CN116504733B - High-power patch bridge heat dissipation packaging structure and packaging method - Google Patents
High-power patch bridge heat dissipation packaging structure and packaging method Download PDFInfo
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- CN116504733B CN116504733B CN202310770964.3A CN202310770964A CN116504733B CN 116504733 B CN116504733 B CN 116504733B CN 202310770964 A CN202310770964 A CN 202310770964A CN 116504733 B CN116504733 B CN 116504733B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 93
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000007789 sealing Methods 0.000 claims description 29
- 230000005855 radiation Effects 0.000 claims description 18
- 230000000694 effects Effects 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 12
- 238000001125 extrusion Methods 0.000 claims description 11
- 230000009471 action Effects 0.000 claims description 5
- 238000002788 crimping Methods 0.000 description 19
- 238000003466 welding Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- 238000009434 installation Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000003912 environmental pollution Methods 0.000 description 4
- 238000004880 explosion Methods 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000306 component Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
Abstract
The application relates to a high-power patch bridge heat dissipation packaging structure and a packaging method, wherein the high-power patch bridge heat dissipation packaging structure comprises a packaging shell, a chip and pins arranged on the chip, wherein the upper surface of the packaging shell is provided with a plurality of groups of mounting grooves for the pins to pass through, a PCB (printed circuit board) is arranged in the mounting grooves, the PCB is electrically connected with the pins, a heat dissipation groove is arranged in the packaging shell and is positioned at the lower side of the mounting groove, an opening of the heat dissipation groove faces the outer side of the packaging shell, a heat dissipation plate is arranged in the heat dissipation groove of the packaging shell in a sliding manner, a plurality of heat conduction curled pieces and heat dissipation struts for heat dissipation are arranged in the heat dissipation plate, the heat conduction curled pieces and the heat dissipation struts are alternately arranged, the heat conduction curled pieces and the chips are arranged in a one-to-one correspondence manner, the heat conduction curled pieces are positioned under the chip, and the heat conduction curled pieces are in a flat spiral structure. The high-power patch bridge heat dissipation packaging structure and the packaging method are high in heat dissipation efficiency and small in occupied area.
Description
Technical Field
The application relates to the technical field of electronic device packaging and heat dissipation, in particular to a high-power patch bridge heat dissipation packaging structure and a packaging method.
Background
The high-power patch bridge heat dissipation packaging structure is a heat dissipation packaging structure for a high-power patch bridge rectifier. The structure is generally composed of a heat dissipation base, a heat dissipation sheet, an insulating gasket, a patch bridge, a packaging shell and the like, and is used for improving the heat dissipation capacity and the reliability of the patch bridge rectifier.
The heat dissipation base and the heat dissipation fin of the high-power patch bridge heat dissipation packaging structure are generally manufactured by adopting excellent heat dissipation materials, such as aluminum alloy, copper and the like, so as to improve heat dissipation efficiency. The insulating pad is generally made of silica gel, rubber and other materials so as to ensure insulating performance. The chip bridge is a core component of the rectifier, and the inside of the chip bridge is usually composed of a plurality of diodes, thermistors and other devices. The packaging shell plays a role in protecting components in the rectifier.
However, the heat dissipation effect of the high-power patch bridge heat dissipation packaging structure is poor, and the heat dissipation assembly occupies a large area, so that the high-power patch bridge heat dissipation packaging structure is provided to solve the technical problems.
Disclosure of Invention
The application provides a high-power patch bridge heat dissipation packaging structure and a packaging method, which have high heat dissipation efficiency and small occupied area.
The application provides a high-power patch bridge heat dissipation packaging structure and a packaging method, which adopt the following technical scheme:
the utility model provides a high-power paster bridge heat dissipation packaging structure, includes encapsulation casing, chip and locates the pin on the chip, the upper surface of encapsulation casing is equipped with the mounting groove that a plurality of groups supplied the pin to pass, the inside of mounting groove is equipped with the PCB board, electric connection between PCB board and the pin, the inside of encapsulation casing is equipped with the heat dissipation groove, the heat dissipation groove is located the downside of mounting groove, the opening in heat dissipation groove is towards the outside of encapsulation casing, the inside slip in heat dissipation groove of encapsulation casing is equipped with the heating panel, the inside of heating panel is equipped with a plurality of heat conduction crimping spare and the heat dissipation pillar that is used for radiating, alternate setting between heat conduction crimping spare and the heat dissipation pillar, heat conduction crimping spare is the one-to-one setting with the chip, and heat conduction crimping spare is located under the chip, heat conduction crimping spare is flat heliciform structure.
Through adopting above-mentioned technical scheme, through being equipped with the heat conduction crimping piece under the chip, be the heat conduction crimping piece of flat heliciform structure can increase radiating area effectively, can effectually lead the heat that produces the chip operation in-process and send to the heating panel rapidly on, thereby improve radiating efficiency, because the heat conduction crimping piece is heliciform structure, make the heat can more evenly distribute on whole heating panel, thereby realize more even heat dissipation, in addition, the heat conduction crimping piece of flat heliciform structure can provide smoother air flow, thereby noise reduction, compare in traditional heat conduction crimping piece, the heat conduction crimping piece of flat heliciform structure can reduce the volume under the same radiating effect.
Preferably, the heat dissipation groove comprises a longitudinal channel and a transverse channel, and a corner is formed at the joint of the longitudinal channel and the transverse channel.
Through adopting above-mentioned technical scheme, vertical passageway and horizontal passageway constitution L font recess, L font recess can separate different pins, avoid they to take place the short circuit at the encapsulation in-process, improve the reliability and the stability of chip, and L font recess can strengthen the mechanical strength of chip, reduce the damage of chip in encapsulation and use, in addition, through L font recess, can realize the high-speed production on the automated production line, improve production efficiency and reduce cost, and through passing the pin L font recess, the pin arrangement of chip is inseparabler, thereby reduce the size of chip encapsulation, improve the integrated level of chip.
Preferably, the PCB is located in the transverse channel, a plugging groove is formed in the packaging shell, the top of the plugging groove is communicated with the bottom of the transverse channel, and a plugging rod is slidably arranged in the plugging groove.
Through adopting above-mentioned technical scheme, through mutual extrusion between plug rod and the pin, make the pin crooked towards the direction of transverse channel, until the pin contacts with the PCB board, be used for locking the installation chip, because the extrusion mode of plug rod need not use the welding material, and the solder in the welding process can receive the influence of factors such as temperature, humidity and change, influence the reliability of installation, and under certain circumstances, the welding pin can receive the influence of high temperature environment and take place the problem such as deformation, become flexible, and the mode of plug rod extrusion pin can avoid the appearance of this kind of problem, be applicable to high temperature technology, moreover, the mode of plug rod extrusion pin need not use welding material, therefore the cost is lower, in addition, the mode of plug rod extrusion pin can make installation and dismantlement become simpler, convenient maintenance and change, the mode of plug rod extrusion pin can reduce environmental pollution.
Preferably, one end of the plugging rod is provided with an arc-shaped concave surface, and the arc-shaped concave surface faces the corner part.
Through adopting above-mentioned technical scheme, the cross-section of arc concave surface increases gradually, and the slip grafting of concomitantly inserting the pole makes the pin take place bending deformation along the arc concave surface, and the deformation effect of pin is good.
Preferably, a sealing groove is formed in the upper surface of the packaging shell, a sealing plate is arranged in the sealing groove, and the sealing plate is located on the opening side of the heat dissipation groove.
Through adopting above-mentioned technical scheme, sealing plate slides and inserts sealed radiating groove of mode of seal groove, can prevent effectively that dust, impurity etc. from getting into the radiating groove, thereby keep radiating groove's cleanness, the radiating effect is improved, and sealing plate slides and inserts sealed groove's mode can realize sealed effectual, avoid because radiating groove poor seal and the electronic device that leads to become invalid, damage scheduling problem, the reliability of equipment has been improved, in addition, adopt sealing plate to slide and insert sealed radiating groove's mode sealed radiating groove, can make to maintain more convenient, easily clean and change, sealing plate slides moreover and inserts sealed groove's mode manufacturing cost relatively lower, the manufacturing cost of equipment has been reduced.
Preferably, the upper surface of the packaging shell is provided with a containing groove, and a locking component for locking the chip is arranged in the containing groove of the packaging shell.
Through adopting above-mentioned technical scheme, through utilizing locking component, can effectually lock the chip on the encapsulation casing to guarantee the stability of chip installation.
Preferably, the locking assembly comprises a plug rod arranged at the bottom of the chip and a sleeve arranged in the accommodating groove, a telescopic rod matched with the plug rod is arranged in the sleeve, and the telescopic rod is arranged in the sleeve in a telescopic manner.
Through adopting above-mentioned technical scheme, through the pressing of inserted bar to under the direction effect of telescopic link, insert the inserted bar of chip bottom in the sleeve, with the direction installation effect to the chip.
Preferably, the bottom of the telescopic rod is connected with the top of the heat dissipation support.
Through adopting above-mentioned technical scheme, through the telescopic link with the connection of heat dissipation support for on the temperature on the chip is transmitted the heating panel rapidly, play the radiating effect of chip.
Preferably, the telescopic inside is equipped with two relatively setting clamping bars at least, the middle part of clamping bar sets up with articulated in the sleeve, the bottom activity of clamping bar is located on the telescopic link, the top of clamping bar is equipped with the centre gripping end, the both ends of inserted bar are equipped with the grip block, the inner of centre gripping end is equipped with the draw-in groove with grip block assorted.
Through adopting above-mentioned technical scheme, through the rotation of two clamping rods in the sleeve for the grip block and the draw-in groove phase-match that the top of clamping rod set up are used for quick lock die chip, avoid the chip to rock.
Preferably, the packaging method of the high-power patch bridge heat dissipation packaging structure comprises the following packaging steps:
s1: installing a heat radiation plate;
the heat radiation plate is passed through the opening of the heat radiation groove and slid toward the inside of the heat radiation groove until the heat radiation plate completely enters the inside of the heat radiation groove.
S2: mounting a chip;
the pins on the chip are aligned with the mounting grooves on the upper surface of the packaging shell, the chip is inserted downwards, the pins on the chip in a vertical state slide into the longitudinal channels until the bottoms of the pins are positioned in the inserting grooves, when the inserting rods at the bottoms of the chips downwards extrude the telescopic rods, the two clamping rods oppositely arranged move towards the inserting rods until the clamping grooves of the clamping ends are clamped with the clamping blocks, and at the moment, the chip is locked on the upper surface of the packaging shell.
S3: packaging the chip;
and (3) enabling the plugging rod with the arc-shaped concave surface to penetrate through the plugging groove, wherein when the plugging rod is contacted with the pins, the pins are bent at the corner parts under the action of slow guiding of the arc-shaped concave surface until the bent pins are electrically connected with the PCB.
S4: sealing and packaging the shell;
the sealing plate is passed through the sealing groove until the sealing plate completely covers the opening of the heat dissipation groove.
Through adopting above-mentioned technical scheme, through the mode of pegging graft, with the chip location in the encapsulation casing, can effectually avoid the solder in the welding process probably to receive the influence of factors such as temperature, humidity and change, influence the reliability of installation to utilize the mode of peg graft pole extrusion pin can realize that repeatability is good, be applicable to high temperature technology, with low costs, be convenient for maintain and reduce environmental pollution etc. benefit, be a relatively reliable mounting means.
In summary, the application has the following beneficial effects:
1. according to the high-power patch bridge heat dissipation packaging structure, the heat conduction curling piece is arranged right below the chip, the heat dissipation area can be effectively increased by the heat conduction curling piece in a flat spiral structure, heat generated in the chip operation process can be effectively and rapidly transmitted to the heat dissipation plate, so that the heat dissipation efficiency is improved, the heat can be more uniformly distributed on the whole heat dissipation plate due to the fact that the heat conduction curling piece is in a spiral structure, and therefore more uniform heat dissipation is achieved, in addition, the heat conduction curling piece in the flat spiral structure can provide smoother air flow, so that noise is reduced, and compared with the traditional heat conduction curling piece, the heat conduction curling piece in the flat spiral structure can reduce the volume under the same heat dissipation effect;
2. according to the packaging method of the high-power patch bridge heat dissipation packaging structure, the chip is positioned in the packaging shell in the plugging mode, the phenomenon that the solder in the welding process is possibly influenced by factors such as temperature and humidity to change so as to influence the reliability of installation can be effectively avoided, and the pin extrusion mode of the plugging rod is utilized, so that the high-power patch bridge heat dissipation packaging structure has the advantages of being good in repeatability, suitable for a high-temperature process, low in cost, convenient to maintain, environment-friendly and the like, and is a relatively reliable installation mode.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a heat dissipation package structure of a high-power patch bridge in this embodiment;
fig. 2 is an overall sectional view of the package housing in the present embodiment;
fig. 3 is a schematic diagram of an explosion structure between the heat dissipating plate and the package case in the present embodiment;
FIG. 4 is a schematic diagram of an explosion structure between a chip and a package housing in the present embodiment;
FIG. 5 is a schematic diagram of an explosion structure between the chip and the locking assembly in the present embodiment;
FIG. 6 is a schematic view of an explosion structure between the plunger and the sleeve in the present embodiment;
FIG. 7 is a schematic cross-sectional view of the sleeve in the present embodiment;
fig. 8 is a schematic view of the overall structure of the heat conductive crimping member in this embodiment.
Reference numerals illustrate: 1. packaging the shell; 2. a chip; 3. pins; 4. a mounting groove; 5. a PCB board; 6. a heat sink; 7. a heat dissipation plate; 8. a thermally conductive crimping member; 9. a heat dissipation support; 10. a plug-in groove; 11. inserting a connecting rod; 12. an arc-shaped concave surface; 13. sealing grooves; 14. a sealing plate; 15. a receiving groove; 16. a locking assembly; 1601. a rod; 1602. a sleeve; 1603. a telescopic rod; 1604. a clamping rod; 1605. clamping the end head; 1606. and a clamping block.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings, wherein it is to be understood that the following detailed description is for the purpose of further illustrating the application only and is not to be construed as limiting the scope of the application, as various insubstantial modifications and adaptations of the application to those skilled in the art can be made in light of the foregoing disclosure.
The application discloses a high-power patch bridge heat dissipation packaging structure and a packaging method, as shown in figures 1, 2 and 3, the high-power patch bridge heat dissipation packaging structure comprises a packaging shell 1, a chip 2 and pins 3 arranged on the chip 2, wherein the upper surface of the packaging shell 1 is provided with a plurality of groups of mounting grooves 4 for the pins 3 to pass through, the inside of the mounting grooves 4 is provided with a PCB (printed circuit board) 5, the PCB 5 is electrically connected with the pins 3, the inside of the packaging shell 1 is provided with a heat dissipation groove 6, the heat dissipation groove 6 is positioned at the lower side of the mounting grooves 4, the opening of the heat dissipation groove 6 faces the outside of the packaging shell 1, a heat dissipation plate 7 is slidably arranged in the heat dissipation groove 6 of the packaging shell 1, a plurality of heat conduction curled pieces 8 and heat dissipation struts 9 for heat dissipation are arranged in the heat dissipation plate 7, the heat conduction curled pieces 8 and the heat dissipation struts 9 are alternately arranged, the heat conduction curled pieces 8 and the chip 2 are arranged in a one-to-one correspondence manner, and the heat conduction curled pieces 8 are positioned under the chip 2, as shown in figure 8, and are in a flat spiral structure; through being equipped with heat conduction crimping piece 8 under chip 2, be the heat conduction crimping piece 8 of flat heliciform structure can increase radiating area effectively, can be effectual with the heat rapid conduction that produces on the chip 2 operation in-process to heating panel 7, thereby improve radiating efficiency, because heat conduction crimping piece 8 is heliciform structure, make the heat can more evenly distribute on whole heating panel 7, thereby realize more even heat dissipation, in addition, flat heliciform structure's heat conduction crimping piece 8 can provide smoother air flow, thereby reduce noise, compare in traditional heat conduction crimping piece 8, flat heliciform structure's heat conduction crimping piece 8 can reduce the volume under the same radiating effect.
As shown in fig. 2, the heat dissipation groove 6 includes a longitudinal channel and a transverse channel, the joint of the longitudinal channel and the transverse channel forms a corner, the longitudinal channel and the transverse channel form an L-shaped groove, the L-shaped groove can separate different pins 3, so as to avoid short circuit in the packaging process, improve the reliability and stability of the chip 2, the L-shaped groove can enhance the mechanical strength of the chip 2, reduce the damage of the chip 2 in the packaging and using processes, and in addition, the L-shaped groove can realize high-speed production on an automatic production line, improve the production efficiency and reduce the cost, and the pins 3 of the chip 2 can be arranged more tightly by passing the pins 3 through the L-shaped groove, thereby reducing the packaging size of the chip 2 and improving the integration level of the chip 2;
as shown in fig. 3, the PCB 5 is located in the transverse channel, a plugging slot 10 is provided in the package housing 1, the top of the plugging slot 10 is communicated with the bottom of the transverse channel, and a plugging rod 11 is slidably provided in the plugging slot 10; the pins 3 are bent towards the direction of the transverse channel by mutual extrusion between the plug-in rod 11 and the pins 3 until the pins 3 are in contact with the PCB 5, so that the method is used for locking the mounting chip 2, as the extrusion mode of the plug-in rod 11 does not need to use welding materials, the welding materials in the welding process can be influenced by factors such as temperature, humidity and the like to change, the reliability of mounting is influenced, and in some cases, the problems such as deformation and loosening can be caused by the influence of high-temperature environment on the welding pins 3, the pin 3 is extruded by the plug-in rod 11, the method is applicable to high-temperature technology, welding materials are not needed in the pin 3 extruding mode of the plug-in rod 11, so that the cost is lower, in addition, the pin 3 extruding mode of the plug-in rod 11 can be used for enabling the mounting and dismounting to be simpler, the maintenance and replacement are convenient, and the pin 3 extruding mode of the plug-in rod 11 can reduce environmental pollution; an arc-shaped concave surface 12 is arranged at one end of the insertion rod 11, and the arc-shaped concave surface 12 faces to the corner part; the section of the arc concave surface 12 is gradually increased, and the pin 3 is bent and deformed along the arc concave surface 12 along with the sliding insertion of the insertion rod 11, so that the deformation effect of the pin 3 is good.
As shown in fig. 3, the upper surface of the package housing 1 is provided with a sealing groove 13, a sealing plate 14 is arranged in the sealing groove 13, and the sealing plate 14 is positioned at the opening side of the heat dissipation groove 6; the sealing plate 14 slides and inserts the mode sealed radiating groove 6 of seal groove 13, can prevent effectively that dust, impurity etc. from getting into radiating groove 6, thereby keep radiating groove 6's cleanness, the radiating effect is improved, and sealing plate 14 slides and inserts the mode of seal groove 13 and can realize sealed effectual, avoid because radiating groove 6 poor seal's electronic device inefficacy, damage scheduling problem that leads to, improved the reliability of equipment, in addition, adopt sealing plate 14 to slide and insert the mode sealed radiating groove 6 of seal groove 13, can make the maintenance more convenient, easy cleanness and change, sealing plate 14 slides and inserts the mode manufacturing cost of seal groove 13 relatively lower moreover, the manufacturing cost of equipment has been reduced.
As shown in fig. 4, 5 and 6, the upper surface of the package housing 1 is provided with a receiving groove 15, and a locking assembly 16 for locking the chip 2 is arranged in the receiving groove 15 of the package housing 1; by using the locking assembly 16, the chip 2 can be effectively locked on the package housing 1 so as to ensure the stability of the mounting of the chip 2; the locking assembly 16 comprises a plug-in rod 1601 arranged at the bottom of the chip 2 and a sleeve 1602 arranged in the accommodating groove 15, a telescopic rod 1603 matched with the plug-in rod 1601 is arranged in the sleeve 1602, and the telescopic rod 1603 is telescopically arranged in the sleeve 1602; the inserted link 1601 at the bottom of the chip 2 is inserted into the sleeve 1602 under the guiding action of the telescopic link 1603 by pressing the inserted link 1601, so as to realize the guiding and installing action on the chip 2; the bottom of the telescopic rod 1603 is connected with the top of the heat dissipation strut 9; the telescopic rod 1603 is connected with the heat dissipation support 9, so that the temperature on the chip 2 is rapidly transferred to the heat dissipation plate 7, and the heat dissipation effect of the chip 2 is achieved.
As shown in fig. 6 and 7, at least two opposite clamping rods 1604 are arranged in the sleeve 1602, the middle part of the clamping rod 1604 is hinged with the sleeve 1602, the bottom end of the clamping rod 1604 is movably arranged on the telescopic rod 1603, the top end of the clamping rod 1604 is provided with a clamping end 1605, two ends of the inserting rod 1601 are provided with clamping blocks 1606, and the inner end of the clamping end 1605 is provided with a clamping groove matched with the clamping blocks 1606; through the rotation of two clamping rods 1604 in the sleeve 1602, the clamping blocks 1606 arranged at the top ends of the clamping rods 1604 are matched with the clamping grooves and used for rapidly locking the chip 2, so that the chip 2 is prevented from shaking.
The packaging method of the high-power patch bridge heat dissipation packaging structure comprises the following packaging steps:
s1: a heat radiation plate 7 is arranged;
the heat radiation plate 7 is passed through the opening of the heat radiation groove 6 and slid toward the inside of the heat radiation groove 6 until the heat radiation plate 7 is completely entered into the inside of the heat radiation groove 6.
S2: mounting a chip 2;
the pins 3 on the chip 2 are aligned with the mounting grooves 4 on the upper surface of the package housing 1, the chip 2 is inserted downwards, the pins 3 on the chip 2 in a vertical state slide into the longitudinal channels until the bottoms of the pins 3 are positioned in the inserting grooves 10, when the inserting rods 1601 at the bottoms of the chip 2 downwards squeeze the telescopic rods 1603, the two oppositely arranged clamping rods 1604 move towards the inserting rods 1601 until the clamping grooves of the clamping ends 1605 are clamped with the clamping blocks 1606, and at the moment, the chip 2 is locked on the upper surface of the package housing 1.
S3: packaging the chip 2;
the plugging rod 11 with the arc concave 12 passes through the plugging groove 10, when the plugging rod 11 is contacted with the pins 3, the pins 3 can bend at the corner part under the action of slow guiding of the arc concave 12 until the bent pins 3 are electrically connected with the PCB 5.
S4: sealing and packaging the shell 1;
the sealing plate 14 is passed through the sealing groove 13 until the sealing plate 14 completely covers the opening of the heat sink 6.
The chip 2 is positioned in the packaging shell 1 in a plugging manner, so that the phenomenon that the solder in the welding process is possibly influenced by factors such as temperature, humidity and the like to change, the mounting reliability is influenced can be effectively avoided, and the pin 3 is extruded by the plugging rod 11, so that the mounting manner is stable and reliable, has the advantages of good repeatability, suitability for high-temperature processes, low cost, convenience in maintenance, reduction of environmental pollution and the like.
The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (3)
1. The utility model provides a high-power paster bridge heat dissipation packaging structure, includes encapsulation casing (1), PCB board (5), chip (2) and locates pin (3) on chip (2), its characterized in that: the packaging structure comprises a packaging shell (1), wherein the upper surface of the packaging shell (1) is provided with a plurality of groups of mounting grooves (4) for pins (3) to pass through, the PCB (5) is electrically connected with the pins (3), the inside of the packaging shell (1) is provided with heat dissipation grooves (6), the heat dissipation grooves (6) are positioned at the lower side of the mounting grooves (4), the openings of the heat dissipation grooves (6) face the outer side of the packaging shell (1), the inside of the heat dissipation grooves (6) of the packaging shell (1) is slidably provided with heat dissipation plates (7), the inside of the heat dissipation plates (7) is provided with a plurality of heat conduction curled pieces (8) and heat dissipation supporting columns (9) for heat dissipation, the heat conduction curled pieces (8) are arranged between the heat dissipation supporting columns (9) in a one-to-one correspondence mode, the heat conduction curled pieces (8) are positioned under the chips (2), and the heat conduction curled pieces (8) are in a flat spiral structure;
the device comprises a longitudinal channel and a transverse channel, wherein the joint of the longitudinal channel and the transverse channel forms a corner part;
the PCB (5) is positioned in the transverse channel, a plug-in groove (10) is formed in the packaging shell (1), the top of the plug-in groove (10) is communicated with the bottom of the transverse channel, and a plug-in rod (11) is slidably arranged in the plug-in groove (10);
the longitudinal channel and the transverse channel form an L-shaped groove;
the pins (3) are bent towards the direction of the transverse channel by mutual extrusion between the inserting connection rods (11) and the pins (3) until the pins (3) are contacted with the PCB (5) for locking and mounting the chip (2);
an arc-shaped concave surface (12) is arranged at one end of the plugging rod (11), and the arc-shaped concave surface (12) faces to the corner part, so that pins at two sides of the chip are bent towards a direction away from each other;
the pins (3) on the chip (2) and in a vertical state are arranged in the longitudinal channels in a sliding manner until the bottoms of the pins (3) are positioned in the inserting grooves (10);
the upper surface of the packaging shell (1) is provided with a containing groove (15), and a locking assembly (16) for locking the chip (2) is arranged in the containing groove (15) of the packaging shell (1);
the locking assembly (16) comprises a plug rod (1601) arranged at the bottom of the chip (2) and a sleeve (1602) arranged in the accommodating groove (15), a telescopic rod (1603) matched with the plug rod (1601) is arranged in the sleeve (1602), and the telescopic rod (1603) is arranged in the sleeve (1602) in a telescopic manner;
the bottom of the telescopic rod (1603) is connected with the top of the heat dissipation support column (9);
the inside of telescopic (1602) is equipped with two relative clamping bars (1604) that set up at least, the middle part of clamping bar (1604) articulates in with telescopic (1602) and sets up, on telescopic link (1603) are located in the bottom activity of clamping bar (1604), the top of clamping bar (1604) is equipped with centre gripping end (1605), the both ends of inserted bar (1601) are equipped with grip block (1606), the inner of centre gripping end (1605) is equipped with the draw-in groove with grip block (1606) assorted.
2. The high-power chip bridge heat dissipation package structure as defined in claim 1, wherein: the upper surface of encapsulation casing (1) is equipped with seal groove (13), the inside of seal groove (13) is equipped with closing plate (14), closing plate (14) are located the open side of heat dissipation groove (6).
3. A method for packaging the high-power patch bridge heat dissipation packaging structure as recited in any one of claims 1-2, wherein: the packaging steps comprise:
s1: a heat radiation plate (7) is arranged;
passing the heat radiation plate (7) through the opening of the heat radiation groove (6) and sliding towards the inside of the heat radiation groove (6) until the heat radiation plate (7) completely enters the inside of the heat radiation groove (6);
s2: mounting a chip (2);
aligning pins (3) on a chip (2) with mounting grooves (4) on the upper surface of a packaging shell (1), downwards inserting the chip (2), enabling the pins (3) on the chip (2) and in a vertical state to slide into a longitudinal channel until the bottoms of the pins (3) are positioned in inserting grooves (10), and when inserting rods (1601) at the bottoms of the chip (2) downwards squeeze the telescopic rods (1603), moving two opposite clamping rods (1604) towards the inserting rods (1601) until clamping grooves of clamping ends (1605) are mutually clamped with clamping blocks (1606), wherein the chip (2) is locked on the upper surface of the packaging shell (1);
s3: packaging the chip (2);
passing a plugging rod (11) with an arc concave surface (12) through the plugging groove (10), wherein when the plugging rod (11) is contacted with the pins (3), the pins (3) are bent at the corner parts under the action of slow guiding of the arc concave surface (12) until the bent pins (3) are electrically connected with the PCB (5);
s4: a sealed package housing (1);
the sealing plate (14) is passed through the sealing groove (13) until the sealing plate (14) completely covers the opening of the heat dissipation groove (6).
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004162A (en) * | 2010-06-14 | 2012-01-05 | Yokogawa Electric Corp | Heat dissipation apparatus for surface mounting component |
| CN202427865U (en) * | 2011-12-23 | 2012-09-12 | 东莞市新泽谷机械制造股份有限公司 | Electronic element pin bending device |
| CN103327752A (en) * | 2012-03-23 | 2013-09-25 | 富泰华工业（深圳）有限公司 | Clamping device |
| CN107507810A (en) * | 2016-06-14 | 2017-12-22 | 瑞萨电子株式会社 | The manufacture method of semiconductor devices and semiconductor devices |
| CN206923177U (en) * | 2017-05-05 | 2018-01-23 | 杨振宁 | A kind of electronic equipment installs case apparatus |
| CN112333350A (en) * | 2019-07-30 | 2021-02-05 | 宁波舜宇光电信息有限公司 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
| CN113380669A (en) * | 2021-05-12 | 2021-09-10 | 赵赛赛 | Intelligent packaging equipment and packaging method for frequency components |
| CN114845539A (en) * | 2022-04-18 | 2022-08-02 | 永城职业学院 | Clamping mechanism and computer motherboard component putting device |
| CN218416915U (en) * | 2022-08-23 | 2023-01-31 | 广州市因博电子科技有限公司 | DC-DC power module packaging structure |
| CN115734513A (en) * | 2022-12-19 | 2023-03-03 | 江苏长实基业电气科技有限公司 | Automatic equipment of circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW566838U (en) * | 2003-04-25 | 2003-12-11 | Hon Hai Prec Ind Co Ltd | Heat sink |
-
2023
- 2023-06-28 CN CN202310770964.3A patent/CN116504733B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004162A (en) * | 2010-06-14 | 2012-01-05 | Yokogawa Electric Corp | Heat dissipation apparatus for surface mounting component |
| CN202427865U (en) * | 2011-12-23 | 2012-09-12 | 东莞市新泽谷机械制造股份有限公司 | Electronic element pin bending device |
| CN103327752A (en) * | 2012-03-23 | 2013-09-25 | 富泰华工业（深圳）有限公司 | Clamping device |
| CN107507810A (en) * | 2016-06-14 | 2017-12-22 | 瑞萨电子株式会社 | The manufacture method of semiconductor devices and semiconductor devices |
| CN206923177U (en) * | 2017-05-05 | 2018-01-23 | 杨振宁 | A kind of electronic equipment installs case apparatus |
| CN112333350A (en) * | 2019-07-30 | 2021-02-05 | 宁波舜宇光电信息有限公司 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
| CN113380669A (en) * | 2021-05-12 | 2021-09-10 | 赵赛赛 | Intelligent packaging equipment and packaging method for frequency components |
| CN114845539A (en) * | 2022-04-18 | 2022-08-02 | 永城职业学院 | Clamping mechanism and computer motherboard component putting device |
| CN218416915U (en) * | 2022-08-23 | 2023-01-31 | 广州市因博电子科技有限公司 | DC-DC power module packaging structure |
| CN115734513A (en) * | 2022-12-19 | 2023-03-03 | 江苏长实基业电气科技有限公司 | Automatic equipment of circuit board |
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| CN116504733A (en) | 2023-07-28 |
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Address after: Building 1402, No. 4, Zhuoyue Meilin Center Square (North District), No. 128 Zhongkang Road, Meidu Community, Meilin Street, Futian District, Shenzhen City, Guangdong Province, 518000 Patentee after: Shenzhen Chenda Semiconductor Co.,Ltd. Address before: Building 1402, No. 4, Zhuoyue Meilin Center Square (North District), No. 128 Zhongkang Road, Meidu Community, Meilin Street, Futian District, Shenzhen City, Guangdong Province, 518000 Patentee before: SHENZHEN CHENDAHANG ELECTRONICS CO.,LTD. |
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