CN209896042U - Direct-insertion type high-power hybrid integrated circuit shell - Google Patents
Direct-insertion type high-power hybrid integrated circuit shell Download PDFInfo
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- CN209896042U CN209896042U CN201920631174.6U CN201920631174U CN209896042U CN 209896042 U CN209896042 U CN 209896042U CN 201920631174 U CN201920631174 U CN 201920631174U CN 209896042 U CN209896042 U CN 209896042U
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- integrated circuit
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- ring frame
- groove
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Abstract
The utility model provides a direct-insert high-power hybrid integrated circuit shell, which comprises a mounting plate, a lead component, a ring frame and a sealing plate, wherein the sealing plate is fixedly connected with the ring frame; the sealing plate is convexly provided with a lug boss which is clamped with the ring frame to seal the ring frame, so that the sealing performance of the sealing plate and the ring frame is improved; the mounting panel still is equipped with lead wire groove and spacing groove, the lead wire groove with the spacing groove communicates with each other, the lead wire subassembly is equipped with spacing portion, the lead wire subassembly inserts the lead wire groove, just spacing portion end in thereby the spacing groove makes the lead wire subassembly is installed the mounting panel, the leakproofness of cuting straightly the high-power hybrid integrated circuit shell of formula obtains improving.
Description
Technical Field
The utility model belongs to the technical field of the integrated circuit part technique and specifically relates to a high-power hybrid integrated circuit shell of formula cut straightly.
Background
With the development of science and technology and electronic information industry, the requirements for the structural design of the hybrid circuit module are higher and higher, and the requirements for higher performance, more convenient and efficient use and lower cost are also required.
The shell leakproofness that is used for high-power hybrid integrated circuit module at present is poor, and the shell is equipped with lead wire subassembly and mounting panel, but the lead wire subassembly only is equipped with the insulating part, and the lead wire unit mount is behind the mounting panel, and the lead wire subassembly easily produces the gap with the mounting panel, has reduced the leakproofness of shell, and the shell easily permeates steam and corrodes.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a high-power hybrid integrated circuit shell of formula that cut straightly that the leakproofness is good.
The utility model discloses a following technical scheme realizes:
the utility model provides a direct-insertion high-power hybrid integrated circuit shell, which comprises a mounting plate, a lead component, a ring frame and a sealing plate, wherein the sealing plate is fixedly connected with the ring frame; the shrouding protruding is equipped with suddenly the platform, suddenly the platform block the ring frame is used for sealing the ring frame, the mounting panel still is equipped with lead wire groove and spacing groove, the lead wire groove with the spacing groove communicates with each other, the lead wire subassembly is equipped with spacing portion, the lead wire subassembly inserts the lead wire groove, just thereby spacing portion end in the spacing groove makes the lead wire subassembly is installed the mounting panel.
Furthermore, the lead assembly is provided with a connecting part, and the limiting part is fixedly connected with the connecting part; the connecting part is inserted into the lead groove, and the limiting part is accommodated in the limiting groove and is stopped at the lead groove, so that the lead assembly is installed on the installation plate.
Furthermore, the lead assembly is provided with an insulating part for filling an insulator, and the insulating part is accommodated in the connecting part and the limiting part.
Further, the lead assembly is provided with a lead channel, and the lead channel penetrates through the connecting part and the limiting part.
Further, the mounting plate is provided with mounting feet for mounting externally, the mounting feet are provided with mounting holes, and the direct-insertion type high-power hybrid integrated circuit shell is mounted to the external environment through the mounting holes.
Further, the mounting plate is of an integrally formed structure.
Furthermore, the ring frame and the sealing plate are both provided with a plurality of fillet structures, the sealing plate is fixedly connected with the ring frame, and the fillet structures are fixedly connected with the bosses.
The utility model has the advantages that: the direct-insertion type high-power hybrid integrated circuit shell comprises a mounting plate, a lead assembly, a ring frame and a sealing plate, wherein the sealing plate is fixedly connected with the ring frame, and the mounting plate covers the ring frame to form an accommodating cavity for accommodating integrated circuit parts; the sealing plate is convexly provided with a lug boss which is clamped with the ring frame to seal the ring frame, so that the sealing performance of the sealing plate and the ring frame is improved; the mounting panel still is equipped with lead wire groove and spacing groove, the lead wire groove with the spacing groove communicates with each other, the lead wire subassembly is equipped with spacing portion, the lead wire subassembly inserts the lead wire groove, just spacing portion end in thereby the spacing groove makes the lead wire subassembly is installed the mounting panel, the leakproofness of cuting straightly the high-power hybrid integrated circuit shell of formula obtains improving.
Drawings
FIG. 1 is an exploded view of the in-line high power hybrid integrated circuit housing;
FIG. 2 is an exploded view of the in-line high power hybrid integrated circuit housing from another perspective;
FIG. 3 is an enlarged schematic view of the structure of FIG. 2A;
FIG. 4 is a schematic perspective view of the directly-inserted high-power hybrid integrated circuit housing;
FIG. 5 is a schematic diagram of the lead assembly of the in-line high power hybrid integrated circuit package;
FIG. 6 is a schematic diagram of the structure of the in-line high power hybrid integrated circuit housing with the mounting plate separated from the ring frame.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | Direct-insertion type high-power hybrid integrated |
10 | |
| 20 | |
30 | Containing |
| 40 | |
50 | |
| 110 | |
120 | Limiting groove |
| 130 | Mounting foot | 140 | |
| 150 | Limiting |
160 | |
| 170 | |
180 | |
| 400 | |
500 | Projection table |
Detailed Description
For a more clear and complete description of the technical solution of the present invention, the following description is made with reference to the accompanying drawings.
For a more clear and complete description of the technical solution of the present invention, the following description is made with reference to the accompanying drawings.
Referring to fig. 1-6, the present invention provides an in-line high power hybrid integrated circuit housing 1, where the in-line high power hybrid integrated circuit housing 1 includes a mounting plate 10, a lead assembly 20, a ring frame 40 and a sealing plate 50, the sealing plate 50 is fixedly connected to the ring frame 40, and the mounting plate 10 covers the ring frame 40 to form a receiving cavity 20 for receiving an integrated circuit component; the sealing plate 50 is convexly provided with a boss 500, the boss 500 is engaged with the ring frame 40 to seal the ring frame 40, the mounting plate 10 is further provided with a lead groove 110 and a limiting groove 120, the lead groove 110 is communicated with the limiting groove 120, and the lead assembly 20 is inserted into the lead groove 110 and is stopped at the limiting groove 120, so that the lead assembly 20 is mounted on the mounting plate 10.
In this embodiment, the sealing plate 50 and the ring frame 40 are both rectangular, the sealing plate 50 is provided with the protruding platform 500, and the sealing performance between the ring frame 40 and the sealing plate 50 is higher.
When the lead assembly 20 needs to be mounted on the mounting plate 10, the lead assembly 20 is inserted into the lead groove 110, the limiting portion 150 of the lead assembly 20 is clamped in the limiting groove 120, the limiting portion 150 blocks the lead groove 110, so that water vapor is prevented from permeating from a gap between the lead assembly 20 and the mounting plate 10, and the sealing performance of the direct-insertion type high-power hybrid integrated circuit housing 1 is improved.
Referring to fig. 5, the lead assembly 20 is provided with a connecting portion 150, and the limiting portion 150 is fixedly connected to the connecting portion 150; the connection part 150 is inserted into the lead groove 110, and the stopper part 150 is received in the stopper groove 120 and is stopped at the lead groove 110, so that the lead assembly 20 is mounted on the mounting plate 10. The lead assembly 20 further includes an insulating portion 170 for filling an insulator, and the insulating portion 170 is received in the connecting portion 150 and the limiting portion 150.
In the present embodiment, the insulating portion 170 is filled with a glass insulator.
Further, the lead assembly 20 is provided with a lead channel 180, and the lead channel 180 penetrates through the connecting portion 150 and the limiting portion 150.
In this embodiment, the leads of the integrated circuit component are routed out of or into the lead channels 180.
Further, the mounting plate 10 is provided with mounting pins 130 for external mounting, the mounting pins 130 are provided with mounting holes 140, and the in-line high-power hybrid integrated circuit housing 1 is mounted to the external environment through the mounting holes 140. The mounting plate 10 is of an integrally formed structure.
Referring to fig. 2 and 3, the ring frame 40 and the sealing plate 50 are both provided with a plurality of fillet structures 400, the sealing plate 50 is fixedly connected with the ring frame 40, and the fillet structures 400 are fixedly connected with the bosses 500. The fillet structure 400 is provided at four corners of the ring frame 40 and the bottom plate.
At present, a high-power hybrid integrated circuit module shell is mostly formed by milling cold rolled steel or punching and then plated with nickel, an output insulating end is obtained by adopting a glass sintering guide pin mode so as to obtain a formed shell base body, and after a module carrier substrate and a circuit are assembled, the nickel-plated mounting plate 10 is sealed and welded in a sealing mode through a parallel seam welding process to carry out full-sealing. The cold rolled steel shell has poor thermal conductivity (for example, the thermal conductivity of 10# steel is about 45W/(m.K)), and high density (close to 8.0 g/cm)3And the weight is heavy), when the power of the designed circuit module is larger, the shell can not meet the requirements of heat conduction and heat dissipation, and the influence on the service life and the function of the product is great. Therefore, a light-weight, good heat dissipation, low cost (suitable for mass production) housing is important for high-power hybrid integrated circuit modules.
The utility model discloses a concrete assembly, operation mode: 1. the insulating part 170 is filled with a glass insulator, and the insulating part 170 and the lead channel 10 are fixed by a graphite tool, sintered at high temperature in a furnace and plated with gold to obtain a single universal type insulated lead assembly 20.
2. The lead assembly 20 is positioned and fixed by a graphite tool: firstly, the air tightness of the direct-insertion type high-power hybrid integrated circuit shell 1 after positioning and soldering is improved through the concave-convex matching of the lead groove 110, the limiting groove 120, the limiting part 150 and the connecting part 160; then, gold-tin solder is placed on the soldering contact surface of the mounting board 30, and the mounting board 30 and the ring frame 40 are mounted together.
3. And placing gold-tin solder on the periphery of the lead groove 110, the limiting groove 120, the ring frame 40 and the accommodating cavity 20 of the lead assembly 20 and the mounting plate 30.
4. And positioning and compressing the direct-insert high-power hybrid integrated circuit shell 1 through a graphite clamp.
5. And (4) passing through a fire to obtain the direct-insertion type high-power hybrid integrated circuit shell 1.
The utility model discloses a high-power hybrid integrated circuit shell 1 of formula cut straightly, ring frame 40 uses kovar material, shrouding 50 adopts aluminium carborundum material, has light in weight (density 3.0 g/cm)3While the common cold rolled steel and Kovar are close to 8.0g/cm3) The heat conductivity is excellent (the heat conductivity is 165-225W/(m.K), while the common cold rolled steel and Kovar are only 10-45W/(m.K)), the linear expansion matching is proper (the numerical range is 6.0-8.9 ppm/DEG C), the air tightness is good (the aluminum silicon carbide adopts the mode of aluminizing and coating aluminum on the surface of the base material, and the air tightness is close to 1.0 multiplied by 10-3Pa.cm3Cc/g, which is 5 times of kovar), the mounting plate 10 is designed with the lead groove 110 and the limiting groove 120 which are adapted to the assembly of the lead assembly 20, and is plated with gold. Then, because of the material constraints of the parallel seam welding process, the ring frame 40 is formed using kovar as a substrate and plated with gold to facilitate brazing of the sealing plate 50. Secondly, the lead assembly 20 is an assembly formed by sintering a kovar lead as a base glass and then plating gold, and is convenient to be used as a brazeable lead end of the direct-insertion type high-power hybrid integrated circuit shell 1. The seal plate 50, the ring frame 40 and the lead assembly 20 are fixed by a graphite tool and are brazed into a whole by using gold-tin solder at low temperature, and the straight-insertion type high-power hybrid integrated circuit shell 1 capable of being sealed by parallel seam welding is obtained.
The utility model discloses a formula of cuting straightly high-power hybrid integrated circuit shell 1 brazes fell ring frame 40 and lead wire subassembly 20's structural scheme through aluminium carborundum mounting panel 10 reduces formula of cuting straightly high-power hybrid integrated circuit shell 1's weight greatly strengthens hybrid integrated circuit's thermal conductivity, and the bottom plate reduces the work load of aluminium carborundum part with ring frame 40 fixed connection's structure moreover, reduces batch production cost, and has improved formula of cuting straightly high-power hybrid integrated circuit shell 1's leakproofness.
Of course, the present invention can also have other various embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative work, and all of them belong to the protection scope of the present invention.
Claims (7)
1. A direct-insert high-power hybrid integrated circuit shell is characterized by comprising an installation plate, a lead assembly, a ring frame and a seal plate, wherein the seal plate is fixedly connected with the ring frame;
the sealing plate is provided with a protruding platform in a protruding mode, the protruding platform is clamped with the ring frame and used for sealing the ring frame, the mounting plate is further provided with a lead groove and a limiting groove, the lead groove is communicated with the limiting groove, the lead assembly is provided with a limiting portion, the lead assembly is inserted into the lead groove, and the limiting portion is stopped at the limiting groove to enable the lead assembly to be mounted on the mounting plate.
2. The in-line high power hybrid integrated circuit package according to claim 1, wherein the lead assembly has a connection portion, and the limiting portion is fixedly connected to the connection portion; the connecting part is inserted into the lead groove, and the limiting part is accommodated in the limiting groove and is stopped at the lead groove, so that the lead assembly is installed on the installation plate.
3. The in-line high power hybrid integrated circuit package of claim 2, wherein the lead assembly is provided with an insulation portion for filling with insulation, the insulation portion being received within the connecting portion and the retention portion.
4. The in-line high power hybrid integrated circuit package of claim 2, wherein the lead assembly defines a lead channel, the lead channel extending through the connecting portion and the retention portion.
5. The in-line high power hybrid integrated circuit package of claim 1, wherein the mounting plate is provided with mounting feet for external mounting, the mounting feet being provided with mounting holes through which the in-line high power hybrid integrated circuit package is mounted to an external environment.
6. The in-line high power hybrid integrated circuit package of claim 1, wherein the mounting board is of unitary construction.
7. The in-line high power hybrid integrated circuit package according to claim 1, wherein the ring frame and the sealing plate each have a plurality of fillet structures, the sealing plate is fixedly attached to the ring frame, and the fillet structures are fixedly attached to the bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920631174.6U CN209896042U (en) | 2019-04-30 | 2019-04-30 | Direct-insertion type high-power hybrid integrated circuit shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920631174.6U CN209896042U (en) | 2019-04-30 | 2019-04-30 | Direct-insertion type high-power hybrid integrated circuit shell |
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| Publication Number | Publication Date |
|---|---|
| CN209896042U true CN209896042U (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920631174.6U Active CN209896042U (en) | 2019-04-30 | 2019-04-30 | Direct-insertion type high-power hybrid integrated circuit shell |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112086403A (en) * | 2020-09-02 | 2020-12-15 | 东莞市柏尔电子科技有限公司 | Waterproof triode and preparation process thereof |
-
2019
- 2019-04-30 CN CN201920631174.6U patent/CN209896042U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112086403A (en) * | 2020-09-02 | 2020-12-15 | 东莞市柏尔电子科技有限公司 | Waterproof triode and preparation process thereof |
| CN112086403B (en) * | 2020-09-02 | 2022-04-15 | 东莞市柏尔电子科技有限公司 | Waterproof triode and preparation process thereof |
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