CN218975415U

CN218975415U - Auxiliary positioning device for silicon carbide module packaging

Info

Publication number: CN218975415U
Application number: CN202122685206.0U
Authority: CN
Inventors: 罗艳玲; 赵清; 单卫平; 龚秀友; 钮应喜; 郭宗友; 袁松; 张晓洪; 左万胜; 史田超; 刘志远; 钟敏
Original assignee: Anhui Changfei Advanced Semiconductor Co ltd
Current assignee: Anhui Changfei Advanced Semiconductor Co ltd
Priority date: 2021-11-04
Filing date: 2021-11-04
Publication date: 2023-05-05
Anticipated expiration: 2031-11-04

Abstract

The utility model relates to the field of module structure production equipment, in particular to an auxiliary positioning device for silicon carbide module packaging. The utility model discloses an auxiliary positioning device for packaging a silicon carbide module, which is mainly used for facilitating the coating of solder paste on a substrate and the assembly connection between the substrate and a lead frame.

Description

Auxiliary positioning device for silicon carbide module packaging

Technical Field

The utility model relates to the field of module structure production equipment, in particular to an auxiliary positioning device for silicon carbide module encapsulation.

Background

With the market demand for silicon carbide modules, the corresponding processes, materials and auxiliary tools related to the encapsulation of the silicon carbide modules need to be developed.

At present, the tool for the silicon carbide product is relatively unstable in process, and the tool type which is relatively solidified does not exist, so that the problem to be solved is relatively urgent how to effectively and reasonably match the packaging process to develop the corresponding auxiliary tool.

Disclosure of Invention

The utility model aims to overcome the defects of the prior art and provides an auxiliary tool suitable for a silicon carbide module packaging process.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the auxiliary positioning device for the encapsulation of the silicon carbide module comprises a chassis, wherein a plurality of placing grooves are formed in the chassis.

The plurality of placing grooves are distributed in parallel at intervals; each placement groove comprises a placement groove arranged on the chassis.

The placing groove further comprises a placing sinking groove; the placing sink groove is communicated with the placing groove.

The depth of the placement sink groove is larger than that of the placement groove.

A positioning mechanism is arranged in the placing sink groove, the positioning mechanism comprises a limiting plate arranged in the placing sink groove,

one side of the limiting plate, which is far away from the chassis, is provided with a positioning inclined plane.

And the limiting plate is provided with a locating pin.

The limiting plate is provided with an avoidance sink; a positioning lug is arranged in the avoidance sink groove; the thickness of the positioning protruding block is larger than the maximum thickness of the limiting plate.

The positioning mechanism further comprises a pressing plate, and the pressing plate is arranged above the limiting plate.

The adsorption mechanism is arranged between the pressing plate and the chassis and comprises a lower magnet arranged on the chassis and an upper magnet arranged on the pressing plate, and the upper magnet and the lower magnet are mutually arranged.

The utility model has the advantages that:

the utility model discloses an auxiliary positioning device for packaging a silicon carbide module, which is mainly used for facilitating the coating of solder paste on a substrate and the assembly connection between the substrate and a lead frame.

Drawings

The contents of the drawings and the marks in the drawings of the present specification are briefly described as follows:

fig. 1 is a top view of a chassis in the present utility model.

Fig. 2 is a side view of the chassis of the present utility model.

Fig. 3 is a top view of the limiting plate according to the present utility model.

Fig. 4 is a side view of the limiting plate of the present utility model.

FIG. 5 is a top view of a platen according to the present utility model.

Fig. 6 is a schematic structural diagram of a substrate and a leadframe to be produced according to the present utility model.

Fig. 7 is a top view of the present utility model when the substrate and the lead frame are press-fitted.

Fig. 8 is a top view of the positioning mechanism of the present utility model disposed on the chassis.

Fig. 9 is a schematic view of the present utility model when the limiting plate and the pressing plate are butt-jointed and pressed.

The labels in the above figures are:

1. chassis 2, limiting plate 3, clamp plate.

Detailed Description

The following detailed description of the utility model refers to the accompanying drawings, which illustrate preferred embodiments of the utility model in further detail.

In addition, in fig. 8 of the present utility model, fig. 8 is a top view of the positioning mechanism disposed on the chassis; in fig. 8, the paper surface is used as a reference; a limiting plate and a pressing plate are arranged in a settling tank in a first placing tank (left one) on the chassis; a limiting plate is arranged in the placing sink groove in the second placing groove (left two), and a pressing plate is not arranged in the placing sink groove; the positioning mechanisms are not placed in the placing sink grooves in the third and fourth placing grooves (left three and left four).

An auxiliary positioning device for packaging a silicon carbide module comprises a chassis 1, wherein a plurality of placing grooves 1-1 are formed in the chassis 1; the utility model discloses an auxiliary positioning device for packaging a silicon carbide module, which is mainly used for facilitating the coating of solder paste on a substrate 4 and the assembly connection between the substrate 4 and a lead frame 41.

Specifically, the auxiliary positioning device disclosed by the utility model mainly comprises a chassis 1, wherein the chassis 1 facilitates the placement of a part substrate 4 to be produced and a lead frame 41; the chassis 1 is provided with the mounting groove 1-1, and the mounting groove 1-1 plays a role in positioning one substrate 4 and a lead frame 41, so that the positioning and placing operation of the substrate 4 before solder paste coating is facilitated, and in addition, the mounting and positioning between the subsequent substrate 4 and the lead frame 41 are also facilitated; in other words, the positioning and placing of the substrate 4 are facilitated by the arrangement of the placement groove 1-1, so that the subsequent solder paste coating is facilitated, the subsequent mounting and connection of the chip on the substrate 4 are also facilitated, and finally the connection and assembly between the lead frame 41 and the substrate 4 are facilitated.

Further, in the utility model, a plurality of the placing grooves 1-1 are distributed in parallel at intervals; by such arrangement, the lead frame 41 and the substrate 4 can be integrally assembled, and after the assembly is completed, the parts are cut, so that a plurality of silicon carbide module main body structures are finally formed; in addition, each of the seating grooves 1-1 includes a seating groove 13 provided on the chassis 1 in the present utility model; in the utility model, a plurality of the placing and sinking grooves 11 are distributed in parallel at intervals; the arrangement is convenient, the auxiliary positioning device can simultaneously produce a plurality of silicon carbide modules, and the application range of the utility model is favorably increased; and the production efficiency of the silicon carbide module is improved.

Further, in the utility model, the placing groove 1-1 also comprises a placing sink groove 11; the placing sink 11 is communicated with the placing groove 13; the placement sink 11 is matched with a positioning mechanism to support the lead frame 41 in actual use; the placement groove 13 is used for placing and supporting the substrate 4, and the placement of the substrate 4 and the lead frame 41 can be facilitated through the matching of the placement sink 11 and the placement groove 13, so that the subsequent mounting connection of the substrate 4 and the lead frame 41 is facilitated.

In addition, the depth of the placement sink 11 is larger than that of the placement groove 13 in the utility model; by means of the arrangement, the placement sink 11 and the placement groove 13 have height differences, a stepped platform structure is formed, the lead frame 41 is supported by the aid of the matched limiting plates conveniently, and meanwhile the subsequent connection assembly of the substrate 4 and the lead frame 41 is facilitated.

Further, in the utility model, a positioning mechanism is arranged in the placing sink 11, and the positioning mechanism comprises a limiting plate 2; the limiting plate is arranged in the placing sink 11, and the limiting plate 2 plays a role of basic support, so that the lead frame 41 can be conveniently pressed and positioned by the following matched pressing plate 3.

In addition, it should be noted that when the substrate 4 is coated with solder paste, the substrate 4 is directly placed in the placement groove 13, which is that there is no need to place a limiting plate in the placement sink 11, when the lead frame 41 needs to be assembled after the substrate 4 is coated with solder paste, a limiting plate is placed in the placement sink 11, and after the limiting plate is placed, the lead frame 41 to be assembled is placed on the limiting plate, that is, when the lead frame 41 is assembled with the substrate 4, the limiting plate is located below the lead frame 41; the upper end of the lead frame 41 is then press-covered and fixed by a pressing plate.

In actual use, the limiting plate 2 is placed in the placing sink 11, and the substrate 4 is placed in the placing groove 13; the lead frame 41 is placed on the limiting plate 2, and the limiting plate 2 is matched with the placing sink 11, so that the lead frame 41 can be supported and limited conveniently; the placement of the placement groove 13 facilitates the placement and positioning of the substrate 4.

Further, in the present utility model, a positioning inclined plane 21 is provided on a side of the limiting plate 2 away from the chassis 1; the positioning inclined plane 21 is arranged, and the inclined angle can be an angle of 5 degrees with the horizontal plane; such a tilting manner that the lead frame 41 is tilted at an angle upon placement; the angle of the semi-finished product is kept consistent with that of the lead frame 41 for the silicon carbide module, the head of the substrate 4 is tilted upwards by about 5 degrees after assembly, the heat radiating surface of the semi-finished product is guaranteed to be in hundred-percent fit with the die cavity during plastic packaging operation, no glue overflow phenomenon exists, and the heat radiating surface is completely exposed.

Further, in the present utility model, the limiting plate 2 is provided with a positioning pin 22; the positioning pins 22 play a good role in positioning, are convenient to connect with the through holes on the lead frame 41, and are convenient for placing and positioning the lead frame 41 on the chassis 1; positioning of the lead frame 41 on the limiting plate 2 is also facilitated; thereby facilitating subsequent connection of the leadframe 41 to the substrate 4.

Furthermore, in the utility model, the limiting plate 2 is provided with an avoidance sink 23; the avoidance sinking groove 23 is arranged at the end part of the limiting plate 2, and the avoidance sinking groove 23 is convenient for the limiting plate 2 to be clamped in the placement sinking groove 11, so that the protrusion limit of the limiting plate 2 is convenient; in addition, in the utility model, a positioning lug 24 is arranged in the avoiding sink 23; the thickness of the positioning lug 24 is larger than the maximum thickness of the limiting plate 2; such an arrangement; the limiting plate 2 is provided with a bulge; thereby facilitating the positioning operation between the limiting plate 2 and the subsequent pressing plate 3.

Further, in the utility model, the positioning mechanism further comprises a pressing plate 3, and the pressing plate 3 is arranged above the limiting plate 2; the pressing plate 3 plays a good role in pressing and fixing, and can well ensure the stability of the lead frame 41 placed on the chassis 1.

Further, in the utility model, an adsorption mechanism is arranged between the pressing plate 3 and the chassis 1, the adsorption mechanism comprises a lower magnet 12 arranged on the chassis 1 and an upper magnet 31 arranged on the pressing plate 3, and the upper magnet 31 and the lower magnet 12 are mutually arranged; through the arrangement of the adsorption mechanism, the placement stability of the pressing plate 3 is well ensured; the integrity of the auxiliary positioning device is improved; while ensuring the stability of the press plate to press against the lead frame 41.

Further, in the utility model, a placing sink 121 is arranged in the placing groove on the chassis 1, and the lower magnet 12 is arranged in the placing sink 121; the setting of the settling tank 121 facilitates the setting of the lower magnet 12, and avoids the influence of the leakage of the lower magnet 12 on the arrangement of the limiting plate 2.

Further, in the utility model, the horizontal projection of the pressing plate 3 is in a convex shape; by the arrangement, the edge of the pressing plate 3 is provided with a notch, and the positioning convex blocks 24 on the limiting plate 2 are matched with each other conveniently, so that the accuracy of the relative positions of the pressing plate 3 and the limiting plate 2 is ensured.

Meanwhile, in order to avoid the installation interference between the placement of the pressing plate and the positioning pin 22 on the limiting plate, the pressing plate is required to be provided with an avoidance perforation in the utility model; the locating pin is convenient to penetrate through the pressing plate, and the placing of the pressing plate is prevented from being influenced by the existence of the locating pin.

In addition, in the case of the optical fiber,

the auxiliary positioning device disclosed by the utility model can be used in printing and assembling links without converting tools back and forth, wherein the chassis 1 part is made of graphite, so that the heat conduction of a product in the process of reflow is improved, the reflow effect of the product is ensured, the limiting plate 2 and the pressing plate 3 part are made of synthetic stone, the whole tool has lower thermal expansion, and the operation precision of the product can be fully ensured.

In actual use, the substrate 4 is firstly placed in the placement groove 13, the substrate 4 is coated with solder paste, chip mounting is performed after the coating, a limiting plate is placed in the placement sink 11 after the mounting is completed, the lead frame 41 to be mounted is placed on the limiting plate, after the mounting is completed, the lead frame 41 of the limiting plate is covered by the pressing plate, the stability of the placement of the lead frame 41 is realized by the mutual adsorption of an upper magnet on the pressing plate and a lower magnet on the chassis 1, and the subsequent mounting and assembly of the subsequent lead frame 41 and the substrate 4 are facilitated

It is obvious that the specific implementation of the present utility model is not limited by the above-mentioned modes, and that it is within the scope of protection of the present utility model only to adopt various insubstantial modifications made by the method conception and technical scheme of the present utility model.

Claims

1. The auxiliary positioning device for the encapsulation of the silicon carbide module is characterized by comprising a chassis, wherein a plurality of placing grooves are formed in the chassis;

the plurality of placing grooves are distributed in parallel at intervals; each placement groove comprises a placement groove arranged on the chassis;

2. The auxiliary positioning device for silicon carbide module packaging according to claim 1, wherein the placement recess depth is greater than the placement recess depth.

3. The auxiliary positioning device for silicon carbide module packaging according to claim 1, wherein a positioning mechanism is arranged in the placing sink, and the positioning mechanism comprises a limiting plate arranged in the placing sink.

4. An auxiliary positioning device for silicon carbide module packaging according to claim 3 and wherein said limiting plate has a positioning bevel on a side thereof remote from said chassis.

5. An auxiliary positioning device for packaging a silicon carbide module according to claim 3, wherein the limiting plate is provided with a positioning pin.

6. The auxiliary positioning device for packaging the silicon carbide module according to claim 3, wherein the limiting plate is provided with an avoidance sink; a positioning lug is arranged in the avoidance sink groove; the thickness of the positioning protruding block is larger than the maximum thickness of the limiting plate.

7. A silicon carbide module package aid according to claim 3, wherein the positioning mechanism further comprises a platen disposed above the limiting plate.

8. The auxiliary positioning device for silicon carbide module packaging according to claim 7, wherein an adsorption mechanism is arranged between the pressing plate and the chassis, the adsorption mechanism comprises a lower magnet arranged on the chassis and an upper magnet arranged on the pressing plate, and the upper magnet and the lower magnet are mutually arranged.