CN218918851U

CN218918851U - System packaging structure integrating multiple chips

Info

Publication number: CN218918851U
Application number: CN202222999554.XU
Authority: CN
Inventors: 牟春乔; 沈焱; 张改侠; 谢根长
Original assignee: Shenzhen Easebell Technology Co ltd
Current assignee: Shenzhen Easebell Technology Co ltd
Priority date: 2022-11-11
Filing date: 2022-11-11
Publication date: 2023-04-25
Anticipated expiration: 2032-11-11

Abstract

The utility model belongs to the field of chip packaging, in particular to a system packaging structure integrating a plurality of chips, which aims at the problem that the existing chips are mainly subjected to heat conduction with the outside through metal connected with the chips, have limited heat dissipation capacity, cannot rapidly dissipate heat and influence the running stability of the chips; the chip is placed on the base plate without corresponding positioning, so that the level of the chip is inconsistent when the chip is welded with the base plate, and the problem of inconvenient welding of the conducting wires is solved; the heat dissipation mechanism is arranged at the bottom of the shell and used for dissipating heat of the chip main body; the positioning mechanism can accelerate the heat dissipation of the chip main body through the heat dissipation mechanism, improves the running stability of the chip main body, can position a plurality of chip main bodies through the positioning mechanism, enables the chip main bodies to be horizontal and consistent, and is convenient for welding the conductive wires.

Description

System packaging structure integrating multiple chips

Technical Field

The present utility model relates to the field of chip packaging technologies, and in particular, to a system packaging structure for integrating multiple chips.

Background

Packaging is a process of assembling an integrated circuit into a chip end product, that is, a process technology of placing a produced integrated circuit bare chip on a substrate with a bearing function, leading out a pipe pin, and then fixedly packaging the pipe pin into a whole to avoid the chip from contacting with the outside and preventing the outside from damaging the chip. Impurities and bad gases in the air, and even water vapor, can corrode the precision circuits on the chip, thereby causing degradation of electrical properties. The existing packaging structure has the following problems:

1. the chip conducts heat with the outside mainly through the metal connected with the chip, has limited heat dissipation capacity, cannot rapidly dissipate heat, and influences the running stability of the chip;

2. the chip is placed on the substrate without corresponding positioning, so that the level of the chip is inconsistent when the chip is welded with the substrate, and the conductive wires are inconvenient to weld;

in view of the above, the present disclosure proposes a system package structure integrating multiple chips.

Disclosure of Invention

The utility model provides a system packaging structure integrating a plurality of chips, which solves the problems that in the prior art, the chips conduct heat with the outside mainly through metal connected with the chips, the heat dissipation capacity is limited, the heat cannot be dissipated rapidly, and the running stability of the chips is affected; the chip is placed on the substrate without corresponding positioning, so that the level of the chip is inconsistent when the chip is welded with the substrate, and the defect that the conductive wires are inconvenient to weld is caused.

The utility model provides the following technical scheme:

the system packaging structure for integrating a plurality of chips comprises a substrate, wherein the top of the substrate is fixedly connected with a square frame, the top of the square frame is provided with a shell, and the top of the substrate is welded with a chip main body;

the heat dissipation mechanism is arranged at the bottom of the shell and used for dissipating heat of the chip main body;

the positioning mechanism is arranged at the top of the substrate and used for positioning the chip main body.

In one possible design, the heat dissipation mechanism comprises a heat conduction sheet for heat dissipation, the top of the shell is provided with a heat dissipation hole for heat dissipation, the top of the heat conduction sheet is fixedly connected with the bottom inner wall of the shell and is positioned at the bottom of the heat dissipation hole, and the bottom of the heat conduction sheet is attached to the top of the chip main body.

In one possible design, the positioning mechanism comprises a plurality of positioning plates for facilitating positioning of the chip main body, and the bottoms of the positioning plates are fixedly connected with the top of the substrate.

In one possible design, two buckles are fixedly connected to two sides of the bottom of the shell, clamping grooves are formed in two sides of the top of the square frame, and the buckles are clamped with the clamping grooves.

In one possible design, the bottom both sides of casing all fixedly connected with be convenient for buckle and draw-in groove block's longboard, two intercommunication grooves have all been seted up to the top both sides of square frame, the longboard is pegged graft with the intercommunication inslot.

In one possible design, the material of the housing is a metal material.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.

In the utility model, as the heat conducting fin and the heat radiating holes are arranged, the heat emitted by the chip main body can be transmitted to the metal shell through the heat conducting fin, and the heat on the heat conducting fin can be emitted through the heat radiating holes, so that the heat radiation of the chip main body can be accelerated, and the running stability of the chip main body is improved.

In the utility model, as the plurality of positioning plates are arranged, the positioning plates can position the plurality of chip main bodies, so that the plurality of chip main bodies are consistent in level, thereby being convenient for welding the conductive wires;

according to the utility model, the heat dissipation of the chip main body can be accelerated through the heat dissipation mechanism, the running stability of the chip main body is improved, and the plurality of chip main bodies can be positioned through the positioning mechanism, so that the plurality of chip main bodies are consistent in level, and the conductive wires are convenient to weld.

Drawings

Fig. 1 is a schematic front view of a system package structure integrated with a plurality of chips according to an embodiment of the present utility model;

fig. 2 is a schematic bottom view of a housing of a system package structure integrated with a plurality of chips according to an embodiment of the present utility model;

fig. 3 is a schematic substrate structure of a system in package structure integrated with a plurality of chips according to an embodiment of the present utility model;

fig. 4 is an exploded view of a system in package structure with multiple chips integrated according to an embodiment of the present utility model.

Reference numerals:

1. a heat radiation hole; 2. a housing; 3. a substrate; 4. a buckle; 5. a long plate; 6. a positioning plate; 7. a block; 8. a chip main body; 9. a clamping groove; 10. a communication groove; 11. and a heat conductive sheet.

Detailed Description

Embodiments of the present utility model will be described below with reference to the accompanying drawings in the embodiments of the present utility model.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled" and "mounted" should be interpreted broadly, and for example, "coupled" may or may not be detachably coupled; may be directly connected or indirectly connected through an intermediate medium. In addition, "communication" may be direct communication or may be indirect communication through an intermediary. Wherein, "fixed" means that the relative positional relationship is not changed after being connected to each other. References to orientation terms, such as "inner", "outer", "top", "bottom", etc., in the embodiments of the present utility model are merely to refer to the orientation of the drawings and, therefore, the use of orientation terms is intended to better and more clearly illustrate and understand the embodiments of the present utility model, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the embodiments of the present utility model.

In embodiments of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

In the embodiment of the present utility model, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

Example 1

Referring to fig. 1-4, a system package structure for integrating a plurality of chips comprises a substrate 3, wherein a square frame 7 is fixedly connected to the top of the substrate 3, a shell 2 is arranged at the top of the square frame 7, and a chip main body 8 is welded to the top of the substrate 3;

the heat dissipation mechanism is arranged at the bottom of the shell 2 and used for dissipating heat of the chip main body 8;

and the positioning mechanism is arranged at the top of the substrate 3 and used for positioning the chip main body 8.

According to the technical scheme, the heat dissipation of the chip main body 8 can be quickened through the heat dissipation mechanism, the running stability of the chip main body 8 is improved, the plurality of chip main bodies 8 can be positioned through the positioning mechanism, the plurality of chip main bodies 8 are consistent in level, and therefore the welding of the conductive wires is facilitated.

Referring to fig. 2, the heat dissipation mechanism includes a heat conducting fin 11 for dissipating heat, a heat dissipating hole 1 for dissipating heat is formed in the top of the housing 2, the top of the heat conducting fin 11 is fixedly connected to the inner wall of the bottom of the housing 2 and located at the bottom of the heat dissipating hole 1, and the bottom of the heat conducting fin 11 is attached to the top of the chip main body 8.

Above-mentioned technical scheme chip main part 8 radiating heat can be transmitted to the casing 2 of metal material through the conducting strip 11 on, and the louvre 1 can make the heat on the conducting strip 11 distribute away through louvre 1 to can accelerate to dispel the heat to chip main part 8, improve the stability of chip main part 8 operation.

Referring to fig. 3, the positioning mechanism includes a plurality of positioning plates 6 for facilitating positioning of the chip main body 8, and bottoms of the plurality of positioning plates 6 are fixedly connected with the top of the substrate 3.

According to the technical scheme, the positioning plate 6 can position the plurality of chip main bodies 8, so that the plurality of chip main bodies 8 are consistent in level, and the conductive wires are convenient to weld.

Example 2

Referring to fig. 2, two buckles 4 are fixedly connected to two sides of the bottom of the shell 2, clamping grooves 9 are formed in two sides of the top of the square frame 7, and the buckles 4 are clamped with the clamping grooves 9.

The buckle 4 is clamped between the clamping grooves 9, so that the shell 2 and the substrate 3 can be fixed.

Referring to fig. 2, two sides of the bottom of the casing 2 are fixedly connected with long plates 5 which are convenient for the clamping buckles 4 to be clamped with the clamping grooves 9, two communicating grooves 10 are formed in two sides of the top of the square frame 7, and the long plates 5 are inserted into the communicating grooves 10.

According to the technical scheme, the long plate 5 can enter the communicating groove 10 when the shell 2 is covered on the base plate 3, and the buckle 4 and the clamping groove 9 can be positioned.

Referring to fig. 1, the housing 2 is made of metal.

The metal shell 2 of the above technical solution is convenient for the heat conducting fin 11 to conduct heat.

The working principle and the using flow of the technical scheme are as follows: when packaging is started, firstly, the chip main body 8 is placed at the top of the substrate 3, the positioning plate 6 is arranged, the positioning plate 6 can position a plurality of chip main bodies 8, so that the chip main bodies 8 are horizontally consistent, the conductive wires are convenient to weld, then the chip main bodies 8 are welded on the substrate 3, then the shell 2 is taken, the shell 2 is covered on the square frame 7 at the top of the substrate 3, due to the fact that the long plate 5 is arranged, when the shell 2 is covered on the substrate 3, the long plate 5 can enter the communicating groove 10, the clamp 4 and the clamping groove 9 can be positioned, then the clamp 4 can be clamped between the clamping groove 9, the shell 2 and the substrate 3 can be fixed, at the moment, the bottom of the heat conducting sheet 11 is in a joint state with the top of the chip main bodies 8, when the chip main bodies 8 are started to be used, heat emitted by the chip main bodies 8 can be transmitted to the shell 2 made of metal materials through the heat conducting sheet 11, and can be emitted through the heat radiating holes 1, so that the chip main bodies 8 can be accelerated, and the heat radiation stability of the chip main bodies 8 can be improved.

The present utility model is not limited to the specific embodiments, but the scope of the utility model 2 is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present utility model, and the changes or substitutions are covered by the scope of the utility model; embodiments of the utility model and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims

1. A system-in-package structure integrating a plurality of chips, comprising:

the chip comprises a substrate (3), wherein a square frame (7) is fixedly connected to the top of the substrate (3), a shell (2) is arranged at the top of the square frame (7), and a chip main body (8) is welded at the top of the substrate (3);

the heat dissipation mechanism is arranged at the bottom of the shell (2) and used for dissipating heat of the chip main body (8);

the positioning mechanism is arranged at the top of the substrate (3) and used for positioning the chip main body (8).

2. The system in package structure of claim 1, wherein the heat dissipation mechanism includes a heat conducting fin (11) for dissipating heat, the top of the housing (2) is provided with a heat dissipating hole (1) for dissipating heat, the top of the heat conducting fin (11) is fixedly connected with the inner wall of the bottom of the housing (2) and is located at the bottom of the heat dissipating hole (1), and the bottom of the heat conducting fin (11) is attached to the top of the chip main body (8).

3. The system-in-package structure of claim 1, wherein the positioning mechanism comprises a plurality of positioning plates (6) for facilitating positioning of the chip main body (8), and the bottoms of the plurality of positioning plates (6) are fixedly connected with the top of the substrate (3).

4. A system in package structure for integrating multiple chips according to any one of claims 1-3, wherein two buckles (4) are fixedly connected to two sides of the bottom of the housing (2), clamping grooves (9) are formed in two sides of the top of the square frame (7), and the buckles (4) are clamped with the clamping grooves (9).

5. The system packaging structure integrated with a plurality of chips according to claim 1, wherein the two sides of the bottom of the shell (2) are fixedly connected with long plates (5) which are convenient for clamping the clamping buckles (4) and the clamping grooves (9), two communicating grooves (10) are formed in the two sides of the top of the square frame (7), and the long plates (5) are inserted into the communicating grooves (10).

6. The system-in-package structure of claim 1, wherein the housing (2) is made of metal.