CN219917135U - Packaging shell of multi-chip integrated circuit - Google Patents

Abstract

The utility model discloses a packaging shell of a multi-chip integrated circuit, which relates to the technical field of packaging shells and comprises an upper shell and a lower shell, wherein a mounting seat is sleeved on the lower shell, and an assembly groove matched with the integrated circuit is formed in the mounting seat. This package shell of multicore piece integrated circuit uses through the cooperation of heat-conducting plate and fin and second spring and louvre for this package shell of multicore piece integrated circuit keeps the laminating with the integrated circuit outside under the effect of second spring elasticity at the in-process of integrated circuit work, in the heat-conducting plate with the integrated circuit work in-process heat-generating is leading-in fin, carries out supplementary heat dissipation through extending to the outside fin of upper casing, and the louvre and the air-out all can assist the exchange effect of air and outside air in the upper casing on the upper casing simultaneously, consequently can effectually guarantee the package shell radiating effect of this multicore piece integrated circuit.

Description

Packaging shell of multi-chip integrated circuit

Technical Field

The utility model relates to the technical field of packaging shells, in particular to a packaging shell of a multi-chip integrated circuit.

Background

An integrated circuit is a type of microelectronic device or component. The components such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring are interconnected together by adopting a certain process, are manufactured on a small or a few small semiconductor wafers or dielectric substrates and then are packaged in a tube shell to form a microstructure with the required circuit function, wherein all the components structurally form a whole, so that the electronic components are greatly advanced towards microminiaturization, low power consumption, intellectualization and high reliability, and a packaging shell is required to be assembled outside the electronic components in order to realize comprehensive protection of the integrated circuit.

In the prior art CN202023210213.7, a chip packaging technology is proposed, which is a technology for packaging a chip to avoid the chip from contacting with the outside and preventing the chip from being damaged by the outside. Impurities and bad gases in the air, and even water vapor, can corrode the precision circuits on the chip, thereby causing degradation of electrical properties. Different packaging technologies have great differences in the aspects of manufacturing procedures and processes, and play a vital role in playing a role in the performance of the memory chip after packaging. With the rapid development of photoelectric and micro-electric manufacturing process technologies, electronic products are always developed towards smaller, lighter and cheaper directions, so that the packaging form of chip elements is improved continuously, and a multi-chip integrated circuit packaging structure is provided based on the improved packaging form.

This packaging structure passes through the cooperation of louvre, the heating panel, the heat of passing through the louvre with inside is discharged by the heating panel, improve self performance, increase in service time, but the heating panel is located the inboard of packaging structure, the effect that can play, only with the heat direction that produces in the integrated circuit course of working be close to the position of louvre, its main radiating means still relies on the air exchange of louvre with the external world to carry out supplementary heat dissipation alone, the radiating effect that actually can play is limited, and pass through metal pin connection between the upper and lower casing of this packaging structure and fix, though fixed mode is stable, dismantlement between the structure is comparatively inconvenient after the encapsulation, be unfavorable for the follow-up maintenance work of integrated circuit, for this reason, we have designed the encapsulation shell of a multichip integrated circuit and have solved above-mentioned problem.

Disclosure of Invention

In order to overcome the defects in the prior art, the utility model provides a packaging shell of a multi-chip integrated circuit, which solves the problems in the prior art.

In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a package housing of multicore integrated circuit, includes casing and lower casing, the cover is equipped with the mount pad on the lower casing, set up in the mount pad with integrated circuit assorted mounting groove, the cover is equipped with evenly distributed's stopper in the last casing, the outside fixedly connected with of stopper extends to the outside pin of upper casing, the cover is equipped with the heat-conducting plate in the last casing, and fixedly connected with evenly distributed's second spring between last casing and the heat-conducting plate, the outside fixedly connected with evenly distributed's of heat-conducting plate fin, the outside movable sleeve of mount pad is equipped with supplementary upper casing, lower casing connection fixed fixture block, offer on the upper casing with fixture block assorted through-opening.

Further, the radiating fin extends to the outer side of the upper shell, a sliding groove matched with the radiating fin is formed in the upper shell, a groove matched with a radiating fin distribution area is formed in the top end of the upper shell, the radiating fin and the heat conducting plate can move on the inner side of the upper shell, and the heat conducting plate can be kept attached to the outer portion of the integrated circuit under the action of the elastic force of the second spring.

Further, evenly distributed's thermovent has been seted up to the both sides of going up the casing, and the top of going up the casing has been seted up and is located the recess evenly distributed's louvre, thermovent's distributing position all corresponds with the position of heat-conducting plate, and the heat-conducting plate can be with the heat-conducting plate in the integrated circuit course of working produces, carries out auxiliary heat dissipation through extending to the outside fin of last casing, and the exchange of air and outside air in the casing is all assisted to thermovent and thermovent.

Further, set up in the mount pad with fixture block assorted activity chamber, and fixedly connected with first spring between mount pad and the fixture block, the outside of fixture block is provided with the arc curved surface, and when the position and the through opening of fixture block correspond, the fixture block passes the through opening on the upper casing under the effect of first spring elasticity, will go up casing, lower casing connection fixed.

Further, the top fixedly connected with of lower casing is at mount pad evenly distributed's guide bar all around, open in the last casing have with the guide bar guide slot of one-to-one, lower casing and last casing butt joint encapsulation in-process, the guide bar can dock with the guide slot, for the encapsulation butt joint process of last casing, lower casing provides the direction.

Further, sliding connection between guide bar and the guide way, movable sleeve is equipped with the contact plate in the guide way, and fixedly connected with third spring between guide way and the contact plate, the guide bar insert in the guide way can contact each other with the contact plate, can drive the contact plate after the guide bar contacts the contact plate and slide and compress the guide way in the guide way.

Further, after the upper shell and the lower shell are in butt joint packaging, the contact plate and the guide rod are in contact extrusion, the third spring is in a compressed state, and after connection fixation between the upper shell and the lower shell is released, the third spring can drive the contact plate to extrude the guide rod under the action of self elastic force, so that separation of the upper shell and the lower shell is promoted.

The utility model provides a package housing of a multi-chip integrated circuit, which has the following beneficial effects:

1. this package shell of multicore piece integrated circuit uses through the cooperation of heat-conducting plate and fin and second spring and louvre for this package shell of multicore piece integrated circuit keeps the laminating with the integrated circuit outside under the effect of second spring elasticity at the in-process of integrated circuit work, in the heat-conducting plate with the integrated circuit work in-process heat-generating is leading-in fin, carries out supplementary heat dissipation through extending to the outside fin of upper casing, and the louvre and the air-out all can assist the exchange effect of air and outside air in the upper casing on the upper casing simultaneously, consequently can effectually guarantee the package shell radiating effect of this multicore piece integrated circuit.

2. This encapsulation shell of multicore piece integrated circuit uses through fixture block and through opening and the cooperation of third spring and contact plate for this encapsulation shell of multicore piece integrated circuit finishes at the encapsulation, dock each other between last casing and the lower casing, guide bar and contact plate contact each other and compress the third spring, the fixture block passes through the through opening on the last casing under the effect of first spring elasticity, will go up casing, lower casing connection is fixed, guarantee the stability between the last casing of encapsulation, lower casing, when needing the split to go up casing, lower casing overhauls the integrated circuit, extrusion fixture block makes the fixture block shrink into the activity intracavity, the third spring can drive the contact plate extrusion guide bar under self elastic force, promote the separation of last casing and lower casing, thereby make the split maintenance operation of encapsulation shell of multicore piece integrated circuit simple and convenient.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the assembled exterior of the present utility model;

FIG. 3 is a schematic view of the structure of the inside of the lower housing of the present utility model;

FIG. 4 is a schematic view of the structure of the inside of the upper housing of the present utility model;

FIG. 5 is a schematic view of the structure of the outer portion of the heat conducting plate of the present utility model;

fig. 6 is a schematic view of the structure of the outside of the guide bar and the contact plate of the present utility model.

In the figure: 1. an upper housing; 2. a lower housing; 3. a mounting base; 4. pins; 5. a heat sink; 6. a heat radiation hole; 7. a heat radiation port; 8. a through opening; 9. a clamping block; 10. a guide rod; 11. an assembly groove; 12. a movable cavity; 13. a first spring; 14. a guide groove; 15. a heat conductive plate; 16. a contact plate; 17. a limiting block; 18. a second spring; 19. and a third spring.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1 to 4, the present utility model provides a technical solution: the utility model provides a package shell of multicore integrated circuit, including last casing 1 and lower casing 2, the cover is equipped with mount pad 3 on the lower casing 2, set up in the mount pad 3 with integrated circuit assorted assembly groove 11, integrated circuit can place in the assembly groove 11 on mount pad 3, the cover is equipped with evenly distributed's stopper 17 in going up the casing 1, the outside fixedly connected with of stopper 17 extends to the outside pin 4 of last casing 1, the position of integrated circuit can be restricted to stopper 17 to through electric connection between pin 4 and the integrated circuit.

The top of the lower shell 2 is fixedly connected with guide rods 10 which are uniformly distributed around the mounting seat 3, guide grooves 14 which are in one-to-one correspondence with the guide rods 10 are formed in the upper shell 1, the guide rods 10 can be in butt joint with the guide grooves 14 in the butt joint packaging process of the lower shell 2 and the upper shell 1, guide is provided for the packaging butt joint process of the upper shell 1 and the lower shell 2, the guide rods 10 are in sliding connection with the guide grooves 14, a contact plate 16 is movably sleeved in the guide grooves 14, a third spring 19 is fixedly connected between the guide grooves 14 and the contact plate 16, the guide rods 10 are inserted into the guide grooves 14 and can be in contact with the contact plate 16, the contact plate 16 can be driven to slide in the guide grooves 14 and compress the guide grooves 14 after the guide rods 10 contact the contact plate 16, a heat conducting plate 15 is sleeved in the upper shell 1, second springs 18 which are uniformly distributed are fixedly connected between the upper shell 1 and the heat conducting plate 15, and the heat radiating fins 5 which are uniformly distributed are fixedly connected outside the heat conducting plate 15.

Referring to fig. 2 to 6, the heat sink 5 extends to the outer side of the upper housing 1, a sliding groove matched with the heat sink 5 is formed in the upper housing 1, both the heat sink 5 and the heat conducting plate 15 can move on the inner side of the upper housing 1, a groove matched with the distribution area of the heat sink 5 is formed in the top end of the upper housing 1, the heat conducting plate 15 can keep fit with the outer part of the integrated circuit under the action of elastic force of the second spring 18, meanwhile, the heat conducting plate 15 is prevented from excessively extruding the integrated circuit to cause damage of the integrated circuit, evenly distributed heat dissipation openings 7 are formed in two sides of the upper housing 1, heat dissipation holes 6 which are located in the groove and evenly distributed are formed in the top of the upper housing 1, and the heat conducting plate 15 can guide heat generated in the working process of the integrated circuit into the heat sink 5 to conduct auxiliary heat dissipation through the heat sink 5 extending to the outer part of the upper housing 1.

The distribution positions of the radiating holes 6 and the radiating openings 7 correspond to the positions of the heat conducting plate 15, meanwhile, the radiating holes 6 and the radiating openings 7 formed in the upper shell 1 assist in exchanging air and outside air in the upper shell 1, the heat radiating work is promoted, a clamping block 9 for assisting the upper shell 1 and the lower shell 2 to be connected and fixed is sleeved outside the mounting seat 3, a through opening 8 matched with the clamping block 9 is formed in the upper shell 1, a movable cavity 12 matched with the clamping block 9 is formed in the mounting seat 3, the clamping block 9 is contracted into the movable cavity 12 and compresses the first spring 13 after being extruded by the upper shell 1 in the process of mutually butting and packaging the upper shell 1 and the lower shell 2, a first spring 13 is fixedly connected between the mounting seat 3 and the clamping block 9, an arc-shaped curved surface is arranged outside the clamping block 9, and when the position of the clamping block 9 corresponds to the through opening 8, the clamping block 9 penetrates through the through opening 8 in the upper shell 1 under the action of the elastic force of the first spring 13, and the upper shell 1 and the lower shell 2 are connected and fixed.

After the upper shell 1 and the lower shell 2 are in butt joint packaging, the contact plate 16 and the guide rod 10 are in contact extrusion, the third spring 19 is in a compressed state, when the upper shell 1 and the lower shell 2 are required to be disassembled, the clamping block 9 is extruded, so that the clamping block 9 is retracted into the movable cavity 12 to release the connection fixation between the upper shell 1 and the lower shell 2, and the third spring 19 can drive the contact plate 16 to extrude the guide rod 10 under the action of self elastic force, so that the separation of the upper shell 1 and the lower shell 2 is promoted.

In summary, when the package housing of the multi-chip integrated circuit is used, the integrated circuit is placed in the assembly groove 11 on the mounting seat 3, the upper housing 1 is taken out, the upper housing 1 and the lower housing 2 are mutually butted and packaged, the guide rod 10 and the contact plate 16 are mutually contacted and compress the third spring 19, the clamping block 9 is extruded by the upper housing 1 and then is retracted into the movable cavity 12 and compresses the first spring 13, when the position of the clamping block 9 corresponds to the through opening 8, the clamping block 9 passes through the through opening 8 on the upper housing 1 under the action of the elastic force of the first spring 13, the upper housing 1 and the lower housing 2 are connected and fixed, the stability between the upper housing 1 and the lower housing 2 after packaging is ensured, the position of the integrated circuit is limited by the limiting block 17, and the pin 4 is electrically connected with the integrated circuit, heat is generated in the working process of the integrated circuit, the heat conducting plate 15 keeps the laminating with the outside of integrated circuit under the effect of second spring 18 elasticity, in leading-in fin 5 of heat that produces in the integrated circuit course of working, carry out auxiliary heat dissipation through extending to the outside fin 5 of upper casing 1, the exchange of air and outside air in the upper casing 1 is all assisted to the louvre 6 and the thermovent 7 of seting up on the upper casing 1 simultaneously, when needing the split to go up casing 1, when lower casing 2 overhauls the integrated circuit, extrusion fixture block 9 makes fixture block 9 shrink into movable chamber 12, third spring 19 can drive contact plate 16 extrusion guide bar 10 under the effect of self elasticity, promote the separation of upper casing 1 and lower casing 2, accomplish the dismouting of the encapsulation shell of whole multichip integrated circuit and the radiating process of during operation, can.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," "third," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally coupled, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a multicore piece integrated circuit's encapsulation shell, includes casing (1) and lower casing (2), the cover is installed seat (3) on casing (2) down, set up in installation seat (3) with integrated circuit assorted assembly groove (11), its characterized in that: the utility model discloses a heat conduction device, including upper casing (1), lower casing (2), upper casing (1), cover in, the cover is equipped with evenly distributed's stopper (17) in upper casing (1), the outside fixedly connected with of stopper (17) extends to pin (4) of the outside of upper casing (1), cover is equipped with heat-conducting plate (15) in upper casing (1), and fixedly connected with evenly distributed's second spring (18) between upper casing (1) and heat-conducting plate (15), the outside fixedly connected with evenly distributed's of heat-conducting plate (15) fin (5), the outside movable sleeve of mount pad (3) is equipped with supplementary upper casing (1), lower casing (2) is connected fixed fixture block (9), offer on upper casing (1) with fixture block (9) assorted through opening (8).

2. The package housing for a multi-chip integrated circuit of claim 1, wherein: the cooling fin (5) extends to the outer side of the upper shell (1), a sliding groove matched with the cooling fin (5) is formed in the upper shell (1), and a groove matched with a distribution area of the cooling fin (5) is formed in the top end of the upper shell (1).

3. The package housing for a multi-chip integrated circuit of claim 2, wherein: evenly distributed's thermovent (7) have been seted up to the both sides of going up casing (1), and go up the top of casing (1) and seted up evenly distributed's louvre (6) that are located the recess, the distribution position of louvre (6), thermovent (7) all corresponds with the position of heat conduction board (15).

4. The package housing for a multi-chip integrated circuit of claim 1, wherein: the mounting seat (3) is internally provided with a movable cavity (12) matched with the clamping block (9), a first spring (13) is fixedly connected between the mounting seat (3) and the clamping block (9), and an arc-shaped curved surface is arranged outside the clamping block (9).

5. The package housing for a multi-chip integrated circuit of claim 1, wherein: guide rods (10) uniformly distributed around the mounting seat (3) are fixedly connected to the top of the lower shell (2), and guide grooves (14) which are in one-to-one correspondence with the guide rods (10) are formed in the upper shell (1).

6. The package housing for a multi-chip integrated circuit of claim 5, wherein: the guide rod (10) is in sliding connection with the guide groove (14), the guide groove (14) is movably sleeved with the contact plate (16), and a third spring (19) is fixedly connected between the guide groove (14) and the contact plate (16).

7. The package housing for a multi-chip integrated circuit of claim 6, wherein: after the upper shell (1) and the lower shell (2) are in butt joint packaging, the contact plate (16) and the guide rod (10) are in contact extrusion, and the third spring (19) is in a compressed state.