CN115734513A - Automatic equipment of circuit board - Google Patents
Automatic equipment of circuit board Download PDFInfo
- Publication number
- CN115734513A CN115734513A CN202211632772.8A CN202211632772A CN115734513A CN 115734513 A CN115734513 A CN 115734513A CN 202211632772 A CN202211632772 A CN 202211632772A CN 115734513 A CN115734513 A CN 115734513A
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- circuit board
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- bending
- extrusion
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Abstract
The invention belongs to the technical field of circuit board assembly, and particularly discloses automatic circuit board assembly equipment. The automatic circuit board assembling equipment comprises a conveying device, a butt joint device, a bending device, a turnover device, a welding device and a discharging device, wherein the conveying device is horizontally arranged, a placing block is connected and installed on the surface of the conveying device, the butt joint device, the bending device, the turnover device, the welding device and the discharging device are sequentially distributed at intervals along the conveying direction of the conveying device, the bending device comprises an extrusion piece and a bending piece which are vertically distributed at intervals, the far end faces of the extrusion piece and the far end faces of the bending piece are both connected with linear telescopic pieces, the two linear telescopic pieces respectively drive the extrusion piece and the bending piece to move oppositely, a deformation groove is formed in the surface of the bending piece, the extrusion piece pushes the bending piece and the deformation groove to extrude each other, and an electronic element pin is changed into a bending shape from a vertical shape; this automatic equipment of circuit board, during the welding, can avoid electronic component and circuit board separation, the condition that the electronic component lacked appears.
Description
Technical Field
The invention belongs to the technical field of circuit board assembly, and particularly relates to automatic circuit board assembly equipment.
Background
The circuit board is also called as a printed circuit board, has the characteristics of high wiring density, light weight, thin thickness and good bending property, and the existing circuit board enables the circuit to be miniaturized and visualized and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
When the existing circuit board is assembled, an electronic element needs to be installed on the surface of the circuit board, after the electronic element is installed, the electronic element needs to be welded on the circuit board, in order to facilitate welding treatment, the circuit board needs to be turned over, pins of the electronic element are enabled to be upwards welded, however, due to different sizes of different electronic elements, small components are easy to separate from the circuit board after turning over, the electronic element is absent, and then the electronic element absent from the circuit board needs to be supplemented, and the working efficiency of the circuit board during production is slowed down.
Disclosure of Invention
In order to solve the above problems, an automatic assembly apparatus for a circuit board is provided.
The invention realizes the purpose through the following technical scheme:
the utility model provides an automatic equipment of circuit board, including conveyor, interfacing apparatus, the device of buckling, turning device, welding set and discharge apparatus, the conveyor level is arranged, conveyor's surface connection installs and places the piece, interfacing apparatus, the device of buckling, turning device, welding set and discharge apparatus are along conveyor's direction of delivery according to preface interval distribution, the device of buckling includes interval arrangement's extruded article and the piece of buckling from top to bottom, the extruded article all is connected with linear extensible member with the terminal surface of keeping away from of the piece of buckling, two linear extensible members drive the extruded article respectively and buckle a removal in opposite directions, the surface of the piece of buckling is seted up and is had the deformation groove, the extruded article promotes the piece of buckling and extrudees each other with the deformation groove, the electronic component pin becomes the form of buckling by vertical form.
As a further optimization scheme of the invention, the surface of the placing block is provided with a through placing opening, the side wall of the placing opening is provided with a supporting boss, the circuit is placed on the surface of the supporting boss, the two sides of the placing block are also provided with the wrapping and clamping components, and after the placing block is turned over by one hundred eighty degrees through the turning device, the wrapping and clamping components support the bottom surface of the circuit board to prevent the circuit board from being separated from the placing block.
As a further optimization scheme of the invention, the package clamp assembly comprises an extrusion bag and a deformation bag, the extrusion bag and the deformation bag are arranged at intervals downwards, the extrusion bag and the deformation bag are respectively arranged at two sides of the circuit board, a built-in bag is further arranged inside the placing block and is respectively communicated with the extrusion bag and the deformation bag through a pipeline, a valve is arranged inside the pipeline communicated with the extrusion bag, the extrusion bag is in an expansion state, the deformation bag is in a contraction state and is marked as a normal state, the extrusion bag is in a contraction state, the deformation bag is in an expansion state and is marked as a working state, and adjusting parts are further arranged at two sides of the bending part and are used for adjusting the extrusion bag and the deformation bag to be switched between the normal state and the working state.
As a further optimization scheme of the invention, a cavity is arranged in the bending piece, the adjusting part comprises a side extrusion block, a rotating shaft is arranged on the surface of the side extrusion block, the rotating shaft is rotatably connected with the side wall of the bending piece, a gear is further sleeved on the surface of the rotating shaft, a rack which is meshed with the gear is arranged on the outer side of the gear, and the rack is slidably arranged on the inner cavity surface of the bending piece.
As a further optimization scheme of the invention, the bottom of the deformation groove is provided with a channel communicated with the cavity of the bending piece, the rack blocks the channel, and the back of the rack is provided with a pin groove.
As a further optimization scheme of the invention, the wall of the deformation groove is provided with an electric heating block.
As a further optimization scheme of the invention, the surface of the extrusion piece close to the bending piece is provided with an expansion bag, the extrusion piece is externally connected with an air pump, the output end of the air pump is communicated with the expansion bag, and when the extrusion piece extrudes the electronic element, the air pump injects air into the expansion bag, and the expansion bag expands to prop against the electronic element.
As a further optimization scheme of the invention, the side wall of the placing block is also provided with a rectangular butt joint groove, the turnover device comprises a rotating motor and a linear cylinder, the output end of the linear cylinder is connected with a butt joint block matched with the butt joint groove, the butt joint block is inserted into the butt joint groove, and the rotating motor drives the linear cylinder to turn over by one hundred eighty degrees, so that the electronic element is in a state that the pins face upwards.
As a further optimization scheme of the invention, a feeding device is further arranged on one side of the docking device, the feeding device is provided with two feeding channels, the two feeding channels respectively correspond to the docking device and the placing blocks at the docking device, the feeding device conveys required electronic elements to the docking device, and empty circuit boards are put on the placing blocks at the docking device.
As a further optimization scheme of the invention, the conveying device is annular, the placing blocks are provided with a plurality of groups, the plurality of groups of placing blocks correspond to the butt joint device, the bending device, the turnover device, the welding device and the discharging device one by one, and the conveying device drives the placing blocks to do intermittent motion.
The invention has the beneficial effects that: according to the invention, by arranging the bending device, when the electronic element is butted, the pin of the electronic element can be bent, and after the circuit board is turned over, the bent electronic element can be hung on the circuit board, so that the electronic element is prevented from being separated from the circuit board, and the welding treatment is convenient.
Drawings
FIG. 1 is a schematic diagram of the circuit board assembly process of the present invention;
FIG. 2 is a schematic view of the connection of the circuit board to the electronic component of the present invention;
FIG. 3 is a schematic diagram illustrating a bent state of a lead of an electronic device according to the present invention;
FIG. 4 is a schematic view of the placement block of the present invention mated to a circuit board;
FIG. 5 is a schematic view of the operating state of the clamping assembly of the present invention;
FIG. 6 is a schematic diagram of a circuit board of the present invention in a flipped state;
FIG. 7 is a schematic view of the construction of the bending member of the present invention;
FIG. 8 is a schematic view of the bending member of the present invention in a state of bending the leads of the electronic component;
fig. 9 is a schematic diagram of the placement block of the present invention mated to a circuit board.
In the figure: 1. a conveying device; 2. a docking device; 3. a bending device; 31. an extrusion member; 311. an inflation bladder; 32. a bending member; 321. a deformation groove; 322. an electric heating block; 323. side extrusion blocks; 324. a rotating shaft; 325. a gear; 326. a rack; 327. a lead groove; 33. a linear expansion member; 4. a turning device; 41. a butt joint block; 5. a welding device; 6. a discharge device; 7. placing the blocks; 71. placing the opening; 72. supporting the boss; 73. a bag clamp assembly; 731. a bag is arranged inside; 732. extruding the bag; 733. a deformation capsule; 734. a valve member; 74. a butt joint groove; 8. a feeding device.
Detailed Description
The present application will now be described in further detail with reference to the drawings, it should be noted that the following detailed description is given for illustrative purposes only and is not to be construed as limiting the scope of the present application, as those skilled in the art will be able to make numerous insubstantial modifications and adaptations to the present application based on the above disclosure.
Example 1
As shown in fig. 1 to 9, an automatic circuit board assembling device includes a conveying device 1, a docking device 2, a bending device 3, a turnover device 4, a welding device 5, and a discharging device 6, the conveying device 1 is horizontally arranged, a placing block 7 is connected to the surface of the conveying device 1, the docking device 2, the bending device 3, the turnover device 4, the welding device 5, and the discharging device 6 are sequentially distributed at intervals along the conveying direction of the conveying device 1, the bending device 3 includes an extruding part 31 and a bending part 32 which are arranged at intervals from top to bottom, the end faces far away from the extruding part 31 and the bending part 32 are connected with linear expansion parts 33, the two linear expansion parts 33 respectively drive the extruding part 31 and the bending part 32 to move in opposite directions, a shape changing groove 321 is formed on the surface of the bending part 32, the extruding part 31 pushes the bending part 32 and the shape changing groove 321 to extrude each other, and pins of electronic components are changed from a vertical shape to a bending shape.
The surface of placing piece 7 is opened the through opening 71 of placing, and the lateral wall of placing opening 71 is provided with support boss 72, and the circuit is placed on the surface of supporting boss 72, and the both sides of placing piece 7 still are equipped with package and press from both sides subassembly 73, place piece 7 through after turning device 4 upset one hundred eighty degrees, package presss from both sides subassembly 73 and supports the bottom surface of circuit board, prevent the circuit board with place piece 7 and break away from.
The clamping assembly 73 comprises an extrusion bag 732 and a deformation bag 733, the extrusion bag 732 and the deformation bag 733 are arranged at intervals downwards, the extrusion bag 732 and the deformation bag 733 are respectively arranged at two sides of the circuit board, a built-in bag 731 is further arranged inside the placing block 7, the built-in bag 731 is respectively communicated with the extrusion bag 732 and the deformation bag 733 through a pipeline, a valve element 734 is arranged inside the pipeline through which the built-in bag 731 is communicated with the extrusion bag 732, the extrusion bag 732 is in an expansion state, the deformation bag 733 is in a contraction state, the extrusion bag 732 is in a contraction state, the deformation bag 733 is in an expansion state, the deformation bag 733 is in a working state, and adjusting parts are further arranged at two sides of the bending piece 32 and used for adjusting the extrusion bag 732 and the deformation bag 733 to be switched between the normal state and the working state.
It should be noted that, in this embodiment, the valve element 734 is an electrically controlled one-way valve, when the extrusion bag 732 is extruded, gas enters the deformation bag 733 through the valve element 734, and a material receiving device is further disposed at the discharging device 6, the material receiving device includes a material receiving conveyor belt and a collecting box, the conveyor belt is located right below the discharging device 6, and the discharging device 6 includes a telescopic push rod, when the placing block 7 moves to the discharging device 6, the telescopic push rod extends to push the back of the circuit board downward, so as to assist the circuit board to separate from the placing block 7, thereby completing the discharging process.
Wherein, the surface of placing piece 7 should still set up camera and control module, when the camera detected to place piece 7 and got into to 6 departments of discharge apparatus, the camera sent the model to control module, control module control valve piece 734 opens, the inside air current of deformation bag 733 runs off, begin the shrink and can't continue to support the circuit board, the circuit board is under the action of gravity, the circuit board more easily with place the separation of piece 7, fall into to receiving the material conveyer belt surface, the transport through receiving the material conveyer belt gets into to the collecting box inside.
The cavity is arranged inside the bending piece 32, the adjusting part comprises a side extrusion block 323, a rotating shaft 324 is mounted on the surface of the side extrusion block 323, the rotating shaft 324 is rotatably connected with the side wall of the bending piece 32, a gear 325 is further sleeved on the surface of the rotating shaft 324, a meshed rack 326 is arranged on the outer side of the gear 325, and the rack 326 is slidably mounted on the inner cavity surface of the bending piece 32.
It should be noted that, in this embodiment, the side squeezing block 323 is fan-shaped, in an initial state, the slope section of the side squeezing block 323 inclines upward, at this time, the side squeezing block 323 that inclines upward cannot contact with the pressing bag 732 as the bending piece 32 moves upward, when the rotating shaft 324 rotates, the side squeezing block 323 rotates along the axial direction of the rotating shaft 324 toward the bending piece 32, so that the side squeezing block becomes a rotation in which the slope section inclines downward, and further, when the bending piece 32 is far away from the circuit board, the side squeezing block can squeeze the pressing bag 732 to trigger the deformation bag 733 to press the upper end of the circuit board.
The bottom of the deformation groove 321 is provided with a channel communicated with the cavity of the bending piece 32, the rack 326 blocks the channel, and the back of the rack 326 is provided with a pin groove 327.
It should be noted that the rack 326 is connected to the cavity of the bending member 32 through a return spring.
The wall of the deformation groove 321 is provided with an electric heating block 322.
It should be noted that when the pins of the electronic component are inserted into the pin slots 327, the electric heating blocks 322 are energized to raise the temperature of the pins of the electronic component, so that the pins of the electronic component can be bent more easily.
The surface of the extrusion piece 31 close to the bending piece 32 is provided with an expansion bag 311, the extrusion piece 31 is externally connected with an air pump, the output end of the air pump is communicated with the expansion bag 311, when the extrusion piece 31 extrudes the electronic element, the air pump injects air into the expansion bag 311, and the expansion bag 311 expands to prop against the electronic element.
The side wall of the placing block 7 is further provided with a rectangular butt joint groove 74, the turnover device 4 comprises a rotary motor and a linear cylinder, the output end of the linear cylinder is connected with a butt joint block 41 matched with the butt joint groove 74, the butt joint block 41 is inserted into the butt joint groove 74, and the rotary motor drives the linear cylinder to overturn by one hundred eighty degrees, so that the electronic element is changed into a state with the pin facing upwards.
One side of the butt joint device 2 is further provided with a feeding device 8, the feeding device 8 is provided with two feeding channels, the two feeding channels respectively correspond to the butt joint device 2 and the placing blocks 7 at the butt joint device 2, the feeding device 8 conveys required electronic elements to the butt joint device 2, and empty circuit boards are put on the placing blocks 7 at the butt joint device 2.
It should be noted that, in the present embodiment, the loading device 8 includes a plurality of sets of manipulators, and the manipulators place the circuit boards and the electronic components with the mounted electronic components inside the docking device 2.
When the automatic circuit board assembling equipment is used, the feeding device 8 places an empty circuit board on the surface of the supporting boss 72 of the placing block 7, and conveys an electronic component to be installed to the butting device 2, the manipulator of the butting device 2 inserts the electronic component to the surface of the circuit board according to the installation position, the circuit board is butted with the electronic component, the conveying device 1 continues to convey the circuit board on the placing block 7 to the bending device 3, at the moment, the linear expansion members 33 which are symmetrically arranged up and down extend to drive the extrusion member 31 and the bending member 32 to move towards the surface of the circuit board, the extrusion member 31 abuts against the upper surface of the circuit board, at the moment, the air pump injects air into the expansion bag 311, the expansion bag 311 inflates, the inflated expansion bag 311 can be contacted with the top surfaces of the electronic components with different heights to extrude the electronic component, meanwhile, the bending piece 32 also moves to the pin of the electronic component, the pin of the electronic component is inserted into the pin groove 327 on the back of the rack 326, the electric heating block 322 on the inner wall of the pin groove 327 heats the pin of the electronic component to soften the pin of the electronic component, then the bending piece 32 moves upwards continuously under the action of the linear expansion piece 33 to extrude the pin of the electronic component, the hardware of the electronic component moves towards two sides under extrusion to form an L-shaped bending shape, the bending processing of the pin of the electronic component is completed, and when the pin of the electronic component bends towards two sides, the pin of the electronic component pushes the rack 326 to move towards two sides, the rack 326 is meshed with the gear 325 to drive the gear 325 to rotate, the gear 325 drives the rotating shaft 324 to rotate, the side extrusion piece 323 is driven to overturn 180 degrees, the inclined plane end of the side extrusion piece faces downwards, then when the linear expansion piece 33 drives the bending piece 32 to be far away from the electronic component, when the side extrusion block 323 moves downwards, the inclined surface and the extrusion bag 732 are extruded mutually, the extrusion bag 732 contracts, gas in the extrusion bag 732 enters the deformation bag 733 under the guidance of the built-in bag 731, the deformation bag 733 inflates and expands to press the upper end face of the circuit board, so as to complete the upper end wrapping of the circuit board, then the conveying device 1 drives the placing block 7 to enter the turnover device 4, the linear air cylinder extends to enable the butt joint block 41 to be inserted into the butt joint groove 74, then the rotary motor drives the linear air cylinder to turn over by one hundred eighty degrees, so that the electronic element is in a state of an upward pin, at the moment, the wrapping of the deformation bag 733 supports the circuit board to prevent the circuit board from being separated from the placing block 7, then the conveying device 1 continues to move to drive the circuit board with the upward pin to enter the welding device 5, the welding device 5 welds the pin of the electric element, finally, the electronic element enters the unloading device 6 after being conveyed by the conveying device 1, the telescopic push rod extends to downwards to press the back of the circuit board to assist the circuit board to separate from the placing block 7, so as to complete the unloading process.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention.
Claims (10)
1. The utility model provides an automatic equipment of circuit board, a serial communication port, including conveyor (1), interfacing apparatus (2), bending device (3), turning device (4), welding set (5) and discharge apparatus (6), conveyor (1) level is arranged, conveyor's (1) surface connection installs places piece (7), interfacing apparatus (2), bending device (3), turning device (4), welding set (5) and discharge apparatus (6) are along the direction of delivery of conveyor (1) interval distribution according to the preface, bending device (3) are including extruded article (31) and the piece (32) of buckling of interval arrangement from top to bottom, the terminal surface of keeping away from of extruded article (31) and piece (32) of buckling all is connected with linear extensible member (33), two linear extensible member (33) drive extruded article (31) and piece (32) of buckling respectively and move towards each other, the surface of piece (32) of buckling is seted up tangible groove (321) that becomes, extruded article (31) promote piece (32) and deformation groove (321) to extrude each other, the electronic component pin becomes the form of buckling by vertical.
2. The automatic circuit board assembling equipment of claim 1, wherein: the surface of placing piece (7) is opened the through opening of placing (71), and the lateral wall of placing opening (71) is provided with support boss (72), and the circuit is placed on the surface of supporting boss (72), and the both sides of placing piece (7) still are equipped with package and press from both sides subassembly (73), place piece (7) through after turning device (4) upset one hundred eighty degrees, package presss from both sides subassembly (73) support circuit board's bottom surface, prevent circuit board and place piece (7) and break away from.
3. The automatic circuit board assembling equipment of claim 2, wherein: the clamping assembly (73) comprises an extrusion bag (732) and a deformation bag (733), the extrusion bag (732) and the deformation bag (733) are arranged at intervals downwards, the extrusion bag (732) and the deformation bag (733) are respectively arranged on two sides of the circuit board, a built-in bag (731) is further arranged inside the placing block (7), the built-in bag (731) is communicated with the extrusion bag (732) and the deformation bag (733) through a pipeline respectively, a valve piece (734) is arranged inside the pipeline through which the built-in bag (731) is communicated with the extrusion bag (732), the extrusion bag (732) is in an expansion state, the deformation bag (733) is in a contraction state and is marked as a normal state, the extrusion bag (732) is in a contraction state, the deformation bag (733) is marked as a working state, adjusting parts are further arranged on two sides of the bending piece (32), and the adjusting parts are used for adjusting the extrusion bag (732) and the deformation bag (733) to be switched between the normal state and the working state.
4. The automatic circuit board assembling equipment of claim 3, wherein: the inside cavity that is provided with of piece (32) of buckling, regulating part include side crowded piece (323), and the surface mounting of side crowded piece (323) has pivot (324), and pivot (324) rotate with the lateral wall of buckling piece (32) and are connected, and the surface of pivot (324) still overlaps and is equipped with gear (325), and the outside of gear (325) is equipped with engaged with rack (326), and rack (326) slidable mounting is at the inner chamber face of buckling piece (32).
5. The automatic circuit board assembling equipment of claim 4, wherein: the bottom of the deformation groove (321) is provided with a channel communicated with the cavity of the bending piece (32), the rack (326) blocks the channel, and the back of the rack (326) is provided with a pin groove (327).
6. The automatic circuit board assembling equipment of claim 5, wherein: the wall of the deformation groove (321) is provided with an electric heating block (322).
7. The automated circuit board assembly apparatus of claim 6, wherein: the surface of the extrusion piece (31) close to the bending piece (32) is provided with an expansion bag (311), the extrusion piece (31) is externally connected with an air pump, the output end of the air pump is communicated with the expansion bag (311), when the extrusion piece (31) extrudes the electronic element, the air pump injects air into the expansion bag (311), and the expansion bag (311) expands to abut against the electronic element.
8. The automated circuit board assembly apparatus of claim 7, wherein: the side wall of placing piece (7) still sets up rectangular butt joint groove (74), and turning device (4) include rotating electrical machines and linear cylinder, and the output of linear cylinder is connected with butt joint piece (41) with butt joint groove (74) mutual adaptation, and inside butt joint piece (41) inserted butt joint groove (74), the linear cylinder upset of rotating electrical machines drive one hundred eighty degrees for electronic component becomes pin up state.
9. The automated circuit board assembly apparatus of claim 8, wherein: one side of the butt joint device (2) is further provided with a feeding device (8), the feeding device (8) is provided with two feeding channels, the two feeding channels correspond to the butt joint device (2) and the placing blocks (7) at the butt joint device (2) respectively, the feeding device (8) conveys needed electronic elements to the butt joint device (2), and empty circuit boards are put on the placing blocks (7) at the butt joint device (2).
10. The automated circuit board assembly apparatus of claim 9, wherein: conveyor (1) is the annular, places piece (7) and is provided with the multiunit, and the multiunit is placed piece (7) and interfacing apparatus (2), bending device (3), turning device (4), welding set (5) and discharge apparatus (6) one-to-one, and conveyor (1) drives and places piece (7) and do intermittent motion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211632772.8A CN115734513A (en) | 2022-12-19 | 2022-12-19 | Automatic equipment of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211632772.8A CN115734513A (en) | 2022-12-19 | 2022-12-19 | Automatic equipment of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115734513A true CN115734513A (en) | 2023-03-03 |
Family
ID=85301583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211632772.8A Withdrawn CN115734513A (en) | 2022-12-19 | 2022-12-19 | Automatic equipment of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115734513A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504733A (en) * | 2023-06-28 | 2023-07-28 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
| CN116652473A (en) * | 2023-07-28 | 2023-08-29 | 熊比特科技(南京)有限公司 | Welding equipment for manufacturing Internet of things equipment and application method thereof |
-
2022
- 2022-12-19 CN CN202211632772.8A patent/CN115734513A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504733A (en) * | 2023-06-28 | 2023-07-28 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
| CN116504733B (en) * | 2023-06-28 | 2023-09-15 | 深圳辰达行电子有限公司 | High-power patch bridge heat dissipation packaging structure and packaging method |
| CN116652473A (en) * | 2023-07-28 | 2023-08-29 | 熊比特科技(南京)有限公司 | Welding equipment for manufacturing Internet of things equipment and application method thereof |
| CN116652473B (en) * | 2023-07-28 | 2023-10-13 | 熊比特科技(南京)有限公司 | Welding equipment for manufacturing Internet of things equipment and application method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20230303 |
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| WW01 | Invention patent application withdrawn after publication |