CN218416786U - Boards and Power Devices - Google Patents

Abstract

The utility model discloses a circuit board and power equipment, wherein, the circuit board comprises a drive board and a power board, the surface of the drive board is provided with an installation station, and the installation station is provided with a first connection point; the power board is attached to the installation station, a second connecting contact is arranged on the surface, facing the installation station, of the power board, the second connecting contact is arranged facing the first connecting contact, solder is arranged on the second connecting contact and/or the first connecting contact, the power board is attached to the installation station of the driving board through the solder, and therefore the two ends of the solder are connected with the first connecting contact and the second connecting contact respectively. The utility model discloses technical scheme is through attaching the power board on the drive plate, utilizes the second to connect the cooperation welding of contact point and first contact point to realize being connected of power board and drive plate, is favorable to simplifying the overall structure of circuit board, and the automated production of the circuit board of being convenient for has improved the welding efficiency of drive plate, and then has effectively improved the processing production efficiency of circuit board.

Description

Boards and Power Devices

technical field

The utility model relates to the technical field of circuit board assembly, in particular to a circuit board and power equipment.

Background technique

In the existing power equipment, most of the power boards carrying power components are plugged into the drive board through pins to realize the electrical connection between the power board and the drive board, and then the pins of the power board are stabilized by welding the whole machine. Solder on the driver board to form a circuit board.

However, if the power board is installed on the drive board by means of pin insertion, it is necessary to use auxiliary tools to accurately insert the pins on the power board into the pin mounting holes of the drive board, and then weld each pin in turn through the welding of the whole machine. On the driver board, the installation process in this way is complicated, which makes the welding efficiency of the driver board lower, affects the production efficiency of the circuit board and is not convenient for realizing the automatic production of the circuit board.

Utility model content

The main purpose of the utility model is to provide a circuit board, which aims to simplify the overall structure of the circuit board and improve the production efficiency of the circuit board.

In order to achieve the above object, the circuit board proposed by the utility model includes a driving board and a power board, the board surface of the driving board is provided with an installation station, and the installation station is provided with a first connection contact; the power board faces The board surface of the installation station is provided with a second connection contact, the second connection contact is arranged towards the first connection contact, and the second connection contact and/or the first connection contact Solder is provided on it, and the power board is attached to the installation station of the drive board through the solder, so that the two ends of the solder are respectively connected to the first connection contact and the second connection. Contact point.

Optionally, the power board includes a power substrate and a power element, the power substrate is attached to the installation station, and the surface of the power substrate facing the driving board is provided with the second connection contact; The power element is connected to a board surface of the power substrate facing the driving board.

Optionally, the drive board is provided with a heat dissipation hole at the installation station, the first connection contact is arranged on the outer periphery of the heat dissipation hole, the power board covers the heat dissipation hole, and the second Two connection contacts are arranged on the outer edge of the power substrate to be welded with the first connection contact, and the power element is passed through the heat dissipation hole.

Optionally, the drive board is provided with a plurality of the first connection contacts, and the plurality of the first connection contacts are sequentially arranged at intervals along the circumferential direction of the heat dissipation hole. The power board is provided with a plurality of the second connection contacts, and the plurality of the second connection contacts are sequentially arranged at intervals along the outer edge of the power substrate, and each of the second connection contacts is connected to one of the The first connecting contact is soldered.

Optionally, the heat dissipation holes are arranged in the central area of the installation station.

Optionally, the heat dissipation holes are arranged in a rectangular shape.

Optionally, the circuit board further includes a radiator, the radiator is connected to a surface of the power substrate away from the driving board, and the radiator is used for dissipating heat from the power substrate.

Optionally, the heat sink includes a heat conduction plate and a plurality of heat dissipation fins, the heat conduction plate is connected to the board surface of the power substrate away from the drive board; a plurality of the heat dissipation fins are connected to the heat conduction plate at intervals A plate faces away from the surface of the power substrate.

Optionally, the power substrate is an aluminum substrate, and the aluminum substrate includes a circuit layer facing the driving board and a heat conducting layer facing away from the driving board, and the heat sink is connected to the heat conducting layer.

The utility model also proposes a power device, which is characterized in that the power device includes a body and a circuit board, and the circuit board is electrically connected to the body. The circuit board includes a drive board and a power board, the board surface of the drive board is provided with an installation station, and the installation station is provided with a first connection contact; the power board is attached to the installation station, The surface of the power board facing the installation station is provided with a second connecting contact, the second connecting contact is arranged facing the first connecting contact, and the second connecting contact is connected to the first connecting contact. Solder is provided between the connecting contacts, and two ends of the solder are respectively connected to the first connecting contact and the second connecting contact.

The technical scheme of the utility model realizes the connection between the power board and the driving board by attaching the power board to the driving board, and welding the second connecting contact on the power board and the first connecting contact on the driving board. It is beneficial to simplify the overall structure of the circuit board. By attaching the power board to the driver board, the installation process of plugging the power board into the driver board and welding the whole machine is reduced, which facilitates the automatic production of the circuit board and improves the welding of the driver board. Efficiency, thereby effectively improving the processing and production efficiency of circuit boards.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are only some embodiments of the present utility model, and those skilled in the art can also obtain other drawings according to the structures shown in these drawings without creative work.

Fig. 1 is the three-dimensional structural diagram of an embodiment of the utility model circuit board;

Fig. 2 is an exploded view of the structure of an embodiment of the front side of the circuit board of Fig. 1;

FIG. 3 is an exploded view of an embodiment of the back of the circuit board shown in FIG. 1 .

Explanation of reference numbers:

label name label name 100 circuit board 31 Power substrate 10 Driver board 311 second connecting contact 11 installation station 33 power components 13 first connecting contact 50 heat sink 15 Vents 51 Heat conduction plate 30 power board 53 cooling fins

The realization of the purpose of the utility model, functional characteristics and advantages will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

In this utility model, unless otherwise specified and limited, the terms "connection" and "fixation" should be understood in a broad sense, for example, "fixation" can be a fixed connection, a detachable connection, or an integration; It may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediary, and it may be an internal communication between two elements or an interaction relationship between two elements, unless otherwise clearly defined. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model according to specific situations.

In addition, in the present application, descriptions such as "first", "second" and so on are used for description purposes only, and should not be understood as indicating or implying their relative importance or implicitly indicating the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the meaning of "and/or" appearing in the whole text includes three parallel schemes, taking "A and/or B as an example", including scheme A, scheme B, or schemes satisfying both A and B. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realization of those skilled in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist , also not within the scope of protection required by the utility model.

In the existing power equipment, most of the power boards carrying power components are plugged into the drive board through pins to realize the electrical connection between the power board and the drive board, and then the pins of the power board are stabilized by welding the whole machine. Solder on the driver board to form a circuit board. However, the power board is installed on the driver board by means of pin insertion. It is necessary to use auxiliary tools to accurately insert the pins on the power board into the pin mounting holes of the driver board, and then weld each pin on the drive board in sequence through welding of the whole machine. On the driver board, the installation process in this way is complicated, which makes the welding efficiency of the driver board lower, affects the production efficiency of the circuit board and is not convenient for realizing the automatic production of the circuit board. In view of the above problems, the utility model proposes a circuit board.

1 to 3, in the embodiment of the present invention, the circuit board 100 includes a drive board 10 and a power board 30, the board surface of the drive board 10 is provided with an installation station 11, and the installation station 11 is provided with a first connection The contact point 13; the power board 30 is attached to the installation station 11, the power board 30 is provided with a second connection contact 311 facing the board surface of the installation station 11, and the second connection contact 311 is arranged toward the first connection contact 13, Solder is provided on the second connection contact 311 and/or the first connection contact 13, and the power board 30 is attached to the installation station 11 of the drive board 10 by solder, so that the two ends of the solder are respectively connected to the first connection contact. 13 and the second connecting contact 311.

It can be understood that, during the assembly process of the circuit board 100, the power board 30 can be positioned and attached to the driver board 10 by using a placement machine, which is beneficial to better use the placement machine to realize batch production of the driver board 10 and the power board 30 Autowiring. Before assembly, the solder can be pre-set on the surface of the second connection contact 311, or the solder can be pre-set on the surface of the first connection contact 13, or the first connection contact 13 and the second connection contact 311 The surface of each is preset with solder, so that when the power board 30 is attached to the drive board 10, the first connection contact 13 and the second connection contact 311 cooperate with each other, and the solder can be well arranged on the first connection contact 13 and the second connection contact 311, so that the mounted circuit board 100 can be sent to the reflow soldering equipment to melt the solder to weld the first connection contact 13 and the second connection contact 311, realizing the connection between the drive board 10 and the power The firm connection assembly of the board 30. Compared with the existing technology of pin insertion and complete machine welding, the use of auxiliary tools is effectively reduced, and it is beneficial to realize the automatic production of the circuit board 100 and improve the production efficiency of the circuit board 100 .

Wherein, the substrates of the drive board 10 and the power board 30 are essentially a circuit board, and conductors for electrically communicating with components arranged on the board surfaces of the two boards can be printed, and the power board 30 is installed The two can also be electrically connected on the driving board 10 , so that the two can be electrically conducted through the first connecting contact 13 and the second connecting contact 311 , so as to realize the function of the circuit board 100 .

The technical solution of the utility model realizes the power board 30 by attaching the power board 30 on the drive board 10, and welding the second connection contact 311 on the power board 30 with the first connection contact 13 on the drive board 10. The connection with the driver board 10 is conducive to simplifying the overall structure of the circuit board 100. By attaching the power board 30 to the driver board 10, the installation process of plugging the power board 30 into the driver board 10 using pins and welding the whole machine is reduced. The automated production of the circuit board 100 is facilitated, the welding efficiency of the driving board 10 is improved, and the processing and production efficiency of the circuit board 100 is effectively improved.

2 and 3, in one embodiment of the present invention, the power board 30 includes a power board 31 and a power element 33, the power board 31 is attached to the installation station 11, and the power board 31 faces the board surface of the driving board 10 A second connection contact 311 is provided; the power element 33 is connected to the surface of the power substrate 31 facing the driving board 10 .

In this embodiment, by arranging the power element 33 and the second connection contact 311 on the board surface of the power substrate 31 facing the driving board 10, a certain heat dissipation surface can be formed on the board surface of the power substrate 31 facing away from the driving board 10, The power element 33 can better concentrate and conduct heat to the heat dissipation surface, and then the heat dissipation element in the power device can dissipate heat on the heat dissipation surface, which is conducive to further improving the heat dissipation efficiency of the power board 30 and improving the overall performance of the power board 30. heat radiation. Wherein, the surface of the power element 33 facing away from the power substrate 31 can be provided with a heat insulating material, so as to reduce the heat generated by the power element 33 from being directly transmitted to the driving board 10. In addition, the power element 33 and the driving board 10 can be increased by increasing the distance between the power element 33 and the driving board 10. The distance between them further reduces the heat that the power element 33 acts on the driving board 10 , and further improves the stability and reliability of the circuit board 100 .

Secondly, in another embodiment, the power element 33 can be arranged on the surface of the power substrate 31 away from the drive board 10, so that the heat dissipation elements in the power device directly act on the power element 33 to dissipate heat, further improving the performance of the power board 30. cooling effect.

Further, referring to Fig. 1 to Fig. 3, in one embodiment of the present invention, the driving board 10 is provided with a cooling hole 15 at the installation station 11, the first connecting contact 13 is arranged on the outer periphery of the cooling hole 15, and the power board 30 covers the cooling hole 15 , the second connection contact 311 is disposed on the outer edge of the power substrate 31 for welding with the first connection contact 13 , and the power element 33 passes through the cooling hole 15 .

In this embodiment, by opening the heat dissipation holes 15 on the drive board 10, the power element 33 is penetrated on the heat dissipation holes 15, which is conducive to further directly dissipating heat from the power element 33 through the heat dissipation holes 15, and further improves the performance of the power board 30. Cooling effect and cooling efficiency. At the same time, by passing the power element 33 through the heat dissipation hole 15, it is also beneficial to avoid the direct contact between the power element 33 and the drive board 10, thereby reducing the heat that the power element 33 directly acts on the drive board 10, and further improving the thermal stability of the circuit board 100. The overall heat dissipation effect makes the overall structure of the circuit board 100 more stable and reliable. Wherein, a certain distance can be formed between the power element 33 and the hole wall of the cooling hole 15, thereby further avoiding direct contact between the power element 33 and the driving board 10, and reducing the self-heating of the power element 33 during operation to the driving board 10. Impact.

Secondly, by arranging the first connection contact 13 on the outer periphery of the heat dissipation hole 15, and disposing the second connection contact 311 on the outer edge of the power substrate 31, it is more convenient to use the power board 30 to cover the heat dissipation hole 15 at the same time. The first connecting contact 13 and the second connecting contact 311 can be directly mated and welded, which is beneficial to further improve the assembly efficiency of the circuit board 100 .

Further, referring to FIG. 2 and FIG. 3 , in one embodiment of the present invention, the drive board 10 is provided with a plurality of first connection contacts 13 , and the plurality of first connection contacts 13 are sequentially arranged along the circumferential direction of the cooling hole 15 interval setting. The power board 30 is provided with a plurality of second connection contacts 311, and the plurality of second connection contacts 311 are sequentially arranged at intervals along the outer edge of the power substrate 31, and each second connection contact 311 is welded to a first connection contact 13 .

In this embodiment, by arranging a plurality of first connecting contacts 13 at intervals on the driving board 10 and arranging a plurality of second connecting contacts 311 at intervals on the power board 30, the driving board 10 and the power board 30 can be connected in multiple A more stable and reliable connection can be realized under the cooperative welding of the first connection contacts 13 and the plurality of second connection contacts 311 , thereby further improving the overall structural stability of the circuit board 100 . At the same time, a plurality of first connection contacts 13 are sequentially arranged at intervals along the circumferential direction of the heat dissipation hole 15, and a plurality of second connection contacts 311 are arranged at intervals in sequence along the outer edge of the power substrate 31, so that the power board 30 can be connected to the drive board 10. The overall force is more balanced and stable after being installed, which is beneficial to avoid the unbalanced connection between the power board 30 and the driving board 10. It is easy to be affected by external forces during the transportation or use of the circuit board 100, which may cause the power board 30 to detach from the driving board 10. The overall structural stability of the circuit board 100 is further improved, making the circuit board 100 more reliable.

Secondly, adopting a plurality of first connection contacts 13 and a plurality of second connection contacts 311 is also conducive to reducing the overall volume of the first connection contacts 13 and the second connection contacts 311, which is convenient for reducing the production cost of the circuit board 100 , to further improve the practicability of the circuit board 100 .

Further, referring to FIG. 1 to FIG. 3 , in one embodiment of the present invention, the cooling hole 15 is provided in the central area of the installation station 11 .

It can be understood that, in this embodiment, the installation station 11 can be a vacant area with a certain area formed on the board surface of the driving board 10, and the central area of the installation station 11 can extend from the geometric center of the vacant area. To an area at a certain distance from the edge of the vacant area, so as to arrange the first connection contact 13 between the central area and the edge of the vacant area, so as to achieve a stable connection between the power board 30 and the driving board 10 . By arranging the heat dissipation hole 15 in the central area of the installation station 11, the heat dissipation hole 15 can be better arranged corresponding to the power element 33 on the power board 30, and the installation station 11 and the power substrate 31 can also have a certain connection. area, and it is beneficial to make the connection area around the cooling hole 15 more even, so that the connection between the power board 30 and the driving board 10 can be more stable and reliable.

Referring to FIG. 1 to FIG. 3 , in one embodiment of the present invention, the cooling holes 15 are arranged in a rectangular shape.

In this embodiment, the power substrate 31 can adopt a square design, and the power elements 33 can be arranged side by side on the power substrate 31. At this time, the cooling holes 15 can be arranged in a rectangular shape, so that the cooling holes 15 can better match the power. The arrangement of the components 33 makes the connection area between the power substrate 31 and the drive board 10 more uniform, which is beneficial to further improving the stability of the circuit board 100 and facilitates the processing and assembly of the circuit board 100 . Moreover, the shape of the rectangular cooling holes 15 is more regular, which facilitates the processing and production of the driving board 10 and further improves the production efficiency of the circuit board 100 .

In other embodiments, the heat dissipation holes 15 may also be arranged in an elliptical or circular shape according to the shape of the power substrate 31 and the arrangement of the power elements 33 , so as to further improve the structural stability and practicability of the circuit board 100 .

2 and 3, in one embodiment of the present invention, the circuit board 100 also includes a heat sink 50, the heat sink 50 is connected to the surface of the power substrate 31 away from the drive board 10, and the heat sink 50 is used for cooling the power substrate 31. To dissipate heat.

In this embodiment, by disposing the heat sink 50 on the power board 30 , the heat dissipation effect and heat dissipation efficiency of the power board 30 can be further improved by using the heat sink 50 , so that the circuit board 100 can operate more stably and reliably. It can be understood that the power element 33 can be arranged on the surface of the power substrate 31 facing the driver board 10, so that the heat generated by the power element 33 can be better concentrated and conducted to the surface of the power substrate 31 away from the driver board 10, so that the heat sink 50 dissipating heat on the surface of the power substrate 31 facing away from the driving board 10 can dissipate heat to the entire power board 30 more quickly, further improving the overall heat dissipation efficiency of the power board 30 . Secondly, the power element 33 can also be arranged on the surface of the power substrate 31 away from the drive board 10. At this time, the heat sink 50 can more directly dissipate heat to the power element 33, which can also further improve the overall heat dissipation effect and heat dissipation efficiency of the power board 30. function, further improving the practicability and reliability of the circuit board 100 .

Further, referring to FIG. 2 and FIG. 3 , in one embodiment of the present invention, the heat sink 50 includes a heat conduction plate 51 and a plurality of heat dissipation fins 53 , and the heat conduction plate 51 is connected to the board surface of the power substrate 31 away from the drive board 10 A plurality of cooling fins 53 are connected to the surface of the heat conducting plate 51 away from the power substrate 31 at intervals.

In this embodiment, the heat sink 50 can quickly separate the heat generated by the power board 30 from the power board 30 by using the heat conduction plate 51, and conduct it to the heat dissipation fins 53 for heat dissipation, so as to reduce the power board 30 being exposed to high heat for a long time. Under the influence, there is a certain probability of affecting the normal operation of the power board 30 . At this time, a plurality of heat dissipation fins 53 are arranged at intervals so that the heat can be better dispersed to the plurality of heat dissipation fins 53, and the heat on each heat dissipation fin 53 can be better dissipated to the outside of the circuit board 100, At the same time, it is also beneficial to better increase the overall heat dissipation area of the radiator 50 and further improve the overall heat dissipation effect and heat dissipation efficiency of the radiator 50 . Secondly, a heat dissipation device for dissipating heat from the heat sink 50 may be provided inside the power device to further improve the heat dissipation effect of the heat sink 50 and further improve the overall heat dissipation efficiency of the power board 30 , making the circuit board 100 more stable and reliable.

In one embodiment of the present invention, the power substrate 31 is an aluminum substrate, the aluminum substrate includes a circuit layer facing the driving board 10 and a heat conducting layer facing away from the driving board 10, and the heat sink 50 is connected to the heat conducting layer.

In this embodiment, by arranging the power element 33 on the surface of the power substrate 31 facing the drive board 10, the heat generated by the power element 33 can be directed to the surface of the power substrate 31 away from the power element 33, and then the heat generated by the power substrate 31 can be The surface away from the power element 33 dissipates heat to the entire power board 30 , further improving the heat dissipation effect of the power board 30 . Among them, the power substrate 31 can be made of an aluminum substrate. The aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function, which can minimize the overall thermal resistance, has excellent heat conduction performance, and has high heat conduction efficiency, which is conducive to further improving The overall heat dissipation effect of the power board 30 . At this time, the circuit layer of the aluminum substrate facing the driver board 10 can be used to connect the power element 33, and the heat conduction layer of the aluminum substrate facing away from the driver board 10 can quickly transfer the heat of the power element 33 to the heat sink 50 for heat dissipation, further improving the The overall heat dissipation efficiency and heat dissipation effect of the power board 30 improve the overall structural stability and reliability of the circuit board 100 .

Secondly, the aluminum substrate can also include an insulating layer, which is arranged between the circuit layer and the heat conduction layer. The insulation layer can be made of a heat conduction insulating material with low thermal resistance to reduce the influence of the heat conduction layer by the electric energy of the circuit layer and accelerate the heating process. The rate at which heat from the circuit layer is transferred to the heat conduction layer makes the overall structure of the power board 30 more stable and reliable, and further improves the practicability of the circuit board 100 .

The utility model also proposes a power device (not shown), the power device includes a body (not shown) and a circuit board 100, the circuit board 100 is electrically connected to the body, the specific structure of the circuit board 100 refers to the above-mentioned embodiment, Since the power device adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

The above is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. Under the inventive concept of the utility model, the equivalent structural transformation made by using the specification of the utility model and the contents of the accompanying drawings, or Direct/indirect application in other related technical fields is included in the patent protection scope of the present utility model.

Claims (10)

1. A circuit board, characterized in that, the circuit board comprises: A drive board, the board surface of the drive board is provided with an installation station, and the installation station is provided with a first connection contact; and A power board, the power board is provided with a second connection contact facing the board surface of the installation station, the second connection contact is arranged facing the first connection contact, and the second connection contact and/or Or the first connection contact is provided with solder, and the power board is attached to the installation station of the drive board through the solder, so that the two ends of the solder are respectively connected to the first connection contact point and the second connecting contact. 2. The circuit board according to claim 1, wherein the power board comprises: a power substrate, the power substrate is attached to the installation station, and the surface of the power substrate facing the driving board is provided with the second connection contact; and A power element, the power element is connected to the board surface of the power substrate facing the driving board. 3. The circuit board according to claim 2, wherein the driving board is provided with a heat dissipation hole at the installation station, the first connection contact is arranged on the outer periphery of the heat dissipation hole, and the power The heat dissipation hole is provided on the board cover, the second connection contact is disposed on the outer edge of the power substrate for welding with the first connection contact, and the power element is passed through the heat dissipation hole. 4. The circuit board according to claim 3, wherein the driving board is provided with a plurality of the first connection contacts, and the plurality of the first connection contacts are sequentially arranged along the circumference of the heat dissipation hole. interval setting; The power board is provided with a plurality of the second connection contacts, and the plurality of the second connection contacts are sequentially arranged at intervals along the outer edge of the power substrate, and each of the second connection contacts is connected to one of the The first connecting contact is soldered. 5 . The circuit board as claimed in claim 3 , wherein the heat dissipation hole is disposed at a central area of the installation station. 6 . 6. The circuit board according to claim 3, wherein the heat dissipation holes are arranged in a rectangular shape. 7. The circuit board according to claim 2, wherein the circuit board further comprises a radiator, the radiator is connected to the surface of the power substrate away from the driving board, and the radiator is used for cooling the The above power substrate is used for heat dissipation. 8. The circuit board of claim 7, wherein the heat sink comprises: a heat conduction plate, the heat conduction plate is connected to the board surface of the power substrate away from the drive board; and A plurality of heat dissipation fins, the plurality of heat dissipation fins are connected to the surface of the heat conducting plate away from the power substrate at intervals. 9. The circuit board according to claim 7, wherein the power substrate is an aluminum substrate, and the aluminum substrate includes a circuit layer facing the driving board and a heat conduction layer facing away from the driving board, and the heat dissipation connected to the thermally conductive layer. 10. A power device, characterized in that the power device comprises a body and a circuit board, the circuit board is the circuit board according to any one of claims 1 to 9, and the circuit board is electrically connected to the body .

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