CN114068431A - Silicon carbide module structure and manufacturing method thereof - Google Patents
Silicon carbide module structure and manufacturing method thereof Download PDFInfo
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- CN114068431A CN114068431A CN202111357262.XA CN202111357262A CN114068431A CN 114068431 A CN114068431 A CN 114068431A CN 202111357262 A CN202111357262 A CN 202111357262A CN 114068431 A CN114068431 A CN 114068431A
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 62
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 121
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 238000000926 separation method Methods 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 10
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 238000007689 inspection Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 2
- 238000012858 packaging process Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- 239000000178 monomer Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002969 artificial stone Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009421 internal insulation Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
The invention relates to the field of module structure production equipment, in particular to a silicon carbide module structure and a manufacturing method thereof; the plastic package comprises a plastic package body, wherein a substrate is arranged in the plastic package body; the silicon carbide chip is arranged on the substrate, and the substrate is connected with a substrate and pins; carrying out silicon carbide chip mounting after substrate tin paste printing, then carrying out backflow and cleaning on a copper substrate provided with a silicon carbide chip, then carrying out lead bonding operation on each monomer substrate in the whole copper substrate, then carrying out plate separation, dividing into single substrate structures, then carrying out assembly on the substrate and a lead frame by virtue of the following auxiliary tool, carrying out sealing insulation on the whole product circuit through a plastic packaging process, and finally carrying out electroplating and rib cutting molding to complete the packaging of the whole product; the invention discloses a silicon carbide module which can meet the application requirements of special environments such as high frequency, high power, high temperature resistance, radiation resistance and the like; meanwhile, the manufacturing method of the silicon carbide module disclosed by the invention can be used for conveniently realizing the production of the silicon carbide module.
Description
Technical Field
The invention relates to the field of module structure production equipment, in particular to an auxiliary positioning device for packaging a silicon carbide module.
Background
With the market demand for silicon carbide modules, the processes, materials and auxiliary tools for packaging the corresponding silicon carbide modules need to be developed.
At present, the production process of the silicon carbide module needs to be determined and optimized because the process of the tool for the silicon carbide product is relatively unstable.
In addition, because the existing tool for the silicon carbide product is relatively unstable in process, no relatively cured tool type exists, and how to develop a corresponding obtained auxiliary tool effectively and reasonably in cooperation with a packaging process is a relatively urgent problem to be solved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a novel silicon carbide module structure.
In order to achieve the purpose, the invention adopts the technical scheme that:
a silicon carbide module structure comprises a plastic package body, wherein a substrate is arranged in the plastic package body; the silicon carbide chip is arranged on the substrate, and the substrate is connected with a substrate and pins; the pins penetrate through the plastic package body and extend to the outer side of the plastic package body.
A method for manufacturing a silicon carbide module is characterized by comprising the following steps:
step 1: printing a copper substrate; carrying out solder paste printing on the copper substrate by adopting a large-plate process;
step 2: adding a silicon carbide chip; adding a silicon carbide chip on the copper substrate coated with the solder paste;
and step 3: carrying out wire bonding operation; after the silicon carbide chip is subjected to surface mounting in the step 2, carrying out copper substrate backflow and cleaning operation, and then carrying out wire welding operation on the silicon carbide chip and the copper substrate;
and 4, step 4: after the step 2 is finished, carrying out plate separation operation on the whole copper substrate to separate the whole copper substrate into a plurality of single substrates;
and 5: assembling and reflowing the lead frame; after step 4, assembling the substrate and the lead frame; assembling the lead frame and each separated substrate;
step 6: after the step 5 is finished, carrying out plastic package operation on the assembled substrate and the assembled pin frame;
and 7: after the step 6 is finished, electroplating the product processed in the step 6;
and 8: after step 7, performing rib cutting and forming on the electroplated product;
and step 9: and (8) after the step 8 is finished, carrying out inspection test on the product after the cut rib is formed.
The substrate is a ceramic copper-clad substrate; the ceramic copper-clad substrate has an aluminum nitride component.
And in the step 5, the substrate is connected with the lead frame through an auxiliary tool.
The auxiliary tool comprises a base plate, and a plurality of placing grooves are formed in the base plate; each placing groove comprises a placing groove arranged on the chassis; the placing groove also comprises a placing sinking groove; the placing sink groove is communicated with the placing groove.
The plurality of placing grooves are distributed in parallel at intervals; the depth of the placing sunken groove in each placing groove is greater than that of the placing groove; a positioning mechanism is arranged in the placing sinking groove, the positioning mechanism comprises a limiting plate arranged in the placing sinking groove,
and one side of the limiting plate, which is far away from the chassis, is provided with a positioning inclined plane.
And the limiting plate is provided with a positioning pin.
The positioning mechanism further comprises a pressing plate, and the pressing plate is arranged above the limiting plate.
An adsorption mechanism is arranged between the pressing plate and the base plate and comprises a lower magnet arranged on the base plate and an upper magnet arranged on the pressing plate, and the upper magnet and the lower magnet are arranged mutually.
The invention has the advantages that:
the invention discloses a silicon carbide module and a manufacturing method of the silicon carbide module; the invention discloses a silicon carbide module which can meet the application requirements of special environments such as high frequency, high power, high temperature resistance, radiation resistance and the like; meanwhile, the manufacturing method of the silicon carbide module disclosed by the invention can be used for conveniently realizing the production of the silicon carbide module; in addition, the manufacturing method disclosed by the invention realizes the assembly between the lead frame and the substrate by using the auxiliary tool, thereby facilitating the assembly and the connection between the substrate and the lead frame.
Drawings
The contents of the expressions in the various figures of the present specification and the labels in the figures are briefly described as follows:
fig. 1 is a top view of a chassis in the present invention.
Fig. 2 is a side view of the chassis of the present invention.
Fig. 3 is a top view of the limiting plate of the present invention.
Fig. 4 is a side view of the limiting plate of the invention.
FIG. 5 is a top view of the platen of the present invention.
Fig. 6 is a schematic structural diagram of a substrate to be produced and a lead frame according to the present invention.
Fig. 7 is a top view of the substrate and leadframe being press-fit secured in accordance with the present invention.
Fig. 8 is a top view of the positioning mechanism of the present invention disposed on a chassis.
Fig. 9 is a schematic view illustrating the abutting engagement of the limiting plate and the pressing plate according to the present invention.
FIG. 10 is a process flow diagram for the production of a silicon carbide module according to the present invention.
Fig. 11 is a schematic view of the structure of a silicon carbide module according to the present invention.
Fig. 12 is a schematic structural view of the copper substrate of the present invention in a monolithic structure.
Fig. 13 is a schematic structural view of a lead frame according to the present invention.
The labels in the above figures are:
1. the device comprises a chassis, 2, a limiting plate, 3 and a pressing plate; 4. the lead frame comprises a substrate 41, a lead frame 5, a plastic package body 6, a silicon carbide chip 7 and a lead.
Detailed Description
The following description of preferred embodiments of the invention will be made in further detail with reference to the accompanying drawings.
A silicon carbide module structure comprises a plastic package body 5, wherein a substrate is arranged in the plastic package body 5; the silicon carbide chip 6 is arranged on the substrate, and the substrate is connected with a substrate connecting pin 411; the pins 411 extend to the outer side of the plastic package body 5 through the plastic package body 5; the silicon carbide module mainly comprises a substrate and a silicon carbide chip 6, wherein the substrate is connected with the silicon carbide chip 6 through a lead 7, the lead 7 is connected with an adjacent part in a welding mode, and meanwhile, in order to ensure the using effect of the silicon carbide module and reduce the influence of the external environment on the silicon carbide module in use, a plastic package body 5 is required to be coated on the substrate and the silicon carbide chip 6; through the structure, the silicon carbide module disclosed by the invention can meet the application requirements of special environments such as high frequency, high power, high temperature resistance, irradiation resistance and the like.
A method for manufacturing a silicon carbide module is characterized by comprising the following steps:
step 1: printing a copper substrate 4-1; the copper substrate 4-1 is subjected to solder paste printing by adopting a large-plate process;
step 2: adding a silicon carbide chip 6; adding a silicon carbide chip 6 on the copper substrate 4-1 coated with the solder paste;
and step 3: carrying out bonding operation of the lead 7; after the silicon carbide chip 6 in the step 2 is pasted, carrying out the backflow and cleaning operation of the copper substrate 4-1, and then carrying out the wire bonding operation on the silicon carbide chip 6 and the copper substrate 4-1;
and 4, step 4: after the step 2 is finished, carrying out plate separation operation on the whole copper substrate 4-1 to separate the whole copper substrate into a plurality of single substrates;
and 5: assembling and reflowing the lead frame; after step 4, assembling the substrate with the lead frame 41; the lead frame 41 is assembled with each substrate after separation;
step 6: after step 5, performing plastic package operation on the assembled substrate and the lead frame 41;
and 7: after the step 6 is finished, electroplating the product processed in the step 6;
and 8: after step 7, performing rib cutting and forming on the lead frame 41 on the electroplated product;
and step 9: and (8) after the step 8 is finished, carrying out inspection test on the product after the cut rib is formed.
Specifically, the invention discloses a method for manufacturing a silicon carbide module, which mainly comprises the steps of printing tin paste on a copper substrate 4-1, wherein the copper substrate 4-1 adopts a large plate process (a large plate refers to a plate structure with a large size and comprising a plurality of single substrates), the large plate process is adopted, namely, the copper substrate is integrally used as a base for production, after the tin paste of the copper substrate 4-1 is printed, silicon carbide chips 6 are pasted, then the copper substrate 4-1 provided with the silicon carbide chips 6 is refluxed and cleaned, then lead 7 bonding operation is carried out on each single substrate in the whole copper substrate 4-1, then the single substrates are separated into single substrate structures, then the substrates are assembled with a lead frame 41 by means of an auxiliary tool below and are connected with the lead frame 41, because the tin paste is printed in advance on the bonding part of the substrate and the lead 411 in the previous process on the substrate, only need here to add scaling powder at pin 411, then carry out secondary reflow soldering can, the product after the backward flow is through the plastic envelope process whole product circuit sealed insulation, electroplate the encapsulation that the muscle was cut to the shaping completion whole product at last.
Further, the substrate is a ceramic copper-clad substrate 4-1; the ceramic copper-clad substrate 4-1 has an aluminum nitride component; the ceramic copper-clad substrate 4-1 adopted by the product is made of aluminum nitride, the product structure has an internal insulation function, an insulating sheet does not need to be independently installed at a client application end, the thermal conductivity coefficient of the ceramic is much higher than that of a plastic package material, and the heat dissipation of the product is better.
In addition, the lead frame 41 of the present invention adopts a design that ten leads 411 are one, and can share a mold with a conventional product during plastic package.
In addition, the ceramic copper-clad substrate 4-1 adopts a large plate to operate, the defects of the previous process can be directly removed after the plate is divided, special marks are not needed to be made, the ribs are cut, and then screening is carried out, so that the waste of resources caused by the fact that the defective products flow into the next process is completely avoided.
Through the manufacturing method disclosed above, the plastic package process of the silicon carbide module is designed without a thimble; the production process is simplified.
In addition, an inclination angle of 3-6 degrees is required to be formed when the substrate and the lead frame 41 are assembled, in order to achieve the density, an auxiliary tool is adopted, and the technical effect can be achieved through the use of the auxiliary tool; and the ceramic copper-clad substrate 4-1 can be tightly attached to the surface of a cavity of a plastic package mold in the mold closing time of the plastic package operation, so that the exposed surface is ensured to have no glue overflow, and the integral heat dissipation function of the product is not influenced.
Further, in the present invention, in the step 5, the substrate is connected to the lead frame 41 through an auxiliary tool.
Before further detailed description, for convenience of understanding, the following description will be made, and in fig. 8 of the present invention, fig. 8 is a plan view of a positioning mechanism disposed on a chassis; in FIG. 8, reference is made to the paper; a limiting plate and a pressing plate are placed in a placing sinking groove in a first placing groove (left one) on the chassis; a limiting plate is placed in the placing sinking groove in the second placing groove (the left second groove), and a pressing plate is not placed in the placing sinking groove; and no positioning mechanism is arranged in the placing sinking grooves in the third placing groove and the fourth placing groove (the left third placing groove and the left fourth placing groove).
Specifically, the auxiliary tool disclosed by the invention comprises a chassis 1, wherein a plurality of placing grooves 1-1 are formed in the chassis 1; the auxiliary tool disclosed by the invention is mainly convenient for coating the substrate 4 with the solder paste and for assembling and connecting the substrate 4 and the lead frame 41.
The base plate disclosed by the invention can be used independently, and when the base plate is used, the substrate is placed in the placing groove on the base plate, so that the subsequent tin paste coating operation of the substrate is conveniently realized.
Specifically, the auxiliary tool disclosed by the invention mainly comprises a chassis 1, wherein the chassis 1 facilitates the placement of a part substrate 4 to be produced and a lead frame 41; the base plate 1 is provided with the placing groove 1-1, and the placing groove 1-1 plays a role in placing and positioning the substrate 4 and the lead frame 41, so that the positioning and placing operation of the substrate 4 before tin paste coating is facilitated, and in addition, the subsequent installation and positioning between the substrate 4 and the lead frame 41 are facilitated; in other words, the placement grooves 1-1 facilitate the positioning and placement of the substrate 4, so as to facilitate the subsequent solder paste coating, and finally facilitate the connection and assembly between the lead frame 41 and the substrate 4.
Further, in the invention, a plurality of the mounting grooves 1-1 are distributed in parallel at intervals; with such an arrangement, the lead frame 41 and the substrate 4 can be integrally assembled, and then the components are cut after the assembly is completed, so as to finally form a plurality of silicon carbide module main body structures; in addition, each placement groove 1-1 comprises a placement groove 13 arranged on the chassis 1; in the invention, a plurality of the placing sinking grooves 11 are distributed in parallel at intervals; by the arrangement, the auxiliary positioning device can be used for producing a plurality of silicon carbide modules at the same time, and the application range of the invention is increased; the production efficiency of the silicon carbide module is improved.
In addition, a partition part 13-1 is arranged in the placing groove, the partition part 13-1 comprises a partition block 13-11 arranged in the placing groove, the invention separates a plurality of single-groove structures of the placing groove through the arrangement of the partition block 13-11, and each single groove is provided with a single substrate, so that the single positioning of the substrates is facilitated, and the subsequent butt joint with a lead frame is facilitated; in addition, the separation blocks 13-11 can be designed into an internal hollow structure, and the separation blocks 13-11 can be made of flexible materials, so that the separation blocks 13-11 can deform, the side surfaces of the substrate can be clamped and fixed conveniently, and the substrate cannot be damaged.
Further, the placing groove 1-1 also comprises a placing sinking groove 11; the placing sinking groove 11 is communicated with the placing groove 13; in actual use, the sink 11 is placed to cooperate with the positioning mechanism to support the lead frame 41; above-mentioned recess 13 of placing is used for placing the support to base plate 4, can make things convenient for placing of base plate 4 and lead frame 41 through placing heavy groove 11 and the cooperation of placing recess 13, makes things convenient for subsequent base plate 4 and lead frame 41's erection joint.
In addition, the invention requires that each placement groove comprises a placement groove arranged on the chassis; the placing groove also comprises a placing sinking groove; the placing sinking groove is communicated with the placing groove; that is, in the present invention, the depth of the placing sink 11 is greater than the depth of the placing groove 13; with the arrangement, the accommodating groove 11 and the accommodating groove 13 have different heights to form a stepped platform structure, and the arrangement facilitates matching with a limiting plate to support the lead frame 41 and facilitates connection and assembly of the subsequent substrate 4 and the lead frame 41.
Further, a positioning mechanism is arranged in the placing sinking groove 11, and the positioning mechanism comprises a limiting plate 2; the limiting plate is arranged in the placing sink groove 11, and the limiting plate 2 plays a role in supporting a foundation, so that the lead frame 41 can be conveniently pressed and positioned by the subsequent matching pressing plate 3.
In addition, it should be noted here that when the substrate 4 is coated with the solder paste, the substrate 4 is directly placed inside the placing groove 13, which does not require placing a limiting plate in the placing sink 11, after the substrate 4 is coated with the solder paste, when the lead frame 41 needs to be assembled, the limiting plate is placed in the placing sink 11, after the limiting plate is placed, the lead frame 41 to be assembled is placed on the limiting plate, that is, when the lead frame 41 is assembled with the substrate 4, the limiting plate is located below the lead frame 41; the upper end of the lead frame 41 is pressed and fixed by a pressing plate.
In actual use, the limiting plate 2 is placed in the placing sinking groove 11, and the substrate 4 is placed in the placing groove 13; the lead frame 41 is placed on the limiting plate 2, and the limiting plate 2 is matched with the placing sink 11, so that the lead frame 41 can be conveniently supported and limited; the arrangement of the placing groove 13 facilitates the placing and positioning of the substrate 4.
Furthermore, a positioning inclined plane 21 is arranged on one side, away from the chassis 1, of the limiting plate 2; the inclined angle of the positioning slope 21 can be 5 degrees from the horizontal plane; such a way of tilting, such that the angle of tilt when the lead frame 41 is placed; the angle of the base plate 4 is kept consistent with that of the lead frame 41 for the silicon carbide module, the head of the base plate 4 is enabled to be tilted by about 5 degrees after assembly, the radiating surface of a semi-finished product after assembly is enabled to be attached to the cavity of the mold in a hundred percent mode during plastic package operation, glue overflow is avoided, and the radiating surface is completely exposed.
Further, the limiting plate 2 is provided with a positioning pin 22; the positioning pin 22 plays a good positioning role, is convenient to be connected with the through hole on the lead frame 41, and is convenient to place and position the lead frame 41 on the chassis 1; the lead frame 41 is also convenient to position on the limiting plate 2; thereby facilitating subsequent connection of lead frame 41 to substrate 4.
Further, the limiting plate 2 is provided with an avoidance sinking groove 23; the avoidance sinking groove 23 is formed in the end portion of the limiting plate 2, and due to the arrangement of the avoidance sinking groove 23, the limiting plate 2 is conveniently clamped in the placing sinking groove 11, and the protrusion limiting of the limiting plate 2 is facilitated; in addition, a positioning bump 24 is arranged in the avoidance sinking groove 23; the thickness of the positioning lug 24 is larger than the maximum thickness of the limiting plate 2; such an arrangement; so that the limiting plate 2 is provided with a bulge; and then the positioning operation between the limiting plate 2 and the subsequent pressing plate 3 is facilitated.
Further, the positioning mechanism further comprises a pressing plate 3, and the pressing plate 3 is arranged above the limiting plate 2; the pressing plate 3 plays a good role in pressing and fixing, and can well ensure the stability of the lead frame 41 placed on the chassis 1.
Further, in the invention, an adsorption mechanism is arranged between the pressing plate 3 and the chassis 1, the adsorption mechanism comprises a lower magnet 12 arranged on the chassis 1 and an upper magnet 31 arranged on the pressing plate 3, and the upper magnet 31 and the lower magnet 12 are mutually arranged; the arrangement of the adsorption mechanism well ensures the stability of the pressure plate 3; the integrity of the auxiliary positioning device is improved; while ensuring the stability of the platen to press against leadframe 41.
Further, in the present invention, a placing sink 121 is disposed in the placing groove on the chassis 1, and the lower magnet 12 is disposed in the placing sink 121; the arrangement of the sinking groove 121 facilitates the arrangement of the lower magnet 12, and the influence of the leakage of the lower magnet 12 on the arrangement of the limiting plate 2 is avoided.
Further, in the invention, the horizontal projection of the pressing plate 3 is in a convex shape; such setting also makes 3 edges of clamp plate have the breach, and the convenience is mutually supported with the location lug 24 on the limiting plate 2 to guarantee the accuracy of clamp plate 3 and limiting plate 2 relative position.
Meanwhile, in order to avoid installation interference between the placement of the pressing plate and the positioning pin 22 on the limiting plate, the pressing plate is required to be provided with an avoiding perforation; make things convenient for the locating pin to pass the clamp plate, and then avoid the existence of locating pin and influence the placing of clamp plate.
In addition, the first and second substrates are,
the auxiliary tool disclosed by the invention can be used in the printing and assembling links without converting the tool back and forth, wherein the chassis 1 is made of graphite, the heat conduction of a product in the backflow process is improved, and the backflow effect of the product is ensured, and the limiting plate 2 and the pressing plate 3 are made of synthetic stone, so that the whole tool has low thermal expansion, and the operation precision of the product can be fully ensured.
In addition, when the auxiliary tool disclosed by the invention is used independently, the substrate 4 is firstly placed in the placing groove 13, and the tin paste is coated on the substrate 4.
When the assembly of the substrate and the lead frame is realized:
the substrate is placed in each single-groove structure in the placement groove; and then place the limiting plate in placing heavy groove 11, place the lead frame 41 that waits to adorn at the limiting plate again, after placing, use the clamp plate to cover on the lead frame 41 of limiting plate again, through upper magnet on the clamp plate and lower magnet on the chassis 1 mutual absorption, realize the stability of placing lead frame 41, then make things convenient for follow-up installation assembly of follow-up lead frame 41 and base plate 4.
It is clear that the specific implementation of the invention is not restricted to the above-described embodiments, but that various insubstantial modifications of the inventive process concept and technical solutions are within the scope of protection of the invention.
Claims (10)
1. The silicon carbide module structure is characterized by comprising a plastic package body, wherein a substrate is arranged in the plastic package body; the silicon carbide chip is arranged on the substrate, and the substrate is connected with a substrate and pins; the pins penetrate through the plastic package body and extend to the outer side of the plastic package body.
2. A method for manufacturing a silicon carbide module is characterized by comprising the following steps:
step 1: printing a copper substrate; carrying out solder paste printing on the copper substrate by adopting a large-plate process;
step 2: adding a silicon carbide chip; adding a silicon carbide chip on the copper substrate coated with the solder paste;
and step 3: carrying out wire bonding operation; after the silicon carbide chip is subjected to surface mounting in the step 2, carrying out copper substrate backflow and cleaning operation, and then carrying out wire welding operation on the silicon carbide chip and the copper substrate;
and 4, step 4: after the step 2 is finished, carrying out plate separation operation on the whole copper substrate to separate the whole copper substrate into a plurality of single substrates;
and 5: assembling and reflowing the lead frame; after step 4, assembling the substrate and the lead frame; assembling the lead frame and each separated substrate;
step 6: after the step 5 is finished, carrying out plastic package operation on the assembled substrate and the assembled pin frame;
and 7: after the step 6 is finished, electroplating the product processed in the step 6;
and 8: after step 7, performing rib cutting and forming on the electroplated product;
and step 9: and (8) after the step 8 is finished, carrying out inspection test on the product after the cut rib is formed.
3. The method of claim 2, wherein the substrate is a ceramic copper clad substrate; the ceramic copper-clad substrate has an aluminum nitride component.
4. The method of claim 2, wherein in step 5 the substrate is attached to the leadframe by an auxiliary tool.
5. The method for manufacturing the silicon carbide module according to claim 4, wherein the auxiliary tool comprises a base plate, and a plurality of placing grooves are formed in the base plate; each placing groove comprises a placing groove arranged on the chassis; the placing groove also comprises a placing sinking groove; the placing sink groove is communicated with the placing groove.
6. The method of claim 2, wherein a plurality of the receiving slots are spaced apart and arranged in parallel; the depth of the placing sunken groove in each placing groove is greater than that of the placing groove; a positioning mechanism is arranged in the placing sinking groove, the positioning mechanism comprises a limiting plate arranged in the placing sinking groove,
7. the method for manufacturing the silicon carbide module as claimed in claim 6, wherein the side of the limiting plate away from the chassis is provided with a positioning slope.
8. The method according to claim 2, wherein the positioning pin is provided on the limiting plate.
9. The method of claim 2, wherein the positioning mechanism further comprises a pressing plate disposed above the limiting plate.
10. The method of claim 2, wherein a suction mechanism is disposed between the platen and the base plate, the suction mechanism comprises a lower magnet disposed on the base plate and an upper magnet disposed on the platen, and the upper magnet and the lower magnet are mutually arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111357262.XA CN114068431A (en) | 2021-11-16 | 2021-11-16 | Silicon carbide module structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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