CN218647940U

CN218647940U - Power module

Info

Publication number: CN218647940U
Application number: CN202222624419.7U
Authority: CN
Inventors: 方伟锋; 王慈慰
Original assignee: Hangzhou Silan Microelectronics Co Ltd
Current assignee: Hangzhou Silan Microelectronics Co Ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2023-03-17
Anticipated expiration: 2032-09-30

Abstract

The application discloses power module includes: the insulating substrate is provided with a first surface and a second surface which are opposite, and the insulating substrate is provided with a conducting layer; the device is positioned on the conducting layer on the first surface of the insulating substrate and is electrically connected with the conducting layer on the first surface of the insulating substrate; the heat dissipation substrate is positioned on the second surface of the insulating substrate and connected with the insulating substrate; the first terminal is positioned on the side surface of the insulating substrate and is electrically connected with the conducting layer on the first surface of the insulating substrate; a second terminal located on the conductive layer of the first surface of the insulating substrate and electrically connected to the conductive layer of the first surface of the insulating substrate, the second terminal being disposed perpendicular to the insulating substrate; the device comprises at least two devices, and the two devices are arranged on the same horizontal plane in a staggered mode. The power module has small size, high reliability and strong heat dissipation capability, and is also provided with a plurality of thermistors for monitoring the temperature of each part, and the load and the power of each module can be adjusted in time according to the temperature.

Description

Power module

Technical Field

The utility model relates to a semiconductor technology field, more specifically relates to a power module.

Background

With the development of science and technology, more and more small electronic products are made available. However, the electronic components generate a large amount of heat during operation, so that the heat dissipation of the electronic product is related to the operation safety and stability of the electronic product. The technological progress has led to higher and higher integration of present terminal electronic products, and a large amount of heat generated by electronic components during operation needs to be rapidly dissipated into the environment (generally air) to avoid burning the electronic components due to over-high temperature.

The power module is a power driving device combining power electronic devices such as metal oxide semiconductor field effect transistors (MOS), insulated Gate Bipolar Transistors (IGBT), fast Recovery Diodes (FRD) and integrated circuit technologies, and the power module gains an increasingly large market in the fields of electric vehicles, photovoltaic power generation, wind power generation, industrial frequency conversion and the like due to the advantages of high integration level, high reliability and the like. With the rapid development and popularization of new energy automobiles, power modules with higher reliability and higher heat dissipation capacity are developed as power modules with high integration level according to market demands.

Therefore, a power module with higher reliability, stronger heat dissipation capability and smaller size is needed to meet the market demand.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a power module has realized the demand of small-size, high reliability and high heat-sinking capability.

To achieve the purpose, the utility model adopts the following technical proposal: a power module, comprising: an insulating substrate having first and second opposing surfaces, the insulating substrate having a conductive layer thereon; the device is positioned on the conducting layer on the first surface of the insulating substrate and is electrically connected with the conducting layer on the first surface of the insulating substrate; the heat dissipation substrate is positioned on the second surface of the insulating substrate and connected with the insulating substrate; the first terminal is positioned on the side surface of the insulating substrate and is electrically connected with the conducting layer on the first surface of the insulating substrate; a second terminal located on the conductive layer of the first surface of the insulating substrate and electrically connected to the conductive layer of the first surface of the insulating substrate, the second terminal being disposed perpendicular to the insulating substrate; the device comprises at least two devices, and the two devices are arranged on the same horizontal plane in a staggered mode.

Preferably, the insulating substrate is a copper-clad ceramic substrate, the first surface and the second surface of the insulating substrate are both provided with a conducting layer, and the heat dissipation substrate is connected with the conducting layer on the second surface of the insulating substrate through welding.

Preferably, the devices include IGBT devices and FRD devices.

Preferably, the power module further comprises a thermistor located on the first surface of the insulating substrate and electrically connected to at least part of the second terminal.

Preferably, the number of the insulating substrates is multiple, each insulating substrate is a power unit, and each power unit is provided with at least one thermistor and at least two staggered devices.

Preferably, each thermistor is located at a side region of the power unit corresponding to the thermistor.

Preferably, at least one device and the other devices of the same kind are not in a horizontal line in the transverse direction and are not in a horizontal line in the longitudinal direction.

Preferably, the number of the insulating substrates is four, the power module comprises four power units, one of the four power units is used for controlling brake, and the other three power units are used for supplying three-phase current to provide three-phase power.

Preferably, in the other three power units, the same devices are arranged in a diagonal line.

Preferably, the power module further includes a housing, the insulating substrate is rectangular, the housing is rectangular frame-shaped, and one side of the housing is connected to the heat dissipation substrate, so that the insulating substrate is located inside the housing.

Preferably, the housing further includes a positioning pillar, the positioning pillar is perpendicular to the insulating substrate, and a top surface of the positioning pillar is not lower than a top surface of the second terminal.

Preferably, the positioning columns include a plurality of positioning columns, and the plurality of positioning columns are located on two opposite sides of the insulating substrate or on the same side.

Preferably, the first terminal includes a plurality ofly, and is a plurality of the first terminal sets up respectively in the relative first side of insulating substrate and second side, be located at least partly the first terminal of first side includes the tip and will the tip with the neck that the conducting layer links to each other, the width of tip is greater than the width of neck.

Preferably, the housing has a strip-shaped step structure protruding outward at a position corresponding to the first terminal of the insulating substrate, so as to increase a creepage distance.

Preferably, the power module further includes a cover plate, the cover plate is matched with the housing, the cover plate is located on one side of the first surface of the insulating substrate, a through hole matched with the second terminal is formed in the cover plate, and at least part of the second terminal penetrates out of the through hole.

Preferably, the power module further comprises metal wires electrically connecting the conductive layer and the device, and the device.

Preferably, one side of the heat dissipation substrate, which faces away from the insulating substrate, is provided with a plurality of heat dissipation columns arranged in an array, and the cross section of each heat dissipation column is at least one of a circle and an ellipse.

Preferably, a dimension of the insulating substrate in an arrangement direction of the first terminals is not more than 155mm.

The utility model has the advantages of: the first terminal of the power module is directly injected in the shell, the first terminal and the insulating substrate are welded through ultrasonic welding or tin soldering to improve the whole anti-vibration capability of the module, and the part (end part) of part of the first terminal outside the module extends transversely to increase the area and improve the heat dissipation capability; the second terminal is arranged perpendicular to the insulating substrate, and can realize electric connection and signal transmission through the insertion connection with an external circuit board, so that the design of the circuit board connected with the second terminal is more convenient; each power unit of the insulating substrate is provided with a thermistor, so that the temperature of each unit of the power module can be monitored more accurately, and two devices on the insulating substrate are arranged in a staggered manner on the same horizontal plane, so that the heat dissipation capacity can be further improved, and the devices with smaller sizes are adopted while the performance is kept unchanged, so that the size of the insulating substrate is further reduced, the material consumption is reduced, and the cost is reduced; still surround first terminal in order to increase creepage distance through set up bar stair structure outside the shell, further increase reliability and stability. The back of the radiating substrate of the power module is provided with the radiating columns which are arranged in an array mode, so that the radiating capacity of the module can be effectively improved, and the output capacity of the power module is further improved.

The power module has small size, high reliability and strong heat dissipation capacity, can meet the requirements of various application scenes such as electric or hybrid vehicles, photovoltaic power generation, wind power generation, industrial frequency conversion and the like, and is also provided with a plurality of thermistors for monitoring the temperature of each part of the power module, so that the load and the power of each module can be timely adjusted according to the temperature.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

fig. 1a is a schematic front view of a power module according to a first embodiment of the present invention;

fig. 1b is a schematic back view of a power module according to a first embodiment of the present invention;

fig. 2a is a schematic circuit diagram of a power module according to a first embodiment of the present invention;

fig. 2b is a front view of the power module with a cover plate according to the first embodiment of the present invention;

fig. 2c isbase:Sub>A schematic cross-sectional view of the power module of the first embodiment of the present invention taken along section linebase:Sub>A-base:Sub>A;

fig. 2d is a schematic side view of a power module according to a first embodiment of the invention;

fig. 2e is a schematic top view of a power module according to a first embodiment of the present invention;

fig. 3a is a schematic front view of a power module according to a second embodiment of the present invention;

fig. 3b is a schematic back view of a power module according to a second embodiment of the present invention;

fig. 4 is a schematic front view of a power module with a cover plate according to a second embodiment of the present invention.

Detailed Description

The present invention will be described below based on examples, but the present invention is not limited to only these examples. In the following detailed description of the present invention, certain specific details are set forth in detail. It will be apparent to one skilled in the art that the present invention may be practiced without these specific details. Well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.

In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "transverse", "longitudinal", etc. are based on the directions or positional relationships shown in the corresponding drawings, which are for convenience of description of the forms, positions and connection relationships of the components of the present invention, and are not intended to indicate or imply that the components must be located in specific directions and morphological structures in the whole, and should not be construed as limiting the present invention.

Fig. 1a and 1b show schematic diagrams of the front and back of a power module according to a first embodiment of the present invention, respectively. The power module of the first embodiment includes: an insulating substrate 110, a heat dissipation substrate 120,

first devices

131, 133, a second device 132, a first terminal 140, and a second terminal 150. The insulating substrate 110 is, for example, a Copper-clad ceramic substrate (DBC), and has a first surface and a second surface opposite to each other, and the first surface and the second surface are, for example, both provided with a conductive layer. As shown in fig. 1a, the outline of the insulating substrate 110 is, for example, a rectangle, and the embodiment includes four insulating substrates 110 arranged laterally (along the arrangement direction of the first terminals 140) to respectively serve as four power units, each power unit includes at least one

first device

131 or 133 and at least one second device 132, the

first devices

131 and 133 are, for example, IGBT (Insulated Gate Bipolar Transistor) devices, the second device 132 is, for example, FRD (Fast recovery diode) devices, the

first devices

131 and 133 and the second device 132 are, for example, soldered on a conductive layer on the first surface of the insulating substrate 110, and the

first devices

131 and 133 and the second device 132 are connected in parallel in each power unit and are staggered on the same horizontal plane. Preferably, in each power unit, at least one first device and other first devices are not laterally on a horizontal line and not longitudinally on a horizontal line; at least one second device 132 and other second devices 132 are not laterally aligned and not longitudinally aligned. Specifically, the leftmost power unit is, for example, a brake unit for controlling braking, and the remaining three power units are, for example, single-phase control units of one phase of three-phase (U, V, W-phase) control units, respectively, which are used to supply three-phase currents to provide three-phase power, and of course, the positions of the power units may be interchanged; the brake unit comprises three rows of devices arranged transversely, the single-phase control unit comprises two rows of devices arranged transversely, each row comprises two

first devices

131 or 133 and two second devices 132, and the current loads of the brake unit and the three-phase control unit are different, so the

first devices

131 and 133 in the embodiment adopt two different sizes to respectively correspond to the brake unit and the single-phase control unit, namely the size of the first device 131 in the single-phase control unit is smaller than that of the first device 133 in the brake unit, so that the transverse size of the insulating substrate 110 is further reduced, and the transverse size of the insulating substrate 110 is reduced to be less than 155mm. The layout structures of all the single-phase control units except the brake unit at the leftmost side are basically the same. Preferably, in the single-phase control unit, the first devices 131 are arranged diagonally and the second devices 132 are arranged diagonally. In other embodiments, the number of the insulating substrate 110 and the corresponding power units may also be 1, 2, 3, 5, and so on. The first terminal 140 is, for example, a power terminal, the first terminal 140 includes a dc terminal 141 and an ac terminal 142, an upper side of each power unit includes two dc terminals 141, and a lower side of each power unit includes one ac terminal 142. Further, each power unit is further provided with a thermistor 134, and the thermistor 134 is located in a side area, such as a right side, of the corresponding power unit, close to the lower position, and is as close to the device as possible, so as to quickly and accurately feed back the temperature of the unit. The first surface of the insulating substrate 110 is further provided with a second terminal 150 perpendicular thereto, the second terminal 150 is, for example, a signal terminal in the form of, for example, a fish eye pressure contact (pressure), and signals of the

first devices

131 and 133, the second device 132, the conductive layer, and the thermistor 134 can be led out through the second terminal 150. Further, on the insulating substrate 110, the thermistor 134 and the second terminal 150 are each soldered to the conductive layer on the first surface of the insulating substrate 110 by solder, the first terminal 140 is soldered to the conductive layer on the first surface of the insulating substrate 110 by ultrasonic welding or solder, and the rest of the devices and the other devices and the conductive layer may be electrically connected by wire bonding, for example, at least one of an aluminum wire, a copper wire, a gold wire, or a silver wire. The gaps between and above the

first devices

131, 133, the second device 132, the first terminal 140, the second terminal 150, and the thermistor 134 are electrically isolated and protected by, for example, covering with silicon gel. The heat dissipating substrate 120 is disposed on the second surface of the insulating substrate 110, for example, and is connected to the conductive layer on the second surface of the insulating substrate 110 by soldering, the area of the heat dissipating substrate 120 is larger than that of the insulating substrate 110, and the insulating substrate 110 is covered with the case 160 disposed on the heat dissipating substrate 120. The housing 160 is, for example, rectangular frame-shaped, and is disposed around the insulating substrate 110, the insulating substrate 110 is located inside the housing 160, the upper side and the lower side of the housing 160 have openings, the connection surface between the housing 160 and the heat dissipation substrate 120 is sealed by, for example, a sealant and is fastened by using a self-tapping screw, and further, the connection end between the first terminal 140 and the insulating substrate 110 is wrapped inside the housing 160 by injection molding. The housing 160 further has a first positioning post 161 and a second positioning post 162, wherein the first positioning post 161 and the second positioning post 162 penetrate through the heat dissipating substrate 120, the first positioning post 161 is located on one side (lower right corner) of the housing 160, the second positioning post 162 is located on the other side (upper left corner) of the housing 160, i.e. the first positioning post 161 and the second positioning post 162 are located on two opposite sides of the insulating substrate 110, and the end surfaces of the first positioning post 161 and the second positioning post 162 protruding from one end of the housing 160 are higher than the top surface of the second terminal 150, so as to perform a positioning function, and prevent the second terminal 150 from being bent and damaged due to misalignment. As shown in fig. 1b, the heat dissipation substrate 120 is provided with a plurality of heat conduction pillars 121 arranged in an array on a side away from the insulating substrate 110, a cross section of each heat conduction pillar 121 is, for example, an ellipse, and a cross section of each heat conduction pillar 121 may also be, for example, a circle, a rectangle, a semicircle, a drop, a triangle, a diamond, or the like.

Fig. 2a to 2e are schematic diagrams illustrating the first embodiment of the present invention, a cover plate 170 is further disposed on one side (the side of the first surface of the insulating substrate 110) of the casing 160 away from the heat dissipation substrate 120, the cover plate 170 partially shields and protects each device on the insulating substrate 110, and the first positioning column 161 and the second positioning column 162 penetrate through the cover plate 170 and penetrate out of the cover plate 170. Fig. 2a is a schematic circuit diagram of the power module of the first embodiment, wherein the reference numerals correspond to the terminal reference numerals in fig. 2b, and it can be seen that each power unit on the insulating substrate 110 is provided with a thermistor 134, and specifically, the thermistors 134 are provided between T1 and T2, between T3 and T4, between T5 and T6, and between T7 and T8. Further, as shown in fig. 2b, the cover plate 170 is provided with a through hole 171 for passing at least a portion of the second terminal 150 out of the cover plate 170 to be electrically connected to the outside. The cover plate 170 further has a bayonet 172, and correspondingly, the housing 160 has a latch 163, and the latch 163 is engaged with the bayonet 172 through the latch 163, so as to connect the cover plate 170 and the housing 160, specifically, the cover plate 170 has a bayonet at a middle cross beam except for two respective bayonets 172 at left and right sides, and the bayonet is located at a gap between power units of the insulating substrate 110, for example, where the corresponding latch 163 does not interfere with the layout on the insulating substrate 110. Further, at least some of the terminals in the dc terminals 141 are in a scoop shape, and include an end portion 1412 and a neck portion 1411, where the end portion 1412 has a connection hole, the end portion 1412 is used for connecting with an external dc input, the end portion 1412 is connected with the conductive layer on the insulating substrate 110 through the neck portion 1411, a width of the end portion 1412 is larger than a width of the neck portion 1411, for example, in the same power unit, the end portions 1412 of the two dc terminals 141 extend transversely to a direction away from each other, that is, on one side between the two dc terminals 141, the neck portion 1411 is flush with an edge of the end portion 1412, and on the other side, the end portion 1412 protrudes out of the neck portion 1411.

Fig. 2c isbase:Sub>A schematic cross-sectional view taken along section linebase:Sub>A-base:Sub>A in fig. 2b, fig. 2d isbase:Sub>A side view of the power module of the first embodiment, and fig. 2e isbase:Sub>A top view of the power module of the first embodiment, as shown in fig. 2c to 2e, in whichbase:Sub>A heat-dissipating substrate 120,base:Sub>A housing 160, andbase:Sub>A cover plate 170 enclosebase:Sub>A cavity, and an insulating substrate 110 is located in the cavity and connected to the heat-dissipating substrate 120. The dc terminals 141 of the first terminals 140 are arranged in a stacked structure, for example, to reduce stray inductance, and as can be seen in fig. 2c-2e, the two dc terminals 141 in the same power unit are in different layers. The second terminal 150 includes, for example, a base 151 and a signal pin 152, wherein the base 151 is, for example, welded on a conductive layer on the first surface of the insulating substrate 110, one end of the signal pin 152 is inserted into the base 151, and the other end of the signal pin 152 passes through the through hole 171 from the cover plate 170 to be connected to the outside; specifically, the signal pin 152 and the base 151 are in interference fit, and in order to increase the connection performance when the signal pin 152 is inserted into the base 151, a structure such as a clamping groove or a bending section may be further provided for the signal pin 152 to increase the connection reliability. Further, both the dc terminal 141 and the ac terminal 142 of the first terminal 140 need to have better electrical isolation, so referring to fig. 2e, a strip-shaped step structure 164 protruding outward is disposed on the outer side surface of the housing 160 at a position corresponding to the first terminal 140 to increase a creepage distance and enhance the reliability of the power module, specifically, the cross section of the step structure 164 is, for example, a concave shape, and the first terminal 140 is located in the concave groove. Further, as shown in fig. 2d, the short side 165 of the housing 160 is a plane structure, and of course, a rectangular groove may be further disposed on the short side 165 of the housing 160, which is not limited in this embodiment.

Fig. 3a and 3b show schematic diagrams of a front side and a back side, respectively, of a power module of a second embodiment of the present invention; the second embodiment is similar to the first embodiment, and the same parts are not repeated, but the second embodiment is different from the first embodiment in that the first positioning pillar 261 and the second positioning pillar 262 are located on the same side edge of the insulating substrate 110 in the second embodiment.

Fig. 4 is a schematic front view of a power module with a cover plate according to a second embodiment of the present invention, the second embodiment is similar to the first embodiment, and the same parts are not repeated herein, in this embodiment, the first positioning column 261 and the second positioning column 262 are located on the same side edge of the insulating substrate 110, specifically, the first positioning column 261 and the second positioning column 262 are located at the left end and the right end of the side edge of the insulating substrate 110 where the ac terminal 142 is disposed.

The utility model has the advantages of: the first terminal of the power module is directly injected in the shell, the first terminal and the insulating substrate are welded through ultrasonic welding or tin soldering to improve the whole anti-vibration capability of the module, and the part (end part) of part of the first terminal outside the module extends transversely to increase the area and improve the heat dissipation capability; the second terminal is arranged perpendicular to the insulating substrate, and can realize electric connection and signal transmission through the insertion connection with an external circuit board, so that the design of the circuit board connected with the second terminal is more convenient; each power unit of the insulating substrate is provided with a thermistor, so that the temperature of each unit of the power module can be monitored more accurately, and two devices on the insulating substrate are arranged in a staggered manner on the same horizontal plane, so that the heat dissipation capacity can be further improved, and the devices with smaller sizes are adopted while the performance is kept unchanged, so that the size of the insulating substrate is further reduced, the material consumption is reduced, and the cost is reduced; still surround first terminal in order to increase creepage distance through set up bar stair structure outside the shell, further increase reliability and stability. The back of the heat dissipation substrate of the power module is provided with the heat dissipation columns which are arranged in an array mode, so that the heat dissipation capacity of the module can be effectively improved, and the output capacity of the power module is further improved.

Further, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

Also, it should be understood that the example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods to provide a thorough understanding of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that example embodiments should not be construed as limiting the scope of the disclosure. In some example embodiments, well-known device structures and well-known technologies are not described in detail.

When an element or layer is referred to as being "on," "engaged to," "connected to" or "coupled to" another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" and "directly between," "adjacent" and "directly adjacent," etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another element, region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A power module, comprising:

an insulating substrate having first and second opposing surfaces, the insulating substrate having a conductive layer thereon;

the device is positioned on the conducting layer on the first surface of the insulating substrate and is electrically connected with the conducting layer on the first surface of the insulating substrate;

the heat dissipation substrate is positioned on the second surface of the insulating substrate and connected with the insulating substrate;

the first terminal is positioned on the side surface of the insulating substrate and is electrically connected with the conducting layer on the first surface of the insulating substrate;

a second terminal located on the conductive layer of the first surface of the insulating substrate and electrically connected to the conductive layer of the first surface of the insulating substrate, the second terminal being disposed perpendicular to the insulating substrate;

the device comprises at least two devices, and the two devices are arranged on the same horizontal plane in a staggered mode.

2. The power module according to claim 1, wherein the insulating substrate is a copper-clad ceramic substrate, the first surface and the second surface of the insulating substrate are both provided with conductive layers, and the heat dissipation substrate is connected with the conductive layers on the second surface of the insulating substrate by welding.

3. The power module of claim 1 wherein the devices comprise IGBT devices and FRD devices.

4. The power module of claim 1, further comprising a thermistor on the first surface of the insulating substrate and electrically connected to at least a portion of the second terminal.

5. The power module of claim 4, wherein the insulating substrate is a plurality of insulating substrates, each insulating substrate is a power cell, and each power cell has at least one thermistor and at least two staggered devices.

6. The power module of claim 5, wherein each thermistor is located at a side region of its corresponding power cell.

7. The power module of claim 5 wherein at least one of said devices and the other devices are not horizontally aligned in the lateral direction and not horizontally aligned in the longitudinal direction.

8. The power module of claim 5, wherein the number of the insulating substrates is four, the power module comprises four power cells, one of the four power cells is used for controlling braking, and the remaining three power cells are used for supplying three-phase current to provide three-phase power.

9. The power module of claim 8, wherein the same devices in the remaining three power cells are arranged diagonally.

10. The power module according to claim 1, further comprising a case, wherein the insulating substrate has a rectangular shape, the case has a rectangular frame shape, and one side of the case is connected to the heat dissipating substrate so that the insulating substrate is located inside the case.

11. The power module of claim 10, wherein the housing further comprises a positioning post, the positioning post is perpendicular to the insulating substrate, and a top surface of the positioning post is not lower than a top surface of the second terminal.

12. The power module of claim 11, wherein the plurality of positioning posts are located on two opposite sides or the same side of the insulating substrate.

13. The power module of claim 1, wherein the first terminals comprise a plurality of first terminals respectively disposed on first and second opposite sides of the insulating substrate, at least a portion of the first terminals on the first side comprising an end portion and a neck portion connecting the end portion to the conductive layer, the end portion having a width greater than a width of the neck portion.

14. The power module as claimed in claim 10, wherein the housing has a strip-shaped step structure protruding outward at a position corresponding to the first terminal of the insulating substrate to increase a creepage distance.

15. The power module of claim 10, further comprising a cover plate mated with the housing, the cover plate being positioned on one side of the first surface of the insulating base plate, the cover plate having a through hole mated with the second terminal, at least a portion of the second terminal protruding through the through hole.

16. The power module of claim 1 further comprising metal lines electrically connecting between the conductive layer and the device, the device and the device.

17. The power module of claim 1, wherein a side of the heat-dissipating substrate facing away from the insulating substrate has a plurality of heat-dissipating studs arranged in an array, and a cross section of the heat-dissipating studs is at least one of circular and oval.

18. The power module according to claim 1, wherein a dimension of the insulating substrate in an arrangement direction of the first terminals is not more than 155mm.