CN210956622U

CN210956622U - Semiconductor device flip-chip mounting bracket

Info

Publication number: CN210956622U
Application number: CN201922430633.7U
Authority: CN
Inventors: 郁迎春
Original assignee: Taicheng Semiconductor Precision Suzhou Co ltd
Current assignee: Taicheng Semiconductor Precision Suzhou Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-07-07
Anticipated expiration: 2029-12-30

Abstract

The utility model belongs to the relevant field of semiconductor production, specifically disclose a semiconductor device flip-chip mounting support, including bottom plate and riser, two riser upper ends symmetry sets up the limiting plate, sets up the holding down plate on two limiting plates, sets up the push pedal directly over the bottom plate, and the push pedal bottom is connected with the bottom plate through compression spring; the limiting plate is used for clamping and limiting the chip, and the substrate is supported and placed by the push plate, so that the chip and the substrate can be aligned quickly; under the downward pressing action of the lower pressing plate, the chip moves downwards, the welding salient points on the front surface of the chip are attached to the substrate, the push plate is pressed to move downwards at the moment and compresses the compression spring, and under the reverse acting force of the compression spring, the push plate has upward-ejecting force, so that the tight attaching state of the welding salient points and the substrate is kept, and good contact in the welding process is ensured; meanwhile, the lower pressing plate is stably connected with the limiting plate under the action of the inserted bar and the magnetic plate, so that sufficient pressing support is kept, and stable assembly of the chip and the substrate is realized.

Description

Semiconductor device flip-chip mounting bracket

Technical Field

The utility model relates to a semiconductor production relevant field specifically is a semiconductor device flip-chip installing support.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion, and the like. Such as diodes, are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors.

The flip chip is a hot spot in the field of semiconductor packaging at present, and is not only a chip interconnection technology, but also an ideal chip bonding technology. The flip chip is characterized in that the active area of the chip faces the substrate, the interconnection between the chip and the substrate is realized through the solder bumps arranged in an array on the chip, the lead bonding is not needed, the shortest circuit is formed, and the resistance is reduced; and the metal balls are used for connection, so that the packaging size is reduced, and the electrical performance is improved. And in the flip-chip process, the chip and the substrate need to be positioned after being attached, and then welding is completed, so that the mounting bracket capable of quickly positioning and attaching the chip and the substrate is needed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor device flip-chip installing support to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor device flip mounting support comprises a bottom plate and vertical plates vertically mounted at two ends of the bottom plate, wherein convex limiting plates are symmetrically arranged on opposite surfaces of the upper ends of the two vertical plates, an accommodating space for embedding a chip is formed between the two limiting plates, the front surface of the chip faces downwards, and the front surface comprises a plurality of welding salient points; the two limiting plates are provided with lower pressing plates for limiting the upper parts of the chips, the lower pressing plates are of T-shaped structures and comprise lower pressing parts which are embedded between the two limiting plates and abutted against the upper surfaces of the chips and positioning parts which extend outwards along two ends of the upper surfaces of the lower pressing parts; a push plate used for placing the substrate is arranged right above the bottom plate, the upper surface of the substrate is abutted to the welding salient points, and the bottom of the push plate is connected with the bottom plate through a compression spring.

Preferably, the positioning portion abuts against the corresponding limiting plate in an attaching mode, the middle portion of the limiting plate is provided with a positioning groove with an upward opening, and the position, corresponding to the bottom surface of the positioning portion, of the positioning portion is provided with an inserting rod inserted into the positioning groove.

Preferably, mutually attracted magnetic plates are respectively stuck and fixed on the opposite surfaces of the positioning part and the limiting plate.

Preferably, a handle is mounted on the lower pressure plate.

Preferably, the guide rods of the vertical directional vertical plates are provided with guide grooves with opposite openings on opposite surfaces of the two vertical plates respectively, and free ends of the guide rods extend outwards respectively to be inserted into the corresponding guide grooves and are provided with limit ends arranged in the guide grooves.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses the symmetry sets up the limiting plate on two risers for it is spacing to the chip centre gripping, utilizes the push pedal to support the base plate and places, and two risers carry on spacingly to base plate both ends position simultaneously, make chip and base plate align fast; under the downward pressing action of the lower pressing plate, the chip moves downwards, the welding salient points on the front surface of the chip are attached to the substrate, the push plate is pressed to move downwards at the moment and compresses the compression spring, and under the reverse acting force of the compression spring, the push plate has upward-ejecting force, so that the tight attaching state of the welding salient points and the substrate is kept, and good contact in the welding process is ensured; meanwhile, the lower pressing plate is stably connected with the limiting plate under the action of the inserted bar and the magnetic plate, so that sufficient pressing support is kept, and stable assembly of the chip and the substrate is realized.

Drawings

Fig. 1 is a schematic view of the overall assembly structure of the present invention;

fig. 2 is the utility model discloses a concrete connection structure schematic diagram of limiting plate.

In the figure: 1. a base plate; 2. a vertical plate; 3. a limiting plate; 4. a chip; 5. welding the salient points; 6. a lower pressing plate; 7. a pressing part; 8. a positioning part; 9. positioning a groove; 10. inserting a rod; 11. a magnetic plate; 12. a handle; 13. pushing the plate; 14. a compression spring; 15. a substrate; 16. a guide bar; 17. a guide groove; 18. a limiting end.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1-2, the present invention provides a technical solution: a semiconductor device flip mounting support comprises a bottom plate 1 and vertical plates 2 vertically mounted at two ends of the bottom plate 1, wherein convex limiting plates 3 are symmetrically arranged on opposite surfaces of the upper ends of the two vertical plates 2, a containing space for embedding a chip 4 is formed between the two limiting plates 3, the front surface of the chip 4 faces downwards, and the front surface comprises a plurality of welding salient points 5; the two limiting plates 3 are provided with lower pressing plates 6 for limiting the upper parts of the chips 4, and the lower pressing plates 6 are of T-shaped structures and comprise lower pressing parts 7 embedded between the two limiting plates 3 and abutted to the upper surfaces of the chips 4 and positioning parts 8 extending outwards along two ends of the upper surfaces of the lower pressing parts 7; a push plate 13 used for placing a substrate 15 is arranged right above the bottom plate 1, the upper surface of the substrate 15 is abutted to the welding salient points 5, and the bottom of the push plate 13 is connected with the bottom plate 1 through a compression spring 14.

Further, location portion 8 and the 3 laminating butt of limiting plate that corresponds, the limiting plate 3 middle part is provided with the ascending constant head tank 9 of opening, and 8 bottom surfaces of location portion correspond the position department and be provided with the inserted bar 10 that inserts in the constant head tank 9.

Furthermore, magnetic plates 11 which are mutually attracted are respectively stuck and fixed on the opposite surfaces of the positioning part 8 and the limiting plate 3.

Further, a handle 12 is mounted on the lower pressure plate 6.

Furthermore, guide bars 16 of the vertical plates 2 are vertically directed, guide grooves 17 with opposite openings are respectively formed in opposite surfaces of the two vertical plates 2, free ends of the guide bars 16 respectively extend outwards to be inserted into the corresponding guide grooves 17, and limiting ends 18 arranged in the guide grooves 17 are installed.

The working principle is as follows: during installation, the base plate 15 is placed on the push plate 13, the distance between the two vertical plates 2 is matched with the size of the base plate 15, and the two vertical plates 2 are used for limiting the two ends of the base plate 15; the chip is placed between the two limiting plates 3, the distance between the two limiting plates 3 is matched with the size of the chip 4, the two ends of the chip 5 are limited by the limiting plates 3, and the substrate 15 is vertically opposite to the chip 4.

And a lower pressing plate 6 is placed, a lower pressing part 7 of the lower pressing plate is embedded between the two limiting plates 3, the chip 4 is pressed downwards until a positioning part 8 of the chip is attached to the limiting plates 3, an inserting rod 10 on the positioning part 8 is inserted into a positioning groove 9 of the limiting plates 3, the positioning part 8 and the limiting plates 3 are kept in a good attaching state through a magnetic plate 11, sufficient pressing support is kept, and stable assembly of the chip 4 and the substrate 15 is realized.

After the lower pressing plate 6 is installed, the chip 4 moves downwards under the downward pressing action of the lower pressing plate 6, the welding salient point 5 on the front side of the chip is attached to the substrate 15, the push plate 13 is pressed to move downwards at the moment, the compression spring 14 is compressed, and under the reverse acting force of the compression spring 14, the push plate 13 has upward jacking force, so that the tight attaching state of the welding salient point 5 and the substrate 15 is kept, and the good contact in the welding process is ensured.

It is worth noting that the mounting bracket of the present invention can be provided with various models according to the sizes of the actual chip 4 and the substrate 15.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor device flip mounting support is characterized by comprising a bottom plate (1) and vertical plates (2) vertically mounted at two ends of the bottom plate (1), wherein convex limiting plates (3) are symmetrically arranged on opposite surfaces of the upper ends of the two vertical plates (2), a containing space for embedding a chip (4) is formed between the two limiting plates (3), the front surface of the chip (4) faces downwards, and the front surface comprises a plurality of welding salient points (5); the two limiting plates (3) are provided with lower pressing plates (6) for limiting the upper parts of the chips (4), the lower pressing plates (6) are of T-shaped structures and comprise lower pressing parts (7) which are embedded between the two limiting plates (3) and abutted against the upper surfaces of the chips (4), and positioning parts (8) which extend outwards along two ends of the upper surfaces of the lower pressing parts (7); the welding device is characterized in that a push plate (13) used for placing a substrate (15) is arranged right above the bottom plate (1), the upper surface of the substrate (15) is abutted to the welding salient points (5), and the bottom of the push plate (13) is connected with the bottom plate (1) through a compression spring (14).

2. A semiconductor device flip-chip mounting bracket according to claim 1, wherein: the positioning portion (8) is abutted to the corresponding limiting plate (3) in a laminating mode, the middle portion of the limiting plate (3) is provided with a positioning groove (9) with an upward opening, and an inserting rod (10) inserted into the positioning groove (9) is arranged at the position, corresponding to the bottom face of the positioning portion (8).

3. A semiconductor device flip-chip mounting bracket according to claim 1, wherein: and magnetic plates (11) which are mutually attracted are respectively stuck and fixed on the opposite surfaces of the positioning part (8) and the limiting plate (3).

4. A semiconductor device flip-chip mounting bracket according to claim 1, wherein: and a handle (12) is arranged on the lower pressure plate (6).

5. A semiconductor device flip-chip mounting bracket according to claim 1, wherein: the push pedal (13) both sides are installed guide bar (16) of a perpendicular directional riser (2) respectively, have seted up guide way (17) that the opening is relative on two riser (2) opposite faces respectively, and guide bar (16) free end outwards extends respectively and inserts in corresponding guide way (17) to install spacing end (18) of arranging in guide way (17).