CN218677068U - Manual piece arranging jig for module manufacturing - Google Patents
Manual piece arranging jig for module manufacturing Download PDFInfo
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- CN218677068U CN218677068U CN202223189414.2U CN202223189414U CN218677068U CN 218677068 U CN218677068 U CN 218677068U CN 202223189414 U CN202223189414 U CN 202223189414U CN 218677068 U CN218677068 U CN 218677068U
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- jig
- plate
- adhesive film
- arranging
- bottom plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a manual piece arranging jig for module manufacturing, which comprises a magnetic bottom plate, a support plate, an adhesive film and a cover plate jig; the magnetic bottom plate is used for adsorbing the carrier plate through magnetic force; an adhesive film is clamped between the support plate and the magnetic bottom plate and used for providing a stable film arrangement plane for the adhesive film; the part of the adhesive film exposed on the carrier plate is used for arranging substrates; the cover plate jig is aligned and abutted to the support plate and used for providing a reference template for the substrates distributed on the adhesive film. The utility model discloses can realize artifical manual work base plate as required evenly distributed, the flexibility is strong, and the cost is very low, the preparation of very suitable small quantity research and development sample.
Description
Technical Field
The utility model belongs to the technical field of the chip package preparation, concretely relates to manual row of piece tool of module preparation.
Background
Semiconductor lasers, especially vertical cavity surface emitting diodes (VCSELs), are important in many fields such as face recognition, 3D applications, and optical sensing technologies such as laser radar.
In order to better verify the performance of the device, the chip needs to be packaged in another substrate, so as to verify the overall performance effect of the chip and the optical device.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a jig for manually arranging modules.
In order to achieve the above purpose, the technical scheme of the utility model is realized like this:
the embodiment of the utility model provides a manual piece arranging jig for manufacturing modules, which comprises a magnetic bottom plate, a support plate, an adhesive film and a cover plate jig;
the magnetic bottom plate is used for adsorbing the carrier plate through magnetic force;
an adhesive film is clamped between the support plate and the magnetic bottom plate and used for providing a stable film arrangement plane for the adhesive film;
the part of the adhesive film exposed on the carrier plate is used for arranging substrates;
the cover plate jig is aligned and abutted to the support plate and used for providing a reference template for the substrates distributed on the adhesive film.
In the above scheme, the magnetic bottom plate comprises a metal bottom plate and magnetic pieces, the front surface of the metal bottom plate is used for adsorbing the carrier plate, and the back of the metal bottom plate is uniformly provided with the magnetic pieces.
In the above scheme, a plurality of mounting through holes are uniformly distributed on the back surface of the metal base plate and used for mounting the magnetic pieces.
In the above scheme, the carrier plate is provided with a plurality of mounting slots at intervals, and the part of the adhesive film located at the mounting slots is exposed on the carrier plate and used for arranging the substrates.
In the above scheme, the size of the cover plate jig is matched with the carrier plate, the protruding arrangement groove is arranged at the position corresponding to the installation groove, and the installation groove corresponding to the protruding arrangement groove is clamped.
In the above scheme, each of the convex arranging slots is provided with a plurality of arranging hole sites from top to bottom along the vertical direction for arranging the substrates.
In the above scheme, the protruding arrangement groove is a stepped boss.
In the above scheme, the carrier plate is provided with a first alignment hole group, and the cover plate jig is correspondingly provided with a second alignment hole group.
Compared with the prior art, the utility model discloses can realize artifical base plate as required evenly distributed, the flexibility is strong, and the cost is very low, the preparation of very suitable small amount research and development sample.
Drawings
The accompanying drawings, which are described herein, serve to disclose a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are used to explain the invention and not to constitute an undue limitation on the invention. In the drawings:
fig. 1 is an exploded view of a manual die-setting jig for manufacturing a die set according to an embodiment of the present invention;
fig. 2 is an assembly view of a manual jig for arranging chips in a module according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a cover plate jig in a manual sheet arranging jig for manufacturing modules according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplified description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationships in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, article, or apparatus that comprises the element.
The embodiment of the utility model provides a manual sheet arranging jig for module manufacturing, as shown in figures 1-3, the jig comprises a magnetic bottom plate 1, a support plate 2, an adhesive film 3, a cover plate jig 4,
the magnetic bottom plate 1 is used for adsorbing the carrier plate 2 through magnetic force;
the adhesive film 3 is clamped between the carrier plate 2 and the magnetic bottom plate 1 and used for providing a stable film arrangement plane for the adhesive film 3;
the part of the adhesive film 3 exposed on the carrier plate 2 is used for arranging substrates;
the cover plate jig 4 is aligned and abutted with the carrier plate 2 and used for providing a reference template for the substrates arranged on the adhesive film 3.
After the assembly of the magnetic bottom plate 1, the carrier plate 2, the adhesive film 3 and the cover plate jig 4 is completed, the base plates are uniformly distributed on the carrier plate 2 through the cover plate jig 4, and then the cover plate jig 4 is removed, so that accurate and uniformly distributed position points are provided for the subsequent DA process of placing VCSELs in the base plates.
The magnetic bottom plate 1 comprises a metal bottom plate 11 and magnetic pieces 12, wherein the front surface of the metal bottom plate 11 is used for adsorbing the carrier plate 2, and the back of the metal bottom plate is uniformly provided with the magnetic pieces 12.
A plurality of mounting through holes are uniformly distributed on the back surface of the metal base plate 11 and are used for mounting the magnetic pieces 12.
In some embodiments, the magnetic member 12 is a magnetic block, which may be circular, rectangular, etc., and of course, the shape of the mounting through hole matches the shape of the magnetic block.
The plurality of magnetic members 12 are uniformly arranged to generate uniformly distributed magnetic force on the metal base plate 11, so that the adsorption carrier plate 2 is more stable.
A plurality of mounting groove positions 21 are arranged on the carrier plate 2 at intervals, and the part of the adhesive film 3 positioned at the mounting groove positions 21 is exposed on the carrier plate 2 and used for arranging substrates.
The size of the cover plate jig 4 is matched with that of the carrier plate 2, the convex arranging groove 41 is arranged at the position corresponding to the mounting groove 21, and the mounting groove 21 corresponding to the convex arranging groove 41 is clamped, so that the convex arranging groove 41 of the cover plate jig 4 is fixed with the mounting groove 21 on the carrier plate 2 and is aligned with the adhesive film 3 at the mounting groove 21.
Each of the protrusion arranging slots 41 is provided with a plurality of arranging hole sites 411 from top to bottom along the vertical direction for arranging the substrates.
The protruding arranging groove 41 is a stepped boss, so that the protruding arranging groove can be conveniently clamped with the mounting groove 21, the connection is more stable, the protruding arranging groove and the mounting groove are not required to be fixed by an additional fixing piece after being clamped by the stepped boss, and the cover plate jig 4 can be conveniently removed after manual typesetting.
After the magnetic bottom plate 1, the support plate 2, the adhesive film 3 and the cover plate jig 4 are connected, 2 edges of the substrate are aligned with 2 edges in the protruding distribution groove 41, so that the substrate is uniformly attached to the corresponding adhesive film 3 in an aligned mode one by one, the cover plate jig 4 is taken down after the completion, the manual typesetting work of the product is completed, and the next DA process can be performed.
Further, in order to determine whether the clamping connection between the carrier plate 2 and the cover plate jig 4 is accurate, a first alignment hole group is arranged on the carrier plate 2, and a second alignment hole group is correspondingly arranged on the cover plate jig 4, so that the alignment state between the cover plate jig 4 and the carrier plate 2 in the X, Y, Z three directions, that is, the clamping connection state between the protrusion arrangement slot 41 and the installation slot 21, can be determined through the alignment state between the first alignment hole group and the second pair Ji Kongzu.
In some embodiments, the carrier plate 2 is provided with a first alignment hole 22 on the upper side for aligning with the cover plate fixture 4, and at least two second alignment holes 23 on the lower side for aligning with the cover plate fixture 4.
The upper side of the cover plate jig 4 is provided with a third alignment hole 42 corresponding to the first alignment hole 22, and the lower side is provided with two adjacent fourth alignment holes 43 aligned with the second pair Ji Kong.
The first aligning hole 22 and the third aligning hole 42 are aligned, and the second aligning hole 23 and the fourth aligning hole 43 are aligned, so that the cover plate jig 4 and the carrier plate 2 are more accurately matched, and the protruding arranging groove 41 of the cover plate jig 4 corresponds to the adhesive film 3 of the mounting groove 21.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
Claims (8)
1. A manual piece arranging jig for manufacturing a module is characterized by comprising a magnetic bottom plate, a support plate, an adhesive film and a cover plate jig;
the magnetic bottom plate is used for adsorbing the carrier plate through magnetic force;
an adhesive film is clamped between the support plate and the magnetic bottom plate and used for providing a stable film arrangement plane for the adhesive film;
the part of the adhesive film exposed on the carrier plate is used for arranging substrates;
the cover plate jig is aligned and abutted to the support plate and used for providing a reference template for the substrates distributed on the adhesive film.
2. The manual die set manufacturing jig of claim 1, wherein the magnetic bottom plate comprises a metal bottom plate and magnetic members, the front surface of the metal bottom plate is used for adsorbing the carrier plate, and the back surface of the metal bottom plate is uniformly provided with a plurality of magnetic members.
3. The jig for manually arranging mold blocks according to claim 2, wherein the back of the metal base plate is uniformly provided with a plurality of mounting holes for mounting magnetic members.
4. The jig for die set manufacturing according to any one of claims 1 to 3, wherein a plurality of mounting slots are spaced on the carrier plate, and the adhesive film is exposed on the carrier plate at the mounting slots and used for arranging the substrates.
5. The jig for manually arranging the chips in the module manufacturing process according to claim 4, wherein the cover plate jig is matched with the carrier plate in size, and a protruding arrangement slot is arranged at a position corresponding to the installation slot, and the installation slot corresponding to the protruding arrangement slot is clamped.
6. The jig for die set manufacturing manual sheet arrangement according to claim 5, wherein each of the protruding arranging slots is provided with a plurality of arranging holes from top to bottom along the vertical direction for arranging the substrates.
7. The jig for die set manufacturing manual sheet arrangement according to claim 6, wherein the protrusion arrangement groove is a stepped boss.
8. The jig for die set manufacturing of claim 7, wherein the carrier has a first set of alignment holes and the cover has a second set of alignment holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223189414.2U CN218677068U (en) | 2022-11-29 | 2022-11-29 | Manual piece arranging jig for module manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223189414.2U CN218677068U (en) | 2022-11-29 | 2022-11-29 | Manual piece arranging jig for module manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218677068U true CN218677068U (en) | 2023-03-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223189414.2U Active CN218677068U (en) | 2022-11-29 | 2022-11-29 | Manual piece arranging jig for module manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218677068U (en) |
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2022
- 2022-11-29 CN CN202223189414.2U patent/CN218677068U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230802 Address after: No. 99 Zhenyuan Road, Weitang Street, Jiashan County, Jiaxing City, Zhejiang Province, 314199 Patentee after: Zhejiang Bosheng Photoelectric Technology Co.,Ltd. Address before: Room 2401, Building 3, Chongwen Park, Nanshan Zhiyuan, No. 3370, Liuxian Avenue, Fuguang Community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong 518055 Patentee before: Shenzhen Bosheng Photoelectric Technology Co.,Ltd. |
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| TR01 | Transfer of patent right |