CN201937131U - Integrated circuit testing socket with high-frequency performance improved by central grounding bock - Google Patents
Integrated circuit testing socket with high-frequency performance improved by central grounding bock Download PDFInfo
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- CN201937131U CN201937131U CN2010205965465U CN201020596546U CN201937131U CN 201937131 U CN201937131 U CN 201937131U CN 2010205965465 U CN2010205965465 U CN 2010205965465U CN 201020596546 U CN201020596546 U CN 201020596546U CN 201937131 U CN201937131 U CN 201937131U
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- copper billet
- integrated circuit
- centre
- point earth
- frequency performance
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Abstract
The utility model discloses an integrated circuit testing socket with high-frequency performance improved by a central grounding bock, which comprises a socket body, wherein the socket body consists of a base plate and a connector. The connector contacts with a semiconductor chip to be tested, central copper grounding blocks are assembled between the middle of the connector body and the base plate of the connector, a spring probe includes a signal transmitting spring probe and a grounding spring probe, and the signal transmitting spring probe and the grounding spring probe are inserted into a corresponding hole of the connector and corresponding holes of the central copper grounding blocks respectively. The central copper grounding blocks are fixed onto the socket body via eight corner fasteners, the distance between a middle shaft of the signal transmitting spring probe and the central copper grounding block is 0.35mm+/-0.02mm, and gaps are reserved among sides of the central copper grounding blocks and the socket body. After the central copper grounding blocks with gold plated surfaces are added to the probe type testing socket, heat generated when the testing socket is used can be dissipated more efficiently, so that high-frequency performance is improved and success ratio is increased.
Description
Technical field
The utility model belongs to semicon industry, and the integrated circuit test socket that high frequency performance is improved in the plot is led at especially a kind of dependence center that is used for semiconductor die testing.
Background technology
Test jack is a kind of equipment that is electrically connected in field extensive uses such as integrated circuit testing, electronic system debugging, programmable chip burning, circuit malfunction analyses, directly links to each other with chip under test in chip testing and plays the function of test signal transmission.Particularly in the integrated circuit testing industry, test jack is as the interface between test machine system and the chip under test, be one of key that guarantees test yield, raising testing efficiency, its performance such as contact resistance, test yields, mechanical performance etc. all can directly have influence on the test effect.
QFN (Quad Flat No-Lead Package), the QFN encapsulation, be that a kind of pad size is little, volume is little, with the emerging surface mount chip encapsulation technology of plastics as encapsulant, because the pad of bottom center big exposure is soldered on the heat radiation pad of PCB, makes QFN have splendid electricity and hot property.QFN is a kind of no pin package, is square or rectangle, and the package bottom middle position has the exposed pad of a large tracts of land, has the effect of heat conduction, is with the conductive welding disk that realization is electrically connected outside the encapsulation of large bonding pad.Because the QFN encapsulation has gull wing lead-in wire unlike traditional SOIC and TSOP encapsulation, the conductive path between inner pin and the pad is short, and the cloth line resistance is very low in coefficient of self-inductance and the packaging body, so it can provide remarkable electrical property.In addition, it also provides outstanding heat dispersion by the leadframe pad that exposes, and this pad has the passage of direct heat radiation, is used to discharge the heat in the encapsulation.Usually, the pad that will dispel the heat directly is welded on the circuit board, and the heat radiation via hole among the PCB helps unnecessary power consumption is diffused in the copper ground plate, thereby absorbs unnecessary heat.
Along with raising day by day, particularly high frequency performance, transmission speed, the signal to noise ratio requirement raising day by day of performance of integrated circuits, to the also raising day by day of requirement of test jack.When the integrated circuit of test QFN encapsulated type, require test jack: (1) has very little contact resistance to keep between chip and electronic circuit board excellent contact being arranged; (2) good thermal conductivity is arranged, guarantee that the heat that tested integrated circuit sends leaves by socket; (3) good high frequency characteristics will be arranged, insertion loss when guaranteeing high-frequency signal transmission (Insertion Loss) and return loss (Return Loss) are within the limits prescribed.At present, the socket of more common test QFN encapsulated type all is to be equipped with the probe identical with signal conduction position to carry out ground connection, heat conduction in the centre, and its capacity of heat transmission is limited, does not possess the function of improving high frequency characteristics substantially.
The utility model content
The purpose of this utility model provides a kind of center that relies on and leads the integrated circuit test socket that high frequency performance is improved in the plot, is that the center adopts the specific dimensions metal to lead the plot, possesses the sonde-type test jack that improves high frequency characteristics and high-efficiency heat conduction ability.
The technical scheme that its technical problem that solves the utility model adopts is:
The integrated circuit test socket that high frequency performance is improved in the plot is led at a kind of center that relies on, comprise socket main body, wherein, described socket main body comprises base plate and the connector body that contacts with tested semiconductor chip, between the middle part of described connector body and described base plate, be equipped with the centre-point earth copper billet, spring probe comprises signal transmission spring probe and ground spring probe, inserts respectively in described connector body and the corresponding vestibule of described centre-point earth copper billet.
The integrated circuit test socket that high frequency performance is improved in the plot is led at above-mentioned dependence center, and wherein, described centre-point earth copper billet is made of last centre-point earth copper billet and following centre-point earth copper billet.
The integrated circuit test socket that high frequency performance is improved in the plot is led at above-mentioned dependence center, wherein, and described centre-point earth copper billet surface gold-plating.
The integrated circuit test socket that high frequency performance is improved in the plot is led at above-mentioned dependence center, and wherein, the outer surface of described ground spring probe and the corresponding vestibule inwall of described centre-point earth copper billet fit tightly.
The integrated circuit test socket that high frequency performance is improved in the plot is led at above-mentioned dependence center, and wherein, described centre-point earth copper billet is fixed on the described socket main body by 8 corner buckle structures.
The integrated circuit test socket that high frequency performance is improved in the plot is led at above-mentioned dependence center, and wherein, the distance between described signal transmission spring probe axis and the described centre-point earth copper billet is 0.35mm ± 0.02mm.
The integrated circuit test socket that high frequency performance is improved in the plot is led at above-mentioned dependence center, wherein, leaves the gap between described centre-point earth copper billet avris and the described socket main body.
The utility model compared with prior art has the following advantages:
1, introduced the centre-point earth copper billet of surface gold-plating after, the heat that produces when making the test jack course of work can distribute more efficiently, has improved high frequency performance;
2, remain with the reactance that the design of air gap can obtain to fix between centre-point earth copper billet avris and the socket main body;
3, the outer surface of ground spring probe and the corresponding central region vestibule of centre-point earth copper billet inwall fit tightly, and have guaranteed reliable ground connection property.
Description of drawings
Fig. 1 is that the structural representation that the integrated circuit test socket of high frequency performance is improved in the plot is led at the utility model dependence center;
Fig. 2 is that the utility model dependence center is led the plot and improved the centre-point earth copper billet of integrated circuit test socket of high frequency performance and the fastening structure schematic diagram of connector body;
Fig. 3 is that the profile that the integrated circuit test socket of high frequency performance is improved in the plot is led at the utility model dependence center.
Embodiment
The utility model is described in further detail below in conjunction with the drawings and specific embodiments, but not as qualification of the present utility model.
Please referring to illustrated in figures 1 and 2, the utility model dependence center is led the plot and is improved the integrated circuit test socket of high frequency performance and comprise socket main body 1, socket main body 1 comprises base plate 11 and the connector body 12 that contacts with tested semiconductor chip, between the middle part of connector body 12 and base plate 11, be equipped with centre-point earth copper billet 3, utilize bolt 13 that base plate 11 and connector body 12 are tightened together, in the middle of centre-point earth copper billet 3 tightly is clamped in.Spring probe 2 comprises signal transmission spring probe 21 and ground spring probe 22, inserts respectively in connector body 12 corresponding vestibules 211 and the centre-point earth copper billet 3 corresponding vestibules 221.
Please referring to Fig. 2 and shown in Figure 3, centre-point earth copper billet 3 surface gold-plating, constitute by last centre-point earth copper billet 31 and following centre-point earth copper billet 32, be provided with concave inward structure snap close 301 separately on eight corners of last centre-point earth copper billet 31 and following centre-point earth copper billet 32, outer male structure 101 with connector body 12 middle parts and base plate 11 cooperates respectively, further guarantee the fixed-site of centre-point earth copper billet 3 in socket main body 1, the spring probe 2 that the size of concave inward structure snap close 301 must be considered can not have influence in the centre-point earth copper billet 3 fully contacts with tested semiconductor chip, and make socket main body 1 normally bearing spring probe 21 load the pretightning force that the back that finishes produces.Ground spring probe 22 parts are concentrated the central region 221 that is distributed in centre-point earth copper billet 3, a part is evenly distributed on the outer edge area 221 of centre-point earth copper billet 3 in addition, signal transmission spring probe 21 is located on the connector body 12, be evenly distributed near centre-point earth copper billet 3 around 211, number of probes and arrangement mode specifically can be adjusted according to actual conditions.The outer surface of ground spring probe 22 and centre-point earth copper billet 3 corresponding vestibule 221 inwalls fit tightly, and have guaranteed reliable ground connection property.Leave certain air gap 4 between centre-point earth copper billet 3 avris and the socket main body 1,, therefore obtained certain reactance because air is a dielectric.Diameter and length according to signal transmission spring probe 21, the material of connector body 12, and the distance of each test pin centreline space (pin distance, data herein are applicable to the integrated circuit testing of the QFN encapsulated type of 0.4mm and 0.5mm pin distance), the spacing of control signal transmission spring probe 21 axis and centre-point earth copper billet 3 must be strict controlled in 0.35mm ± 0.02mm scope, based on the kelvin effect principle, be skin effect again, when alternating current passes through conductor, electric current will concentrate on conductive surface and flow through, so, can improve the heat transfer efficiency of whole test jack, improve high frequency characteristics.Be also noted that during assembling, the upper surface of centre-point earth copper billet 3 should not be higher than connector body 12 surfaces of periphery, the former should be lower than the latter slightly under the normal condition, otherwise after test jack is inserted in the vehicle Hi-pot test environment, be easy to the tested semiconductor chip of placing on the connector body 12 is damaged.
At the long probe of certain 3.0mm, the utility model installs the centre-point earth copper billet additional and does not install the high frequency characteristics test result of ground connection copper billet (traditional socket) additional as follows, for reference:
Carry out yields at pin apart from the QFN encapsulated type test jack that is 0.5mm and test and compare with the common test socket, the discovery yields has been brought up to 70%-90% from common 60%-80%.(test condition: number of pins: 32, lead pin pitch 0.5mm, chip under test size 5.0mm X 5.0mm ,-1dB bandwidth: 3-4GHz, probe temperature: 120 degrees centigrade).
In sum, lead after the plot improves the integrated circuit test socket of high frequency performance and introduced the centre-point earth copper billet of surface gold-plating at the utility model dependence center, the heat that produces when making the test jack course of work can distribute more efficiently, has improved high frequency performance, has improved yields.
Claims (7)
1. one kind relies on the center to lead the integrated circuit test socket that high frequency performance is improved in the plot, comprise socket main body, it is characterized in that, described socket main body comprises base plate and the connector body that contacts with tested semiconductor chip, between the middle part of described connector body and described base plate, be equipped with the centre-point earth copper billet, spring probe comprises signal transmission spring probe and ground spring probe, inserts respectively in described connector body and the corresponding vestibule of described centre-point earth copper billet.
2. the integrated circuit test socket that high frequency performance is improved in the plot is led at dependence according to claim 1 center, it is characterized in that, described centre-point earth copper billet is made of last centre-point earth copper billet and following centre-point earth copper billet.
3. the integrated circuit test socket that high frequency performance is improved in the plot is led at dependence according to claim 1 and 2 center, it is characterized in that, described centre-point earth copper billet surface gold-plating.
4. the integrated circuit test socket that high frequency performance is improved in the plot is led at dependence according to claim 1 center, it is characterized in that, the outer surface of described ground spring probe and the corresponding vestibule inwall of described centre-point earth copper billet fit tightly.
5. the integrated circuit test socket that high frequency performance is improved in the plot is led at dependence according to claim 1 center, it is characterized in that, described centre-point earth copper billet is fixed on the described socket main body by 8 corner buckle structures.
6. the integrated circuit test socket that high frequency performance is improved in the plot is led at dependence according to claim 1 center, it is characterized in that, the distance between described signal transmission spring probe axis and the described centre-point earth copper billet is 0.35mm ± 0.02mm.
7. the integrated circuit test socket that high frequency performance is improved in the plot is led at dependence according to claim 1 center, it is characterized in that, leaves the gap between described centre-point earth copper billet avris and the described socket main body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205965465U CN201937131U (en) | 2010-11-08 | 2010-11-08 | Integrated circuit testing socket with high-frequency performance improved by central grounding bock |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205965465U CN201937131U (en) | 2010-11-08 | 2010-11-08 | Integrated circuit testing socket with high-frequency performance improved by central grounding bock |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201937131U true CN201937131U (en) | 2011-08-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205965465U Expired - Lifetime CN201937131U (en) | 2010-11-08 | 2010-11-08 | Integrated circuit testing socket with high-frequency performance improved by central grounding bock |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201937131U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107765164A (en) * | 2017-09-28 | 2018-03-06 | 国营芜湖机械厂 | A kind of circuit board high-frequency signal method of adjustment |
| CN109884507A (en) * | 2019-03-20 | 2019-06-14 | 苏州和林微纳科技有限公司 | QFN chip high-frequency test seat |
| CN112394205A (en) * | 2019-08-15 | 2021-02-23 | 旺矽科技股份有限公司 | Probe head capable of being used for high-frequency and medium-low frequency signal test simultaneously |
| CN115128312A (en) * | 2022-07-14 | 2022-09-30 | 法特迪精密科技（苏州）有限公司 | Distributed high-power test socket suitable for radio frequency module |
-
2010
- 2010-11-08 CN CN2010205965465U patent/CN201937131U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107765164A (en) * | 2017-09-28 | 2018-03-06 | 国营芜湖机械厂 | A kind of circuit board high-frequency signal method of adjustment |
| CN109884507A (en) * | 2019-03-20 | 2019-06-14 | 苏州和林微纳科技有限公司 | QFN chip high-frequency test seat |
| CN112394205A (en) * | 2019-08-15 | 2021-02-23 | 旺矽科技股份有限公司 | Probe head capable of being used for high-frequency and medium-low frequency signal test simultaneously |
| CN115128312A (en) * | 2022-07-14 | 2022-09-30 | 法特迪精密科技（苏州）有限公司 | Distributed high-power test socket suitable for radio frequency module |
| CN115128312B (en) * | 2022-07-14 | 2024-04-02 | 法特迪精密科技（苏州）有限公司 | Distributed high-power test socket applicable to radio frequency module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110817 |