block positioning plate in a penetrating manner; the DBC substrate pressing block is arranged in the clamping groove of the pressing block positioning plate to tightly press the DCB substrate arranged on the limiting accommodating groove.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor technology and specifically relates to a welding frock of copper ceramic substrate is covered to inside of power semiconductor module.
Background
Welding is one of the most critical processes in power semiconductor module packaging, and comprises welding between a chip and a copper-clad ceramic substrate (hereinafter referred to as DBC) and welding between the DBC and a heat dissipation bottom plate, wherein the welding quality is directly related to heat dissipation of the power chip, and further related to the application reliability of the whole module. The DBC is one of the important components of a power semiconductor module, and an internal chip is soldered to the DBC by solder, and the other side of the DBC is soldered to a heat sink base. However, the prior art has the following disadvantages:
1) the welding tool is not accurate enough in positioning, and the position is easy to deviate;
2) the welding tool is easy to damage and cannot be reused for a long time;
3) after the DBC and the radiating bottom plate are welded, the tool is not easy to assemble and the part is not easy to take out;
4) currently, no effective tool equipment is used for positioning the DBC welding process, and the problem that the void ratio or the welding point position is wrong is often caused during welding.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a welding frock of copper ceramic substrate is covered to power semiconductor module inside to solve the technical problem who exists among the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
in a first aspect, the utility model provides a welding frock of copper ceramic substrate is covered to inside of power semiconductor module, it includes: the DBC positioning plate, the pressing block positioning plate, the DBC substrate pressing block and the positioning pin are arranged on the base plate;
the DBC positioning plate is provided with a plurality of limiting accommodating grooves for mounting the DCB substrate, the DBC positioning plate is provided with a plurality of positioning holes, and the positioning holes of the DBC positioning plate and the positioning holes of the heat dissipation bottom plate below the DBC positioning plate are concentrically arranged;
the pressing block positioning plate is provided with a plurality of positioning holes, the pressing block positioning plate is provided with a plurality of clamping grooves, and each clamping groove is arranged corresponding to the limiting accommodating groove;
the lower part of the positioning pin is arranged in a positioning hole between the DBC positioning plate and the heat dissipation bottom plate in a penetrating manner, and the upper part of the positioning pin is arranged in a positioning hole of the pressing block positioning plate in a penetrating manner;
the DBC substrate pressing block is arranged in the clamping groove of the pressing block positioning plate to tightly press the DCB substrate arranged on the limiting accommodating groove.
As a further technical scheme, the DBC positioning plate is provided with four positioning holes, and the four positioning holes are respectively arranged at four corner positions of the DBC positioning plate; the inner side of the hollow area of the DBC positioning plate is respectively provided with four limiting clamping pieces; the limiting clamping piece divides the hollow area of the DBC positioning plate into four limiting accommodating grooves for installing DCB substrates.
As a further technical scheme, the middle part of the positioning pin is fixed on the DBC positioning plate through a positioning sleeve.
As a further technical scheme, the briquetting positioning plate is provided with four positioning holes which are respectively arranged at four corner positions of the briquetting positioning plate; the pressing block positioning plate is provided with four clamping grooves through a cross frame; and the side edge of the clamping groove and the cross frame are respectively provided with a limiting clamping groove.
As a further technical scheme, the lower edge of the pressing block positioning plate is respectively provided with four connecting blocks, and the height of each connecting block is consistent with that of a positioning sleeve in the middle of the positioning pin.
As a further technical solution, two sides of the lower part of the DBC substrate pressing block are respectively provided with a pressing block; the upper surface of the DBC substrate pressing block is provided with a hollow long hole; and clamping connectors are respectively arranged on two sides of the upper part of the DBC substrate pressing block.
In a second aspect, the present invention provides a method for welding electrodes by using a welding tool for a copper-clad ceramic substrate inside a power semiconductor module, comprising the steps of:
placing a DBC positioning plate above the heat dissipation bottom plate, and concentrically aligning and positioning the DBC positioning plate and four positioning holes on the heat dissipation bottom plate;
placing four positioning pins into four positioning holes of the DBC positioning plate and the radiating bottom plate respectively, and installing the four positioning pins above the DBC positioning plate for positioning;
placing four DBC substrates into four limiting accommodating grooves of a DBC positioning plate in sequence, and coating welding fluxes on welding parts of the DBC substrates;
placing the briquetting positioning plate in the four positioning pins, and installing the briquetting positioning plate above the DCB positioning plate for positioning;
the four DCB substrate pressing blocks are placed in the clamping grooves of the pressing block positioning plate, the DBC substrate is pressed tightly, the whole tool structure is placed in a welding furnace, the melting temperature of the welding flux is heated, the welding flux can enable the welding part of the DBC substrate to be bonded to the radiating bottom plate, and the welding action is completed.
Adopt above-mentioned technical scheme, the utility model discloses following beneficial effect has:
1) the DBC base plate welding mode of the utility model is reasonable in design, the DBC pressing block can be directly inserted and taken out in the vertical direction, and the disassembly is convenient;
2) the DBC substrate welding tool is simple and visual in positioning, convenient to operate and accurate in positioning without deviation;
3) the tool is simple and reasonable in structure, so that the efficiency of the welding process is improved, and the voidage is effectively controlled;
4) the tool is reinforced, is not easy to damage and has long service cycle;
5) DBC locating plate, briquetting locating plate have the mistake proofing and prevent slow-witted design, can prevent effectively that DBC base plate and DBC base plate briquetting from putting the wrong position, improve the working efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a perspective view of a welding tool for a copper-clad ceramic substrate inside a power semiconductor module according to an embodiment of the present invention;
fig. 2 is a top view of a welding tool for a copper-clad ceramic substrate inside a power semiconductor module according to an embodiment of the present invention;
fig. 3 is an exploded view of a welding tool for a copper-clad ceramic substrate inside a power semiconductor module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a DBC substrate compact provided by an embodiment of the present invention;
fig. 5 is a schematic structural view of a press block positioning plate provided in an embodiment of the present invention;
fig. 6 is a schematic structural view of a DBC positioning plate according to an embodiment of the present invention.
Icon: 1-DBC substrate briquetting; 2-a briquetting positioning plate; 3-positioning pins; 4-DBC substrate; 5-DBC positioning plate; 6-heat dissipation bottom plate; 11-a crimping block; 12-a bayonet joint; 13-hollow slot; 21-card slot; 22-connecting block; 23-cross box; 51-limit fastener.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
Example one
Referring to fig. 1 to 5, in one embodiment, a welding tool for a copper-clad ceramic substrate inside a power semiconductor module includes: the DBC positioning plate 5, the pressing block positioning plate 2, the DBC substrate pressing block 1 and the positioning pin 3; the DBC positioning plate 5 is provided with a plurality of limiting accommodating grooves for mounting the DCB substrate 4, the DBC positioning plate 5 is provided with a plurality of positioning holes, and the positioning holes of the DBC positioning plate 5 and the positioning holes of the heat dissipation bottom plate 6 below the DBC positioning plate are concentrically arranged; the pressing block positioning plate 2 is provided with a plurality of positioning holes, the pressing block positioning plate 2 is provided with a plurality of clamping grooves, and each clamping groove is arranged corresponding to the limiting accommodating groove; the lower part of the positioning pin 3 is arranged in a positioning hole between the DBC positioning plate 5 and the heat dissipation bottom plate 6 in a penetrating manner, and the upper part of the positioning pin 3 is arranged in a positioning hole of the briquetting positioning plate 2 in a penetrating manner; the DBC substrate pressing block 1 is arranged in the clamping groove 21 of the pressing block positioning plate 2 to tightly press the DCB substrate 4 arranged on the limiting accommodating groove. This 5 structures of DBC locating plate can be fixed in the position that needs the welding with the DBC base plate is reliable, not only can improve the welding quality and the void ratio of DBC ceramic substrate, and can reduce the manpower in welding process for welding process's efficiency improves greatly.
The welding frock that this embodiment provided, its simple structure, convenient operation can change the defect that the frock time is long among the effectual solution prior art, and its structural style makes welding position accurate and firm moreover, carries out the design change on the basis of current frock, and the structural modification adjustment has carried out preliminary design and correction to the designing requirement, has evaded operation, processing in the middle of the design process, has kept away a series of problems such as position.
In this embodiment, preferably, the DBC positioning plate 5 is provided with four positioning holes, and the four positioning holes are respectively disposed at four corner positions of the DBC positioning plate 5; the inner sides of the hollow areas of the DBC positioning plate 5 are respectively provided with four limiting clamping pieces 5151; the limiting clamping piece 51 divides the hollow area of the DBC positioning plate 5 into four limiting accommodating grooves for installing DCB substrates.
In this embodiment, preferably, the middle of the positioning pin 3 is fixed on the DBC positioning plate 5 through a positioning sleeve.
In this embodiment, as a further technical solution, the briquetting positioning plate 2 is provided with four positioning holes, and the four positioning holes are respectively arranged at four corner positions of the briquetting positioning plate 2; the pressing block positioning plate 2 is provided with four clamping grooves 21 through a cross-shaped frame 23 (each clamping groove 21 is arranged corresponding to the limiting accommodating groove and is positioned above the DCB substrate); the side edges of the clamping grooves and the cross frame 23 are respectively provided with a limiting clamping groove (small groove structure).
Preferably, four connecting blocks 22 are respectively arranged at the lower edge of the pressing block positioning plate 2, the height of each connecting block 22 is consistent with that of a positioning sleeve in the middle of the positioning pin 3, and the connecting blocks 22 are used for being overlapped at the edge of the DBC positioning plate 5.
As a further technical scheme, two sides of the lower part of the DBC substrate pressing block 1 are respectively provided with a pressing block 11, and the pressing blocks sequentially extend into the clamping grooves of the pressing block positioning plate 2 and then are pressed on the DBC substrate; the upper surface of the DBC substrate compact 1 is provided with hollow long holes 13 (the specific number may be three); the upper portion both sides of DBC base plate briquetting 1 have joint 12 respectively, the joint 12 of DBC base plate briquetting 1 is installed in the spacing draw-in groove of briquetting locating plate 2.
Example two
The embodiment provides a method for carrying out electrode welding by using the welding tool for the copper-clad ceramic substrate in the power semiconductor module, which comprises the following steps:
placing a DBC positioning plate 5 above a heat dissipation bottom plate 6, and concentrically aligning and positioning the DBC positioning plate 5 and four positioning holes on the heat dissipation bottom plate 6;
placing four positioning pins 3 into four positioning holes of a DBC positioning plate 5 and a heat dissipation bottom plate 6 respectively, and installing the four positioning pins above the DBC positioning plate 5 for positioning;
placing four DBC substrates into four limiting accommodating grooves of the DBC positioning plate 5 in sequence, and coating welding fluxes on welding parts of the DBC substrates;
placing the briquetting positioning plate 2 in the four positioning pins 3, and installing the briquetting positioning plate above the DCB positioning plate for positioning;
the four DCB substrate pressing blocks are placed in the clamping grooves of the pressing block positioning plate 2, the DBC substrate is pressed tightly, the whole tool structure is placed in a welding furnace, the melting temperature of the welding flux is heated, the welding flux can enable the welding part of the DBC substrate to be bonded to the radiating bottom plate 6, and welding actions are completed.
To sum up, adopt above-mentioned technical scheme, the utility model has the advantages of as follows:
1) the DBC base plate welding mode of the utility model is reasonable in design, the DBC pressing block can be directly inserted and taken out in the vertical direction, and the disassembly is convenient;
2) the DBC substrate welding tool is simple and visual in positioning, convenient to operate and accurate in positioning without deviation;
3) the tool is simple and reasonable in structure, so that the efficiency of the welding process is improved, and the voidage is effectively controlled;
4) the tool is reinforced, is not easy to damage and has long service cycle;
5) DBC locating plate 5, briquetting locating plate 2 have the mistake proofing and prevent slow-witted design, can effectively prevent the position of misplacing DBC base plate and DBC base plate briquetting 1, improve the working efficiency.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (6)
1. The utility model provides a welding frock of inside copper-clad ceramic substrate of power semiconductor module which characterized in that includes: the DBC positioning plate, the pressing block positioning plate, the DBC substrate pressing block and the positioning pin are arranged on the base plate;
the DBC positioning plate is provided with a plurality of limiting accommodating grooves for mounting the DCB substrate, the DBC positioning plate is provided with a plurality of positioning holes, and the positioning holes of the DBC positioning plate and the positioning holes of the heat dissipation bottom plate below the DBC positioning plate are concentrically arranged;
the pressing block positioning plate is provided with a plurality of positioning holes, the pressing block positioning plate is provided with a plurality of clamping grooves, and each clamping groove is arranged corresponding to the limiting accommodating groove;
the lower part of the positioning pin is arranged in a positioning hole between the DBC positioning plate and the heat dissipation bottom plate in a penetrating manner, and the upper part of the positioning pin is arranged in a positioning hole of the pressing block positioning plate in a penetrating manner;
the DBC substrate pressing block is arranged in the clamping groove of the pressing block positioning plate to tightly press the DCB substrate arranged on the limiting accommodating groove.
2. The welding tool for the copper-clad ceramic substrate inside the power semiconductor module according to claim 1, wherein the DBC positioning plate is provided with four positioning holes, and the four positioning holes are respectively arranged at four corner positions of the DBC positioning plate;
the inner side of the hollow area of the DBC positioning plate is respectively provided with four limiting clamping pieces;
the limiting clamping piece divides the hollow area of the DBC positioning plate into four limiting accommodating grooves for installing DCB substrates.
3. The welding tool for the copper-clad ceramic substrate inside the power semiconductor module according to claim 1, wherein the middle part of the positioning pin is fixed on the DBC positioning plate through a positioning sleeve.
4. The welding tool for the copper-clad ceramic substrate inside the power semiconductor module according to claim 1, wherein the compact positioning plate is provided with four positioning holes, and the four positioning holes are respectively arranged at four corner positions of the compact positioning plate;
the pressing block positioning plate is provided with four clamping grooves through a cross frame;
and the side edge of the clamping groove and the cross frame are respectively provided with a limiting clamping groove.
5. The welding tool for the copper-clad ceramic substrate inside the power semiconductor module according to claim 4, wherein four connecting blocks are respectively arranged on the lower edge of the pressing block positioning plate, and the height of each connecting block is consistent with that of a positioning sleeve in the middle of each positioning pin.
6. The tool for welding the copper-clad ceramic substrate inside the power semiconductor module according to claim 1, wherein the DBC substrate pressing block is provided with a pressing block on each of two sides of the lower portion thereof;
the upper surface of the DBC substrate pressing block is provided with a hollow long hole;
and clamping connectors are respectively arranged on two sides of the upper part of the DBC substrate pressing block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020183306.6U CN211708330U (en) | 2020-02-19 | 2020-02-19 | Welding tool for copper-clad ceramic substrate inside power semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020183306.6U CN211708330U (en) | 2020-02-19 | 2020-02-19 | Welding tool for copper-clad ceramic substrate inside power semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211708330U true CN211708330U (en) | 2020-10-20 |
Family
ID=72825804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020183306.6U Active CN211708330U (en) | 2020-02-19 | 2020-02-19 | Welding tool for copper-clad ceramic substrate inside power semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211708330U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111151838A (en) * | 2020-02-19 | 2020-05-15 | 华芯威半导体科技(北京)有限责任公司 | Welding tool and method for copper-clad ceramic substrate inside power semiconductor module |
| CN112828414A (en) * | 2020-12-30 | 2021-05-25 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
-
2020
- 2020-02-19 CN CN202020183306.6U patent/CN211708330U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111151838A (en) * | 2020-02-19 | 2020-05-15 | 华芯威半导体科技(北京)有限责任公司 | Welding tool and method for copper-clad ceramic substrate inside power semiconductor module |
| CN111151838B (en) * | 2020-02-19 | 2023-10-13 | 华芯威半导体科技(北京)有限责任公司 | Welding fixture and method for copper-clad ceramic substrate inside power semiconductor module |
| CN112828414A (en) * | 2020-12-30 | 2021-05-25 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
| CN112828414B (en) * | 2020-12-30 | 2022-09-13 | 中国航天科工集团八五一一研究所 | Integrated sintering tool for micro-assembly substrate connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101373932B (en) | Miniature surface-pasted single-phase full wave bridge rectifier and manufacturing method thereof | |
| CN211708330U (en) | Welding tool for copper-clad ceramic substrate inside power semiconductor module | |
| US10403616B2 (en) | Method of manufacturing a semiconductor device | |
| CN111151838B (en) | Welding fixture and method for copper-clad ceramic substrate inside power semiconductor module | |
| US20210233885A1 (en) | Semiconductor device and lead frame member | |
| CN113658934A (en) | Power module internal connection copper sheet, preparation method thereof and power semiconductor module | |
| CN215999052U (en) | Terminal pin inserting jig | |
| JP4964858B2 (en) | Protection circuit module for rechargeable battery | |
| CN211759085U (en) | Welding tool for internal electrode of power semiconductor module | |
| CN217822678U (en) | IGBT module welding positioning tool | |
| JP3120575B2 (en) | Semiconductor device | |
| JP3198331B2 (en) | Method of manufacturing circuit board having metal terminal strip, circuit board obtained by this manufacturing method, and method of connecting conductor piece to this circuit board | |
| CN202084542U (en) | Chip in-line small bridge | |
| CN114284160A (en) | IGBT module power terminal welding positioning assembly and method | |
| CN211588840U (en) | Welding auxiliary device | |
| CN110767990B (en) | PCB antenna and preparation method thereof | |
| CN109449125B (en) | Double-row structure internal insulation type plastic package semiconductor device and manufacturing method thereof | |
| CN219336575U (en) | Welding positioning tool | |
| CN219917161U (en) | Flat plug-in rectifier bridge | |
| CN219575584U (en) | Graphite boat for reducing welding stress of electronic components | |
| CN216849841U (en) | IGBT module power terminal welding position subassembly | |
| CN112289754B (en) | Power module and packaging method | |
| CN111250813A (en) | Welding tool and method for internal electrode of power semiconductor module | |
| KR101069162B1 (en) | Connecting Member of Improved Weld-ability | |
| CN103594458A (en) | Lining plate structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |