CN111446226A - Fixing device of lead frame - Google Patents
Fixing device of lead frame Download PDFInfo
- Publication number
- CN111446226A CN111446226A CN202010398755.7A CN202010398755A CN111446226A CN 111446226 A CN111446226 A CN 111446226A CN 202010398755 A CN202010398755 A CN 202010398755A CN 111446226 A CN111446226 A CN 111446226A
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- Prior art keywords
- frame
- lead
- lead frame
- circuit board
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
Abstract
The invention discloses a fixing device of a lead frame, which structurally comprises a radiating fin, a metal sealing cover, a packaging lead frame, a lead conducting bottom frame, a frame fixing frame, a circuit board, a lower groove and a through hole, and has the following effects: encapsulation lead frame and lead wire conduction underframe cooperation, the chip that can make the loading possesses good thermal diffusivity, and through inclosed structure, can avoid the dust to cause the pollution to the chip, turn into a whole with many pins of arranging the setting simultaneously and cooperate with the circuit board, the electric conductivity of the chip that can improve greatly, improve heat dissipation and information processing efficiency, frame mount and circuit board cooperation, the lead wire structure that can make encapsulation lead frame and lead wire conduction underframe to constitute fast fixes at the circuit board top, and through simple and easy pressing operation, can demolish lead wire structure from the circuit board fast, be favorable to the later maintenance and the repair of lead frame.
Description
Technical Field
The invention relates to the field of lead frames of semiconductor devices, in particular to a fixing device of a lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, the lead frame is a key structural member for realizing the electrical connection between the leading-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical circuit, the lead frame is required to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry, the main function of the lead frame is to provide a carrier for mechanically supporting the chip and serve as a conductive medium for internally and externally connecting the chip circuit to form an electrical signal path and a heat dissipation path for dissipating heat generated during the operation of the chip together with a packaging shell, the existing lead frame of a semiconductor device is generally welded and fixed on a welding spot on the surface of a circuit board by pins with two axially symmetrical sides, the later maintenance and repair of the lead frame are not facilitated, and the lead frame of the semiconductor device is forcibly detached from the circuit board, the circuit that can cause the not damage of equidimension to the circuit of circuit board consequently needs to develop a fixing device of lead frame to this solves current semiconductor device lead frame and utilizes both sides to be axisymmetric's pin welded fastening on the solder joint on circuit board surface usually, is unfavorable for the later maintenance and the repair of lead frame, and demolishs the semiconductor device lead frame from the circuit board by force, can cause the not problem of the damage of equidimension to the circuit of circuit board.
Summary of the invention
Aiming at the defects of the prior art, the invention is realized by the following technical scheme: a fixing device of a lead frame comprises radiating fins, a metal sealing cover, a packaging lead frame, a lead conducting bottom frame, a frame fixing frame, a circuit board, a lower groove and through holes, wherein the packaging lead frame is arranged above the circuit board, the metal sealing cover is arranged at the top of the packaging lead frame, the metal sealing cover is buckled with the packaging lead frame, more than two radiating fins are arranged at the top of the metal sealing cover in parallel, the radiating fins and the metal sealing cover are of an integrated structure, the lead conducting bottom frame is arranged at the bottom of the packaging lead frame, the lead conducting bottom frame is matched with the packaging lead frame, the packaging lead frame is matched with the circuit board through the lead conducting bottom frame, the lower groove is arranged at the bottom of the circuit board, the lower groove and the circuit board are of an integrated structure, two through holes are arranged on two sides of the lower groove in, the through hole and the circuit board are of an integrated structure, the lower groove is provided with a frame fixing frame, the frame fixing frame is movably connected with the lower groove, and the frame fixing frame is matched with the lead conducting bottom frame through the through hole.
As the further optimization of this technical scheme, encapsulation lead frame constitute by insulating frame, outer lead gold thread, inner lead gold thread, chip pad, recess, insulating frame top be equipped with the recess, recess and insulating frame structure as an organic whole, the inside central point of recess put and be equipped with the chip pad, chip pad and recess adopt interference fit, chip pad both sides be axisymmetric structure and be equipped with two inner lead gold threads, inner lead gold thread and chip pad connect, insulating frame both sides be axisymmetric structure and be equipped with two outer lead gold threads, outer lead gold thread and inner lead gold thread connect.
As the further optimization of this technical scheme, the chip pad constitute by pad, thermal-arrest groove, heat-conduction thin rod, external metal frame, pad top evenly distributed have the thermal-arrest groove more than two, thermal-arrest groove and pad structure as an organic whole, pad below be equipped with external metal frame, the parallel equidistance in external metal frame top be equipped with the heat-conduction thin rod more than two, external metal frame be connected with the thermal-arrest groove through heat-conduction thin rod.
As the further optimization of this technical scheme, lead wire conduction underframe constitute by buckle, fixed horizontal bar, pin, fixed slot, notch, buckle central point put and be equipped with the notch, notch and buckle structure as an organic whole, the buckle both sides be axisymmetric structure and be equipped with two pins, the pin top be equipped with fixed horizontal bar, fixed horizontal bar and pin adopt interference fit, pin central point put and be equipped with the fixed slot, fixed slot and pin structure as an organic whole.
As the further optimization of this technical scheme, the frame mount constitute by first spring, slider, slide bar, joint, flat board, spacing seat, the parallel equidistance in dull and stereotyped both sides be equipped with two joints, joint and flat board adopt interference fit, dull and stereotyped central point put and be equipped with the spacing seat, spacing seat vertical welding on flat board, spacing seat both sides be axisymmetric structure and be equipped with the slider, the slider on be equipped with the slide bar, slide bar and flat board be parallel to each other and one end is fixed on spacing seat, the slide bar outer lane on be equipped with first spring, first spring mounting on spacing seat and slider.
As the further optimization of this technical scheme, the joint constitute by branch, spacing ring, kicking block, gag lever post, second spring, stop block, branch top be equipped with the spacing ring, the inside central point of spacing ring put and be equipped with the gag lever post, the stopper overcoat on even equidistance be equipped with four gag lever posts, the stopper pass through the gag lever post and be connected with the spacing ring, branch pass through the stopper and be connected with the spacing ring, the inside even equidistance of spacing ring be equipped with four kicking blocks, kicking block and gag lever post adopt sliding fit, the gag lever post outer lane on be equipped with the second spring, the second spring mounting between kicking block and stopper.
As a further optimization of the technical scheme, the buckle plate is arranged at the bottom of the insulating outer frame and is buckled with the insulating outer frame, and the buckle plate is buckled with the external metal frame through the notch.
As a further optimization of the technical scheme, the flat plate is matched with a lower groove arranged at the bottom of the circuit board through two sliding blocks with the top in an axisymmetric structure.
Advantageous effects
The fixing device of the lead frame is reasonable in design and strong in functionality, and has the following beneficial effects:
the packaging lead frame is matched with the lead conducting bottom frame, so that a loaded chip has good heat dissipation performance, and the chip can be prevented from being polluted by dust through a closed structure;
the radiating fins are arranged at the top of the metal sealing cover, the metal sealing cover is buckled on the insulating outer frame through the groove, the heat collecting grooves are uniformly distributed at the top of the bonding pad, the bonding pad is buckled inside the groove of the insulating outer frame, the bonding pad is connected with the heat conduction thin rod through the heat collecting grooves, and the heat conduction thin rod is connected with the external metal frame arranged at the bottom of the insulating outer frame, so that heat generated by a loaded chip in the operation process can be quickly discharged from the upper end and the lower end of the insulating outer frame by utilizing the heat conduction property of metal, the heat radiation efficiency of the lead frame is greatly improved, the height difference between the heat conduction thin rod and the heat collecting grooves is set, the heat conduction thin rod can be prevented from being directly connected with the chip, the heat collecting grooves can have better heat collection efficiency, and the resistance value and the electric loss of the chip cannot be influenced;
the flat plate of the invention is matched with the lower groove arranged at the bottom of the circuit board through two sliding blocks with the top in an axial symmetry structure, the circumference diameter formed by the outer ring of the limiting ring is equal to the circumference diameter formed by the inner ring of the fixed groove, and the two sliding blocks are matched, because one side of the top end of the sliding block is in an inclined plane structure, when the flat plate is pushed up, the sliding block can quickly enter the lower groove of the circuit board through the inclined plane structure formed by the sliding block, and the flat plate can be fixed by the elastic force formed by a second spring, because the supporting rod can drive the limiting ring to pass through the through hole and accurately enable the limiting ring to enter the fixed groove, because four jacking blocks uniformly arranged in the limiting ring are in an arc block structure and one side is in an inclined plane structure, when the jacking blocks enter the fixed groove, the jacking blocks are tightly attached to the inner wall of the fixed groove by the elastic force formed by the second spring, thereby the lead structure consisting, and the lead structure has the function of being detached from the circuit board on the premise of not damaging the circuit on the surface of the circuit board.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a rear view of a fixing device for a lead frame according to the present invention;
FIG. 2 is a schematic top view of a cross-sectional structure of a package lead frame according to the present invention;
FIG. 3 is a cross-sectional front view of a chip bonding pad according to the present invention;
FIG. 4 is a schematic top cross-sectional view of a lead conducting bottom frame according to the present invention;
FIG. 5 is a rear view of the frame fixing frame of the present invention;
fig. 6 is a schematic top view of the joint of the present invention.
In the figure: the heat dissipation plate comprises a heat dissipation plate-1, a metal sealing cover-2, a packaging lead frame-3, an insulating outer frame-31, an outer lead gold wire-32, an inner lead gold wire-33, a chip bonding pad-34, a bonding pad-34 a, a heat collection groove-34 b, a heat conduction thin rod-34 c, an external metal frame-34 d, a groove-35, a lead conduction bottom frame-4, a buckle plate-41, a fixing transverse strip-42, a pin-43, a fixing groove-44, a notch-45, a frame fixing frame-5, a first spring-51, a slide block-52, a slide rod-53, a joint-54, a support rod-54 a, a limiting ring-54 b, a top block-54 c, a limiting rod-54 d, a second spring-54 e, a limiting block-54 f, a flat plate-55, a, A limiting seat-56, a circuit board-6, a lower groove-7 and a through hole-8.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easy to understand, the following description and the accompanying drawings further illustrate the preferred embodiments of the invention.
Example 1
Referring to fig. 1 to 4, the present invention provides an embodiment of a fixing device for a lead frame, comprising:
referring to fig. 1, a lead frame fixing device structurally comprises a heat sink 1, a metal cover 2, a package lead frame 3, a lead conduction bottom frame 4, a frame fixing frame 5, a circuit board 6, a lower groove 7 and a through hole 8, wherein the package lead frame 3 is arranged above the circuit board 6, the metal cover 2 is arranged at the top of the package lead frame 3, the metal cover 2 and the package lead frame 3 are buckled, more than two heat sinks 1 are arranged at the top of the metal cover 2 in parallel, the heat sinks 1 and the metal cover 2 are of an integrated structure, the lead conduction bottom frame 4 is arranged at the bottom of the package lead frame 3, the lead conduction bottom frame 4 is matched with the package lead frame 3, the package lead frame 3 is matched with the circuit board 6 through the lead conduction bottom frame 4, the lower groove 7 is arranged at the bottom of the circuit board 6, the lower groove 7 and the circuit board 6 are of an integrated structure, two through holes 8 are formed in the two sides of the lower groove 7 in parallel at equal intervals, the through holes 8 and the circuit board 6 are of an integrated structure, a frame fixing frame 5 is arranged on the lower groove 7, the frame fixing frame 5 is movably connected with the lower groove 7, and the frame fixing frame 5 is matched with the lead conducting bottom frame 4 through the through holes 8.
Referring to fig. 2, the package lead frame 3 is composed of an insulating outer frame 31, outer lead gold wires 32, inner lead gold wires 33, a chip pad 34 and a groove 35, the top of the insulating outer frame 31 is provided with the groove 35, the groove 35 and the insulating outer frame 31 are of an integrated structure, the chip pad 34 is arranged at the center position inside the groove 35, the chip pad 34 and the groove 35 are in interference fit, two inner lead gold wires 33 are arranged on two sides of the chip pad 34 in an axisymmetric structure, the inner lead gold wires 33 are connected with the chip pad 34, two outer lead gold wires 32 are arranged on two sides of the insulating outer frame 31 in an axisymmetric structure, the outer lead gold wires 32 are connected with the inner lead gold wires 33, and the groove 35 is arranged below the metal sealing cover 2 and is fastened with the metal sealing cover 2.
Referring to fig. 3, the chip pad 34 includes a pad 34a, a heat collection groove 34b, a fine heat conduction rod 34c, and an external metal frame 34d, the pad 34a is disposed inside the groove 35 and is in interference fit with the groove, the pad 34a is connected to an external lead gold wire 32 through an internal lead gold wire 33, the top of the pad 34a is uniformly distributed with more than two heat collection grooves 34b, the heat collection groove 34b and the pad 34a are integrated, the external metal frame 34d is disposed below the pad 34a, the top of the external metal frame 34d is parallel and equidistantly provided with more than two fine heat conduction rods 34c, the external metal frame 34d is connected to the heat collection groove 34b through the fine heat conduction rods 34c, and one fine heat conduction rod 34c is correspondingly connected to one heat collection groove 34 b.
Referring to fig. 4, the lead conducting bottom frame 4 is composed of a buckle plate 41, a fixing cross bar 42, pins 43, a fixing groove 44 and notches 45, the notches 45 are formed in the center of the buckle plate 41, the notches 45 and the buckle plate 41 are of an integrated structure, the buckle plate 41 is arranged at the bottom of the insulating outer frame 31 and fastened with the insulating outer frame 31, the buckle plate 41 is fastened with the external metal frame 34d through the notches 45, two pins 43 are arranged on two sides of the buckle plate 41 in an axisymmetric structure, the fixing cross bar 42 is arranged at the tops of the pins 43, the fixing cross bar 42 and the pins 43 are in interference fit, the pins 43 are connected with the internal lead gold wires 33 through the external lead gold wires 32, the fixing groove 44 is formed in the center of the pins 43, and the fixing groove 44 and the pins 43 are of an integrated structure.
Example 2
Referring to fig. 1 to 6, the present invention provides an embodiment of a fixing device for a lead frame, comprising:
referring to fig. 1, a lead frame fixing device structurally comprises a heat sink 1, a metal cover 2, a package lead frame 3, a lead conduction bottom frame 4, a frame fixing frame 5, a circuit board 6, a lower groove 7 and a through hole 8, wherein the package lead frame 3 is arranged above the circuit board 6, the metal cover 2 is arranged at the top of the package lead frame 3, the metal cover 2 and the package lead frame 3 are buckled, more than two heat sinks 1 are arranged at the top of the metal cover 2 in parallel, the heat sinks 1 and the metal cover 2 are of an integrated structure, the lead conduction bottom frame 4 is arranged at the bottom of the package lead frame 3, the lead conduction bottom frame 4 is matched with the package lead frame 3, the package lead frame 3 is matched with the circuit board 6 through the lead conduction bottom frame 4, the lower groove 7 is arranged at the bottom of the circuit board 6, the lower groove 7 and the circuit board 6 are of an integrated structure, two through holes 8 are formed in the two sides of the lower groove 7 in parallel at equal intervals, the through holes 8 and the circuit board 6 are of an integrated structure, a frame fixing frame 5 is arranged on the lower groove 7, the frame fixing frame 5 is movably connected with the lower groove 7, and the frame fixing frame 5 is matched with the lead conducting bottom frame 4 through the through holes 8.
Referring to fig. 2, the package lead frame 3 is composed of an insulating outer frame 31, outer lead gold wires 32, inner lead gold wires 33, a chip pad 34 and a groove 35, the top of the insulating outer frame 31 is provided with the groove 35, the groove 35 and the insulating outer frame 31 are of an integrated structure, the chip pad 34 is arranged at the center position inside the groove 35, the chip pad 34 and the groove 35 are in interference fit, two inner lead gold wires 33 are arranged on two sides of the chip pad 34 in an axisymmetric structure, the inner lead gold wires 33 are connected with the chip pad 34, two outer lead gold wires 32 are arranged on two sides of the insulating outer frame 31 in an axisymmetric structure, the outer lead gold wires 32 are connected with the inner lead gold wires 33, and the groove 35 is arranged below the metal sealing cover 2 and is fastened with the metal sealing cover 2.
Referring to fig. 3, the chip pad 34 includes a pad 34a, a heat collection groove 34b, a fine heat conduction rod 34c, and an external metal frame 34d, the pad 34a is disposed inside the groove 35 and is in interference fit with the groove, the pad 34a is connected to an external lead gold wire 32 through an internal lead gold wire 33, the top of the pad 34a is uniformly distributed with more than two heat collection grooves 34b, the heat collection groove 34b and the pad 34a are integrated, the external metal frame 34d is disposed below the pad 34a, the top of the external metal frame 34d is parallel and equidistantly provided with more than two fine heat conduction rods 34c, the external metal frame 34d is connected to the heat collection groove 34b through the fine heat conduction rods 34c, and one fine heat conduction rod 34c is correspondingly connected to one heat collection groove 34 b.
Referring to fig. 4, the lead conducting bottom frame 4 is composed of a buckle plate 41, a fixing cross bar 42, pins 43, a fixing groove 44 and notches 45, the notches 45 are formed in the center of the buckle plate 41, the notches 45 and the buckle plate 41 are of an integrated structure, the buckle plate 41 is arranged at the bottom of the insulating outer frame 31 and fastened with the insulating outer frame 31, the buckle plate 41 is fastened with the external metal frame 34d through the notches 45, two pins 43 are arranged on two sides of the buckle plate 41 in an axisymmetric structure, the fixing cross bar 42 is arranged at the tops of the pins 43, the fixing cross bar 42 and the pins 43 are in interference fit, the pins 43 are connected with the internal lead gold wires 33 through the external lead gold wires 32, the fixing groove 44 is formed in the center of the pins 43, and the fixing groove 44 and the pins 43 are of an integrated structure.
Referring to fig. 5, the frame fixing frame 5 comprises a first spring 51, a sliding block 52, a sliding rod 53, a joint 54, a flat plate 55, and a limiting seat 56, two connectors 54 are arranged on two sides of the flat plate 55 in parallel at equal intervals, the connectors 54 and the flat plate 55 are in interference fit, the central position of the flat plate 55 is provided with a limiting seat 56, the limiting seat 56 is vertically welded on the flat plate 55, the two sides of the limit seat 56 are provided with slide blocks 52 in an axisymmetric structure, the slide blocks 52 are provided with slide rods 53, the sliding rod 53 and the flat plate 55 are parallel to each other, one end of the sliding rod is fixed on the limiting seat 56, the outer ring of the sliding rod 53 is provided with a first spring 51, the first spring 51 is arranged on the limiting seat 56 and the sliding block 52, one side of the top end of the sliding block 52 is in an inclined plane structure, the flat plate 55 is matched with the lower groove 7 arranged at the bottom of the circuit board 6 through two sliding blocks 52 with axisymmetric top parts.
Referring to fig. 6, the joint 54 is composed of a support rod 54a, a limiting ring 54b, a top block 54c, a limiting rod 54d, a second spring 54e and a limiting block 54f, the support rod 54a is vertically arranged on a flat plate 55 and connected with the flat plate 55, the limiting ring 54b is arranged above the support rod 54a, the limiting block 54f is arranged at the center position inside the limiting ring 54b, four limiting rods 54d are uniformly arranged on the outer ring of the limiting block 54f at equal intervals, the limiting block 54f is connected with the limiting ring 54b through the limiting rod 54d, the support rod 54a is connected with the limiting ring 54b through the limiting block 54f, the circumference diameter formed by the outer ring of the limiting ring 54b is equal to the circumference diameter formed by the inner ring of the fixing groove 44 and is in sliding fit with the two, four top blocks 54c are uniformly arranged inside the limiting ring 54b at equal intervals, and the top blocks 54c are in sliding fit with the limiting rod 54d, the limiting rod 54d is correspondingly matched with a top block 54c, a second spring 54e is arranged on the outer ring of the limiting rod 54d, the second spring 54e is installed between the top block 54c and the limiting block 54f, the top block 54c is of an arc-shaped block structure, and one side of the top part is of an inclined plane structure.
The specific realization principle is as follows:
the package lead frame 3 is matched with the lead conducting bottom frame 4, which can make the loaded chip have good heat radiation, and through a closed structure, the pollution of dust to the chip can be avoided, and simultaneously, a plurality of arranged pins 43 are converted into a whole to be matched with the circuit board 6, which can greatly improve the electrical conductivity of the chip, improve the heat radiation and information processing efficiency, because the radiating fins 1 are arranged on the top of the metal sealing cover 2, and the metal sealing cover 2 is buckled on the insulating outer frame 31 through the grooves 35, and the heat collecting grooves 34b are uniformly distributed on the top of the bonding pad 34a, and the bonding pad 34a is buckled inside the groove 35 of the insulating outer frame 31, because the bonding pad 34a is connected with the heat conducting thin rod 34c through the heat collecting groove 34b, and the heat conducting thin rod 34c is connected with the external metal frame 34d arranged at the bottom of the insulating outer frame 31, the heat generated by, the heat dissipation efficiency of the lead frame can be greatly improved by utilizing the heat conduction property of the metal from the upper and lower ends of the insulating outer frame 31, the height difference of the heat conduction thin rod 34c and the heat collection groove 34b can be set, the direct connection of the heat conduction thin rod 34c and the chip can be avoided, the heat collection groove 34b can have better heat collection efficiency, and the resistance value and the electric loss of the chip can not be influenced in the heat conduction process, the lead structure composed of the packaging lead frame 3 and the lead conduction bottom frame 4 can be rapidly fixed on the top of the circuit board 6 by the matching of the frame fixing frame 5 and the circuit board 6, and the lead structure can be rapidly detached from the circuit board 6 by the simple pressing operation, thereby being beneficial to the later maintenance and repair of the lead frame, because the flat plate 55 is matched with the lower groove 7 arranged at the bottom of the circuit board 6 through the two sliders 52 with the top in the axial, and the circumference diameter formed by the outer circle of the limit ring 54b is equal to the circumference diameter formed by the inner circle of the fixed groove 44 and the two are in sliding fit, because one side of the top end of the slide block 52 is in an inclined plane structure, when the top plate 55 is pushed up, the slide block 52 can quickly enter the lower groove 7 of the circuit board 6 through the inclined plane structure formed by the slide block 52, and the elastic force formed by the second spring 54e is used for fixing the flat plate 55, because the support rod 54a can drive the limit ring 54b to pass through the through hole 8, and accurately make the limit ring 54b enter the fixed groove 44, because the four top blocks 54c uniformly arranged in the limit ring 54b are in an arc block structure and one side is in an inclined plane structure, when the top blocks 54c enter the fixed groove 44, the top blocks 54c are tightly attached to the inner wall of the fixed groove 44 by the elastic force formed by the second spring 54e, so that the lead structure formed by the lead frame package 3 and the lead conduction bottom frame 4, and the lead structure has the function of being detached from the circuit board 6 on the premise of not damaging the circuit on the surface of the circuit board 6, so that the problems that the conventional lead frame of the semiconductor device is usually welded and fixed on a welding spot on the surface of the circuit board by pins with two axisymmetric sides, the later maintenance and repair of the lead frame are not facilitated, and the lead frame of the semiconductor device is forcibly detached from the circuit board to cause damage to the circuit of the circuit board in different degrees are solved.
While there have been shown and described what are at present considered the fundamental principles of the invention, the essential features and advantages thereof, it will be understood by those skilled in the art that the present invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but rather, is capable of numerous changes and modifications in various forms without departing from the spirit or essential characteristics thereof, and it is intended that the invention be limited not by the foregoing descriptions, but rather by the appended claims and their equivalents.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. The utility model provides a fixing device of lead frame, its structure includes fin (1), metal closing cap (2), encapsulation lead frame (3), lead wire conduction underframe (4), frame mount (5), circuit board (6), low recess (7), perforation (8), its characterized in that:
circuit board (6) top be equipped with encapsulation lead frame (3), encapsulation lead frame (3) top be equipped with metal closing cap (2), metal closing cap (2) top arrange and have fin (1), encapsulation lead frame (3) bottom be equipped with lead wire conduction underframe (4), circuit board (6) bottom be equipped with low groove (7), low groove (7) both sides be equipped with perforation (8), low groove (7) on be equipped with frame mount (5).
2. A fixing apparatus of a lead frame according to claim 1, wherein: encapsulation lead frame (3) constitute by insulating frame (31), outer lead gold thread (32), inner lead gold thread (33), chip pad (34), recess (35), insulating frame (31) top be equipped with recess (35), recess (35) inside be equipped with chip pad (34), chip pad (34) both sides be equipped with inner lead gold thread (33), insulating frame (31) both sides be equipped with outer lead gold thread (32).
3. A fixing apparatus of a lead frame according to claim 2, wherein: the chip bonding pad (34) comprises a bonding pad (34a), heat collecting grooves (34b), heat conduction thin rods (34c) and an external metal frame (34d), wherein the heat collecting grooves (34b) are uniformly distributed at the top of the bonding pad (34a), the external metal frame (34d) is arranged below the bonding pad (34a), and the heat conduction thin rods (34c) are arranged at the top of the external metal frame (34 d).
4. A fixing apparatus of a lead frame according to claim 1, wherein: lead wire conduction underframe (4) constitute by buckle (41), fixed horizontal bar (42), pin (43), fixed slot (44), notch (45), buckle (41) central point put and be equipped with notch (45), buckle (41) both sides be equipped with pin (43), pin (43) top be equipped with fixed horizontal bar (42), pin (43) central point put and be equipped with fixed slot (44).
5. A fixing apparatus of a lead frame according to claim 1, wherein: frame mount (5) constitute by first spring (51), slider (52), slide bar (53), joint (54), flat board (55), spacing seat (56), flat board (55) both sides be equipped with joint (54), flat board (55) central point put and be equipped with spacing seat (56), spacing seat (56) both sides be equipped with slider (52), slider (52) on be equipped with slide bar (53), slide bar (53) outer lane on be equipped with first spring (51).
6. A fixing device of lead frame according to claim 5, wherein: the connector (54) consists of a support rod (54a), a limiting ring (54b), a top block (54c), a limiting rod (54d), a second spring (54e) and a limiting block (54f), the limiting ring (54b) is arranged above the support rod (54a), the limiting block (54f) is arranged inside the limiting ring (54b), the limiting rod (54d) is arranged on the outer ring of the limiting block (54f), the top block (54c) is arranged inside the limiting ring (54b), and the second spring (54e) is arranged on the outer ring of the limiting rod (54 d).
7. The fixing apparatus of lead frame according to claim 4, wherein: the buckle plate (41) is arranged at the bottom of the insulating outer frame (31) and is buckled with the insulating outer frame, and the buckle plate (41) is buckled with the external metal frame (34d) through the notch (45).
8. A fixing device of lead frame according to claim 5, wherein: the flat plate (55) is matched with a lower groove (7) arranged at the bottom of the circuit board (6) through two sliding blocks (52) with the tops in an axisymmetric structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010398755.7A CN111446226A (en) | 2020-05-12 | 2020-05-12 | Fixing device of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010398755.7A CN111446226A (en) | 2020-05-12 | 2020-05-12 | Fixing device of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111446226A true CN111446226A (en) | 2020-07-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010398755.7A Withdrawn CN111446226A (en) | 2020-05-12 | 2020-05-12 | Fixing device of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111446226A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116441752A (en) * | 2023-04-27 | 2023-07-18 | 广州丰江微电子有限公司 | High-precision positioning lead frame cutting system |
| CN116631961A (en) * | 2023-07-21 | 2023-08-22 | 青岛泰睿思微电子有限公司 | Small-sized DFN packaging chip and wire bonding device thereof |
-
2020
- 2020-05-12 CN CN202010398755.7A patent/CN111446226A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116441752A (en) * | 2023-04-27 | 2023-07-18 | 广州丰江微电子有限公司 | High-precision positioning lead frame cutting system |
| CN116441752B (en) * | 2023-04-27 | 2023-11-21 | 广州丰江微电子有限公司 | High-precision positioning lead frame cutting system |
| CN116631961A (en) * | 2023-07-21 | 2023-08-22 | 青岛泰睿思微电子有限公司 | Small-sized DFN packaging chip and wire bonding device thereof |
| CN116631961B (en) * | 2023-07-21 | 2023-12-08 | 青岛泰睿思微电子有限公司 | Small-sized DFN packaging chip and wire bonding device thereof |
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Application publication date: 20200724 |