JP2003208938A - Lead pin for wiring substrate - Google Patents
Lead pin for wiring substrateInfo
- Publication number
- JP2003208938A JP2003208938A JP2002003236A JP2002003236A JP2003208938A JP 2003208938 A JP2003208938 A JP 2003208938A JP 2002003236 A JP2002003236 A JP 2002003236A JP 2002003236 A JP2002003236 A JP 2002003236A JP 2003208938 A JP2003208938 A JP 2003208938A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- wiring board
- lead pin
- flange portion
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、半導体集積回路
等の電子素子を搭載した配線基板に突設され、その電子
素子と接続される配線基板用リードピンに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board lead pin projecting from a wiring board on which an electronic element such as a semiconductor integrated circuit is mounted and connected to the electronic element.
【０００２】[0002]
【従来の技術】従来、例えばコンピュータのＣＰＵパッ
ケージは、樹脂やセラミックス等の配線基板にＣＰＵを
構成する半導体集積回路が設けられ、この配線基板の裏
面側からは、この半導体集積回路に接続した配線基板用
リードピンが多数突設されている。この配線基板用リー
ドピンは、鉄−ニッケル合金や、ニッケル−コバルト−
鉄合金であるコバール（商標）等から成り、一端部が鍔
状に広がったフランジ部が設けられている。このフラン
ジ部の端面は、配線基板のピン接合部と接続するため
に、銀ロウを付けて凸状に形成したものもある。そし
て、このリードピンの表面には、ニッケルメッキおよび
金メッキが施されている。2. Description of the Related Art Conventionally, for example, in a CPU package of a computer, a semiconductor integrated circuit which constitutes a CPU is provided on a wiring board made of resin, ceramics, or the like. A large number of board lead pins are projected. This wiring board lead pin is made of iron-nickel alloy or nickel-cobalt-
A flange portion, which is made of an iron alloy such as Kovar (trademark) and has one end widened like a brim, is provided. In some cases, the end surface of the flange portion is formed in a convex shape with silver solder for connecting to the pin joint portion of the wiring board. The surface of the lead pin is nickel-plated and gold-plated.
【０００３】この配線基板用リードピンは、配線基板の
裏面に設けられた凹部のピン接合部にフランジ部を対面
させてハンダ付けされる。ピン接合部は、銅等から成り
表面にニッケルメッキや金メッキが施され、配線基板内
の配線と基板厚み方向に接続した導電体のビアと接して
いる。The lead pin for the wiring board is soldered with the flange portion facing the pin joint portion of the recess provided on the back surface of the wiring board. The pin joint portion is made of copper or the like, and the surface thereof is nickel-plated or gold-plated, and is in contact with a wiring in the wiring board and a via of a conductor connected in the board thickness direction.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の技術の場
合、このリードピンはフランジ部のハンダ付け接合力を
高めるために、そのフランジ部の端面に銀ロウを溶かし
て凸状部を形成している。さらに、この凸状部を含むリ
ードピン表面には、ニッケルメッキや金メッキを施して
いるので、リードピンの製造工程が多く、コストがかか
るものであった。In the case of the above-mentioned conventional technique, the lead pin has a convex portion formed by melting silver solder on the end face of the flange portion in order to enhance the soldering and joining force of the flange portion. . Furthermore, since the surface of the lead pin including the convex portion is plated with nickel or gold, the number of steps for manufacturing the lead pin is large and the cost is high.
【０００５】この発明は、上記従来の技術の問題点に鑑
みて成されたもので、一体成形ピンにより、製造が容易
でコストが安価であり、配線基板への接続も一体成形の
フランジ部の凸状部により強固に確実になされ、電気抵
抗も少ない配線基板用リードピンを提供することを目的
とする。The present invention has been made in view of the above-mentioned problems of the prior art. It is easy to manufacture and the cost is low due to the integrally formed pin, and the connection to the wiring board is achieved by the integrally formed flange portion. An object of the present invention is to provide a lead pin for a wiring board, which is firmly and surely formed by the convex portion and has a low electric resistance.
【０００６】[0006]
【課題を解決するための手段】この発明は、絶縁性の配
線基板に設けられたピン接合部に、電気的に接続し固定
される配線基板用リードピンであって、軸状のピン本体
とその一端部に側方に広がったフランジ部を備え、この
ピン本体とフランジ部は、銅合金、鉄−ニッケル合金、
またはニッケル−コバルト−鉄合金であるコバール（商
標）等の鉄−ニッケル系合金により一体に成形して設け
られ、このフランジ部の端面は上記合金により、外側に
膨らんだ膨出部として一体に成形されている配線基板用
リードピンである。上記膨出部の先端部には、上記ピン
本体の延長線と直交する面を有した平面部が形成されて
いる。SUMMARY OF THE INVENTION The present invention is a lead pin for a wiring board, which is electrically connected to and fixed to a pin joint portion provided on an insulating wiring board, and which has a shaft-shaped pin body and a pin body. Equipped with a flange portion that expands laterally at one end, this pin body and flange portion are made of copper alloy, iron-nickel alloy,
Alternatively, an iron-nickel alloy such as Kovar (trademark), which is a nickel-cobalt-iron alloy, is integrally formed and provided, and the end surface of the flange portion is integrally formed as a bulging portion that bulges outward by the alloy It is a lead pin for a wiring board that has been used. A flat surface portion having a surface orthogonal to the extension line of the pin body is formed at the tip of the bulging portion.
【０００７】また、上記膨出部は、上記フランジ部の端
面の一部が外方に膨出した形状に形成されている。Further, the bulging portion is formed in a shape in which a part of the end surface of the flange portion bulges outward.
【０００８】[0008]
【発明の実施の形態】以下、この発明の実施の形態につ
いて図面に基づいて説明する。図１〜図３はこの発明の
第一実施形態を示すもので、この実施形態の配線基板用
リードピン１０は、軸状のピン本体１２とその一端部に
側方に広がったフランジ部１４を備えている。このフラ
ンジ部１４の端面は、一体に外側に膨らんだほぼ半球状
の膨出部１６として形成されている。そして、ピン本体
１２、フランジ部１４及びその膨出部１６は、銅よりも
強度が高く導電性も良い銅合金や、鉄−ニッケル合金、
ニッケル−コバルト−鉄合金であるコバール（商標）等
の鉄−ニッケル系合金から成り、一体に成形して設けら
れている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a first embodiment of the present invention, in which a wiring board lead pin 10 of this embodiment comprises a shaft-shaped pin body 12 and a flange portion 14 flared laterally at one end thereof. ing. The end surface of the flange portion 14 is formed as a substantially hemispherical bulge portion 16 which bulges outward integrally. Then, the pin body 12, the flange portion 14 and the bulging portion 16 thereof are a copper alloy having higher strength and better conductivity than copper, an iron-nickel alloy,
It is made of an iron-nickel alloy such as nickel-cobalt-iron alloy Kovar (trademark), and is integrally formed.
【０００９】配線基板用リードピン１０の膨出部１６
は、図３（ａ）に示す半球状の他、図３（ｂ）に示すよ
うに、円錐台状の膨出部１７や、図３（ｃ）に示すよう
に、円柱状のフランジ部１４の端面角部にＲを付けた形
状の膨出部１８でも良い。これら膨出部１６，１７，１
８には、その各端面にピン本体１２の延長線と直交する
面の平面部２０が各々形成されている。そして、この配
線基板用リードピン１０は、その表面全体にニッケルメ
ッキが施され、さらにその表面全体に金メッキが施され
ている。Bulging portion 16 of lead pin 10 for wiring board
In addition to the hemispherical shape shown in FIG. 3A, as shown in FIG. 3B, a frustoconical bulge portion 17 and a cylindrical flange portion 14 as shown in FIG. Alternatively, the bulging portion 18 may have a shape in which R is attached to the corner of the end face. These bulges 16, 17, 1
In each of the end surfaces of the pin 8, a flat surface portion 20 of a surface orthogonal to the extension line of the pin body 12 is formed. The lead pin 10 for a wiring board has nickel plated on the entire surface and gold plated on the entire surface.
【００１０】この実施形態の配線用リードピン１０は、
図１，図２に示すように、例えばコンピュータのＣＰＵ
を構成する半導体集積回路のＩＣパッケージ２４に設け
られ、樹脂やセラミックス等の配線基板２６の裏面に突
設される。この配線基板２６は、表面側の配線層３０と
裏面側のリードピン突設層３２とから成る。そして配線
基板２６の外面２６ａには、図示しない多数のパッド状
の電極が設けられ、図示しないＣＰＵ等のＩＣの電極が
接続される。The wiring lead pin 10 of this embodiment is
As shown in FIGS. 1 and 2, for example, a CPU of a computer
Is provided in the IC package 24 of the semiconductor integrated circuit constituting the above, and is projected from the back surface of the wiring substrate 26 made of resin, ceramics or the like. The wiring board 26 includes a wiring layer 30 on the front surface side and a lead pin projecting layer 32 on the back surface side. A large number of pad-shaped electrodes (not shown) are provided on the outer surface 26a of the wiring board 26, and electrodes of ICs such as a CPU (not shown) are connected thereto.
【００１１】配線用基板２６のリードピン突設層３２の
外面２６ｂには、配線基板用リードピン１０を突設させ
る凹部２８が縦横に設けられている。凹部２８は、配線
層３０の内側面３０ａに連通した貫通孔である。配線層
３０には図示しない配線が設けられ、配線層３０の厚み
方向に配線接続用に設けられた導電体のビアを備えてい
る。そして、この導電体のビアに接続したピン接合部３
４が、凹部２８に対面した配線層３０の裏面に設けられ
ている。配線層３０に設けられ凹部２８に露出したピン
接合部３４は、銅等により円盤状に形成され、表面にニ
ッケルメッキ及び金メッキが施されている。On the outer surface 26b of the lead pin projecting layer 32 of the wiring board 26, recesses 28 are formed vertically and horizontally for projecting the wiring board lead pins 10. The recess 28 is a through hole that communicates with the inner side surface 30 a of the wiring layer 30. Wiring (not shown) is provided in the wiring layer 30, and conductor vias provided for wiring connection are provided in the thickness direction of the wiring layer 30. And the pin joint part 3 connected to the via of this conductor
4 is provided on the back surface of the wiring layer 30 facing the recess 28. The pin joint portion 34 provided in the wiring layer 30 and exposed in the recess 28 is formed in a disk shape from copper or the like, and the surface thereof is nickel-plated and gold-plated.
【００１２】配線基板２６の裏面側の凹部２８には、配
線基板用リードピン１０のフランジ部１４が挿入され、
ピン接合部３４に膨出部１６の平面部２０が当接され、
この配線基板用リードピン１０のフランジ部１４がピン
接合部３４にハンダ付けされる。ハンダ付けのハンダ３
６は、Ｐｂ−Ｓｎ系ハンダやＰｂ−Ａｇ系ハンダ、Ｓｎ
−Ｓｂ系ハンダ等を適宜選択し得る。The flange portion 14 of the lead pin 10 for the wiring board is inserted into the recess 28 on the back surface side of the wiring board 26.
The flat portion 20 of the bulging portion 16 is brought into contact with the pin joint portion 34,
The flange portion 14 of the wiring board lead pin 10 is soldered to the pin joint portion 34. Soldering solder 3
6 is Pb-Sn solder, Pb-Ag solder, Sn
-Sb type solder or the like can be appropriately selected.
【００１３】ハンダ３６は、フランジ部１４の裏面側ま
で盛り上がり、フランジ部１４を保持固定するととも
に、リードピン突設層３２の凹部２８の開口部よりもピ
ン本体１２の先端方向に流れ出ない方が好ましい。これ
により、このＣＰＵパッケージ２４をマザーボードに取
り付けた際にも、ハンダ等によりリードピン１０及び配
線基板２６が浮いた状態とはならない。It is preferable that the solder 36 rises up to the back surface side of the flange portion 14 to hold and fix the flange portion 14 and not flow out toward the tip end of the pin body 12 than the opening portion of the recess 28 of the lead pin projecting layer 32. . As a result, even when the CPU package 24 is attached to the motherboard, the lead pins 10 and the wiring board 26 do not float due to solder or the like.
【００１４】この実施形態の配線基板用リードピン１０
によれば、膨出部１６を含むフランジ部１４とピン本体
１２を、銅合金や鉄−ニッケル系合金により一体に成形
して設け、ピン接合部３４に強固にハンダ付可能とした
ので、配線基板用リードピン１０の製造が容易であり、
コストが安価である。さらに、平面部２０をピン接合部
３４に当接させてハンダ付けするので、配線基板用リー
ドピン１０を容易に且つ安定に配線基板２６のピン接合
部３４に対して直角に位置決めすることが出来、また配
線基板用リードピン１０に対する横方向の力に対しても
高い抵抗力を備える。また、この配線基板用リードピン
１０が銅合金の場合は、導電性が高く電気抵抗が小さ
く、さらに熱伝導率も高いので、特にＣＰＵのリードピ
ンとしては、電気抵抗や放熱性能の観点から極めて好ま
しいものである。The wiring board lead pin 10 of this embodiment
According to the method, the flange portion 14 including the bulging portion 16 and the pin body 12 are integrally formed and provided with a copper alloy or an iron-nickel alloy, and the pin joint portion 34 can be firmly soldered. The board lead pin 10 is easy to manufacture,
The cost is low. Further, since the flat portion 20 is brought into contact with the pin joint portion 34 and soldered, the wiring board lead pin 10 can be positioned easily and stably at right angles to the pin joint portion 34 of the wiring board 26. Further, the wiring board lead pin 10 has a high resistance force against a lateral force. Further, when the lead pin 10 for a wiring board is a copper alloy, it has high conductivity, low electric resistance, and high thermal conductivity. Therefore, as a lead pin for a CPU, it is extremely preferable from the viewpoint of electric resistance and heat dissipation performance. Is.
【００１５】次にこの発明の第二実施形態ついて図４を
基にして説明する。ここで上述の実施形態と同様の部材
は、同一の符号を付し説明を省略する。この実施形態の
配線基板用リードピン１０も、銅合金や、鉄−ニッケル
合金、その他ニッケル−コバルト−鉄合金であるコバー
ル（商標）等の鉄−ニッケル系合金から成り、一体に成
形して設けられたものである。このフランジ部１４は、
その端面全面が膨出して膨出部が形成されているもので
はなく、フランジ部１４の端面中央の一部に、同心的に
膨出部３６，３７，３８を一体に成形して設けたもので
ある。ここで、膨出部３６は、図４（ａ）に示すよう
に、フランジ部１４と同心的に中央部で半球状に盛り上
がったものである。また、図４（ｂ）に示すように、円
錐台状の膨出部３７や、図４（ｃ）に示すように、フラ
ンジ部１４より小径の円柱状の膨出部３８を形成しても
良い。この膨出部３６，３７，３８にも、その端面にピ
ン本体１２の延長線と直交する面の平面部２０が形成さ
れている。Next, a second embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted. The wiring board lead pin 10 of this embodiment is also made of a copper alloy, an iron-nickel alloy, or an iron-nickel alloy such as Kovar (trademark) which is a nickel-cobalt-iron alloy, and is integrally formed. It is a thing. This flange portion 14 is
The entire end surface is not bulged to form a bulging portion, and the bulging portions 36, 37, 38 are concentrically formed integrally in a part of the center of the end surface of the flange portion 14. Is. Here, as shown in FIG. 4A, the bulging portion 36 is a hemispherical bulge concentric with the flange portion 14 in the central portion. Further, as shown in FIG. 4B, a truncated cone-shaped bulging portion 37 or a cylindrical bulging portion 38 having a diameter smaller than that of the flange portion 14 may be formed as shown in FIG. 4C. good. The bulging portions 36, 37, 38 also have a flat surface portion 20 on the end face thereof, which is a surface orthogonal to the extension line of the pin body 12.
【００１６】この実施形態によっても、上記と同様の効
果が得られ、凹部２８内でのハンダ付け強度も高いもの
とすることができる。Also according to this embodiment, the same effect as described above can be obtained, and the soldering strength in the recess 28 can be made high.
【００１７】[0017]
【発明の効果】この発明による配線基板用リードピン
は、銅合金や鉄−ニッケル系合金で一体に成形してフラ
ンジ部等を設けたので、製造が容易でありコストも安価
に提供することができる。また、銅合金の場合は、電気
伝導や熱伝導が良く、発熱がこもりにくいものである。
さらに、膨出部の端面に平面部を形成することにより、
ピン接合部に対してより安定に当接し、ハンダ付けを確
実にし、取り付け強度も高いものにすることができる。Since the lead pin for wiring board according to the present invention is integrally formed of a copper alloy or an iron-nickel alloy and provided with a flange portion and the like, it is easy to manufacture and can be provided at low cost. . Further, in the case of a copper alloy, electric conduction and heat conduction are good, and heat generation is less likely to occur.
Furthermore, by forming a flat portion on the end surface of the bulging portion,
It is possible to make more stable contact with the pin joint portion, ensure soldering, and increase the mounting strength.
【図１】この発明の第一実施形態の配線基板用リードピ
ンの取り付け状態の部分拡大縦断面図である。FIG. 1 is a partially enlarged vertical cross-sectional view of a wiring board lead pin according to a first embodiment of the present invention in a mounted state.
【図２】この発明の第一実施形態の配線基板用リードピ
ンを設けた配線基板を示す部分破断正面図である。FIG. 2 is a partially cutaway front view showing the wiring board provided with the wiring board lead pins according to the first embodiment of the present invention.
【図３】この発明の第一実施形態の配線基板用リードピ
ンの変形例を示す正面図である。FIG. 3 is a front view showing a modified example of the wiring board lead pin according to the first embodiment of the present invention.
【図４】この発明の第二実施形態の配線基板用リードピ
ンの変形例を示す正面図である。FIG. 4 is a front view showing a modification of the wiring board lead pin according to the second embodiment of the present invention.
１０ 配線基板用リードピン １２ ピン本体 １４ フランジ部 １６，１７，１８，３６，３７，３８ 膨出部 ２０ 平面部 ２４ ＩＣパッケージ ２６ 配線基板 ２８ 凹部 ３０ 配線層 ３２ リードピン突設層 ３４ ピン接合部 10 Lead pin for wiring board 12 pin body 14 Flange 16, 17, 18, 36, 37, 38 Bulging part 20 Plane 24 IC package 26 wiring board 28 recess 30 wiring layers 32 Lead pin projecting layer 34 pin joint
Claims (2)
部に、電気的に接続し固定される配線基板用リードピン
において、軸状のピン本体とその一端部に側方に広がっ
たフランジ部とを備え、このピン本体とフランジ部は銅
合金または鉄−ニッケル系合金により一体に成形して設
けられ、このフランジ部の端面は、外側に膨らんだ膨出
部として形成され、上記膨出部の先端部には、上記ピン
本体の延長線と直交する面を有した平面部が形成されて
いることを特徴とする配線基板用リードピン。1. A lead pin for a wiring board electrically connected to and fixed to a pin joint provided on an insulating wiring board, wherein a shaft-shaped pin body and a flange portion flared laterally at one end thereof. The pin body and the flange portion are integrally formed of a copper alloy or an iron-nickel alloy, and the end surface of the flange portion is formed as a bulging portion that bulges outward. A lead pin for a wiring board, wherein a flat surface portion having a surface orthogonal to the extension line of the pin body is formed at the tip end portion of the lead pin.
一部が外方に膨出した形状に形成されていることを特徴
とする請求項１記載の配線基板用リードピン。2. The lead pin for a wiring board according to claim 1, wherein the bulging portion is formed so that a part of an end surface of the flange portion bulges outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002003236A JP2003208938A (en) | 2002-01-10 | 2002-01-10 | Lead pin for wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002003236A JP2003208938A (en) | 2002-01-10 | 2002-01-10 | Lead pin for wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003208938A true JP2003208938A (en) | 2003-07-25 |
Family
ID=27642872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002003236A Pending JP2003208938A (en) | 2002-01-10 | 2002-01-10 | Lead pin for wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003208938A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100959866B1 (en) * | 2009-07-20 | 2010-05-27 | 삼성전기주식회사 | Lead pin for package substrate |
| KR100959865B1 (en) * | 2009-07-20 | 2010-05-27 | 삼성전기주식회사 | Lead pin for package substrate |
| JP2010141347A (en) * | 2010-02-04 | 2010-06-24 | Shinko Electric Ind Co Ltd | Wiring board having lead pin, and lead pin |
| US20110014826A1 (en) * | 2009-07-20 | 2011-01-20 | Samsung Electro-Mechanics Co., Ltd. | Lead pin for package substrate |
| KR101101513B1 (en) | 2009-12-11 | 2012-01-03 | 삼성전기주식회사 | Lead pin for semiconductor package and semiconductor package |
| US8159064B2 (en) | 2010-08-19 | 2012-04-17 | Samsung Electro-Mechanics Co., Ltd. | Lead pin for package substrate, and method for manufacturing package substrate with the same |
| KR101141386B1 (en) | 2010-02-16 | 2012-05-03 | 삼성전기주식회사 | Lead pin for semiconductor package and semiconductor package |
| US8766450B2 (en) | 2009-09-22 | 2014-07-01 | Samsung Electro-Mechanics Co., Ltd. | Lead pin for package substrate |
-
2002
- 2002-01-10 JP JP2002003236A patent/JP2003208938A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100959866B1 (en) * | 2009-07-20 | 2010-05-27 | 삼성전기주식회사 | Lead pin for package substrate |
| KR100959865B1 (en) * | 2009-07-20 | 2010-05-27 | 삼성전기주식회사 | Lead pin for package substrate |
| US20110014826A1 (en) * | 2009-07-20 | 2011-01-20 | Samsung Electro-Mechanics Co., Ltd. | Lead pin for package substrate |
| US8766450B2 (en) | 2009-09-22 | 2014-07-01 | Samsung Electro-Mechanics Co., Ltd. | Lead pin for package substrate |
| US9142499B2 (en) | 2009-09-22 | 2015-09-22 | Samsung Electro-Machanics Co., Ltd. | Lead pin for package substrate |
| KR101101513B1 (en) | 2009-12-11 | 2012-01-03 | 삼성전기주식회사 | Lead pin for semiconductor package and semiconductor package |
| JP2010141347A (en) * | 2010-02-04 | 2010-06-24 | Shinko Electric Ind Co Ltd | Wiring board having lead pin, and lead pin |
| KR101141386B1 (en) | 2010-02-16 | 2012-05-03 | 삼성전기주식회사 | Lead pin for semiconductor package and semiconductor package |
| US8159064B2 (en) | 2010-08-19 | 2012-04-17 | Samsung Electro-Mechanics Co., Ltd. | Lead pin for package substrate, and method for manufacturing package substrate with the same |
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