CN217468477U

CN217468477U - Optical chip packaging base

Info

Publication number: CN217468477U
Application number: CN202123338433.2U
Authority: CN
Inventors: 龚国华; 张�浩
Original assignee: Synae Microelectronics Co ltd
Current assignee: Synae Microelectronics Co ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2022-09-20
Anticipated expiration: 2031-12-28

Abstract

The utility model relates to a light chip packaging base, which comprises a metal base platform and a metal lead wire, wherein the middle part of the first end of the metal base platform is provided with a groove for mounting a backlight monitoring chip, the metal base platform is also provided with a tube tongue, the tube tongue protrudes out of the first end of the metal base platform, the tube tongue is close to the inner side surface of one end of the groove and is provided with a mounting groove, and the light chip is arranged on the mounting groove; the metal base platform is provided with at least two openings, and the metal lead is fixed in the openings through a copper-sealed glass piece. The utility model discloses an optical chip packaging base simple structure, connection are convenient, have good sealing performance, and the radiating effect is excellent.

Description

Optical chip packaging base

Technical Field

The utility model relates to an optical communication encapsulates the field, especially relates to an optical chip encapsulates base.

Background

With the rapid development of communication technology, optical communication has gradually become the main transmission mode of communication networks, and plays a crucial role in the construction of information highways. The optical chip packaging base is used in an optical communication system as a key component in a light emitting device, and in the optical chip packaging process, a chip can release a large amount of heat, so that a pipe tongue for bearing the chip and a base table have excellent heat dissipation performance. Meanwhile, the chip and the electronic component are prevented from being oxidized in the working process, and the component needs to be packaged in an inert gas or vacuum environment, so that the packaging base has a sealing requirement.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide an optical chip packaging base that sealing performance is good and have excellent heat dispersion.

The utility model provides a technical scheme that its technical problem adopted is: constructing a light chip packaging base, which is characterized by comprising a metal base table and a metal lead, wherein the middle of the first end of the metal base table is provided with a groove for mounting a backlight monitoring chip, the metal base table is also provided with a tube tongue, the tube tongue protrudes out of the first end of the metal base table, the inner side surface of one end, close to the groove, of the tube tongue is provided with a mounting groove, and the light chip is arranged on the mounting groove;

the metal base platform is provided with at least two openings, and the metal lead is fixed in the openings through a copper-sealed glass piece.

Preferably, the metal base table is a highly conductive oxygen-free copper base table.

Preferably, the pipe tongue and the metal base platform are of an integral structure.

Preferably, the metal base platform is an iron base platform, and the pipe tongue is a high-conductivity oxygen-free copper pipe tongue.

Preferably, the pipe tongue is connected with the metal base platform through a copper-zinc alloy piece.

Preferably, a heat sink is arranged on the mounting groove, and the optical chip is mounted on the heat sink.

Preferably, the optical chip packaging base further comprises a ground wire, and the ground wire is connected to the metal base platform and the pipe tongue through a silver ring sealing member.

Preferably, the edge of the metal base table is provided with a positioning groove.

Preferably, the bottom surface of the groove is provided as an inclined surface, and the backlight monitoring chip is mounted in the groove.

Implement the utility model discloses following beneficial effect has: the utility model discloses an optical chip packaging base simple structure, connection are convenient, have good sealing performance, and the radiating effect is excellent.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic structural diagram of an optical chip package base according to the present invention;

FIG. 2 is a cross-sectional view of the photonic chip package base of FIG. 1;

FIG. 3 is a schematic structural diagram of another embodiment of an optical chip package base according to the present invention;

FIG. 4 is a cross-sectional view of the photonic chip package base of FIG. 3 taken along the A-A direction;

FIG. 5 is a cross-sectional view of the photonic chip package base of FIG. 3 taken along the vertical direction A-A.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "upper", "lower", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present invention, but do not indicate that the device or element referred to must have a specific direction, and thus, should not be construed as limiting the present invention.

It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

Referring to fig. 1-5, an optical chip package base according to the present invention includes a metal base platform 1 and a metal lead 2, wherein, in the optical chip package process, the metal base platform 1 is used for bearing a chip and other components; the metal leads 2 are used to connect the chip and an external circuit, and the metal leads 2 include an RF metal lead 2, a DC metal lead 2, and the like. A groove 11 for mounting a backlight monitoring chip is formed in the middle of the first end of the metal base table 1, a tube tongue 12 is further arranged on the metal base table 1, the tube tongue 12 protrudes out of the first end of the metal base table 1, a mounting groove 121 is formed in the inner side face of one end, close to the groove 11, of the tube tongue 12, a light chip is arranged on the mounting groove 121, and the mounting direction of the light chip is parallel to the direction of the mounting groove 121; the metal base platform 1 is provided with at least two openings 13, and the metal lead 2 is fixed in the openings 13 through the copper-sealed glass piece 3; the metal leads 2 can be adjusted in quantity according to actual chip functional requirements, and can be flexibly applied to meet different functional requirements. Accordingly, the number of openings 13 can be adjusted.

The tube tongue 12 can be semi-cylindrical, a mounting groove 121 is formed on the rectangular plane of the tube tongue 12, the mounting groove 121 can be a rectangular groove, and the size of the mounting groove 121 can be adjusted according to the shape and size of the optical chip; the groove 11 is arranged in the middle of the metal base table 1, and the bottom surface of the groove 11 can be an inclined surface along a certain angle, so that the backlight monitoring chip and the optical chip form a certain included angle.

The opening 13 is disposed at one side of the rectangular plane near the tube tongue 12, and may be disposed at both sides of the groove 11, respectively. The metal lead 2 is fixedly connected with the opening 13 on the metal base platform 1 through the copper-sealed glass piece 3, the special copper-sealed glass can be used for high-temperature welding, copper-sealed glass powder is added into a mounting hole between the metal lead 2 and the base before welding, and the temperature is N at the high temperature of 700-900 DEG C ₂ Sintering, melting and cooling in an environment-friendly environment. The copper-sealed glass is in a glass shape after being sintered and cooled at high temperature to form a copper-sealed glass part, and has good sealing performance.

Further, the metal base stand 1 is a high-conductivity oxygen-free copper base stand. Because the copper-sealed glass and the oxygen-free copper have similar thermal expansion coefficients and are made of insulating materials, the oxygen-free copper can be used for the packaging base. The conventional packaging base is made of iron or cold-rolled steel, the metal base platform 1 is made of high-conductivity oxygen-free copper, and compared with conventional metal, the oxygen-free copper has better conductivity and heat-conducting property and is particularly suitable for the field of packaging of high-power optical chips.

Further, the pipe tongue 12 and the metal base table 1 are of an integral structure.

In another embodiment, the metal base station 1 is an iron base station and the pipe tongue 12 is a high-conductivity oxygen-free copper pipe tongue 12. Further, the pipe tongue 12 is connected to the metal base table 1 through a copper-zinc alloy member. The metal base platform 1 is a metal stamping part made of common iron, the pipe tongue 12 is made of high-conductivity oxygen-free copper, and the pipe tongue 12 is welded in the metal base platform 1 through copper-zinc alloy. Compared with the metal material of the common tube seat, the oxygen-free copper has better electric conduction and heat conduction performance and is suitable for high-power optical chip packaging.

Further, a heat sink 4 may be disposed on the mounting groove 121, and the optical chip is mounted on the heat sink 4; a heat sink 4 is provided on the back of the chip for cooling the chip.

As shown in fig. 3-5, further, the optical chip package base further includes a ground wire 5, and the ground wire 5 is connected to the metal base block 1 and the pipe tongue 12 through a silver ring seal 6. The metal lead 2 under the tube tongue 12 is a grounding wire 5, and is hermetically connected with the metal base platform 1 through a silver ring, and the metal lead 2 is conducted with the metal base platform 1 and the tube tongue 12. The other two metal leads 2 are packaged with the metal base table through glass pieces, and the metal leads are insulated with the metal base table and used for being connected with an external circuit;

further, the edge of the metal base platform 1 is provided with a positioning groove 14 for positioning the metal base platform 1 during packaging.

The utility model discloses an optical chip packaging base simple structure, it is convenient to connect, through copper seal glass spare fixed connection between metal lead wire and the metal base platform, has good sealing performance, is equipped with heat sink on the pipe tongue for the radiating effect is good, and the pipe tongue is the high electrically conductive anaerobic copper product, compares in ordinary tube socket metal material, and anaerobic copper has better electric conduction and heat conductivility, satisfies the encapsulation of high power optical chip.

It is to be understood that the foregoing examples merely represent preferred embodiments of the present invention, and that the description thereof is more specific and detailed, but not intended to limit the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. The optical chip packaging base is characterized by comprising a metal base platform (1) and a metal lead (2), wherein a groove (11) for mounting a backlight monitoring chip is formed in the middle of the first end of the metal base platform (1), a tube tongue (12) is further arranged on the metal base platform (1), the tube tongue (12) protrudes out of the first end of the metal base platform (1), a mounting groove (121) is formed in the inner side surface of one end, close to the groove (11), of the tube tongue (12), and an optical chip is arranged on the mounting groove (121);

the metal base platform (1) is provided with at least two open holes (13), and the metal lead (2) is fixed in the open holes (13) through a copper-sealed glass piece (3).

2. The optical chip package base according to claim 1, wherein the metal base platform (1) is a highly conductive oxygen-free copper base platform.

3. The photonic chip package base of claim 2, wherein the pipe tongue (12) and the metal base platform (1) are of a unitary construction.

4. The photonic chip package base of claim 1, wherein the metal base platform (1) is an iron base platform and the tube tongue (12) is a highly conductive oxygen-free copper tube tongue (12).

5. The photonic chip package base according to claim 4, wherein the tube tongue (12) is connected to the metal base block (1) by a copper-zinc alloy.

6. The optical chip package base according to claim 1, wherein a heat sink (4) is disposed on the mounting groove (121), and the optical chip is mounted on the heat sink (4).

7. The photonic chip package base according to claim 1, further comprising a ground wire (5), wherein the ground wire (5) is connected to the metal base block (1) and the tube tongue (12) by a silver ring seal (6).

8. The optical chip package base according to claim 1, wherein the metal base platform (1) has a positioning groove (14) at its edge.

9. The optical chip package base according to claim 1, wherein the bottom surface of the groove (11) is provided as an inclined surface, and the backlight monitoring chip is mounted in the groove (11).